CHILISIN ELECTRONICS CORP. - Промэлектроника · 13 Comprehensive Product Portfolio...
Transcript of CHILISIN ELECTRONICS CORP. - Промэлектроника · 13 Comprehensive Product Portfolio...
CHILISIN ELECTRONICS CORP.
Company Presentation 2013
Corporate Overview
Product Introduction
Product Roadmap
2
Outline
Leading Brand in China
3
Company MilestonesA Local Ferrite Producer
Business Expansion
Major Domestic Player
World-class Company
1972 1977 1990 1998 1999
Year
40,000
80,000
120,000
2002
Established
Developed Mn-Zn and Iron Core
Developed SMD Power Inductor
Public listingon TWSE
20012000
60,000
1997 2003
Rev
enue
K $USD
20072005 20112009 2013
100,000
Established second plant
Developed Wire-Wound and Multilayer
Developed High-Frequency Chip Inductor
Expanded ChinaDongGuan plant
EstablishedChinaSuZhouoffice
Constructed Hukou new HQ and plant
Established China Henan plant
Company established
EstablishedU.S. office
Established China DongGuan plant
EstablishedKorea office
Acquired Belkin Int’l
Formed strategic alliance with Yageo
Developed Moldingand Thin-Film Technology
$3,158
$2,580
$2,216
$2,479
$2,218 $2,408
$0
$500
$1,000
$1,500
$2,000
$2,500
$3,000
$3,500
2008 2009 2010 2011 2012 2013F
Global Value
Chilisin Growth vs. Global Market($USD ’000) ($USD Million)
Source: Paumanok Publications, Inc .
2009~2012 Global
Revenue Growth 94.2% -14.0%
CAGR 24.8% -4.9%
4
Sales Breakdown 2012 – By Region
Sales Breakdown 2012 – By Market Segment
Major Customers
AutomotivesAutomotives
PC / SystemsPC / Systems Consumer ElectronicsConsumer ElectronicsTelecommunicationTelecommunication
OEMs / EMSsOEMs / EMSs
*Any trademarks or logos used throughout this presentation are the property of their respective owners, Chilisin does not claim ownership or distribution rights of the above logos
Global Network & Support
8
Chilisin HQ and Factory
Hukou, Taiwan
Powder FactoryTouliu, TaiwanFactory
Dongguan, China
FactorySuzhou, China
FactoryHenan, China
Distributors and agents Sales offices
Branch OfficeAanyang, Korea
Branch OfficeSan Jose, USA
Manufacturing sites with sales offices
FactoryDongguan, China
Est. 1997Employee: 1,199
FactoryHenan, China
Est. 2010Employee: 518
FactorySuzhou, China
Est. 2001Employee: 96
HeadquarterHukou, Taiwan
Est. 1972Employee: 751
9
Factory Overview
Molding
Wire-Winding
Multi-layering
Thin-film
Through-hole
Manufacture Site Finished Products Inventory
-----------------------------------All factories are ISO 9001 and TS 16949 certified ----------------------------------
LED Home AppliancesComputing / Mobile
Display DSC
Diversified Applications
Graphic CardAlternative EnergySet Top Box
Game Console
Automotive
Server
Mother Board
Corporate Overview
Product Introduction
Product Roadmap
11
Outline
Leading Brand in China
Appendix
12
MoldingWire-winding Multi-layering Thin-film Process
Power Inductor• Wide range• for power solution
Magnetic-resin Power Inductor• 2016~3030 size
for mobile phone• 4040~5050 size
for tablet PC• 6060~8080 size
for TV/audio
Chip Inductor• Ferrite core for power line• Ceramic core for signal line
& RF matching
Common Mode Choke• for USB2.0/3.0/HDMI
Power Inductor• DIP type• for motherboard
Power Inductor
• SMD type• for notebook & tablet PC
Power Inductor• SMD (miniature) type• for handset & ultrabook
Bead Chip Inductor• High frequency• Downsize from 0402 to 0201
Chip Inductor• for handset
New ProductsPower InductorCommon Mode Choke
New ProductsCommon Mode Choke
Product Line and Technology
In-house Powder Mixing
Technology
Core Formation
Powder Formula
13
Comprehensive Product PortfolioMultilayer Power InductorMultilayer Chip InductorMultilayer Chip BeadMultilayer 0805 USB2.0 CMMThin Film RF Inductor
SMD Series
Ni-Zn SeriesEMI FilterSoft Ferrite
Core SeriesIron/Ferrite Toroid
Power Line EMI FilterData Line EMI FilterCoil Series
Comparable with Murata, TDK, Taiyo Yuden, Sumida, Vishay, Coilcraft, Pulse, Wurth….
