Chapter 12: Materials Adhesives - Rutgers University · Chapter 12: Materials Adhesives Richard L....
Transcript of Chapter 12: Materials Adhesives - Rutgers University · Chapter 12: Materials Adhesives Richard L....
Chapter 12: Materials
AdhesivesRichard L. Lehman
Edited byFrank Kreith and Yogi Goswami
Published August, 2004
0866_C00.fm Page iv Tuesday, August 10, 2004 5:04 PM
This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted withpermission, and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publishreliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materialsor for the consequences of their use.
Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical,including photocopying, microfilming, and recording, or by any information storage or retrieval system, without priorpermission in writing from the publisher.
All rights reserved. Authorization to photocopy items for internal or personal use, or the personal or internal use of specificclients, may be granted by CRC Press LLC, provided that $1.50 per page photocopied is paid directly to Copyright ClearanceCenter, 222 Rosewood Drive, Danvers, MA 01923 USA. The fee code for users of the Transactional Reporting Service isISBN 0-8493-0866-6/05/$0.00+$1.50. The fee is subject to change without notice. For organizations that have been granteda photocopy license by the CCC, a separate system of payment has been arranged.
The consent of CRC Press LLC does not extend to copying for general distribution, for promotion, for creating new works,or for resale. Specific permission must be obtained in writing from CRC Press LLC for such copying.
Direct all inquiries to CRC Press LLC, 2000 N.W. Corporate Blvd., Boca Raton, Florida 33431.
Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only foridentification and explanation, without intent to infringe.
Visit the CRC Press Web site at www.crcpress.com
© 2005 by CRC Press LLC
No claim to original U.S. Government worksInternational Standard Book Number 0-8493-0866-6
Library of Congress Card Number 2004051970Printed in the United States of America 1 2 3 4 5 6 7 8 9 0
Printed on acid-free paper
Library of Congress Cataloging-in-Publication Data
The CRC handbook of mechanical engineering / edited by Frank Kreith, Yogi Goswami. –2nd ed.
p. cm. — (Mechanical engineering handbook series)Includes bibliographical references and index.ISBN 0-8493-0866-6 (alk. paper)1. Mechanical engineering—Handbooks, manuals, etc. I. Kreith, Frank. II. Goswami, D.
Yogi. III. Series.
TJ151.C73 2004621.3—dc22 2004051970
Materials 12-31
0866_book.fm Page 31 Friday, August 6, 2004 2:25 PM
Neoprene Rubbers (Polychloroprene, Chloroprene). These are some of the best general-purpose syntheticrubbers. They have excellent resistance to weather aging, moderate resistance to oils, and good resistanceto refrigerants and mild acids. Shore hardness: 40 to 95. Temperature range: –40 to 115°C.
Chlorosulfonated Polyethylene Rubbers (CSM). These have poor mechanical properties but good resis-tance to acids and heat with complete resistance to ozone. They are used in chemical plants, tank linings,and high-voltage insulation. Shore hardness: 45 to 100. Temperature range: –100 to 93°C.
Ethylene Propylene Rubbers (EP, FPM). These specialized rubbers are especially resistant to weatheraging heat, many solvents, steam, hot water, dilute acids and alkalis, and ketones, but not petrol or mineraloils. They are used for conveyor belts, limited automotive applications, silicone fluid systems, andelectrical insulation. Shore hardness: 40 to 90. Temperature hardness: –50 to 177°C.
Fluorocarbon Rubbers. These comprise a wide range of rubbers with excellent resistance to chemicalattack, heat, acids, fuels, oils, aromatic compounds, etc. They have a high service temperature. They areparticularly suitable for vacuum applications. Shore hardness: 60 to 90. Temperature hardness: –23 to260°C.
Isoprenes (Polyisoprene, IR). These are chemically the same as natural rubber but are more costly. Theproperties and applications are similar to those of natural rubber. Shore hardness: 40 to 80. Temperaturehardness: –50 to 82°C.
Polyacrylic Rubbers (ACM, ABR). This is a group of rubbers with properties midway between nitrileand fluorocarbon rubbers with excellent resistance to mineral oils, hypoid oils, and greases and goodresistance to hot air and aging. The mechanical strength is low. They are often used for spark plug sealsand transmission seals. Shore hardness: 40 to 90. Temperature hardness: –30 to 177°C.
Polysulfide Rubbers. These have poor physical properties and heat resistance, but good resistance tooils, solvents, and weathering and are impermeable to gases and moisture. They are used for caulkingand sealing compounds and as a casting material. Shore hardness: 40 to 85. Temperature hardness: –50to 121°C.
Polyurethane Rubbers. These have exceptional strength and tear and abrasion resistance (the best of allrubbers), low-temperature flexibility, and good resistance to fuels, hydrocarbons, ozone, and weather.Resistance to solutions of acids and alkalis, hot water, steam, glycol, and ketones is poor. They are usedfor wear-resistant applications such as floor coverings. Shore hardness: 35 to 100. Temperature hardness:–53 to 115°C.
