· Chip on Board (CoB) Options I2LEDTM – High Power Integrated LED Product Family • High lumen...

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Transcript of  · Chip on Board (CoB) Options I2LEDTM – High Power Integrated LED Product Family • High lumen...

Page 1:  · Chip on Board (CoB) Options I2LEDTM – High Power Integrated LED Product Family • High lumen output and lumen density • Uniform light emitting surface (LES) compared to modules
Page 2:  · Chip on Board (CoB) Options I2LEDTM – High Power Integrated LED Product Family • High lumen output and lumen density • Uniform light emitting surface (LES) compared to modules

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Sapphire Silicon

GaN

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Featured Product

Plessey manufactures low cost high efficiency GaN on Silicon blue die. The die can be customised for a wide range of applications in general lighting including industrial, retail, hospitality and outdoor applications. Specific die are available for both signage and wearable applications. The die can be assembled as single devices or in strings or arrays.

The patented manufacturing process produces a surface emitting structure which has excellent light uniformity and thermal conductivity. Die can be supplied in industry standard sizes up to a maximum of 100mil square. The die technology supports forward voltages between 3V and 48V.

Plessey offers its family of blue die in a range of wavelength options, to cover uses from near UV medical products to visible blue light sources. The standard product provides the blue pump for phosphor conversion to white light.

Application Symbols

MaGICTM Blue LED Die

Spot Lighting

Indicator & Instruments

High Bay

LCD Backlighting

Flood Lighting

DownlightWearables

General Lighting

Commercial Lighting

Horticulture Signage Backlighting

Lamp (bulb) SmallItems

Decor Lighting

Linear Lighting

TubeLighting

Media & Stage

Outdoors & Streetlighting

Available in Blue

Available in White

Available in Amber

Available in Green

EmergencyLighting

Available in Red

Area Lighting

Available in Cyan

Dotmatrix Displays

Directional Lamps

Available inRGBW

Available inRGBA

Plessey Low to Mid Power LED Portfolio

PLW3030DAC Series• 3030 footprint (3.0x3.0x 0.55mm)• 110° wide viewing angle• Vf=6.3V• 150mA• 145lm

3030 / 0.95W

5630 / 0.45WPLW5630BB Series• 5630 footprint (5.7x3.0x0.8mm)• 120° wide viewing angle• 150mA• 68lm

Features

• Simple low cost surface emitting designs • Single junction and multijunction architectures • 60% WPE at 18A/cm2• Input current from 5mA to 3A; peak input

current up to 5A• Wavelength 440-480nm as standard; 410nm-

430nm & 490nm versions available on request• Scaleable from 7mil to 100mil with no

loss of efficiency• Aspect ratios from 1:1 to 3:1• All die manufactured on low cost 6” (150mm)

Silicon substrates• All die supplied sawn and mounted

on membrane• Die thickness 150um as standard, 75um

on request• Gold back metal suitable for solder (AgSn) &

epoxy die attach

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Plessey Low to Mid Power LED Portfolio Plessey High Power LED Portfolio

PLB16A120 Series• Industry standard 5630

footprint• 120° wide viewing angle• Blue engine for remote

phosphor applications• 100mA• 190mW

5630 / 0.03W

PLW2835AA Series• 2835 footprint

(2.8x3.5x0.7mm)• 120° wide viewing angle• 150mA• 68lm

2835 / 0.45W

PLW2835BA Series• 2835 footprint

(2.8x3.5x0.7mm)• 120° wide viewing angle• 60mA• 26lm

2835 / 0.5W

PLW3014CA Series• 3014 (3.00x1.40x 0.75mm)• 120° wide viewing angle• 30mA• 15lm

3014 / 0.90W

PLW114050 Series• Industry standard 3020 footprint• 120° wide viewing angle• 60mA• 21lm

3020 / 1.80W

ALPS Series • Metal alloy substrate for excellent thermal

performance in a ceramic package• Industry standard 3535 footprint• High reliability ceramic package• Domes silicon lens• Full colour range (R,G,B,A, cyan

and white)• 120° wide viewing angle• LM80 test report available

3535 / 0.7 - 2.4W

BLANCA Series• Industry standard 5050 footprint• High optical output• Full white colour range• High reliability ceramic packaging• Domed silicone lens• 145° wide viewing angles• Available as a 4 die (12V)

or single die (3V) emitter

5050 / 0.7 - 2.6W

CERRO Series • Metal alloy substrate for excellent

thermal performance• 140° domed silicone lens version (5050)• Flat silicone lens version (5060)• RGBW, RGBA versions available in

both footprints• High reliability ceramic packaging• Integrated ESD protection

5060 / 1.7 - 2.4W

PLW7070GA Series • Unique multi-junction single chip• 7070 footprint (7.0 x 7.0 x 3.8mm)• Vf=12V• 700mA, up to 1040 Lm• Hot binned at 85C• Up to 150Lm/W• 120 Degree viewing angle

