CIRTEK ELECTRONICS CORPORATION Company Presentation.
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Transcript of CIRTEK ELECTRONICS CORPORATION Company Presentation.
CIRTEK ELECTRONICS CORPORATION
Company Presentation
04/18/23
2
Cirtek Electronics Corporation
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
Outline
04/18/23
3
Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
4
04/18/23Cirtek Electronics Corporation
Company overview
5
04/18/23Cirtek Electronics Corporation
Cirtek Holdings Philippines Corporation
Cirtek Electronics Corporation (“CEC”)
Primary purpose is to engage as an independent subcontractor for
semiconductor assembly, test and packaging services
Cirtek Electronics International Corporation (“CEIC”)
A BVI company which provides marketing, logistical and
administrative support, including collection to CEC.
Company Structure
6
04/18/23
History Established in 1984 as independent Subcontract Assembly & Test Provider Accredited by International Quality institutions
CIRTEK has grown to provide world class turnkey solutions that include services from package design development, wafer probe, wafer back grinding, assembly packaging and final testing of semiconductor devices up to drop shipments to Customer's end users.
Competitive pricing and easily adaptable to customers needs
Cirtek Electronics Corporation
Company overview CIRTEK TODAY
High quality products, while providing production flexibility
Competitive pricing and adaptable to customers’ needs.
25 years experience outsourced assembly & testing solution provider
Profitable despite several economic downturns, debt free company
Growing client base composed of companies located around the world
Company overview
7
04/18/23Cirtek Electronics Corporation
Cirtek assembles and tests semiconductor devices at its manufacturing complex located on a 20,000 square meter property in Biñan, Laguna.
Its manufacturing facility is composed of two buildings, with a total floor area of 14,100 square meters. 1800SQM of clean room environment @ Class 10K. We offer general line and captive line assembly models
A Philippine Economic Zone Authority (PEZA) registered company as an ecozone export enterprise at the Laguna Technopark for the manufacture of standard integrated circuits, discrete, hybrid and potential new packages.
Company overview
8
04/18/23Cirtek Electronics Corporation
Business StrategiesTo develop partnership with its existing and potential customers to provide world class quality solutions through management expertise focused on specific applications to meet customers specification, high reliability and multi chips products.
Partnership with Customer to grow business together
1
To offer dedicated or captive line models for assembly and test services in order to efficiently produce the customer’s mature and stable products through shared investment
Captive Line Development
2
To continuously focus on Innovations and re-Engineering in its production and assembly techniques and capabilities, and to co-develop new technologies with customers
Technology Development
3
To actively seek strategic investments opportunities such as, alliances, joint ventures, and/or acquisitions that will be consistent with the Company’s overall business strategies
Mergers and Acquisitions
4
04/18/23
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Cirtek Electronics Corporation
Organizational StructurePRESIDENT & CEO
Jerry Liu
EXECUTIVE VP/ GEN MANAGER
Jorge Aguilar
VP FOR ENG’G & PURCH, IND’L MGMT,
Raul Santiano
FINAL TEST MANAGERWalter Alegarme
ACCOUNTINGMANAGER Susan Lumba
CFOTony Buyawe
DEVELOPMENT ENG’G.Raymond Tecson
SUSTAINING ENG’GChona Morales
