Chemical and thermodynamic studies of dental gold alloys with...
Transcript of Chemical and thermodynamic studies of dental gold alloys with...
Chemical and thermodynamic studies of dental gold alloys with special reference to homogenization, electrochemical corrosion and cluster formation
AKADEMISK AVHANDLING
SOM MED VEDERBÖRLIGT TILLSTÅND AV
ODONTOLOGISKA FAKULTETEN VID UMEÅ UNIVERSITET
FÖR VINNANDE AV ODONTOLOGIE DOKTORSEXAMEN
OFFENTLIGEN FÖRSVARAS I SJUKSKÖTERSKESKOLANS
AULA, LASARETTET, UMEÅ,
LÖRDAGEN DEN 6 MARS 1976 KL. 09.15 f.m.
AV
MAUD BERGMANleg.tandläkare
UMEÄ 1976
UMEÅ UNIVERSITY ODONTOLOGICAL DISSERTATIONSABSTRACTS
No. 6From the Department of Dental Technology and the Department of Inorganic
Chemistry, University of Umeå, Sweden
Chemical and thermodynamic studies of dental gold alloys with special reference to homogenization, electrochemical corrosion and cluster formation
by
MAUD BERGMAN
Umeå 1976
This thesis is based on the following publications, which will be referred
to by their Roman numerals.
I Heat treatment of soldered joints in dental casting gold alloys. An
electron microprobe analysis. In collaboration with Åke Björnham.
Acta Odont. Scand. 1972, 30:415-439.
II Dissolution rate of cadmium from dental gold solder alloys. In
collaboration with Olle Ginstrup. Acta Odont. Scand. 1975, 33:199-210.
Ill Structure and properties of dental casting gold alloys
I. Determination of ordered structures in solid solutions of gold,
silver and copper by interpretation of variations in the unit cell
length. In collaboration with Lars Holmlund and Nils Ingri. Acta
Chem. Scand. 1972, 26: 2817-2831.
IV Structure and properties of dental casting gold alloys
II. Emf-measurements using stabilized ZrO^ as solid electrolyte
as a means of studying cluster formation in gold-copper alloys.
In collaboration with Erik Rosén. Acta Odont Scand. 1975. Preprint.
Centraltryckeriets Offsetavd Bröderna Larsson Umeå -76
CONTENTS PAGE
INTRODUCTION 4
THE AIM OF THE INVESTIGATIONS 7
PART ONE (I, II) Background 8
MATERIALS 9
METHODS 11
RESULTS 16
DISCUSSION 26
CONCLUSIONS OF PRACTICAL IMPORTANCE 32
PART TWO (III, IV) Background 34
MATERIALS 35
METHODS 36
RESULTS AND DISCUSSION 39
CONCLUSIONS IN SUMMARY 53
GENERAL SUMMARY 57
ACKNOWLEDGEMENTS 59
REFERENCES 60
4
CHEMICAL AND THERMODYNAMIC STUDIES OF DENTAL GOLD ALLOYS WITH SPECIAL
REFERENCE TO HOMOGENIZATION, ELECTROCHEMICAL CORROSION AND CLUSTER FORMATION
INTRODUCTION
Gold alloys have a wide application in dentistry mainly because of their
high corrosion resistance in the oral environment together with suitable
mechanical properties. The ADA specification No. 5 covers dental casting
alloys based on gold and provides a range of alloys for various kinds of
dental restoration. Generally the alloys with simple high-gold-content
compositions are relatively weak and soft and their use is therefore
limited to restorations which are exposed to a load of low magnitude.
When the restoration has to carry heavy stress concentrations alloys with
greatly improved mechanical properties are needed. To meet this requirement
the simple gold-si 1ver-copper alloys are modified by the addition of metals
from the platinum group, especially platinum and palladium. Most commercial
dental gold alloys contain in addition small amounts of zinc which act as a
scavenger by combining with any oxide present. The presence of zinc also
reduces the fusion temperature of the alloy thus increasing the ease with
which the alloy can be cast. Indium is sometimes used in low concentration
as an alloy component because it is a less volatile scavenging element.
Indium also contributes to casting fluidity and a more uniform grain size.
Iridium in very small amounts is sometimes added as a grain refining agent
(Nielsen & Tuccillo 1966, Phillips 1973, Craig et al 1975).
Gold solder alloys are used for assembling a bridge and, sometimes, for
building up a crown locally to ensure a correct relationship with adjacent
teeth. These alloys have compositions which are similar to those of the
casting gold alloys. This is necessary to guarantee colour, mechanical pro
perties and corrosion resistance comparable to those of the alloys being
5
5fC
joined. However, the fusion temperature of a solder must be 50-70 K below
that of the casting alloy to be soldered, in order to allow a sufficient safety
margin and to make the alloy flow more easily during soldering. Thus the
fusion temperatures of the solder alloys are reduced by an increased amount
of zinc or by the addition of tin and cadmium for example. Phosphorous may
sometimes be added to gold solder alloys as a deoxidizer. If a "white"
coloured solder is required, nickel can replace copper in the alloys (Taylor
& Teamer 1949, Phillips 1973, Asgar et al 1975).
For special techniques, for example when porcelain is fused to a dental
bridge the requirements of both the casting gold alloy and the solder alloy
generally implies that the compositions of the alloys are further modified.
The use of dental gold restorations with different requirements regarding
their physical properties thus makes it necessary to have a differentiated
assortment of alloys. The responsible manufacturers of dental gold alloys
make a creditable effort to develop and improve their alloy materials as well
as laboratory methods. However, less responsible manufacturers seem to use
mainly "trial and error" methods in producing some of their gold alloys
which, among other things, results in the availability of an unnecessarily
large number of dental gold alloys. When judging the corrosion resistance of
dental metallic restorative materials it is desirable to consider the entire
oral environment. Thus an alloy might be corrosion resistant per se when ex
posed to different kinds of tests but when used in the oral cavity together
with other gold alloys of very different compositions a situation which pro
motes corrosion may appear due to synergetic effects. From this point of
view it is undesirable to have too many gold alloys for use within the same
field of application.
*In the present thesis the temperatures are given in the SI base unitkelvin. t/°C = T/K - 273.15.
6
The main requirements for dental gold alloys can be summarized as follows:
First, the alloys should resist tarnish and corrosion in the oral environ
ment and second, they should have physical properties which meet the require
ments of the various types of dental restoration.
The first demands that the noble metal content of the alloy must be kept at
a level which will ensure tarnish and corrosion resistance. It also implies
that the melting of the alloy as well as the further laboratory working
moments must be carried out in such a way that any promotion of eventual
corrosion is avoided. The second requirement demands the production of alloys
with for example different melting temperatures and different mechanical pro
perties. In general the tensile strength and proportional limit of these
alloys increase with hardness, while the elongation decreases. An increased
hardening of the temperable gold alloys is attained by suitable treatment,
usually involving heating and cooling.
The heat treatment of the ready-made dental restoration in routine dental
laboratory techniques often involves a homogenizing heat treatment followed
by a hardening heat treatment. The achievement of the maximum increase in
the hardness of an alloy depends, among other things, on the preceeding heat
treatment and quenching temperature. Thus it is undesirable either to use a
scheme which limits the quenching temperature after casting to a standard
value or to use any standard procedure at the subsequent heat treatments.
Such measures tend to restrict unnecessarily the possibility of securing an
optimum result as concerns the dental gold restorations (Wise 1964, Phillips
1973), especially as many manufacturers provide individual laboratory in
structions for their alloys.
7
THE AIM OF THE INVESTIGATIONS
The composition of a dental gold alloy together with the different solid
state reactions which occur during heat treatments are thus factors of basic
interest for the evaluation of the technical quality and durability of the
final product, the dental gold restoration. It was the general purpose of
the present work to elucidate some of these factors. The more specific aims
were as follows:
1. To investigate whether, in gold-soldered assemblies, any changes in the
distribution of available alloy components occur in the region of the
soldered joint after various kinds of conventional heat treatment (I).
2. To determine in vitro the dissolution rate of cadmium from commercial
dental gold solder alloys of those types which are commonly used in
soldered bridge constructions (II).
3. To indicate the composition and amount of clusters in solid solutions of
gold, silver and copper through interpretation of variations in the unit
cell length (III).
4. To determine the activity of copper in alloys of copper and gold to obtain
additional data for testing the previously (in Paper III) proposed cluster
model (IV).
Papers I and II are dealt with in part one of the present work while Papers
III and IV are dealt with in part two.
8
PART ONE (Papers I and II)
Background. Dental gold castings have been found to be far from homogeneous
(Björn & Hedegård 1965, Söremark et al 1966, Eick & Hegdahl 1968) and this
lack of homogeneity in the gold restorations has been seen as one of the
contributery factors in the electrochemical process of oral corrosion (Spreng
1940, 1963, Hedegård 1958). Not only does such corrosion give rise to un
desirable effects on the dental restoration itself, but it may also be a
factor in the production of pathologic changes in biological tissue. Metallic
elements from dental gold restorative materials have been shown to migrate
into hard and soft oral tissue (Söremark et al 1962, Bergenholtz et al 1965).
A number of symptoms and effects attributed to galvanic corrosion in the
oral cavity have been reported, e.g. Lain et al 1940, Schriever & Diamond
1952, Rheinwald 1953, Hedegård 1958, Frykholm & Hedegård 1968. A few cases
of hypersensitivity reaction to gold alloys are described in the literature
(Charpy 1952, Tornei! 1962, Frykholm et al 1969, Eigart & Higdon 1971).