Silicone Rubbers (SI). These have exceptionally high service-temperature ranges, but the mechanicalproperties and chemical resistance are poor. They cannot be used in applications which expose them tofuels, light mineral oils, or high-pressure steam. They are used for high- and low-temperature seals, high-temperature rotary seals, cable insulation, hydraulic seals, and aircraft door and canopy seals. Shorehardness: 30 to 90. Temperature hardness: –116 to 315°C (380°C for intermittent use).
Fluorosilicone Rubbers. These are similar to silicone rubbers but have better oil resistance and a lowertemperature range. Shore hardness: 40 to 80. Temperature hardness: –64 to 204°C.
12.3 Adhesives
Richard L. Lehman
Introduction
Adhesives are substances capable of holding materials together in a useful manner by surface attachment.The principal attribute of adhesives is their ability to form strong bonds with surfaces of a wide rangeof materials and to retain bond strength under expected use conditions. Although most adhesives do nothave excellent bulk properties and it is therefore important to keep adhesive films thin, some materialssuch as epoxies have bulk properties which qualify them as engineering materials and thus can be usedin multifunctional applications.
12-32 Chapter 12
0866_book.fm Page 32 Friday, August 6, 2004 2:25 PM
Advantages and Limitations of Use
The principal advantages of adhesives are their ability to bond similar to dissimilar materials of differentthickness; to enable the fabrication of complex shapes not feasible by other fastening means; to smoothexternal joint surfaces; to permit economic and rapid assembly; to distribute stresses uniformly overjoined interfaces, to provide weight reduction in critical structures via the elimination of fasteners; todampen vibrations; to prevent or reduce galvanic corrosion; and to provide thermal and electricalinsulation.
The limitations of adhesives depend on the specific adhesive and application and may include thenecessity of surface preparation, long curing times, service-temperature limitations, loss of propertiesduring service, toxicity of flammability during assembly or use, and the tendency of many adhesives tocreep under sustained load.
Classes of Adhesives
Thermoplastic adhesives are a general class of adhesives based upon long-chained polymeric structure,and are capable of being softened by the application of heat with subsequent hardening upon cooling(hot-melt adhesives). The softening process if reversible for numerous cycles, which facilitates assemblyand disassembly of structures. Thermosetting adhesives are a general class of adhesives based upon cross-linked polymeric structures which develop strong bonds that cannot be reversibly broken once they areformed. Thus, the thermoset adhesives are incapable of being softened once solidified.
Thermoplastic and thermosetting adhesives are cured, a process often referred to as setting, by poly-merization or solidification, by heat, catalysis, chemical reaction, free-radical activity, radiation, evapo-ration of solvent, or another process as governed by the chemical nature of the particular adhesive.
Elastomers are a special class of thermoplastic adhesive possessing the common quality of substantialflexibility or elasticity. Refer to Section 12.2 on polymers.
Anaerobic adhesives are a special class of thermoplastic adhesive, the polyacrylates, that set only inthe absence of air (oxygen). The two basic types are (1) machinery — possessing shear strength only and(2) structural — possessing both tensile and shear strength.
Pressure-sensitive adhesives are permanently and aggressively tacky solids which form immediatebonds when two parts are brought together under pressure. They are available as films and tapes as wellas hot-melt systems.
Performance of Adhesives
To obtain optimum mechanical performance of an adhesive, it is critical to select the proper compoundfor the target application. Table 12.3.1 illustrates compatibility of adhesives and five broad classes ofcommon materials. Generally, for good adhesive bonds the chemistry of the adhesive must match or besimilar to the surface energy, polarity, and/or chemistry of the material being bonded. The elastic modulusof the adhesive should not be greater than the bonded material.
Adhesives are used in two classes of application, those requiring only shear strength and those requiringstructural properties, often tensile and shear strength. Table 12.3.2 provides a quick reference for sometypical applications. A much more detailed summary and classification of adhesives is given in Table12.3.3.
Table 12.3.3 presents a sample of a number of adhesives (with practical information) that are availablefrom various sources. The table is adapted from the rather extensive one found in J. Shields, AdhesivesHandbook, CRC Press, Boca Raton, FL, 1970. For other extensive lists of trade sources, the reader isreferred to Charles V. Cagle, Ed., Handbook of Adhesive Bonding, McGraw-Hill, New York, 1972, andLerner et al., Adhesives Red Book, Palmerton Publishing Co., New York, 1968.