0805 USB3.0 CMM0805 USB2.0 CMM0805 HDMI CMMChip Wire-wound Inductor
SMD Power InductorSMD Power BeadSMD Molding Choke
Toroidal CoilRF Choke
Leaded Power Inductor Leaded Molding Choke
In-house Ferrite Core
13
Production Capacity
14
Molding Wire-windingMulti-layering
Thin-film Through-hole
Total: 40 Total: 100
Total: 2,600 Total: 85 Chip Inductor Total: 120
(Million Pcs/month)
Common Mode Total: 30
Power Inductor Total: 160
15
Miniaturization
High Current
Low ProfileLow Rdc
Green Compliance
RoHsREACH
40A
20A
60A
1.5mm
1.0mm
0.5mm
04020201
01005
< 2m
<5m
<10m
Product Development Trend
HF
15
Corporate Overview
Product Introduction
Product Roadmap
16
Outline
Leading Brand in China
Appendix
17
SBJ0603(BLM03BD)
~600Ω
PBY1005(BLM15AX)
~1000Ω
UPB0603(BLM03PX)
~22Ω UPB0603(BLM03PX)
80Ω UPB0603(BLM03PX) 120Ω
UPB1005(BLM15PX)
33~80Ω UPB1005(BLM15PX)
180~220Ω UPB1005(BLM15PX)
~600Ω
UPB160805 26~120Ω(BLM18SG_TN)
UPB160805(BLM18SG_TN)
120~330ΩPBY0603 (BLM03AX) 600Ω/1000ΩHFY0603 (BLM03HG) 600Ω/1000ΩHFJ0603 (BLM03HD) 600Ω/1000Ω
MPx252010(LQM2HPN_G)
1.0uH/48mΩ2.5A/2.9A
MPx201610(MPx201610)
1.0uH/150mΩ1.4A/1.6A
CMF1210(CMM0504)
90Ω/120Ω
CMF1210+ESD (CMM0504+ESD)
2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1
Chip bead
TraditionalPhotoTech
Power Inductor
Traditional
CMM
Photo Tech
Multilayer Type
Product Roadmap90Ω/120Ω
18
2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1
MHCC – Amorphous powder for core material to enhance electrical characteristics
MHCD2520≦1.5uH
MHCD25202.2~4.7uH
MHCD2016
AME201610(DFE201610)1.0uH 80mΩ 2.7A/2.3A
AME201612(DFE201612)4.7uH 200mΩ 1.9A/1/5A
AME252010(DFE252010)4.7uH 250mΩ 1.6A/1.2A
AME252012(DFE252012)
10uH 400mΩ1.3A/1.0A
AME201610 (DFE201610)2.2uH 170mΩ 1.9A/1.4A
Molding Type
Product Roadmap
19
2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1
Wire-wound Type
Product Roadmap
CS0201 0.6x0.5x0.45
CM0302 0.9x0.5x0.45
PM0402High Irms 1.1x0.5x0.45
PM0603High Irms
1.8x1.15x1.0
HP0603High Irms
1.8x1.15x1.0
SCID3015 3.0x3.0x1.5Shielded, Coupled Inductor
SCID3010 3.0x3.0x1.0Shielded, Coupled Inductor
LVF121010 1.2x1.0x1.0Shielded
MDSC/MRSC25201x 2.5x2.0x1.0/1.2Shielded, Metal
LVF161010 1.6x1.0x1.0Shielded
20
2013 Q1 2013 Q2 2013 Q42013 Q3 2014 Q1
Thin-film
InductorThin-filmCom
mon-
mode choke
Thin-film + Molding
Power Inductor
TFL0603(TFL0201)
~22nH
CMF0806(CMM0302) 90Ω
TFP201610(TFM201610) 1.0uH
60mΩ2.9A/2.2A
TFP201210(TFM201210) 1.0uH
140mΩ2.2A/1.3A
Thin-film Type
Product Roadmap
Corporate Overview
Product Introduction
Product Roadmap
21
Outline
Leading Brand in China
Appendix
Best Partner Award from Coolpad (2012) Best “Cooperate To Win” Award from Lenovo (2011) Outstanding Supplier Award from SerNet (2011) Best Supplier Award from New Kinpo (2010) Best Supplier Award from Asus (2005)(2007) Best Supplier Award from Solectron (2007) Best Supplier Award from Zyxel (2006)(2007) TS16949 Certification (Since 2005) Samsung Eco-Partner Certificate (Since 2005) ISO 14001 Certification (Since 2004) Sony Green Partner Certificate (Since 2003)
22
Certificates and Awards
23
Customer Design-in
Circuit Simulation
Material Research & Developmet
Technical Seminar
Product Development
Teams:EE & Material
R/L/C Know-how
Value-added ServiceWork Frame for Engineering Support
2424
Trustworthy Supplier Competitive Products
Full Range of Magnetics Series Sufficient Capacity Support World-class Quality Cost Competitiveness Quick Delivery Flexible Logistic Support
Value-added Service
Professional Engineering Support Concurrent Product Innovation Design-in Capability Total Solution Provider
24