According to Eick & Hedegård (1968) and Hedegård (1974) high temperature
heat treatment of a dental gold cast has a tendency to level out concentra
tion gradients due to intracrystal 1 ine segregation. Hedegård (1949, 1958,
1974) therefore recommends that any cast or cast and soldered dental gold
restoration should be exposed to so called homogenizing heat treatment
before being finally installed in the oral cavity. This statement is perhaps
valid as concerns single casts but it cannot be taken for granted that the
proceeding should be extended to include soldered constructions.
Among those alloy elements which can be dissolved from dental gold alloys
by corrosion, cadmium has received a great deal of attention during the last
few years (Kawahara et al 1968, Kawahara et al 1975). This alloy element is
frequently used in dental gold-solder alloys where it contributes to a lower
ing of the fusion temperature (Phillips 1973). Studies in progress
9
(Bergman et al 1976) show that cadmium from test pieces of a commonly used
dental gold solder alloy, subcutaneously implanted in rats, is released and
accumulated principally in the kidney and in the liver.
MATERIALS
-In Papers I and II only commercially available gold alloys were used.
In the paper dealing with heat treatment of soldered joints, (I), the three
casting gold alloys studied were of the types which are commonly used for
fixed crown and bridge restorations and for details of removable partial
prosthesis. The alloy A corresponded to type III and the alloy C to type IV
according to ADA specification No. 5,1973, while the alloy B lies between
type III and IV according to the same specification. The solder alloy used in
this study was of a type commonly used for the soldering of hard gold dental
assemblies. The chemical compositions of the four alloys are given in Table I.
Table I. Chemical composition in weight per cent of the alloys investigated. Code: 1 = specimen which was melted and quenched specially for the chemical analysis, 2 = specimen from one of the original parent samples of each alloy (marked "g"), 3 = alloy formulas provided by the manufacturer.
Alloy Code Au Ag Cu Pt Pd Zn In Ir
A 1 74.7 10.3 11.0 0.46 3.5 0.57 <0.1 0.012 74.0 10.4 11.0 0.46 3.5 0.51 <0.1 0.013 74.0 10.5 11.0 0.50 3.5 0.50
B 1 71.0 10.0 12.9 0.01 6.2 0.58 <0.1 <0.012 70.7 10.0 12.9 <0.01 6.3 0.71 <0.1 <0.013 70.0 10.5 13.0 6.0 0.50
C 1 66.9 10.6 12.3 9.6 0.1 0.52 <0.1 0.092 66.7 11.3 12.2 8.2 0.1 0.21 <0.1 0.073 68.0 12.0 12.5 7.0 0.50
Solder 1 70.0 5.2 15.2 2.87 <0.1 0.83 -5 0.053 71.0 5.5 15.0 2.75 0.75 -5
10
For each of the three casting alloys four parent samples were prepared as
described under "sample preparation" in Paper I. Each of these samples was
divided into twelve pieces of approximately the same size. The pieces were
each given a number and ten pieces were randomly grouped in pairs (marked
a, b, c, d, f) while the remaining two pieces (marked e and g) were used to
represent the "as cast" condition. The paired pieces were then soldered
together two and two. Various heat treatments followed by bench cooling for
one minute and then quenching in water were carried out. The marked specimens
originating from each parent sample were treated as follows:
a: no further heat treatment after soldering
b: heat treatment for 3 hours at 973 K after soldering
c: heat treatment for 1 hour at 973 K after soldering
d: heat treatment for 1 hour at 973 K after soldering, and then hardening
heat treatment from 723 K to 523 K for 30 min followed by quenching
e, g: representing the "as cast" condition (extra samples)
f: heat treatment for 1 hour at 1073 K before soldering and for 1 hour at
973 K after soldering.
The heat treatments were carried out in an inert atmosphere of argon except
the hardening of the d-marked samples which took place in the atmospheric
milieu of a common porcelain furnace. Four series of the a-d specimens and
two series of the f specimen were produced from each alloy giving in total
54 samples which were mounted in methyl methacrylate resin and then polished
using a standard metallographic procedure. The e and g specimens were intended
for reserve use and were not included in the electron microprobe investigation.
In the paper dealing with dissolution of cadmium from solder alloys, (II),
11
six different dental gold solders of the types commonly used for the solder
ing of fixed gold restorations were studied. For comparison the dissolution
rates of copper and zinc were determined. The compositions of the alloys as
concerns the elements studied are given in Tables III-V. The analyses were
carried out by Analytica AB, Sollentuna, Stockholm. "Analysis 1" was made
using the roentgen fluorescence method on alloy samples with the same marking
as the electrode specimens. Before this analysis was performed the material
was melted. "Analysis 2" was made using atomic absorption spectrophotometry
on the residues of the electrodes after the corrosion experiments. In this
case the samples were directly dissolved in acid. The alloy material in band
form was coiled and mounted in a glass tube. The exposed surface of the alloy ?was about 2-4 cm .
The electrolyte used was physiologic saline solution. By addition of potassium
hydrogen phtalate the pH of the solution was buffered to 4.0. This electrolyte
solution was marked "A". In one test series the pH of the electrolyte was
further adjusted to 6.5 with sodium hydroxide solution; this solution was
marked "B". The gas phase used throughout these experiments consisted of an
oxygen-nitrogen mixture of known composition (0.209 ± 0.005 % 0^). Thus in
the experiments the partial pressure of the oxygen was 0.21 kPa as compared
to 21 kPa in normal air. As oxygen interferes with the metal dissolution and
it is practically impossible to remove all oxygen this composition was chosen
to obtain well-defined experimental conditions. All the experiments were
carried out at room temperature (298 K).
METHODS
Firstly the methods used in the electron microprobe study (I) will be
described and then the methods used in the potentiostatic study (II).
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(I). The electron probe microanalysis of the 54 specimens was carried out at
the Swedish Institute for Metal Research (Stockholm) using a Cameca MS 46
microprobe analyzer. This and other electron probes as well as their fields
of application have been described by Kiessling (1960) and Brown & Thresh (1970).
Before the development of the electron probe microanalyzer there was no satis
factory way of determining the distribution of the various constituents of a
material on a micron scale. However, the importance of the electron probe is
not its sensitivity but rather its ability to analyze non-destructively very
small volumes of material.
The element distribution across the gold-solder junction was determined by
moving the specimen progressively under the electron beam. The line analysis
was started in the cast alloy at a distance of 250 pm from the gold-solder
junction and proceeded across this junction into the middle of the soldered
joint. If the joint was very narrow the line analysis proceeded further into
the cast alloy on the other side of the soldered joint. In this way a line
of about 350-500 pm was scanned. Some of the heat treated specimens were
subjected to point analysis of the special demarcated domains, "microphases",
which were observed precisely at the gold-solder junction. Microphotographs
of each of the alloy specimens were taken.
Statistical treatment. The concentration curves were divided into two segments
by the gold-solder junction. Each curve segment has been regarded as a
realization of a stationary process. For each type of treatment, periodicity
i.e. regular segregation of elements, and some other properties of the process,
are given by estimating its mean level and covariance function. Corresponding
properties of the interactions between any two curve segments of the same alloy
are given in a similiar way. By comparing these results some conclusions about
the effects of heat treatments could be drawn, though the sample sizes were
small.
13
(II). The electrochemical cell is shown in Fig. 1. The working electrode, WE,
consisted of the sample. The current direction was anodic (metals were dissolved)
Me(s) -* Me2+ + 2e" (I)
The counter electrode, CE, consisted of a spiral of platinum wire mounted in
a glass tube with a plug of glass filter at the bottom. The electrolysis
current passed through the solution and the glass filter and evolved hydrogen
gas at the counter electrode:
2H+ + 2e~ - H2(g) (II)
The reference electrode, RE, was a commercial saturated calomel electrode
(Metrohm AG, CH - 9100 Herisau). Several reference electrodes were compared.
They agreed within a few millivolts.
The potentiostat (Fig. 2) sensed the potential difference between the working
electrode and the reference electrode. This potential difference was compared
with a preset voltage from a ten-turn potentiometer, E2. The potentiostat sent
an appropriate electrolysis current through the counter and working electrode
system to bring the potential difference El close to the preset voltage E2.
The tolerance was a fraction of a millivolt. The common value of El and E2
is denoted by E in the following. The electrolysis current was integrated by
means of an electronic integrator. The integrator reading was taken from a
digital voltmeter and from a recorder. The electronic components were adjusted
to give a direct reading for the amount of electricity, Q, passing the working
electrode. The accuracy of the adjustment was better than 0.1 %. The experi
mental set-up was similar to that described by Johansson (1965). When an
appropriate amount of electricity had reacted (usually 30 ymol e") the experi
ment was terminated and the electrolyte solution was analysed as regards
cadmium, copper and zinc by atomic absorption spectrophotometry (Department
14
Fig. 1. The measuring cell. Legend: CE = counter electrode;WE = working electrode (the specimen); RE = reference electrode; Gas = gas inlet tube.
CELLPOTENT IOSTAT
INTEGRATOR
Fig. 2. Principal schematic diagram of the cell, potentio- stat and integrator. Legend: CE, WE and RE are the electrodes as in Fig. 1 ; El = potential difference between RE and WE; E2 = adjustable control voltage; 163 = operational amplifier, Analog devices 163; R1 = precision resistor, 10.68ft; R2 = precision switchable resistors, 200 kft,2 Mft or 20 Mft; C = polystyrene precision condenser, 5.0 yF;SP656 = chopper stabilized operational amplifier, Phil brick SP656; REC = strip chart recorder, HEATH JR-18 M; DVM = digital voitmeter.
rm
15
of Analytical Chemistry, University of Umeå). The quantities measured were:9
The electrode area (mm ), E versus SCE (mV), Q (ymol e ), time (min), con
centrations of the three metals in the solution (ppm), see Table I in Paper II.