Materials 12-33
0866_book.fm Page 33 Friday, August 6, 2004 2:25 PM
TABLE 12.3.1 Relative Performance of Adhesive Resins
Adherence To: Resistance
Adhesive Resin Paper Wood Metal Ceramics Rubbers Water Solvents Alkali Acids
Alkyd 6 7 5 6 7 7 2 2 5Cellulose acetate 4 3 1 3 5 2 3 1 3Cellulose acetate butyrate 3 1 4 5 2 3 1 3 3Cellulose nitrate 5 1 5 5 3 2 2 4 4Ethyl cellulose 3 1 3 5 2 3 3 3 3Methyl cellulose 1 1 3 3 1 6 3 3 3Carboxy methyl cellulose 1 2 3 2 1 6 1 4 4Epoxy resin 10 8 8 8 8 7 8 8 8Furane resin 7 2 8 7 8 9 7 8 8Melamine resin 10 5 2 5 4 9 5 5 5Phenolic resins 8 5 5 7 6 10 7 8 8Polyeseter, unsaturated 8 4 5 7 7 6 2 5 7Polyethylacrylate 4 3 5 6 8 4 6 7 7Polymethylmethacrylate 4 4 3 6 6 5 6 7 7Polystyrene 3 2 2 5 8 5 5 8 8Polyvinylacetate 7 7 7 3 3 3 4 6 6Polyvinyl alcohol 2 2 4 6 1 7 1 3 3Polyvinyl acetyl 7 8 7 7 8 5 3 5 5Polyvinyl chloride 7 6 7 6 8 6 10 9 9Polyvinyl acetate chloride 8 6 7 5 8 5 8 8 5Polyvinylidene copolymer 7 6 7 7 8 7 10 9 9Silicone T.S. 6 7 7 8 10 7 6 6 6Urethane T.S. 10 10 9 10 7 8 4 4 4Acrylonitrile rubber 6 8 6 9 7 5 8 8 8Polybutene rubber 3 6 2 8 8 3 10 9 9Chlorinated rubber 5 7 4 7 6 3 10 9 9Styrene rubber 7 6 5 8 7 3 8 9 9
Note: 1 = low performance; 10 = high performance.Source: Adapted from Simonds, H.R. and Church, J.M., A Concise Guide to Plastics, 2nd ed., Reinhold, New York, 1963.
With permission.
TABLE 12.3.2 High-Performance Engineering and Machine Part Adhesives
Thread locking • Anaerobic acrylicHub mounting • Anaerobic acrylic — compatible materials or flow migration unimportant
• Modified acrylic — large gaps or migration must be avoided• Epoxy — maximum strength at high temperatures
Bearing mounting • Anaerobic acrylic — compatible materials necessary and flow into bearing area to be prevented
• Modified acrylic — for lowest costStructural joining • Epoxies and modified epoxies — for maximum strength (highest cost)
• Acrylics — anaerobic or modified cyanacrylatesGasketing • Silicones — primarily anaerobic
12-34 Chapter 12
0866_book.fm Page 34 Friday, August 6, 2004 2:25 PM
TAB
LE 1
2.3.
3 P
rop
erti
es a
nd
App
licat
ion
s of
Adh
esiv
e M
ater
ials
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
An
imal
An
imal
(h
ide)
Mel
ted
at 7
0–75
°C; s
ets
on
cool
ing
<70
Pap
er, w
ood,
tex
tile
sW
oodw
orki
ng,
car
pet
mat
eria
ls,
pap
er, b
ookb
indi
ng
May
be
thin
ned
wit
h w
ater
An
imal
(h
ide)
+
plas
tici
zers
App
lied
as a
mel
t at
60°
C<
60Pa
per
, cel
lulo
sic
mat
eria
lsB
ookb
indi
ng,
sta
tion
ery
appl
icat
ion
sC
ure
s to
per
man
ent
flex
ible
film
Fish
glu
e1
hr
at 2
0°C
<60
Woo
d, c
hip
boar
d, p
aper
Gen
eral
-pu
rpos
e fo
r po
rou
s m
ater
ials
Rap
id s
etti
ng;
goo
d fl
exib
ility
, mod
erat
e re
sist
ance
to
wat
er; h
igh
ta
ckC
asei
nC