7070 / 8W

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Chip on Board (CoB) Options

I2LEDTM – High Power Integrated LED Product Family

• High lumen output and lumen density• Uniform light emitting surface (LES) compared to modules with

discrete arrays• No shadow effect compared to multi-chip packaged LEDs• Enhanced reliability with our vertical chips with half the number

of wire-bonds• Integrated COB eliminates the need to design a

discrete module• Available in CRI > 90 and 95 and a wide range of CCTs• Available as phosphor dam filled or glob-topped versions• Available in a variety of form factors and power outputs• Lower LED junction temperature due to reduced thermal path

and higher thermal conductivity of silicon substrate• Optimised for large area applications in retail and

industrial lighting

• Single chip solutions from 6V to 24V • Multiple junctions integrated in a single chip eliminate shadow

effects and provide optimised far-field imaging• Compatible with industry standard secondary optics• Shrinks ECG form factor and increases driver efficiency• Input currents from 350mA to 3A• Peak input current up to 5A• 1W to 15W power• Full range of CCT and CRI options• 3535, 5050, 7070 and custom ceramic package options

Plessey’s GaN-on-Silicon die can be assembled into leadframe assemblies to create SMT packages or, as a vertically integrated supplier, we have the capabilities to supply die mounted on a substrate in the form of a chip on board (COB) module. The intrinsic advantages of our GaN on-Silicon die become immediately evident when assembled into COB light engines.

The new i2LEDTM high power product family incorporates Plessey’s MaGICTM low cost surface emitting high power silicon die into a range of industry standard high power LED footprints. The family takes advantage of Plessey’s unique integrated multijunction die architecture to provide differentiated cost effective solutions for industrial, retail and outdoor lighting applications.

Plessey dotLEDTM

LED Filaments

• 120° wide viewing angle• In excess of 1-Lumen per mm• Phosphor CCT range 2000K to 6000K• Optional ceramic or MCPCB substrate

(typical 40:1 length-width aspect-ratio)• Optional stainless SS304 or MCPCB

solder terminations• Optional anode polarity indicator, e.g.

circle, square

dotLEDTM — PLW13D003

• Ultra-thin 1005 footprint• 130° wide viewing angle• 5mA• 250mcd

Plessey’s dotLEDTM range, designed specifically for wearable applications such as smart watches, mobile backlighting and textiles, has a a wide selection of colours, including red, green and blue. The product range addresses the optical, mechanical and cost requirements for display applications in the fast growing wearables market.

The extremely small dotLEDTM is a perfect fit for these low profile wearable applications. The white dotLEDTM is available in a 1005 SMT package (1.0mm x 0.5mm). Delivering up to 1.0Lm of white light with a 130 degree viewing angle from a 5mA drive current, the PLW13D003 meets the demand for ever smaller displays. A blue version, the PLB13D003 is also available in a variety of wavelengths from 460nm to 480nm.

Plessey MaGICTM LED filaments are designed for a range of bulb applications including décor bulb. The light is emitted over a wide emission angle. The filaments are equipped with an internal ballast for stability in parallel connection and also for in-rush current protection. The filaments are terminated with stainless steel connectors that are suitable for a spot weld to the bulb internal framework.

1005 / 0.15W

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Plessey presents StellarTM Beam Forming Modules – ground-breaking lighting modules that shape and hone the light at source.

Beam Forming ModulesPractical Applications...

Combines Plessey’s MaGICTM low-cost, high-efficiency surface emitting silicon die with unique optical beam forming architecture

Delivers compact beam forming, reducing fixture size

Modular family allows homogeneity of fixture design

Simplifies the supply chain, reducing both cost and time to market Customised CRI and CCT specific to the application

Shifts the luminaire design paradigm for high luminous flux directional lighting

...in industryBuild high bay lights with less bulk and less weight

Design compact, energy-efficient solutions

Potential to significantly reduce product size and weight, reducing inventory and shipping costs

...outdoorsPut light where you need it with beam forming

Potential for reduced product footprint, allowing non-intrusive illumination

Compact form factor means the product can be situated in small spaces

...in retail

Create revolutionary shallow-form luminaires for minimalist elegance and seamless integration into interior space

StellarTM configuration of beam-forming modules optimises light distribution

Design your lightscape and define your retail space

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DISTRIBUTORS & REPRESENTATIVES

Plessey HeadquartersTamerton Road, Roborough, Plymouth, Devon, PL6 7BQ, United Kingdom T: +44 1752 693000 | F: +44 1752 693200 | [email protected]

UK & IRELAND

Solid State Supplies Tom Freeman | T:+44(0)1527 830800 | [email protected] | www.sssltd.com

EUROPE, MIDDLE EAST & AFRICA

BELGIUMAlcom T: +32 (0)3 458 3033 | [email protected] | www.alcom.be

FRANCESyscom Electronique Jean-Marie Lecuyer | [email protected] | www.syscomelectronique.com