Calculations. The calculated quantities were: firstly the current efficiencies
for dissolution of each of the three metals and then logarithms of dissolution"Merates. The current efficiency (2x-—) is the fraction of the amount of elec-
e~tricity used for the dissolution of one of the metals.
Electrochemically the most interesting quantity is the logarithm of the-1 -2dissolution rate, LDR, where "dissolution rate" has the unit: mol s m .
In the investigation the measurements were centered around LDR = -6 which-6 -I -2corresponds to a dissolution rate of 10 mol s m or a dissolution rate
-1 -2of 3.5 mg Cd year mm . The logarithmic scale was chosen because LDR is a
linear function of the applied potential E, see Fig. 3. According to electrode
kinetic theory (Vetter 1967) the following relationship, called Tafels equa
tion, may be expected
n = a + b log i (1)
where n is the overtension, i is the electrolysis current and a and b are
constants. In the present case Tafels equation may be formulated:
LDR = Cl + C2 (E - 800 mV) (2)
where Cl and C2 are constants, referring to the measuring series and 800 mV
is a potential value chosen arbitrarily in the center of the measuring range.
A least squares method was used to fit the measuring points of each measuring
series to equation (2). The results are given in Tables III-V. In Table III,
the LDR for cadmium has been extrapolated to E = 550 mV.
16
O O
E/mV
Fig. 3. The logarithm of the dissolution rate (LDR) for Cd, as a function of the applied potential (E). The least squares straight line describing the measuring points of the series with specimen codes 2, 4, 5, 6 will be extrapolated to a potential range (500-600 mV) which can be found in the oral cavity. °
RESULTS
(I). The chemical compositions of the alloys as revealed by X-ray fluorescence
analysis and atomic absorption spectrophotometry agreed well with the alloy
formulas provided by the manufacturer (Table I). No inclusions due to extraneous
factors in the laboratory techniques were found in the analysis of the samples.
The demarcated domains, "microphases", which appeared on the microphotographs
17
of the gold-solder junctions (see Fig. 4 in Paper I) of all the homogeni
zing heat treated samples of the alloy C and some of the heat treated samples
of the alloy B (Bid, B2b, B3b and c, B4d) were further investigated by point
analysis using the microprobe analyzer. These domains had compositions (Table II)
which varied a great deal from those of the original alloys (Table I).
Table II. Composition in weight per cent of the demarcated domains emerging in the region of the gold-solder junction after heat treatment.
Specimen
Time forheat treatment(hours)
Domain localization Weight per centAu Ag Cu Pt Pd Zn In
C4b 3 Junction 45 2.0 15.6 28.5 1.2 5.7
Nearest to the junction in the cast alloy (two different domains)
48.761.6
4.612.2
21.8 14.9
23.04.2
1.00.2 0.3
Nearest to the junction in the solder alloy 64.0 6.7 17.5 4.2 0.5 3.6
Cl d 1 Junction 54.3 3.2 18.2 21.0 1.2 1.5
Nearest to the junction in the cast alloy (two different domains)
60.171.0
7.211.5
15.912.7
14.82.9
0.70.2
Nearest to the junction in the solder alloy(two different domains)
64.571.0
6.78.6
15.915.0
8.42.6
0.70.4
3.41.9
B3c 1 Junction 69.4 7.8 14.5 1.7
Nearest to the junction in the cast alloy 70.9 10.1 13.0 0.3
Nearest to the junction in the solder alloy 69.4 7.3 15.2 1.4 2.4 0.5 2.8
18
As regards the line scanning the distribution of each alloy element was
recorded on graphs. The distribution pattern of the elements was similar on
both sides of the soldered joint in those specimens where the line scan had
proceeded across the whole soldered joint into the cast alloy on the other
side. However, the main purpose was not to estimate the alloy composition at
a given point but merely to study changes in the element distribution in the
region of the gold-soldered joint. Since these changes are most pronounced
very close to the junction concentration values from only the shorter parts
(c. 70 ym) of the scanned line on each side of the junction were taken into
consideration. Thus a moving average of three terms for each of 10 sampling
points in the cast alloy and 7-10 sampling points (depending on the width of
the joint) in the solder alloy was determined. The modified concentration
points are plotted in Figs. 4-23. Each figure shows the obtained effects
from heat treatments for an element and an alloy.
As can be seen from the curves (Figs. 4-23) indium which is an alloy element
in the solder alloy only, already during the soldering procedure had diffused
into each of the three casting alloys. A reverse process occured when during
the soldering palladium diffused from the casting alloys A and B into the
non-palladium solder alloy. The hardening heat treatment carried out after
the homogenizing heat treatment on one series (d) of each parent alloy sample
did not seem to have any noticeable effect on the distribution of the alloy
constituents.
A comparison of the effect of alloy composition on the results of the various
heat treatments, see Figs. 4-23, indicates that the composition of casting
alloy and solder alloy was best levelled out in the alloy A. Heat treatment
for three hours (b) in general produced a more even distribution of alloy
19
components than heat treatment for one hour (c, d, f). However, the various
heat treatments did not produce concentration levelling-out effects to any
great extent as regards the alloys B and C. In the alloy C especially heat
treatment for three hours (b) did not level out concentration gradients but
had the opposite effect. These results were to some extent confirmed by the
microphotographs of the specimen surfaces which revealed the existence of
demarcated domains appearing at certain gold-solder junctions, and were further
confirmed by the results of the point analysis of these domains (Table II).
Figs. 4-23. Variation in distribution of available alloy components in soldered assemblies of the casting gold alloys A (Figs. 4-10), B (Figs. 11-17) and C (Figs. 18-23). Each curve is a mean value curve representing four (a, b, c, d) or two (f) average curves. Abscissa: equispaced (7 x 10"^m) sampled points. (Gold-solder junction between points 10 and 11). Ordinate: concentration in weight per cent. ■ = a, • = b, * = c, ▲ = d, — = f.
20
100X10
170X10]
21
22
(II). The sum of the current efficiencies for the dissolution of the three
metals cadmium, copper and zinc from the gold solder alloys studied was
considerably less than unity (with two exceptions which might be due to some
error). This fact indicates that other metals might have been dissolving
simultaneously.
The material "JS 730" was used in five measuring series of which those having
the specimen codes 2, 4, 5 and 6 are merely reproductions using different
specimen samples. As these four measurement series produced no significantly
'different results they were all treated together to yield a common linear LDR-E
relationship for each metal(Tables III-V). In contrast to all the other measuring
series, the fifth one with "JS 730" (specimen code 1) was carried out in the
electrolyte solution B with pH = 6.5. A comparison of the first two lines in
Tables III-V shows that the slopes are unaffected by pH, but the LDR values at
E = 800 mV are lower in solution B (pH = 6.5). The constancy of the slopes
indicates that the mechanisms of the electrode reactions are unaffected by pH.
The change in the LDR values indicates that the dissolution is slower when the
solution is less acid, possibly as a result of oxide film formation. As the pH
in the region of a soldered joint hardly ever goes down to 4.0 the results
obtained in solution A can be regarded as the worst case results.
When comparing the LDR at E = 800 mV with the metal element content it was
found that a low metal content was roughly associated with a low dissolution
rate (see Tables III-V). However, the variations are quite large and are
probably due to metallurgical variables - a point discussed later. Concerning
cadmium, the logarithm of the dissolution rate (LDR) as a function of the
appVied potential (E) is shown in Fig. 3. The straight line obtained from the
least squares calculations and describing the measuring points from the series
with the specimen codes 2, 4, 5, 6 was extrapolated to a potential range
(500-600 mV) which can be found in the oral cavity (e^g. Maschinski 1970).
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1—1 C P -p LO LO 00 OJ 03 CO O■1— CO rO c rO p1— CO CD C OJ 03 o 03 OJ OJ LO 4-
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c o O O rö oo oo CD ■Z. p CD p rö -PO O C '-C ■“3 Q c a_ Q Q_
i—i •1— o -p CO > Ci—i -p CO 13 1— c CD -r-!—i 3 i— rO CD LO *o
CD O > E -oCD o C CO P LO >, CD
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1— 1 CO OO O OJ 1— 1— 1— *
Tabl
e IV. Final
resu
lts fo
r Cu.
For det
ails
see tex
t to Ta
ble H
I.
24
CO£Z cé CM o r— oo o '— CM CM y y CM no
+■>__i
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CD Oo ~a «—o00 T3 X i LO no no no CD CD
c s- CM >1 (Ö O E
o T3LU c
• f— (Ö no i— CM CM CM no noCM 4->
+-> O CO c_> o o o O O o O
fö +
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crII
CL)Cd > > > > > > >Q E E E E E E E
1— _JO o o O o o O
CL) <D o o o o o o oC 00 00 00 00 00 00 00
4- •i—•— 1 1 1 1 1 1
fö4-> LU LU LU LU LU LU LU
1— _C v_X v__- •—^ 1—•" ^ " "—"CD <— «— •— y y y y
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_CföD Cd Cd Cd cd Cd Cd Cd
1— CT Q o Q Q o o oLU _J _J —I _J —1 —1
13 C
i— oOtn 4-> 0Û <c C <C <c c
C\J
CO o• i— 1—
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föCD CD c CM CM i— CM 1— 03 no
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o o Os~ no no o o S-CD CM o OE CD 13 +-> 3 4->E f= CD <C o CD Oo fO tn oo CD CD S-
CJ c: r3 •~D O <c D_ o Q_
cCD CDE
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uo o CM 1 1 1
Tabl
e V. Final
resu
lts fo
r Zn.
For det
ails s
ee tex
t to Ta
ble II
I.