FINAL TEST SUPERVISORManny Olandria
PROBE TEST SUPERVISOR
Roderich Ignacio
MULTI DIE TEST SUPERVISOR
Rey Reyes
QA DIRECTOR Luz Veril
QA / FAREL SECTION MANAGER
Zeny Puedan
QC/QA SEC.MANAGER Jacqueline Blancaflor
VP- Global Business Development
Norman Chang
SENIOR DIRECTOR SALES & MKTG-CSAntonio Callueng
MULTICHIPS BUS. MANAGER MeAnn Canoza
IC BUS. MANAGERMiles Besana
DISCRETE BUS. MANAGER Medy Chua
QFN /DFN BUS. MANAGER Wilson Padre
NEW PRODUCT BUS. MANAGER
Rosendo Cerezo
HERMETICS BUS. MANAGERLaarni Arnesto
CUST SERVICE TEAM
HUMAN RESOURCEDIRECTOR
Milet Cruzada
04/18/23
10
Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
04/18/23
11
Cirtek Electronics Corporation
Cirtek Services
Wafer backgrinding (8” maximum diameter / 4 mils thick capability)
Wafer mapping (8” maximum diameter / ASCII format)
Wafer probing (6” & 8” wafer diameter)
Die sales inspection (Commercial / Military / Medical level of inspection)
Full assembly (Refer to package portfolio)
Marking (ink / laser)
Final test (Refer to test capabilities)
Tape and reel (SOT, 150 / 300 mil SOIC, QFN / DFN)
Tape and Ammo (TO-92 straight / spread leads)
Drop shipment (To any point as required)
Ship to Stock Serve as your HUB/Distribution center
Sort + Assy + Test + Drop shipment
Build of Materials
04/18/23Cirtek Electronics Corporation
Cirtek Standard Materials
Leadframe Molding Compound DA Epoxy
• Stamped LF
Copper A194 PPF -NiPdAu
• Etched LF
• Plating – Spot Ag
• Configuration:
Matrix
HDLF
Single/Dual
• Sumitomo – G600, G770• Sumitomo – G600, G770
• Hitachi 9220HF10 • Hitachi 9220HF10
• Cookson3200LS
• Toshiba KE955WY-white
Plating – 100% Tin
Gold Wire ( Mils)
• 84-1LMI/SR4
• 8900- NC
• 8600 -
• 2600AT - HT
• QMI 529HLV
• CRM 1076NS
• Eutectic DA
• Solder paste• Sn5Pb95
• Sn10Pb90
Copper Wire ( Mils)
0.80, 0.90, 1.0 mils
1.0 , 1.65, 2.0
1.2, 1.3, 1.5, 2.0 mils
Aluminum Wire ( Mils)
1.25, 5.0, 10
Plating –SnPB (85/15)
Copper Clip Attach
• Sumitomo 6710/6600
• NittoG300LC• NittoG300LC
04/18/23
13
Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
14
04/18/23Cirtek Holdings Philippines Corporation
QFN/DFN Packages
QFN Body Size Small Body Size
• 2.00 x 2.00 / 08L• 3.00 x 3.00 / 08L• 3.00 x 3.00 / 16L• 3.50 x 3.50 / 20L• 4.00 x 4.00 / 24L• 5.00 x 5.00 / 28L• 7.00 x 7.00 / 32L• 8.00 x 8.00 / 52L
DFN Body Size
Product Portfolio
• 2.90 x 1.80 / 04L• 1.70 x 1.35 / 08L• 2.00 x 2.00 / 08L• 2.50 x 1.35 / 12L• 3.00 x 1.35 / 12L• 3.30 x 1.35 / 16L• 3.00 x 3.00 / 10L• 4.00 x 1.60 / 16L
15
04/18/23Cirtek Electronics Corporation
SOIC Packages
150 Mils Body Packages 300 Mils Body Packages
08L- Stand
14L - Stand
18L
20L
24/28L
Exposed Pad Version
Product Portfolio
08L- 150 Mils16L – 300 Mils16L – QSOP
16L - Stand
16L Standard – Clip Attach
TSOC 6L– 150 x 150 x 55 mils
Product Portfolio
04/18/23Cirtek Electronics Corporation
Plastic Dual In Line Package
300 Mils Body Package Single In Package 600 Mils Body Package
08L
14L
16L
18L
20L
24/28L
8L, 9L
17
04/18/23Cirtek Electronics Corporation
SOT Packages
SOT 23 Packages TO 92 PackagesSOT Packages
03L
06L
TO 92 -Stand
05L
SOT89 TO 92 - Flat
SOT223
SOT 143
Product Portfolio
18
04/18/23Cirtek Electronics Corporation
Hermetic Packages
Metal Can ( TO 3- TO 5) SMT/COB AssyT-Hole Oscillator
Small Metal Cans Hybrid Assembly Build of Materials
Materials Customer Specific Consignment Flexible Arrangement
Product Portfolio
04/18/23
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Cirtek Electronics Corporation
Other Special Assembly Capabilities
Multi die on standard 150 mil2 die up to 32 die, Custom LF design by Cirtek (SOIC) package
Standard silicon die attach cylindrical crystal through resistance welding LF design by Cirtek 300 mil (SOIC) Pack.