ITALYCodico GmbH Sergio Rossi | M:+39 366 8140982 | T:+39 0362 364358 | [email protected] | www.codico.com

RUSSIARadiant Group LLC Ivan Medvedev | T:+7495 725 0404 | [email protected] | www.radiant.su

TURKEYROM Elektronik Resat Erunsal | T:+90 216 492 85 8550 | [email protected]

DENMARK, GERMANY, AUSTRIA, SWITZERLAND & EAST EUROPE

Codico GmbH Christoph Seper | T:+43 1 86 305 – 0 | [email protected] | [email protected] | www.codico.com

FINLAND, LATIVIA, ESTONIAN & LITHUANIANFintronic Oy Janne Vasama | T:+358 9 2512 7770 | [email protected]

ISRAELDawntek Electronics Ltd Zeev Abramovitz | T:+972 9 7444562 | [email protected] | www.dawntek.co.il

SOUTHERN AFRICA & MAURITIUSTempe Technologies Pty Ltd Willem Hijbeek | Tel:+27 11 4555587

GERMANY, AUSTRIA, SWITZERLAND & EAST EUROPE

Codico GmbH Christoph Seper | T:+43 1 86 305 – 0 | [email protected] | [email protected] | www.codico.com

ITALYMelchioni Giuliano Sala | [email protected] | www.melchioni.it

THE NETHERLANDSAlcom Electronics Marco van Oosten | T:+31 (0)10 288.25.00 | [email protected] | www.alcom.nl

SPAIN & PORTUGALMatrix Electronica S.L. Nuria Vilalonga | T:+902 19 8146 / +34-91 560 2737 | F:+902 99 5414 / +34-91 565 2865 | [email protected] | www.matrix.es

AMERICAS

David Donovan Vice President of Sales, America | T:+1 856 229 4145 | [email protected]

NORTH AMERICA REPRESENTATIVES

Mouser T: +1 800-346-6873 | [email protected] | www.mouser.com

FLORIDA MEC T:+1 800 375 6662 | [email protected]

ALABAMA/MISSISSIPPI/TENNESSEEMEC T:+1 256 351 0352 | [email protected] | www.mec-corp.com

NORTH AMERICA DISTRIBUTORSSaelig T:+1 888 7-SAELIG (888 772-3544) | [email protected] | www.saelig.com

SOUTH [email protected] | [email protected]

GEORGIA MEC T:+1 813 220 2945 | [email protected]

CONNECTICUT/MASSACHUSETTS/VERMONT/MAINE/RHODE ISLAND/NEW HAMPSHIRE Plessey | T: 856-229-4145 | [email protected])

OHIO/WESTERN PENNSYLVANIA/MICHIGAN/INDIANA/KENTUCKY Focus Design Technologies T:+1 440 285 5591 | [email protected] | www.focusdt.com

MINNESOTA, NORTH DAKOTA, SOUTH DAKOTA, IOWA, WESTERN WISCONSIN Northstar Technology Sales | Chuck Diehl | [email protected] | www.northstartek.com

Mouser Tel: +1 800 346-6873 | [email protected] | www.mouser.com

NORTH/SOUTH CAROLINA MEC T:+1 919 215 2555 | [email protected]

NORTHERN CALIFORNIA AND NORTHERN NEVADA Schoenduve T:+1 650 962 8330 | [email protected] | www.schoenduve.com

OREGON/WASHINGTON/IDAHO Discovery Technical Sales Inc. T: 1-503-473-8407 | [email protected] | www.dtsnw.com

TEXAS, OKLAHOMA, ARKANSAS, LOUISIANA, MEXICO TriStar Group Bob Harrison | T:+1 972 392 2848 | [email protected] | www.tsgrep.com

CHINAPlessey Shenzhen T:+86 (0755) 2382 4739

Full Treasure (China) Ltd. Alex Choi | T:+852 9370 7246 | T:+86 186 7672 2843 | [email protected]

Vitec Eddie Chan | T:+85 254 890 108 /+86 147 1549 0108 | [email protected] | www.vitec.co.jp

SINGAPORE, THAILAND, MALAYSIA, VIETNAM, INDONESIA, PHILIPPINES

Alphatec Pte Ltd [email protected]

JAPAN, TOKYOCornes Technologies Ltd T:+81 3 5427 7564 | [email protected] | www.cornestech.co.jp

AUSTRALIA & NEW ZEALAND

Alan Suyko | T:+61 2 8850 0350 | M:+61 400 886 754 | [email protected] | www.glyn.com.au

KOREAPostTech Ltd. T:+82-31-708-1788, +82-10-2707-7780 | [email protected] | www.posttech.co.kr

Cornes Technologies Ltd Osaka | Tel: +81 6 6532 1012 | [email protected] | www.cornestech.co.jp

INDIA Spectra G.P. Deshpande | T: +91 80 4252 7888 | [email protected] | www.spectraind.com