25
toc Cd o o LO 1--- 00 LO i—o o 1— oo 1— 1--- 1— r— OO
•1— __i--—^ +-> o o o o o o o✓—^ 03> •1--E > OO
CU oo T3 1—o y 1—00 ■a 1 ID oo CXJ UO 00 to
£Z L- C\J >1 03 o E
O T3LU c
•1-- "---^ 03 CXI 1— CXJ (XI CXJ CXJ OOCXI +-> r—
4-> o OO CJ O o o o O O o
03 +
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crII
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o o o o O o oCU 0) o o o o O o o
c 00 CO 00 00 00 00 00M— •1—
r— 1 i 1 103
+-> LU LU LU LU LU LU LU1— dc '>— '■— ^ —-- ^^
CD i— r— i— f— 1— r— 1—1 1 1 1 1 1 1
03 > > > >* > > >E E E E E E E
+-> OO oo oo oo OO oo ooCO 1 1 1 1 1
o o O o o o oto 1— 1— i— f— 1— 1— 1—CUi. X X X X X X X03 r^- CO UO ^d" CD CD 00Z3a-to + + + + + + +
+-> r^. ,__ ,_ ^d- UO CXJ oto •03 c r^ to to to I-"* 1"-CU o i i 1 1 1 1 1
-M ii ii II II II II II<U 03
-C =3 Cd QC Cd Cd Cd Cd Cdh- cr CO Q CO co o o oLU _1 —1 —1 _J _l —I
1zs c
1— oo •I—
OO +J CO C <c < < <c
(XI^3"
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£Z C |--- r— LO f— r— o oCUo
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OO c_> CXI 1— 1— '—
26
DISCUSSION
As the liquidus and the solidus temperatures of many dental gold alloys are
fairly close these alloys might be expected to be very homogeneous in the
as-cast condition. On the contrary, however, considerable coring and dendritic
segregation can often be seen in the castings. As the presence of an inhomo
geneous surface structure is a factor which contributes to the occurrence of
corrosion in the oral milieu, various kinds of heat treatments to homogenize
the structure have been suggested (Hedegård 1958, Björn and Hedegård 1965,
Eick and Hedegård 1968, Hedegård 1974).
However, the conditions become more complicated when a cast construction is
to be soldered. If the soldering is properly performed and the surfaces of
the cast parts to be soldered have been wetted by the liquid solder a mutual
saturation of surface bonds occurs and a strong and stable interface bond is
obtained. It is known that the strength of the soldered joint may be influenced
by the composition of the different alloys, particularly when high fusing
solders are used. This indicates that diffusion of elements may occur between
solder and casting alloy. If the solder is overheated the strength of the
joint is seriously affected by diffusion of the solder into the grain bounda
ries of the cast alloy and by diffusion of the cast alloy into the solder
(Phillips 1973). The compositions of the two original alloys are changed which
means that the mechanical properties as well as the electrochemical corrosion
behaviour of the joint are no longer under control. As was shown by El-Ebrashi
et al (1968), using electron microscopy, a distinct demarcation and no diffusion
between the two alloys is seen in the properly soldered joint.
A mutual diffusion between cast alloy and solder alloy can occur because of
overheating during the soldering process but it may also occur at lower
27
temperatures, although not as readily, if the heating is sufficiently prolonged.
A fact to be taken further into consideration is that many dental gold solder
alloys, particularly the lower fusing types, contain eutectics which contribute
to the inhomogeneity of the solder itself (Phillips 1973).
Thus it is, from a theoretical point of view, extremely doubtful whether the
validity of the theories regarding homogenizing heat treatment of pure casts
should be extented to include soldered constructions as proposed by Hedegård
(1958, 1974). These doubts have been confirmed by the results of Paper I.
According to Brown & Thresh (1970) the electron probe is capable of carrying
out chemical analysis for the complete concentration range from 0.1-100 % with
an accuracy of ± 2 % and sometimes ± 1 %, but for greatest accuracy point ana
lysis should be used. In the present work point analysis was used to study
the composition of the demarcated domains appearing in the region of the sol
dered joint after the heat treatment of some of the specimens. During the
line-scanning carried out on all the specimens the main purpose was not to
estimate the alloy composition at a given point but merely to study changes
in the element distribution in the region of the gold-soldered joint.
The curves presented in Figs. 4-23, showing the variation in distribution of
available alloy components in the region of the gold-solder junction, are mean
value curves representing four average curves concerning the treatments denoted
a, b, c, d and two average curves concerning the treatment denoted f. In dental
material research the electron probe microanalyzer is an often used instrument.
Unfortunately this instrument has often been used to investigate one single
specimen representing for example one alloy and one treatment. This must be
considered unsatisfactory if only from consideration of instrument variations
and conceivable differences between specimens.
28
The results of Paper I have shown that indium from the solder alloy rapidly
migrates into the three casting alloys while palladium from the palladium
containing casting alloys A and B rapidly migrates into the solder alloy.
This migration takes place during the soldering process and is in some cases
increased after heat treatment. These circumstances indicate that if an
element is an integral part of only the casting alloy or only the solder
alloy a slight mutual element migration probably occurs immediately during
the properly performed soldering. The results also show that a migration of
alloy elements across the gold-solder junction occurs during the so called
homogenizing heat treatment of the soldered assemblies. Furthermore such
heat treatment may result in the appearance of demarcated domains at the
gold-solder junction. The alloys within these domains have compositions
which are different to a greater or lesser extent from the original alloys
and in addition have unknown physical properties. With no, or at least mini
mum, element migration across the junction more favourable conditions are
created. The chemical compositions of casting alloy and solder alloy are
indeed different but the possibility of corrosion occurring can to some extent
be estimated. The mechanical properties of the two alloys are preserved and
grain growth, microporosities and oxide formation are diminished or avoided.
With respect to the above arguments regarding the importance of avoiding as
far as possible any element migration between casting alloy and solder alloy
the main conclusion of Paper I in the present work is that "homogenizing"
heat treatment of gold-soldered assemblies at high temperatures should not
be carried out as a routine.
Paper II deals with the dissolution rates of cadmium, copper and zinc from
commonly used commercial dental gold solder alloys. As previously stated some
29
of these alloys are becoming increasingly complex as regards their chemical
composition. This development implies that the composition of the alloy is
often changed to meet a new, emerging requirement as regards for instance
fusion temperature, some mechanical property or corrosion behaviour. In fact
some of the solders studied (II) have at present chemical compositions which
differ from those existing when the experimental study was carried out. This
is particularly true for the cadmium and zinc content of these alloys. On
June 24, 1974 the Swedish National Board of Health and Welfare issued a
statement which definitely advised against the use of dental alloys containing
cadmium (MF 1974:34). However, there are still a lot of commonly used dental
gold-solder alloys on the market, which contain cadmium.
It has been shown in many studies, for example by Friberg (1950), Berlin and
Ullberg (1963), Friberg and Piscator (1972) and Bergman et al (1976) that the
element cadmium can be enriched and stored for long periods in various tissues
of the mammalian body, especially in the liver and kidney. Thus it is important
to find out whether cadmium can be dissolved from gold-solder alloys by electro
chemical corrosion. To study this problem clinically would be very intricate
and the results would probably be hard to interpret as appropriate corrosion
tests for use in the oral cavity scarcely exist. An in vivo corrosion test in
the oral cavity might also be dubious from an ethical point of view. It was,
therefore, decided that an in vitro potentiostatic study should be made to
estimate the dissolution rate of cadmium from six different dental gold solder
alloys.
In most studies of this type the conclusions are based mainly on the relation
ship between the electric current and the potential during the progress of
the corrosion experiment. However, this current is a quantity which is diffi
cult to interpret because it is the result of a number of chemical reactions.
In the present work (II) a specific reaction has been studied by means of
30
direct chemical analysis of the electrolyte solution after the corrosion
experiment.
One special factor which has to be considered as regards the alloy composition
as gained from a chemical analysis of the metallic material is whether there
has been any melting of the alloy before the analysis. This was the case with
the roentgen fluorescence analysis, the results of which are presented under
"Analysis 1" in Tables III-V. For example, during a melting of the material
the cadmium can partly evaporate which results in a lowering of the cadmium
content in the solidified material. Attention must be given to this evaporation
of cadmium during melting of the alloy in technical dental laboratory work.
In a narrow, badly ventilated laboratory the dental technician who solders
dental bridgeworks runs the risk of inhaling the cadmium vapour. As inhaled
cadmium is absorbed to a much larger extent than ingested cadmium (Friberg et al,
1971) this aspect must be taken into consideration when choosing solder alloys
containing this element.
The results of Paper II as presented in Tables III-V show that the dissolution
rates of the alloy elements studied are not directly proportional to the amount
of metal in question. This indicates that other factors influencing the process
must be taken into consideration. Metallurgical variables may change the free
energy of the electrode material and - for a given metal - alter its position
in the galvanic series. From this point of view the most important of such
variables are high energy grain boundaries, presence of different phases,
residual internal energy resulting from cold working of the material, compos
itional and surface heterogeneities and foreign inclusions.
The corrosion experiments in the present study were performed in a well-defined
gas atmosphere consisting of an oxygen-nitrogen mixture of known composition.
The partial pressure of the oxygen was 0.21 kPa. Under clinical conditions,
31
variations in oxygen concentration between different parts of the same restora
tion do occur. In regions where plaque deposits exist low oxygen concentrations
are found and these areas will tend to corrode rather than areas of high oxygen
concentration (Greener et al, 1972). According to Hoar & Mears (1966) inorganic
solutions are satisfactory substitutes for extra-cellular body fluids, at least
when the anodic behaviour of passive metals is under consideration. The physio
logic saline chosen had been buffered to pH = 4.0 (in one series to 6.5) thus
avoiding the withdrawal of the dissolved metal from the chemical analysis due
to hydroxide precipitation. Thus the in vitro corrosion experiments in this
study (II) were carried out under circumstances which may be said to represent
very unfavourable conditions within the oral cavity. It was shown that under
these given circumstances the alloy elements cadmium, copper and zinc dissolved
from the dental gold-solder alloys and that the dissolution rate of each of the
three elements could be determined.