Multi die embedded ceramic crystal Mounted die in PCB• NC and conductive epoxy • Transfer over mold process • 300 mil (SOIC) package
Copper Clip attach on SOIC/QFN ESD and Power DevicesDie to Die Bonding
Cylindrical Crystal
Control IC
Copper clip
Multichip on Standard Package
04/18/23
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Cirtek Electronics Corporation
PCB
Passive component attached with solder
GaAs dice attached with conductive epoxy
Gold wire
Non-hermetically sealed using conductive epoxy
Metal lid
Hermetic Module Assembly
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Cirtek Electronics Corporation
CHIP CAPACITOR1
CHIP RESISTOR2
PRESCALER DIE3
1
1
1
11
2
3
LEGEND:
Prescaler-Static divider Module Assembly
04/18/23
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Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
04/18/23
23
Cirtek Electronics Corporation
Company strengths1 Certified to the latest quality standards
2 Solid management team and expertise
3 Ability to adapt to customers’ needs
4 Full turnkey solutions
5 Growing customer base of diverse clients
6 Strong brand name and proven track record
7 A PEZA-registered entity
24
04/18/23Cirtek Electronics Corporation
Cirtek’s manufacturing practices are designed to be compliant with industry requirements and to exceed customer’s expectation.
Manufacturing applies latest quality system standards, which include ISO 9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified facility by UL
Company strengths1 World Class Quality standards
Sales and Marketing
Product Realization
04/18/23
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Cirtek Electronics Corporation
Quality Management System map Internal Quality Auditing – MOP Customer Service - COP
ManagementReview
Cu
sto
mer
s S
atis
fact
ion
Purchasing Billing QA /IQA InspectionWarehousing
Process Design and
Dev’t
Production Planning Control
Process Control Inst /
Doc’n
AssemblyMfg
FA-REL Final Test Delivery
1 2 3 4 6 7 8
9
10
Calibration Process
EngineeringMaintenance
Facilities MIS Training HR EMS
5
Support Process
Main Process
MOPCOP
NOTE:
Support process that has no arrows meaning it will
support the whole organization.
04/18/23
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Cirtek Electronics Corporation
Continual Improvement Process
Information
Input Output
Cirtek Quality Management System
04/18/23
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Cirtek Electronics Corporation
Outstanding Quality SystemQUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND
INDEPENDENT AUDITORSINDEPENDENT AUDITORSACCREDITTED AS QUALIFIED SUPPLIER BY OEM’sACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s
CUSTOMER/END USER SPONSOR YEAR QUALIFIED APPLICATION
HUAWEI – CHINA
PANASONIC MOBILE COMM–JAPAN
CANON INC - JAPAN
GE HEALTH CARE
MICRONAS AUTOMOTIVE
PANASONIC ELECTRONIC-JAPAN
HUAWEI – CHINA
IBM-JAPAN
INTERNATIONAL RECTIFIER
ST MICROLECTRONICS
CMD
EMERSON (ASTEC)
MEDTRONICS
GENNUM
SEMTECH INC
ANALOG DEVICES INC
SEMTECH INC
SUNPOWER
MICRONAS
SEMTECH INC
DALLAS-MAXIM
DALLAS-MAXIM
IR DIVISION
ST MICRO
CMD
SILICON LINK
MICROSEMI
GENNUM-CANADA
2009
2009
2008
2007
2007
2006
2006
2006
2006
2006
2006
2005
2003
2002
POWER SUPPLY - CE
REPEATER/BASE STATION
ELECTRONIC DEVICES
CT SCANNER
HAL SENSOR
FLAT SCREEN TV
ENTERPRISE/OFFICES
DATA NETWORKING
POWER SUPPLY / CHARGERS
MOBILE APPLICATION
MOBILE APPLICATION
POWER SUPPLY - CE
MEDICAL IMPLANTABLE
HEARING AID
Company strengths
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04/18/23Cirtek Electronics Corporation
Management team is composed of highly experienced individuals from various semiconductor and OSAT companies.
The Cirtek Team has over 150 years of combined management and engineering package design expertise specific to semiconductor industry.
Lean organization and prudent decision making.Focused and goal oriented.