old
sett
ing
afte
r 20
min
st
andi
ng
per
iod
on
mix
ing
<50
Tim
ber
wit
h m
oist
ure
con
ten
tL
amin
ated
tim
ber
arch
es a
nd
beam
s, p
lybo
x be
ams,
an
d en
gin
eeri
ng
tim
ber
wor
k
Full
bon
d st
ren
gth
de
velo
ped
aft
er se
ason
ing
per
iod
of 4
8 h
rC
asei
n +
60%
lat
exC
old
sett
ing
afte
r 20
min
st
andi
ng
per
iod
on
mix
ing
<60
Alu
min
um
, woo
d, p
hen
olic
fo
rmal
dehy
de (
rigi
d, le
ath
er,
rubb
er)
Bon
din
g of
dis
sim
ilar
mat
eria
ls t
o gi
ve fl
exib
le, w
ater
-res
ista
nt
bon
dFl
exib
le
Veg
e tab
le
Dex
trin
eA
ir d
ryin
gPa
per
, car
dboa
rd, l
eath
er,
woo
d, p
otte
ryG
ener
al-p
urp
ose
glu
e fo
r ab
sorb
ent
mat
eria
lsM
ediu
m d
ryin
g p
erio
d of
2–
3 h
rD
extr
ine–
star
ch b
len
dA
pplie
d ab
ove
15°C
air
dr
yin
g<
48C
ellu
losi
c m
ater
ials
, ca
rdbo
ard,
pap
erL
abel
ing,
car
ton
sea
ling,
spi
ral-
tube
w
indi
ng
Fast
set
tin
g; m
ay b
e di
lute
d w
ith
wat
erG
um
ara
bic
Col
d se
ttin
g<
50Pa
per
, car
dboa
rdSt
atio
ner
y u
ses
Fast
dry
ing
Min
eral
Silic
ate
8 h
r at
20°
C10
–430
Asb
esto
s, m
agn
esia
Lag
gin
g as
best
os c
loth
on
hig
h-
tem
per
atu
re i
nsu
lati
onU
nsu
itab
le w
her
e m
oist
ure
; not
re
com
men
ded
for
glas
s or
pai
nte
d su
rfac
es
Materials 12-35
0866_book.fm Page 35 Friday, August 6, 2004 2:25 PM
Silic
ate
wit
h c
hin
a-cl
ay
fille
rD
ried
at
80°C
bef
ore
expo
sure
to
hea
t–1
80–1
500
Asb
esto
s, c
eram
ics,
bri
ckw
ork,
gl
ass,
silv
er, a
lum
inu
m, s
teel
(m
ild)–
stee
l
Gen
eral
pu
rpos
e ce
men
t fo
r bo
ndi
ng
refr
acto
ry m
ater
ials
an
d m
etal
s; fu
rnac
e re
pair
s an
d ga
stig
ht
join
tin
g of
pip
e w
ork;
hea
t-in
sula
tin
g m
ater
ials
Res
ista
nt
to o
il, g
asol
ine,
an
d w
eak
acid
s
Sodi
um
sili
cate
Dri
ed a
t 20
–80°
C b
efor
e ex
posu
re t
o h
eat
0–85
0A
lum
inu
m (
foil)
, pap
er,
woo
d–w
ood
Fabr
icat
ion
of
corr
uga
ted
fibe
r bo
ard;
woo
d bo
ndi
ng,
met
al fo
il to
pa
per
lam
inat
ion
Suit
able
for
gla
ss-t
o-st
one
bon
din
g
Alu
min
um
ph
osph
ate
+
silic
a fi
ller
Dri
ed 1 /
2 h
r at
20°
C, t
hen
1 /
2 h
r at
70°
C +
1 /2
hr
at
100°
C +
1 h
r at
200
°C +
1
hr
at 2
50°C
; rep
eat
for
two
over
coat
ings
an
d fi
nal
ly c
ure
at
1 h
r at
35
0°C
<75
0St
eels
(lo
w-a
lloy)
, iro
n, b
rass
, ti
tan
ium
, cop
per
, alu
min
um
Stra
in-g
auge
att
ach
men
t to
hea
t-re
sist
ant
met
als;
hea
ter-
elem
ent
bon
din
g
Par t
icu
larl
y su
ited
to
hea
t-re
sist
ant
stee
ls w
her
e su
rfac
e ox
idat
ion
of
met
al a
t h
igh
te
mp
erat
ure
s is
les
s de
trim
enta
l to
adh
esio
n
Bi t
um
en/l
atex
em
uls
ion
Dri
ed in
air
to a
tack
y st
ate
0–66
Cor
k, p
olys
tyre
ne
(foa
m),
po
lyvi
nyl
chlo
ride
, con
cret
e,
asbe
stos
Ligh
twei
ght
ther
mal
-in
sula
tion
bo
ards
, an
d pr
efor
med
sec
tion
s to
po
rou
s an
d n
onpo
rou
s su
rfac