The dissolution rate of cadmium in a potential region of 550-600 mV (LDR = -11)
which can occur in the oral cavity, corresponds to a dissolution rate of about -1 -20.04 yg year mm , see Fig. 3 and Table III. This extrapolation is doubtful,
however, the value of LDR could not possibly exceed -8. Thus a tentative value
of LDR = -8 might be of interest. Assuming a fairly uniform dissolution rate
over a prolonged period a value of LDR = -8 thus corresponds to 0.04 mg Cd -1 -2year mm . For example a patient who has a large dental bridge construction
2with several soldered joints can have an exposed solder area of about 0.5 cm .
Under the defined conditions and according to the calculations above a dissolution of 2 mg Cd year"^ may occur in the oral cavity of this patient. It
must be taken into consideration that a restoration will be exposed to mechanical
stress and to a certain degree of abrasion, both of which factors may further
proceeding corrosion.
Taking into consideration different sources of cadmium intake (main source: food)
32
the World Health Organization (1972) has proposed a provisional tolerable weekly intake of 400-500 yg Cd per individual. This means 21-26 mg Cd year~^. In compari
son to this value the contribution of cadmium in man resulting from cadmium
dissolution from dental gold solders in the oral cavity must be judged to be
rather small. However, the long-term biological significance is hard to estimate
at the present time.
A great deal of effort has been expended in providing specifications for dental
materials. Previously the main interest was focused to their physical and
chemical properties although the effects of dental materials on biological
tissue has also received a great deal of attention in the last decades. However,
the extremely complicated and individually variable ecology of the oral cavity
makes it very difficult to interpret the results of various tests as regards,
for example, the corrosion tendency of dental materials, in terms of general
validity. Even if an alloy has been shown to be corrosion resistant in different
kinds of laboratory tests this alloy can corrode when combined with other
materials in oral restorations. Factors such as variations in the properties
of saliva and in the intake of drink, food and drugs, various oral hygiene
measures and different magnitude and distribution of load during function make
the net effects hard to estimate.
CONCLUSIONS OF PRACTICAL IMPORTANCE
1. "Homogenizing" heat treatment of gold-soldered assemblies at high tempera
tures should not be carried out as a routine.
2. Dental gold alloys containing cadmium should not be used because this element
can be released from the alloy and contribute to damage to biological tissue.
33
3. Because of the risks of corrosion of dental restorations when different
alloys are used in a patient's oral cavity it is important that the dentist
who is able to estimate the oral situation as a whole, should prescribe the
quality of alloy to be used and not leave the selection of the alloy to the
dental technician.
34
PART TWO (Papers III and IV)
Background. The dental gold alloys, mainly because of their complex chemical
composition, after melting often solidify during coring and dendritic segrega
tion. As the present manufacturing trend often appears to entail the addition
of further elements to the alloys to meet new requirements, principally with
respect to physical properties, it seems to be important to consider the
compositional problems from a basic point of view, starting with the simple
gold-copper and gold-silver-copper alloy systems.
Those dental gold alloys which are capable of age hardening gain their increased
hardness from heat treatment usually carried out at a temperature in the region
of 723-523 K. However, it is important that before such an age hardening the
alloy is first subjected to a heat treatment carried out at temperatures around
1000-1100 K and followed by quenching. In this way residual stress is relieved
and the subsequent age hardening can start with the alloy a uniform solid solu
tion. The solid state reactions allowed to occur during the age hardening then
increase the hardness, tensile strength and proportional limit of the alloy.
As the dental gold alloys often contain six or more elements several solid
state reactions are possible. Many of the alloy elements can in binary combina
tions during age hardening furnish precipitation phases e.g. AuCu, AuCu^ and
PtCu. PdCu is not very effective in producing age hardening unless silver is
present when a ternary phase is formed. Other ternary and possibly quaternary
phases may occur although they are difficult to demonstrate (Phillips, 1973).
As concerns the formation of such precipitation phases during age hardening
it has for example been shown that the rate of the AuCu formation depends on
the temperature from which the alloy was previously quenched (Kuczynski et al
1955, Krivoglaz & Smirnov 1964). The higher the quenching temperature the more
35
rapidly was the subsequent ordering attained. It has also been shown that
clusters of CuAu^, AuCu^ and AuCu can exist in the solid solution in the
temperature range about 670-800 K (Germer et al 1942, Ogawa & Watanabe 1952,
Gehlen & Cohen 1965, Greenholz & Kidron 1970). Thus an increased knowledge
of the structure of the dental gold alloys immediately after casting and at
temperatures just above the quenching temperatures can afford improved
possibilities of directing the solid state reactions. In this way the mechani
cal properties and perhaps also the homogenizing reactions could be better
controlled. This in turn could, in the author's opinion, prepare the way for
dental gold alloys with a decreased number of components which would be most
advantageous e.g. as regards corrosion.
The general purpose of Part Two of the present work was thus to study the
occurrence of ordering in solid solutions of gold-copper and gold-silver-copper
in a state representing the conditions around 1100 K.
MATERIALS
The alloys used in Papers 111-IV were all produced directly in the laboratory.
The raw materials were metal wires with a round cross section and a diameter
of 0.5 mm. The purity for gold and silver was 99.95 % (Nyström and Matthey,
England) and for copper 99.90 % (Cu, type SM-0010-02 Svenska Metallverken,
Sweden).
Specimen preparation. The metals were weighed out in proper proportions
immediately after being treated for 1 min in 4 M H^SO^Ag, Cu) or 4 M HN03(Au)
to eliminate impurities and oxides on the surface. The wires were then twisted
together and melted in an electrically heated furnace with an inert atmosphere
of argon (AGA, quality SR).
36
As regards the material used in Paper III the molten specimens were kept at
1373 K for thirty minutes and cooled in the furnace to 1073 K where they were
kept for another thirty minutes, and then quenched in water at room temperature.
The compositions for these alloys are given in Table VI. Powder specimens were
prepared from the alloys care being taken to extract the powder from the inner
parts of the specimen. To reduce the effect of the lattice distortion, occurring
due to plastic deformation during powder preparation, the powders were heat
treated at 1073 K in an argon atmosphere. The time for this heat treatment was
selected to allow recrystal 1isation without any sintering and thereafter the
crucible with the powder specimen was quenched in water at room temperature.
Concerning the material used in Paper IV the molten specimens were kept at
1373 K for fifteen minutes, cooled down to 1073 K in the furnace and quenched
in water at room temperature. The compositions are given in Table VII. Imme
diately before a run the solid solutions were heat treated for six hours at
1073 K in an argon atmosphere. After the alloys were quenched powder specimens
were prepared as described above. Copper powder and copper (I) oxide (Merck p.a.,
Germany) and copper (II) oxide (Fisher p.a., U.S.A.) were used in testing the
reference systems Cu-Cu^O and CuO - Cu^O. Platinum foils and wires were obtained
from Platinaverken, Vänersborg (Sweden).
METHODS
X-ray measurements. In Paper III the unit cell length of all the heat treated
powder samples was determined from X-ray powder diffraction photograms from a
Guinier-Hägg camera and mainly the CuKa radiation (A = 1.54051). All the
structures observed on the photograms had a face centered cubic unit cell.
No extra lines could be detected. For calibration of the camera constant silicon
with the unit cell length of 5.43054 ± 0.00017 Å at 298 K (Parrish 1960) was
37
used. The parameter a ± a'(a) for all the powder specimens was calculated
and refined using conventional methods (Hägg 1954). The values obtained are
given in Table VI. Powder lines with differences between the calculated and 2observed values of sin 0 greater than 0.0002 were omitted in the determina
tion of the lattice parameters.
Emk-measurements. In Paper IV the activity of Cu in Cu-Au alloys was deter
mined by use of the following cell:
Pt, 02(g), Cu(in alloy), Cu^O || ZrO^ ( CaO) || 02 (air), Pt
In the cell there are two platinum electrodes situated at each side of the
solid electrolyte tube. If the partial pressures of the oxygen are the same
at both electrodes no reaction can occur. However, if the partial pressure2_of oxygen is higher at one electrode, 0 ions will move from this electrode
to the other one, as a potential difference between the two platinum electrodes
has arisen (Kiukkola & Wagner 1957, Sato 1971). By connecting the electrodes
with a potentiometer of high input resistance (Data Precision, series 2000
Digital Multimeter; Model 2500) the existing potential difference, E, could
be measured. This measured value, E, is related to the partial pressure of
oxygen as follows:
E = RT7F In (3)
where R is the gas constant, T the absolute temperature, F the Faraday
constant, Pq the oxygen partial pressure of the sample and p* the oxygen
partial pressure in air (= 21.23 kPa).
The cell arrangement shown in Fig. 24 was used and during each run a continous
stream of purified and dried inert gas (argon, AGA quality SR) passed through
the furnace tube. Within the furnace tube the gas was pre-equi1ibriated by
passing it over a powder mixture of the same type as in the experimental cell
38
before it reached the cell itself. Emf readings were continuously taken in
the region of about 50 K below the solidus temperature of the alloy in question
and down to about 1050 K. Between each reading enough time was left to reach
equilibrium and about ten hours were needed for each series of measures. The
reproducibility of the emf values was ± 2 mV or better. The reference system
Cu-Cu20 was measured several times during the progress of the present study.
The value of E for pure Cu was needed for the calculations but was also used
for testing the experimental set-up which in turn was also tested by the
reference system Cu0-Cu20.
inlet Ar
outlet Ar <r
Fig. 24. The experimental set-up A = Pt wires.B = Pt(10 mass % Rh) wire.C = teflon tape.D = glass tube.E = suspending Al^ capillary.F = Zr02(Ca0) tube.G = pre-reactor with sample.H = Pt electrode wire.I = Al2O3 crucible.K = sample.L = Pt foil.M = external Al^O^ tube; the bottom is kept in the centre of the furnace.