2 Solid Management Team and Expertise
Company strengths
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04/18/23Cirtek Electronics Corporation
3 Ability to adapt to customer’s needs
Customer requirements
World class quality standards Excellence in manufacturingClean room (Class 10K) facility and practice 5S (Japanese) Discipline On-time Delivery Competitive pricing Flexibility / Responsiveness
Technical abilities which provide customers a full range of turnkey solutionsCustomer satisfaction as evidenced by the awards received from several customers
Company strengths
30
04/18/23Cirtek Electronics Corporation
Provide vertically integrated manufacturing solutions to its customers.
+ +Higher productivity / efficiency Lower cost Faster time to market
Package Design & Development
Assembly & Packaging
Test, Pack & drop ship to end Customers
4 Full Turnkey Solution
Company strengths
31
04/18/23Cirtek Electronics Corporation
5 Growing customer base of diverse clients
A growing portfolio of customers. CHPI currently has 42 customers around the world
The Company’s customers are located in various countries, with the bulk of revenues contributed by customers located in Europe and the USA
USA AsiaEurope
% Contribution to revenues per region
Company strengths
32
04/18/23Cirtek Electronics Corporation
Continuous production growth and generating employment.
Delivering profit and dividend every year.
Financially strong.
6 25 Years Proven Track Record
04/18/23
33
Cirtek Electronics Corporation
Company strengths
* The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments, extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service facilities located inside selected areas throughout the country
As a PEZA*-registered entity, the Company enjoys certain incentives like tax holidays, duty free importation of materials and reduced power rate vis-a-vis non-registered entities which enables it to price its products competitively.
Tax incentives Ecozone power rate+ Ability to price
products competitively
Company savings
Entitlement to 5% gross income tax (GIT) incentive. Secure new 4 year income tax holiday (ITH) for new projects
Reduction of 12.5% to 13.5% on power cost
7 A PEZA-registered entity
04/18/23
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Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
04/18/23
35
Cirtek Electronics Corporation
Plans and Programs
This will enable us to support 400 Million units of additional new business from existing and potential customers.
Sustaining cost reduction program, higher quality product and stable process through automation and re-engineering. To develop new packages through innovation to maximize yield and satisfy or exceed customer expectation.
Concluding and enabling Cirtek to realize new potential business in the pipe line worth US$11.8 Million by 2012 and to expand product portfolio.
1 Expansion of Manufacturing facility and Capacity
Innovation and Re-Engineering
Completion of current projects and programs with customers
2 3
New Potential business: Power MOSFET QFN Open cavity moisture / pressure sensor for automotiveOpto Couplers Exposed Cavity Power Amplifier – HSOP Current protection devices
04/18/23
36
Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Product offerings, Services and CEC BOMCompany overview and organization
04/18/23
37
Cirtek Electronics Corporation
Package and Technology Roadmap
HYBRID ASSY
Package Development Roadmap
2005 2007 2009 2011 2013 2014
PDIP SOIC NB SOIC WB
STD TO92
SOT23 SOT143
FLAT TO92
SOT89
METAL CAN
SMT
SMT-COB
SOIC EPAD
CERAMIC ASSY
TSOC SOT23
SOIC W/ CRYSTAL
1.2X0.76X0.76 DFN PACKAGE
1.0X0.5X0.48 DFN PACKAGE
COL / CLEAR PACKAGE DFN
AIR CAVITY QFN / DFN
POWER QFN USING CU CLIP
OPEN CAVITY SENSOR
PCB / LGA / SIP
JEDEC STD QFN / DFN
SOD323 SOT223
HSOP / DSO
0.5X0.25X0.30 DFN PACKAGE
FLIP CHIP ASSY
MSOP
16 QSOP
LED ASSY
TO272
WLCSP
04/18/23