es;
build
ing
appl
icat
ion
s
Not
rec
omm
ende
d fo
r co
nst
ruct
ion
s op
erat
ed
belo
w 0
°C
Ela
stom
ers
Na t
ura
l ru
bber
Air
dri
ed 2
0 m
in a
t 20
°C
and
hea
t-cu
red
5 m
in a
t 14
0°C
<60
Ru
bber
(st
yren
e bu
tadi
ene)
, ru
bber
(la
tex)
, alu
min
um
, ca
rdbo
ard,
lea
ther
, cot
ton
Vu
lcan
izin
g ce
men
t fo
r ru
bber
bo
ndi
ng
to t
exti
les
and
rubb
ers
May
be
thin
ned
wit
h
tolu
ene
Nat
ura
l ru
bber
in
hy
droc
arbo
n s
olve
nt
Air
dri
ed 1
0 m
in a
t 20
°C
and
hea
t-cu
red
for
20
min
at
150°
C
<10
0H
air
(ker
atin
), b
rist
le,
poly
amid
e fi
ber
Bru
sh-s
etti
ng
cem
ent
for
nat
ura
l-
and
syn
thet
ic-fi
ber
mat
eria
lsR
esis
tan
t to
sol
ven
ts
empl
oyed
in
oil,
pai
nt
and
varn
ish
in
dust
ries
, ca
n b
e n
aile
d w
ith
out
split
tin
gR
ubb
er l
atex
Air
dry
ing
wit
hin
15
min
<60
Can
vas,
pap
er, f
abri
cs,
cellu
losi
c m
ater
ials
Bon
din
g te
xtile
s, p
aper
s pa
ckag
ing
mat
eria
ls; c
arp
et b
ondi
ng
Res
ista
nt
to h
eat;
sh
ould
be
pro
tect
ed f
rom
fro
sts,
oi
ls
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
12-36 Chapter 12
0866_book.fm Page 36 Friday, August 6, 2004 2:25 PM
Ch
lori
nat
ed r
ubb
er i
n
hydr
ocar
bon
sol
ven
tsA
ir d
ried
10
min
at
20°C
an
d co
nta
ct b
onde
d–2
0–60
Poly
viny
l ch
lori
de,
acry
lon
itri
le b
uta
dien
e st
yren
e, p
olys
tyre
ne,
ru
bber
, w
ood
Gen
eral
-pu
rpos
e co
nta
ct a
dhes
ive
Res
ista
nt
to a
gin
g, w
ater
, oi
ls, p
etro
leu
m
Styr
ene–
buta
den
e ru
bber
la
ttic
esA
ir d
ryin
g–2
0–60
Poly
styr
ene
(foa
m),
woo
d,
har
dboa
rd, a
sbes
tos,
br
ickw
ood
Bon
din
g p
olys
tyre
ne
foam
s to
po
rou
s su
rfac
e—
Neo
pren
e/n
itri
le r
ubb
ers
in (
?)D
ried
30
min
in
air
an
d bo
nde
d u
nde
r pr
essu
re;
tack
y
–20–
60W
ood,
lin
oleu
m, l
eath
er,
pap
er, m
etal
s, n
itri
le r
ubb
ers,
gl
ass,
fab
rics
Cem
ent
for
bon
din
g sy
nth
etic
ru
bber
s to
met
als,
woo
ds, f
abri
csM
ay b
e th
inn
ed w
ith
ke
ton
es
Ac r
y lon
itri
le r
ubb
er +
ph
enol
ic r
esin
Pr i
mer
air
dri
ed 6
0 m
in a
t 20
°C, fi
lm c
ure
d 60
min
at
175
°C u
nde
r pr
essu
re;
pres
sure
rel
ease
d on
co
olin
g at
50°
C
–40–
130
Alu
min
um
(al
loy)
–alu
min
um
to
DT
D 7
46M
etal
bon
din
g fo
r st
ruct
ura
l ap
plic
atio
ns
at e
leva
ted
tem
per
atu
res
Subj
ect
to c
reep
at
150°
C
for
sust
ain
ed l
oadi
ng
Poly
s ulfi
de r
ubb
er i
n
keto
ne
solv
ent
and
cata
lyst
3 da
ys a
t 25
°C–5
0–13
0, w
ith
stan
ds
hig
her
tem
per
atu
res
for
shor
t p
erio
ds
Met
als
Seal
ant
for
fuel
tan
ks a
nd
pres
suri
zed
cabi
ns
in a
ircr
aft,
wh
ere
good
wea
ther
proo
f an
d w
ater
proo
f pr
oper
ties
are
req
uir
ed
Res
ista
nt
to g
asol
ine,
oil,
hy
drau
lic fl
uid
s, e
ster
lu
bric
ants
; mod
erat
e re
sist
ance
to
acid
s an
d al
kalis
Silic
one
rubb
er24
hr
at 2
0°C
(20
% R
.H.)
