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CLIC activity of R.Raatikainen

16.02.2012

16 Feb 2012 R.Raatikainen BE-RF-PM

Main tasksThermo-mechanical modeling of the CLIC/LAB two-beam modulesFEA for assembling the RF mock structures for the lab

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Overview

Contributions for the CLIC Study

16 Feb 2012 R.Raatikainen, BE-RF-PM

Past CurrentStudied an improved cooling modeling for the CLIC Two-Beam Modules (FEM).

Thermo-mechanical modeling of the CLIC/LAB modules, other FEA simulations especially for the LAB assemblies.

Finalization of tasks. Preparation of models/files for the follower carrying out similar FEA/CFD simulations.

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Past activites – PETS/AS Tooling

16 Feb 2012 R.Raatikainen, BE-RF-PM

Illustration of the FEA performed for the PETS installed in the lab.

Similarly, simulations were carried out for the accelerating structures to be installed in the lab during this year.

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Past activities

16 Feb 2012 R.Raatikainen, BE-RF-PM

Transient structural FEA for the PETS RF On-Off mechanism

3D CFD cooling simulation were carried out for the CLIC Compact Load

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Current activities

16 Feb 2012 R.Raatikainen, BE-RF-PM

The most time consuming project, the so called thermo-mechanical modeling (TMM) of the CLIC two-beam modules

The development of the current complex started as studying a possible fluid flow method, which could afterwards be applied for the whole module (fluid-thermal simulation for the module became possible). However, the structural simulation remained extremely heavy from computational point of view when the first TMM was performed in 2010.

For the time being, also the structural environment has been successfully improved and therefore better understanding of the modules mechanical behavior can be obtained in significantly less time.

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Future aspects

• Based on the 3D CFD cooling simulation performed for the CLIC compact load, a structural and modal analysis should be studied more closely

Future prospects for the TMM

• Since the current TMM has reached relatively stable and computationally efficient stage, the model could be extended to notify transient phenomena in the future. Also the possibility to utilize structural optimization for the large TMM would be beneficial. Which kind of configuration (support location, orientation of the interconnections etc.) would lead into a minimal displacements with the given loading?

• However, any future FEA including possible transient or iterative effects in TMM should be performed using computing resources prepared for solving models in Terabyte level.

16 Feb 2012 R.Raatikainen, BE-RF-PM