39
The activity of copper, called a^, in the alloy is related to the measured
quantity E as follows:
l°g aCu = - F(RTln 10)_1x AE (4)
where AE is the value of E (pure Cu) - E(alloy).
The alloy was considered to behave as an ideal mixture of free copper, free
gold and the complexes CUpAu^ and hence thè activity of copper, a^, could be
put equal to the mole fraction of free copper, Xçu. Thus, the E-values measured
permit determination of x^u.
RESULTS AND DISCUSSION
The concept order-disorder in alloys. In common linguistic usage the application
of the concepts order and disorder is very subjective and individually variable.
However even on the basis of such subjectivity the terms order and disorder can
attain a certain defined meaning. For example it can be said regarding a mixture
of red and white balls: Ordered distributions are those which are characterized
by a simple succinct description, such as "all the red ones together" or "every
other one red" etcetera. Disordered distributions are those which, for their
exact description, require the specification of each ball.
Thermodynamics is based on such macroscopic observations, that is to say only
summary statements can be made such as, for example, two kinds of molecules
are gathered, each in one region. This implies that there are two pure elements
or that the different kinds of molecules are regularly distributed within a
crystal or that they are more or less regularly distributed. If this reasoning
is applied to the copper-gold phase diagram, see Fig. 25, we find that the pure
phases Au,Cu, CuAu and Cu^Au (marked in the diagram) can be defined as ordered,
40
while the one-phase region, denoted (Cu, Au) is a solid solution and thus has
to be defined as disordered. At lower temperatures the boundaries between the
one- and two-phase regions shown in the diagram are impaired by some degree of
uncertainty.
°C
1000
0 10 20 30 40 50 60 70 80 90 100Cu Au
ATOMIC PER CENT GOLD
Fig. 25. Phase diagram of the copper-gold system (after Hansen & Anderko, 1958).
In solid solutions of this type the Au and Cu atoms are of equal size and can
all be randomly distributed. The degree of disorder will depend on the relation
ship between the numbers of Cu- and Au-atoms. The number of macroscopically
equal distributions can be used as a measure of the degree of disorder in such
a mixture of Cu and Au atoms. Such a measure will of course depend upon the
measuring implements available and will thus lack exactness to a greater or
lesser extent. In this situation it is usual to choose to consider systems with
a lot of atoms and to use a relatively rough implement, for example observations
41
by a human eye. Under these conditions the number of ordered distributions
together with those which are not "completely disordered" are only a small
fraction of the total number of distributions. The number of disordered
distributions which are not macroscopically distinguishable from each other
is a quantity which can be expressed mathematically, see for example Prince
(1966), but under the conditions mentioned it can also be approximated to the
total number of distributions. The more molecules there are the better this
approximation will be.
However, the solid solution need not always consist of completely disordered
Au- and Cu-atoms büt can, to a certain degree, be ordered and thus contain
regular arrangements in for example the AuCu and AuCu^ structures, see Fig.26.
Such a state is usually described as "ordered structures in a disordered matrix".
These ordered structures can be called clusters or complexes but are also often
referred to as superstructures because they cause extra lines or line broadening
to appear on the powder photograms. Although in a case like this there is a
certain degree of order in the disorder the system as a whole must be considered
to be disordered because the different kinds of molecules (Cu, Au, AuCu, AuCu^)
are mutually disordered.
O Oo o
cr?n&i r*£n^?
}/-' i çg/ U iV '1 g ^
Au AuCu AuCu^ Cu
Fig. 26. Examples of ordered structures
42
As stated above the aim of the present work is thus to try and establish the
degree of this latter type of ordering in the two alloy systems Au-Cu and
Au-Ag-Cu. Beginning with pure Au and Cu the formation of the disordered [Cu, Au]
matrix can be written
[Cu] + [Au] -> [Cu, Au] (HI)
and for ordered Cu Au phases P q
p[Cu] + q[Au] -* [CUpAUq] (IV)
i.e. the solid solution formed will contain [CUpAu^] complexes (clusters)
distributed in a [Cu, Au] matrix. It is open to question whether these two
reactions occur at random or if there is any mutually dependence, according
to the law of mass action for example.
Experimental data. Two different types of experimental data have been collected.
(i) The cubic unit cell length, a, as a function of the mole fractions X^, Xg,
Xq where X^ = X^, Xg = X^ and X^ = XCu is presented in Paper III. Data are
given in Table VI of the present work. The composition range used which covers
the region of interest to dentistry is further illustrated in the diagram of
Fig. 27. Data of this kind are often explained by a simple Vegard's law model
(Hume-Rothery et al 1969) but as can be seen from Fig. 27 this was impossible
in the present case, and thus cluster formation had to be taken into considera
tion.
(ii) Values of the emf, E, measured using the cell presented on page 37, as
a function of the composition X^, X^ i,e. X^u and X^u are presented in Paper IV.
Fourteen compositions have been studied and the data are given in Table VII.
43
Table VI. Experimental data a (X^u, XCu) with standard deviation o'.
The table also presents the residuals A-j and ^ obtained from two model calculations. A-j = (a(exp) - a(calc))xlo^ Å (a simple Vegard's law model) where a(calc) has been calculated using a^u = 4.078, a^ = 4.086 and a^ = 3.615;
= (a(exp) - a(calc)) xio^ Å where a(calc) has been calculated using the complexes A^B, A^C, AC, AC^ (final results of Paper III). In addition the standard deviation, a'(a) obtained for the determination of the lattice para-
3meter is given in A x10 . The first part of the data given are those obtained from own determinations. The latter part of the data has been used only for calculations in the binary systems. The data within parentheses are data from the literature while the remainder has been obtained by extrapolation from own determinations.
XA5 XB’ XC9 a’ a'(a)’ V A2* °> °> 4-078> 1» 0, 0; 0, 1, 0, 4.086, 1, 0, 0;0, 0, 1, 3.615, 2, 0, 0; 0.83, 0.17, 0, 4.073, 1, -6, 2; 0.69, 0.31, 0, 4.072,1, -8, 0; 0.62, 0.38, 0, 4.073, 1, -8, 0; 0.56, 0.44, 0, 4.074, 1, -8, -1; 0.55,0.45, 0, 4.075, 1, -7, 0; 0.50, 0.50, 0, 4.075, 1, -7, -1; 0.45, 0.55, 0, 4.076,1, -6, -2; 0.74, 0, 0.26, 3.981, 2, 23, 1; 0.65, 0, 0.35, 3.942, 2, 26, -2; 0.51, 0, 0.49, 3.879, 2, 28, -2; 0.48, 0, 0.52, 3.864, 1, 27, -3; 0.43, 0, 0.57, 3.844,2, 30, 1; 0.33, 0, 0.67, 3.791, 2, 23, -1; 0.83, 0.09, 0.08, 4.048, 1, 6, 3;0.70, 0.20, 0.10, 4.040, 2, 7, 1; 0.69, 0.17, 0.14, 4.025, 1, 10, 0; 0.64, 0.06, 0.30, 3.963, 1, 23, -1; 0.62, 0.14, 0.24, 3.988, 1, 20, 0; 0.61, 0.25, 0.14,4.025, 1, 10, -1; 0.59, 0.34, 0.07, 4.054, 1, 6, 2; 0.55, 0.17, 0.28, 3.971, 1,21, -1; 0.54, 0.17, 0.29, 3.969, 1, 24, 1; 0.54, 0.09, 0.37, 3.934, 1, 27, 0;0.51, 0.27, 0.22, 3.994, 1, 16, -3; 0.50, 0.37, 0.13, 4.032, 1, 11, 1; 0.48, 0.45, 0.07, 4.054, 2, 5, 0; 0.48, 0.05, 0.47, 3.891, 2, 30, 1; 0.47, 0.12, 0.41, 3.919,1, 30, 3; 0.45, 0.21, 0.34, 3.949, 2, 27, 3; 0.44, 0.29, 0.27, 3.975, 2, 20, -1;0.42, 0.08, 0.50, 3.875, 1, 28, 0; 0.41, 0.38, 0.21, 4.000, 2, 16, 0; 0.39, 0.05, 0.56, 3.847, 2, 28, 1; 0.38, 0.23, 0.39, 3.924, 2, 25, 1; 0.38, 0.16, 0.46, 3.893, 1, 27, 1; 0.37, 0.04, 0.59, 3.831, 2, 26, 0; 0.35, 0.11, 0.54, 3.854, 1, 25, 0.
XA> XB, Xc, a: (0.10, 0.90, 0, 4.082; 0.20, 0.80, 0, 4.081; 0.30, 0.70, 0, 4.079;0.40, 0.60, 0, 4.076; 0.80, 0.20, 0, 4.072; 0,90» 0J0» 0» 4,074;) 0,80, Q, Q,2Q,4.003; 0.70, 0, 0.30, 3.965; 0.60, 0, 0.40, 3.921; 0.55, 0, 0.45, 3.898; 0.50, 0,0.50, 3.875; 0.40, 0, 0.60, 3.828; 0.35, 0, 0.65, 3.804; 0.25, 0, 0.75, 3.755;0.20, 0, 0.80, 3.728; 0.15, 0, 0.85, 3.700; 0.10, 0, 0.90, 3.672; 0.05, 0, 0.95,3.643.