; fu
ll cu
re i
n 5
day
s–6
5–26
0A
lum
inu
m, t
itan
ium
, ste
el
(sta
inle
ss),
gla
ss, c
ork,
si
licon
e ru
bber
, cu
red
rubb
er–a
lum
inu
m, c
ure
d ru
bber
–tit
aniu
m, c
ure
d ru
bber
–ste
el (
stai
nle
ss),
al
um
inu
m–a
lum
inu
m (
2024
A
lcla
d), c
ork–
cork
(ph
enol
ic
bon
ded)
Gen
eral
-pu
rpos
e bo
ndi
ng
and
scal
ing
appl
icat
ion
s;
adh
esiv
e/se
alan
t fo
r si
tuat
ion
s w
her
e m
ater
ial
is e
xpec
ted
to
supp
ort
con
side
rabl
e su
spen
ded
wei
g ht;
hig
h-p
ress
ure
exp
osu
re
con
diti
ons
Res
ista
nt
to w
eath
erin
g an
d m
oist
ure
Re c
laim
ru
bber
Con
tact
bon
ded
wh
en
tack
y<
50Fa
bric
, lea
ther
, woo
d, g
lass
, m
etal
s (p
rim
ed)
Gen
eral
in
dust
rial
adh
esiv
e fo
r ru
bber
, fab
ric,
lea
ther
, por
ous
mat
eria
ls
May
be
thin
ned
wit
h
tolu
ene
Poly
chlo
ropr
ene
Air
dri
ed 1
0–20
min
at
20°C
<60
Ru
bber
, ste
el, w
ood,
con
cret
eB
ondi
ng
all t
ypes
of r
ubb
er fl
oori
ng
to m
etal
s, w
oods
, an
d m
ason
ryG
ood
hea
t re
sist
ance
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
Materials 12-37
0866_book.fm Page 37 Friday, August 6, 2004 2:25 PM
Mod
ified
pol
yure
than
e3
hr
at 1
8°C
to
16 h
r at
–1
5°C
–80–
110
Con
cret
e, p
last
er, c
eram
ics,
gl
ass,
har
dboa
rds,
woo
d,
poly
ure
than
e (f
oam
), p
hen
ol
form
alde
hyde
(fo
am),
po
lyst
yren
e (f
oam
), c
opp
er,
lead
, ste
el, a
lum
inu
m
Bon
din
g to
rig
id a
nd
sem
irig
id
pan
els
to i
rreg
ula
r w
all
surf
aces
, w
all
clad
din
g an
d fl
oor
layi
ng;
bu
ildin
g in
dust
ry a
pplic
atio
ns
Foam
rem
ain
s fl
exib
le o
n
agin
g ev
en a
t el
evat
ed
tem
per
atu
res;
will
w
ith
stan
d a
12%
m
ovem
ent
Th
erm
opla
stic
Nit
r oce
llulo
se i
n e
ster
so
lven
tH
eat
set
1 h
r at
60°
C a
fter
w
et b
ondi
ng
60Pa
per
, lea
ther
, tex
tile
s, s
ilico
n
carb
ide,
met
als
Labe
ling,
gen
eral
bon
din
g of
in
orga
nic
mat
eria
ls i
ncl
udi
ng
met
als
Goo
d re
sist
ance
to m
iner
al
oils
Mod
ified
met
hyl
cellu
lose
Dri
es i
n a
ir<
50V
inyl
-coa
ted
pap
er,
poly
styr
ene
foam
Hea
vy-d
uty
adh
esiv
e; d
ecor
atin
g pa
per
an
d pl
asti
csC
onta
ins
fun
gici
de t
o pr
even
t bi
odet
erio
rati
onE
thyl
e ne
viny
l ac
etat
e co
poly
mer
+ r
esin
sFi
lm t
ran
sfer
at
70–8
0°C
fo
llow
ed b
y bo
ndi
ng
at
150–
160°
C
60, o
r 1
hr
at 9
0C
otto
n (
duck
)–co
tton
, res
in
rubb
er–l
eath
er, m
elam
ine
lam
inat
e–pl
ywoo
d, s
teel
(m
ild)–
stee
l, ac
rylic
(sh
eet)
ac
rylic
Met
als,
lam
inat
ed p
last
ics,
an
d te
xtile
s; f
abri
cati
on o
f le
ath
er
good
s; l
amin
atio
n w
ork
Goo
d el
ectr
ical
in
sula
tion
Poly
viny
l ac
etat
eR
apid
set
tin
g<
60Pa
per
, car
dboa
rdC
arto
n s
ealin
g in
pac
kagi
ng
indu
stry
Res
ista
nt
to w
ater
Syn
thet
ic p
olym
er b
len
dA
pplie
d as
a m
elt
at 1
77°C
<70
Pap
er, c
ardb
oard
, pol
yth
ene
(coa
ted
mat
eria
ls)
Car
ton
an
d pa
per
bag
seal
ing;
pa
ckag
ing
—
Poly
chlo
ropr
ene/
resi
n
blen
d in
sol
ven
tA
ir d
ried
10
min
at
20°C
an
d cu
red
4 da
ys a
t 20
°C
to 7
hr
at 7
5°C
<70
Ch
loro
sulf
onat
ed p
olyt
hen
e,
poly
chlo
ropr
ene
fabr
ics,
po
lyam
ide
fabr
ics,
lea
ther
, w
ood,
tex
tile
s
Bon
din
g sy
nth
etic
ru
bber
s an
d po
rou
s m
ater
ials
; pri
mer
for
po
lyam
ide-
coat
ed f
abri
cs s
uch
as
nylo
n, t
eryl
ene
—
Poly
chlo
ropr
ene
Air
dri
ed 1
0–20
min
at
20°C
—R
ubb
er, s
teel
, woo
d, c
oncr
ete
Bon
din
g al
l typ
es o
f ru
bber
floo
rin
g to
met
als,
woo
ds, a
nd
mas
onry
Goo
d h
eat
resi
stan
ce
Satu
rate
d po
lyes
ter
+
isoc
yan
ate
cata
lyst
in
et
hyl
acet
ate
Solv
ent
evap
orat
ion
an
d pr
ess
cure
d at
40–
80°C
w
hen
tac
ky
—C
ellu
lose
, cel
lulo
se a
ceta
te,
poly
olefi
ns
(tre
ated
film
),
poly
viny
l ch
lori
de (
rigi
d),
pap
er, a
lum
inu
m (
foil)
, co
pper
(fo
il)
Lam
inat
ion
of
plas
tic
film
s to
th
emse
lves
an
d m
etal
foi
ls f
or
pack
agin
g in
dust
ry, p
rin
ted
circ
uit
s
Res
ista
nt
to h
eat,
moi
stu
re, a
nd
man
y so
lven
ts
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
12-38 Chapter 12
0866_book.fm Page 38 Friday, August 6, 2004 2:25 PM
Cya
noa
cryl
ate
(an
aero
bic)
15 s
ec t
o 10
min
at
20°C
su
bstr
ate
dep
ende
nt
Mel
ts a
t 16
5St
eel–
stee
l, st
eel–
alu
min
um
, al
um
inu
m–a
lum
inu
m, b
uty
l ru
bber
–ph
enol
ic
Rap
id a
ssem
bly
of m
etal
, gla
ss,
plas
tics
, ru
bber
com
pon
ents
An
aero
bic
adh
esiv
e.