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Cirtek Electronics Corporation
Package and Technology Roadmap
2005 2007 2009 2011 2012 2013
Cost Reduction / Development Roadmap
Brass / steel leadframe (10% lower than Cu)
Soft solder / Eutectic Die attach
Ribbon bonding
Auto Clip attach
Die attach film
Copper wirebond (90% lower than Au)
AuSn Eutectic die attach
BSOB bonding AuAg wirebond
(20% lower than Au)
Chinese leadframe supplier (20% lower cost)
Korean Cu wire supplier (21% lower cost)
Low loop profile
( 3% lower Au cost)
Mold compound selection GE300LC2 (21.8% lower cost)
Ag plating thickness reduction (5% lower cost)
MGP / automold conversion (14% lower cost)
Technology
Material
Ultra High Density Leadframe
( High Volume)
High Density Leadframe
(12% productivity improvement) Matrix Leadframe
Stacked Die attach
04/18/23
39
Cirtek Electronics Corporation
Outline
Final Test, Finishing and FAREL
Product Portfolio and Special Capabilities Company strengthsPlans and programsPackage Technology Roadmap
Services and CEC BOMCompany overview and organization
04/18/23
40
Cirtek Electronics Corporation
04/18/23
41
Cirtek Electronics Corporation
Final Test Summary WAFER PROBE CAPABILITIES
Wafer Prober EG1034 – 4” and 5” EG2001 – 6” EG2080 – 8”
Ink/Inkless less Process ASCII format
04/18/23
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Cirtek Electronics Corporation
Final Test Summary TEST CAPABILITIES
Mixed signal device CREDENCE ASL-1000, EAGLE ETS 500D, LTX
Discrete device TESEC 881-TT, FROTHINGHAM CV3000B
Linear device KEITHLEY, GENESIS
RF / IF device HP RACK & STACK, HP84000
Digital /Asic device FAIRCHILD SENTRY, SIEMENS S725
OPTO relay device TESEC, HIPOT
Protection device TESEC, KEITHLEY
MULTI BIN/POST TEST MARKING SOT 89, 223 TO92
04/18/23
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Cirtek Electronics Corporation
Final Test Summary TEST / TAPE & REEL CAPABILITIES
Integrated test and TNR handlers SRM S248 – SOT SRM XD16 – SOT SRM S12 – SOT VECTOR T20 – SOT QMT 1500 – SOT SRM 248XS – TDFN ASM FT2030 FLEXIPACK – SOIC SRM 244XS – SOIC ISMECA –NX16 – DFN ( 0402)
Test handlers (SOIC/PDIP) MCT 3608/5100 MT 8305/8588/8704 AETRIUM 2020 DTS
TNR handlers (SOIC) G6 Visdynamics Systemation TO 485 with 3D vision STI 8028 / ST 60
04/18/23
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Cirtek Electronics Corporation
04/18/23
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Cirtek Electronics Corporation
Internal / external inspection High / low power microscope
X-RAY SOFTEX 100
Decapsulation DECAP AS2000
Autoclave NAPCO 8110-TD test chamber
Open / short test TEXTRONICS curve tracer
85% / 85oC moisture soak ENVIRO SYSTEM chamber
Temperature cycle ENVIRO SYSTEM chamber
Polisher / grinder (cross sectioning) SBT–MODEL 900
Failure Analysis Capability
04/18/23
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Cirtek Electronics Corporation
Die shear MIL STD 883-2013
Bond strength MIL STD 883-2011
Mark permanency test MIL STD 883-2015
3 mins soaking time using IPA @ 30 strokes Solderability test
MIL STD 883-2003-7 / JESD22-B102D 8 hrs steam aging @ 100oC
Temperature cycle MIL STD 883E-1010.7 /JESD22-104B
10 cycles minimum @ 10 minutes / cycle Low temp @ -65oC (+0, -10oC) High temp @ 150oC (+15oC / -0oC) +150oC (+15,-0oC)
Stability bake MIL STD 883-1008.2
6 hrs @ 175oC
Reliability Test Capability
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Cirtek Electronics Corporation
High temp storage JESD22-A103B
500 hrs min @ 150oC Auto clave
JEDEC 22A 102-C 15 PSI for 96 hrs @ 121oC
Fine leak MIL STD 750D 1071.6 / Test Condition D
30 secs soaking time @ 125oC Moisture soak
IPC / JEDEC J-STD-020C 168 hrs soaking time @ 85% RH / 85oC temp
Reliability Test Capability
04/18/23
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Cirtek Electronics Corporation
WHY CIRTEK as ASSSEMBLY & TEST SUBCONTRACT PARTNER?
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Cirtek Electronics Corporation