44
Table VII. Basic experimental data at 1100 K and calculated values for Z(exp) and Z(calc) - Z(exp)
X^u = mole fraction of copper in the gold-copper alloy;
E/mV = emf obtained at 1100 K; a^u = the activity of copper in the alloy;XCu^ca^c^ ” xCu Xfu ” xfuZ(calc) = -----------— and Z(exp) = Lu Lu
Au XAu
XCu E/mV aCu Z(exp)x 102 (Z(calc) - Z(exp))x 102
0.10 171.3 0.07 10.3 6.1
0.20 172.1 0.07 23.2 -1.6
0.25 189.0 0.09 30.5 -4.00.30 232.0 0.14 36.8 1.50.40 265.1 0.20 53.4 7.30.45 256.9 0.18 67.3 -2.90.50 269.7 0.21 79.6 -3.30.55 284.0 0.24 93.7 -5.30.60 317.9 0.35 99.1 5.90.70 356.0 0.52 121.9 4.60.75 370.6 0.60 134.2 1 .80.80 387.5 0.72 140.3 8.40.85 396.2 0.79 157.7 -1.70.90 403.3 0.85 173.5 -11.1
(0.95 409.1 0.91)
45
Cu30a70
3Fig 27. The residuals (a(exp) - a(calc))xlo Å as a function of the composition XAu> XAq, XClj. The quantity a(calc) has been calculated without taking cluster formation into consideration. The diagram illustrates the effects which have to be explained.
Model and calculations. A model was assumed where the alloy was considered to
be an ideal solution with components and complexes. Furthermore it was assumed
that a state of equilibrium existed between complexes and solution that is to
say between ordered species and disordered matrix. This model means that one has
to study equilibrium reactions of the general type
pA + qB + rC ^ ApBqCr (V)
where A, B and C are the different components and p, q and r are integers.
If xA, Xg, xc denotes the mole fractions of free A, B and C the law of mass
action and the conditions for the total mole fractions X^, Xg and X^ will be
46
XA ' XA + p 6pqr XA XB XC
XB = XB + q Bpqr xP x< xj
XC " XC + r epqr XA XB XC
(5)
(6)
(7)
where 3p^r is the equilibrium constant for the formation of the complex in
question. On the basis of this model the aim of the caluclations was thus to
find the set of (p, q, r) values which would best explain the experimental
data. This systematic calculation procedure was carried out by use of a least
squares computer program LETAGROPVRID (Ingri and Sillen 1964, Arnek et al 1969,
Brauner et al 1969). The model which was considered the best was the one that
gave the lowest error squares sum.
U = Z(y(calc) - y)2 (8)
where y = a (the unit cell length) in Paper III and y = Z (the average number
of "bound" Cu per Au) in Paper IV. In both cases y(calc) denotes the corres
ponding calculated quantity. The errors given in the two papers, a(a), a(apqr)>
a(3pqr) and a(Z(exp)) are defined in accordance with Sillen (1962).
Results of the calculations. The measurements of the cell edge as presented in
Paper III indicated that the cell edge followed the relation
a = aAXA + aBXB + aCXC + 2 aA B C XA B Co P q r p q r
(an extended Vegard's law)and the species which best could explain experimental
data were Au, Ag, Cu, AgAu^, CuAu^, CuAu and AuCu^ (Table VIII).
47
Table Vili. The results of Paper III in terms of the complexes tested and the corresponding best constants. The equilibrium constant is defined by the expressions (5), (6) and (7), and the constant by eqn (9).
Number Error qof points tested
H H ' tested squaresr
sum X 10°CT(a) X TO'3 3pqr ± "‘W1 apqr 1 °(apqr)
15 4 1 0 7.6 2.5 1.4 + 0.7 20.16 ±0.03
15 3 1 0 3.6 1.7 1.1 ± 0.5 16.14 ±0.01
15 2 1 0 1.1 1.0 1.2 + 0.6 12.133±0.004
15 8 2 0 16 3.6 3.6 ± 2.0 39.7 ±0.2
15 6 2 0 8.0 2.5 2.7 + 1.4 31.87 ±0.09
15 4 2 0 3.1 1.6 2.1 + 1.0 24.05 ±0.03
20 3 0 1 198 11 1.5 ± 0.7 16.46 ±0.07
20 3 0 2 78 6.7 2.0 + 0.8 20.50 ±0.07
20 3 0 1 16 3.3 *1 0 3
20 5 0 4 84 7.5 *4 0 5
20 3 0 2 3.4 1.4 0.230± 0.001 32 ±12 0 3 89 + 67 19.26 ±0.01
20 3 0 1 1.8 1.1 632 + 114 15.93 ±0.011 0 1 0.935± 0.004 8.46 ±0.051 0 3 33 + 32 14.99 ±0.01
40 3 0 2 13 2.0 66180 ±1008 19.65 ±0.012 0 3 192 + 49 19.25 ±0.022 1 0 0.12 + 0.10 11.77 ±0.05
40 3 0 1 8.1 1.5 639 + 1 15.92 ±0.011 0 1 0.90 + 0.02 8.68 ±0.061 0 3 3.9 + 2.8 14.66 ±0.083 1 0 0.342± 0.003 15.96 ±0.03
* Negative values of 3pqr were obtained (lack physical meaning).
48
Table IX.equilibrium
Some of theconstants.
models tested in Paper IV and the corresponding best
p qtested
Error squares sum X 10
a(Z(exp))X 103
3pq 0<epq>
0 3 1.9 120 3.0 X 107 1.1 X 107
1 1 2048 3413 1 1704 308
1 3 2.1 139 5.6 X 107 3.0 X 107
1 1 984 533 1 660 80
1 9 0.42 57 4.3 X 1024 242.7 X 10^1 3 1.8 X 108 0.8 X 108
1 1 2251 1503 1 1408 29
The best fit with the experimental data of the emf-measurements in gold-copper
alloys (IV) was obtained for the model with the complexes CuAUg, CuAu^, CuAu
and AuCUg(Table IX). From the residuals AZ given in Table VII it can be seen
that there is a fairly good agreement between Z(calc) and Z(exp). Thus the
results of Paper IV strongly confirm the model proposed in Paper III. In both
studies the formation of complexes seemed to follow the law of mass action. The
models presented in the two studies agree well as regards the main complexes
occurring in the gold-copper binary alloy system. However, the magnitude of the
formation constants are not directly comparable for the following reasons: 1
1. The models used were not exactly the same and this will result in different
values for the formation constants.
49
2. The constants obtained in Paper III are not mutually independent, they
can be said to "eat" at each other.
3. The alloys studied in Paper IV had been heat treated for six hours at
1073 K while the alloys studied in Paper III had been subjected to a much
shorter heat treatment at the same temperature.
Comparing Papers III and IV and summing up all the factors involved, it is
the author's opinion that the determination of the equilibrium constants
presented in Paper IV is to be considered the most reliable one.
In Paper IV not only the temperature 1100 K but measuring points at about 50 K
above and below this central temperature have been studied, see Fig. 28, where
the measured emk, E, was plotted as a function of temperature, T. At the basis
of the following relationship
ln8AS0R
AH0RT (10)
(see for example Prince 1966 and Manenc 1972) where AH0 and AS0 denote the
changes of the enthalpy and the entropy respectively and R is the gas constant
the following interpretation can be suggested. The constancy of the slopes of
the lines in Fig. 28 indicates that within the temperature range studied the
value of the equilibrium constant does not generally change with temperature.
This could mean that the value of AH0 is very small or zero and this in turnAS0implies that the entropy term ^ determines the formation of the complexes.
50
1050
Fig. 28. The emf (E/mV) measured against temperature (T/K) for different mole per cent of copper (X^u) in the alloy.
Comments in relation to previous studies of some physical properties. The solid
state reactions which occur during ordering have marked effects on the struc
ture-sensitive physical properties. However, most of the investigations within
this field have been carried out at temperatures in the range 400-700 K, i.e.
at temperatures considerably lower than those of the present work.
51
For example the temperature variation of electrical resistance in copper-gold
alloys has been examined in a number of studies (e.g. Kurnakow et al 1916,
Le Blanc & Wehner 1932, Sykes & Jones 1936, Bumm 1939, Hirabayashi 1959,
Teramoto & Tachiki 1968). Sykes & Jones (1936), who studied the alloy AuCu^,
presented resistivity-temperature curves in the region below 673 K and related
the results to X-ray data. They found that the electrical resistance of the
alloy AuCu^ started to diminish when the ordered regions were about 50 A long
and had not reached the equilibrium value even when these regions were 300 A
long. Hirabayashi (1959) studied the alloy CuAu^ by measuring the electrical
resistivity of the alloy which was quenched from 723 K and annealed at various
temperatures from 373-493 K. The results were related to various states of
ordering as revealed by X-ray patterns. It was confirmed that the formation
and growth of small ordered species in the disordered lattice was accompanied
by a monotonous increase of the resistivity. However, a reduction of the
resistivity was observed after prolonged annealing at about 440 K due to an
increased degree of order.
According to the theoretical model given in the present work the formation of
many small ordered species should result in an increased resistivity. Later
on, at lower temperatures, when the species have precipitated as a special
phase the resistivity may be expected to decrease; thus the results of the
investigations discussed concerning resistivity measurements are in good
agreement with the proposed model.
Nowack (1930) studied the variations in hardness of initially annealed and
quenched AuCu as a function of ordering temperature and time. Nowack found,
after thirty minutes at a temperature of 623 K, a marked increase in hardness
followed by a softening at longer annealing times. In a study of order
52
hardening in AuCu, Arunchalam & Cahn (1967) found that quenched alloys
hardened far more than cold-worked ones when heat treated in the region
423-613 K. A maximum hardness was attained followed by decrease in hardness.