Cu
rin
g ac
tion
is b
ased
on
th
e ra
pid
poly
mer
izat
ion
of
th
e m
onom
er u
nde
r th
e in
flu
ence
of
basi
c ca
taly
sts;
abs
orbe
d ou
ter
laye
r on
mos
t su
rfac
es
suffi
ces
to i
nit
iate
po
lym
eriz
atio
n a
nd
brin
gs a
bou
t bo
ndi
ng
Poly
acry
late
res
in
(an
aero
bic)
3 m
in a
t 12
0°C
to
45 m
in
at 6
5°C
or
7 da
ys a
t 20
°C–5
5–95
Alu
min
um
–alu
min
um
Ass
embl
y re
quir
emen
ts r
equ
irin
g
hig
h r
esis
tan
ce t
o im
pact
or
shoc
k lo
adin
g; m
etal
s, g
lass
an
d th
erm
oset
tin
g pl
asti
cs
An
aero
bic
adh
esiv
e
Th
erm
oset
tin
g
Ur e
a fo
rmal
dehy
de9
hr
at 1
0°C
to 1
hr
at 2
1°C
af
ter
mix
ing
pow
der
wit
h
wat
er (
22%
)
<90
Woo
d, p
hen
olic
lam
inat
eW
ood
glu
ing
and
bon
din
g on
pla
stic
la
min
ates
to
woo
d; p
lyw
ood,
ch
ipbo
ard
man
ufa
ctu
re; b
oat
build
ing
and
tim
ber
engi
nee
rin
g
Exc
ess
glu
e m
ay b
e re
mov
ed w
ith
soa
py
wat
er
Ph
enol
ic f
orm
alde
hyde
+
cata
lyst
PX
-12
Col
d ac
tin
g<
100
Woo
dT
imbe
r an
d si
mila
r por
ous m
ater
ials
fo
r ou
tdoo
r-ex
posu
re c
ondi
tion
s;
shop
fas
cia
pan
els
Goo
d re
sist
ance
to
wea
ther
ing
and
biod
eter
iora
tion
Res
orci
nol
for
mal
dehy
de
+ c
atal
yst
RX
S-8
Cu
red
at 1
6–80
°C u
nde
r pr
essu
re<
100
Woo
d, a
sbes
tos,
alu
min
um
, ph
enol
ic l
amin
ate,
po
lyst
yren
e (f
oam
),
poly
viny
l ch
lori
de,
poly
amid
e (r
igid
)
Co n
stru
ctio
nal
lam
inat
es fo
r mar
ine
craf
t; b
uild
ing
and
tim
ber
appl
icat
ion
s; a
lum
inu
m–p
lyw
ood
bon
din
g; l
amin
ated
pla
stic
s
Rec
o mm
ende
d fo
r se
vere
ou
tdoo
r-ex
posu
re
con
diti
ons
Ep
o xy
resi
n +
cat
alys
t24
–48
hr
at 2
0°C
to 2
0 m
in
at 1
20°C
100
Stee
l, gl
ass,
pol
yest
er–g
lass
fi
ber
com
posi
te,
alu
min
um
–alu
min
um
Gen
eral
-pu
rpos
e st
ruct
ura
l adh
esiv
e—
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
Materials 12-39
0866_book.fm Page 39 Friday, August 6, 2004 2:25 PM
Ep
oxy
resi
n +
cat
alys
t8
hr
at 2
4°C
to 2
hr
at 6
6°C
to
45
min
at
121°
C65
Stee
l, co
pper
, zin
c, s
ilico
n
carb
ide,
woo
d, m
ason
ry,
poly
este
r–gl
ass
fibe
r co
mpo
site
, al
um
inu
m–a
lum
inu
m
Bon
din
g of
met
als,
gla
ss, c
eram
ics,
an
d pl
asti
c co
mpo
site
sC
ure
s to
str
ong,
du
rabl
e bo
nd
Ep
oxy
+ s
teel
fille
r (8
0% w
/w)
1–2
hr
at 2
1°C
120
Iron
, ste
el, a
lum
inu
m, w
ood,
co
ncr
ete,
cer
amic
s,
alu
min
um
–alu
min
um
Indu
stri
al m
ain
ten
ance
rep
airs
; m
etal
lic ta
nks
, pip
es, v
alve
s, e
ngi
ne
cast
ings
, cas
tin
gs
Goo