The latter observation was also made by Leinfelder et al (1972) who presented
results from X-ray diffraction studies and hardness measurements on the AuCu
alloy and on a series of proprietary dental gold alloys during various stages
of aging in the temperature region around 623 K. These authors concluded that
hardening of the proprietary alloys was probably a dual mechanism involving
precipitation and order hardening. The ordered structure was AuCu and the
precipitate was thought to be a gold-rich or silver-rich phase. As concerns
the binary AuCu alloy specimens it was shown that maximum hardness occurred
at about 75 % full order. Further ordering of AuCu was associated with a
decrease in hardness.
In Paper III of the present work the preliminary hardness tests revealed that
the maximum hardness values were found near the Au-Cu edge of the investigated
part of the ternary Au-Ag-Cu diagram and around the composition range Au-Cu,
50 atomic per cent. The results of the present work, although dealing with
alloys representing high temperature conditions, thus indicate the importance
of the AuCu complex in the hardening of the alloys.
Starting from the Au-Ag edge of the ternary Au-Ag-Cu diagram and proceeding with
decreasing Ag content towards the Au-Cu edge reveals a change in the colours of
the alloys. Along the cuts corresponding to 25 and 50 atomic per cent Au the
alloy colour changes from greenish or yellowish through a continuous colour
series to strongly reddish. However, along the 75 atomic per cent Au cut the
colour changes only from yellow to reddish yellow and in far fewer directly
observable stages (Sterner-Rainer 1926, Leuser 1949). Not forgetting the
decreasing Ag-content during this change of colours, the Cu-content seems to
53
influence the colour properties to a very great extent.
The studies discussed concerning resistivity, hardness and colour in relation
to the presence of ordered species point out the existence of a mainly qualita
tive relationship between certain physical properties and the amount of
complexes. It is possible that these properties may be more precisely governed
by an individually adapted heat treatment of the alloys in question. However,
at the present time it is difficult to interpret the special effect on a
physical property that is caused by a certain complex. The use of better tools
such as a determination of the molar absorption coefficient could be one way
of obtaining a quantitative relationship between the amount of a complex and
its individual effect on a physical property.
CONCLUSIONS IN SUMMARY (Papers III and IV)
The tentative model obtained from the calculations of Papers III and IV is
associated with the situation existing in an ideal solution with complexes.
In a solid solution with the components A and B the solvent is a matrix of
A and B atoms. In this solution certain complexes ApB^ exist. These complexes
are perhaps more or less solvated with A and B atoms. A state of equilibrium
between ordered species and disordered matrix, that is to say between com
plexes and solution, is attained. According to the results of the present
work this complex formation seems to follow the law of mass action. When the
thermal motion is no longer able to keep the complexes separated they cluster
together. At temperatures much lower than those considered in the present
work the concentrations of the complexes are high enough to exceed the solu
bility products and the complexes precipitate. In addition it was found that
the length of the edge of the face centered cubic unit cell was changed by
the influence of ordered species appearing in the disordered matrix. The
results seem to indicate that the cell edge of the cubic unit cell varied in
54
accordance with an extended Vegard's law.
The proposed model, which seems to be confirmed by the experimental results
of the present work, indicates a new way of attacking some ordering processes
occurring in certain alloy systems. The complexes have been expressed in terms
of free units of atoms from each alloy constituent. This simplified picture
may hopefully contribute to the understanding of the ordering processes. The
equilibrium calculations cannot provide any direct information regarding the
actual structure of the complexes although in Paper III an attempt was made
to give a structural interpretation of the results.
The best model obtained from the calculations in Paper IV has been illustrated
in a diagram (Fig. 29) revealing the distribution of free Cu and complexes as
functions of X^, the total mole fraction of copper. The diagram represents
the conditioris at 1100 K. According to this model the fraction of free gold is
very small (x^u < 0.003) and therefore the alloys can be regarded as consisting
of gold-copper complexes in mainly a copper matrix. At < 0.5, that is to
say in the region of the composition of the dental alloys, the dominant com
plexes are AuCu followed by CuAu^, CuAUg and AuCu^. It also deserves mention
that one of the models presented in Paper IV, See Table IX, suggests the exist
ence of trimers of gold (Au^-aggregates) in the most gold rich part of the
alloy system. The AuCu, AuCu^ and CuAu^ complexes may, as a suggestion,have
the structures illustrated in Fig. 30. The solution and illustration of the
structure of CuAUg is somewhat more intricate but may be similar to that of
CuAu^ although it is a larger species.
55
OL
Cu Au
Au CuCu Au
AuCu
Fig. 29. Distribution of free Cu and complexes as functions of X^, the total mole fraction of copper. At a given X^, the fraction of a species, a, is represented by the segment of a vertical line falling within the corresponding range.
Fig. 30. Tentative structure units taken out from the fee lattice and representing the complexes AuCu^ (left) and AuCu (right). CuAu^ is the reverse of AuCu^. •= Au,o= Cu. In AuCu3 1/4 and in AuCu 1/8 of each copper atom belongs to the
complex.
56
However, there are various possibilities for determining the structures of
the complexes more definitely in the future.
(i) With a transmission electron microscope of sufficient resolution, using
the so-called lattice-image technique it would be possible to make visible
the exact projected atomic positions. This technique is of topical interest
in the literature.
(ii) By use of electron spectroscopy for chemical analysis (ESCA) it might
be possible to determine the bonding energy of the inner electrons of an
element. As this bonding energy depends on the chemical surroundings of the
element in question the ESCA technique is useful for structural analysis.
In this way the bonding situation within the complexes could be clarified
and the free atoms and the atoms within the complexes could each be studied.
When the solution conditions within the solid gold-copper alloys at elevated
temperatures are known, the alloys ought to be studied at successively lower
temperatures. In this way it could be established whether there is any
defined solubility boundary for a certain complex. A detailed knowledge of the
amounts and structures of the complexes existing in the temperature region 1000-
1100 K in the basic dental alloy gold-copper, will open the way for direct
steering of the solid state reactions in this system and thereby also the
structure-sensistive physical properties. In this way the inherent possibili
ties of the simple basic alloys could be better utilized. This in turn implies
that dental gold alloys with a decreased number of alloy elements could turn
out to be usable for the different kinds of dental gold restoration. This
will finally be an advantage to our patients as fewer components can be dissol
ved from the alloys due to corrosion.
57
GENERAL SUMMARY
The purpose of the present work was:
On commonly used proprietary dental gold alloys to study changes of the element
distribution appearing after so-called homogenization of soldered joints and to
determine in vitro the dissolution rate of cadmium from solder alloys (I, II).
To study cluster formation in solid solutions of the basic dental alloys gold-
silver-copper and gold-copper (III, IV).
The most important, results and the conclusions reached were as follows:
The distribution of available alloy components in the region of the gold-solder
junction after homogenizing heat treatment revealed that concentration diffe
rences had not been levelled out to any great extent. On the contrary certain
negative effects of the heat treatment were established the most important
among which was the appearance of small demarcated domains with alloys of
various compositions precisely at the gold-solder junction. As these alloys
have chemical and physical properties which in each separate case are un
controllable it must be concluded that "homogenizing" heat treatment of gold
soldered assemblies should not be performed as a routine (I).
The dissolution rate of cadmium from dental gold solder alloys under circum
stances which may be said to represent very unfavourable conditions within the
oral cavity was determined. This dissolution rate was rather small. The bio
logical significance of a corresponding dissolution in vivo in the long run is
hard to evaluate at the present time. However, taking into consideration addi
tional effects due to further sources of cadmium intake and also the risk to
the dental technician from inhaling cadmium vapour during soldering it was
58
concluded that dental gold solder alloys containing cadmium should not be
used (II).
The variation of the lattice parameter of the cubic unit cell of from 1073 K
quenched gold-silver-copper alloys of different compositions was determined.
The cell edge seemed to vary in accordance with an extended Vegard's law. The
results were interpreted in terms of complexes and the corresponding equilib
rium constants. The proposed model was further and more directly confirmed by
the results of emf-measurements of gold-copper alloys at temperatures around
1100 K. According to the tentative model assuming complexes in a matrix
of A and B atoms there is a state of equilibrium between ordered species and
disordered matrix, that is to say between complexes and solution. The complex
formation seems to follow the law of mass action. It was concluded that a
detailed knowledge of the amount and structure of the complexes existing in
the temperature region 1000-1100 K in the basic dental alloy gold-copper,
will open the way for direct steering of the solid state reactions and thereby
also the structure-sensitive physical properties. In this way dental gold
alloys with a decreased number of alloy elements could turn out to be usable
for the various kinds of dental gold restoration (III, IV).
59
ACKNOWLEDGEMENTS
It is a pleasure for me to express my sincere gratitude to all those who have
guided, assisted and supported me during the course of these investigations.
Special thanks go to Professor Lars Holmlund and Professor Nils Ingri, for
their unfailing interest in this work, for numerous stimulating and fruitful
discussions and for all the facilities placed at my disposal. Thanks are
also due to Docent Erik Rosén and Docent Olle Ginstrup for interesting
discussions, constructive criticism and generous help during the course of
this work.
Fi1. kand. Åke Björnham helped me with statistical problems and his performance
is much appreciated. In addition I wish to express my sincere gratitude to
Fi 1. lic. Staffan Sjöberg, Fil. dr. Lage Pettersson and Fil. dr. Ragnar Tegman
for valuable discussions concerning computer calculations and experimental
problems.
I am also indebted to Miss Ewa Gruffman and Chief technician Rudolf Lindberg
for skilful laboratory assistance and to Mrs Lilly Leijonhufvud for excellent
secreterial help. Thanks are also due to Lector Patricia Shrimpton who revised
the English manuscript and made helpful suggestions on linguistic points.
The work has been financially supported by the Swedish Medical Research
Council, grants K70-24X-3043-01, K71-24X-3043-02K and B74-24X-3043-03 and
by the Faculty of Odontology, University of Umeå.
Umeå in January 1976
Maud Bergman
60
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