d re
sist
ance
to
chem
ical
s, o
ils, w
ater
Ep
o xy
+ a
min
e ca
taly
st
(an
cam
ine
LT)
2–7
days
at
20°C
for
33%
w
/w c
atal
yst
con
ten
t–5
–60
Con
cret
e st
onew
ork
Rep
air
of c
oncr
ete
road
s an
d st
one
surf
aces
Exc
elle
nt p
igm
ent-
wet
tin
g pr
oper
ties
; eff
ecti
ve
un
derw
ater
an
d su
ited
to
appl
icat
ion
s u
nde
r ad
vers
e w
et o
r co
ld
con
diti
ons
Ep
o xy
resi
n (
mod
ified
)4–
5 h
r at
149
°C t
o 20
min
at
230
°C t
o 7
min
at
280°
C
150
Alu
min
um
, ste
el, c
eram
ics
On
e-pa
rt s
tru
ctu
ral
adh
esiv
e fo
r h
igh
-tem
per
atu
re a
pplic
atio
ns
Goo
d ga
p-fi
llin
g pr
oper
ties
for
poo
rly
fitt
ing
join
ts; r
esis
tan
t to
w
eath
er, g
alva
nic
act
ion
Ep
oxy
45 s
ec a
t 20
°C—
Gem
sto
nes
, gla
ss, s
teel
, al
um
inu
m–a
lum
inu
mR
apid
ass
embl
y of
ele
ctro
nic
co
mpo
nen
ts, i
nst
rum
ent
part
s,
prin
ted
circ
uit
s; s
ton
e se
ttin
g in
je
wel
ry a
nd
as a
n a
lter
nat
ive
to
sold
erin
g
—
Ep
o xy
resi
n i
n s
olve
nt
+
cata
lyst
8 h
r at
52°
C t
o 1 /
2 h
r at
12
1°C
–270
–371
Alu
min
um
an
d m
agn
esiu
m
allo
ys f
or e
leva
ted-
tem
per
atu
re s
ervi
ce
Stra
in g
auge
s fo
r cr
yoge
nic
an
d el
evat
ed-t
emp
erat
ure
use
; m
icro
mea
sure
men
t st
rain
gau
ges
Cu
red
mat
eria
l re
sist
s ou
tgas
sin
g in
hig
h
vacu
um
Ep
oxy
poly
amid
e8
hr
at 2
0°C
to
15 m
in a
t 10
0°C
100
Cop
per
, lea
d, c
oncr
ete,
gla
ss,
wo o
d, fi
berg
lass
, ste
el–s
teel
al
um
inu
m–a
lum
inu
m
Met
als,
cer
amic
s, a
nd
plas
tics
bo
ndi
ng;
bu
ildin
g an
d ci
vil
engi
nee
rin
g ap
plic
atio
ns
Res
ists
wat
er, a
cids
, oils
, gr
ease
s
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks
12-40 Chapter 12
0866_book.fm Page 40 Friday, August 6, 2004 2:25 PM
Ep
oxy/
poly
sulfi
de24
hr
at 2
0°C
to
3 h
r at
60
°C t
o 20
min
at
100°
C<
120
Asb
esto
s (r
igid
), c
eram
ics,
gl
ass–
fibe
r co
mpo
site
s,
carb
on,
poly
tetr
aflu
oroe
thyl
ene
(tre
ated
), p
olye
ster
(fi
lm),
po
lyst
yren
e (t
reat
ed),
ru
bber
(t
reat
ed),
cop
per
(tr
eate
d),
tun
gste
n c
arbi
de, m
agn
esiu
m
allo
ys,
alu
min
um
–alu
min
um
, ste
el
(sta
inle
ss)–
stee
l
Col
d-se
ttin
g ad
hes
ive
esp
ecia
lly
suit
able
for
bon
din
g m
ater
ials
wit
h
diff
erin
g ex
pan
sion
pro
per
ties
Cu
res
to fl
exib
le m
ater
ial;
resi
stan
t to
wat
er,
pet
r ole
um
, alk
alis
, an
d m
ild a
cids
Ph
enol
fu
rfu
ral
+ a
cid
cata
lyst
2 da
ys a
t 21
°C90
–140
Alu
min
a, c
arbo
n (
grap
hit
e)Fo
rmu
lati
on o
f ch
emic
ally
res
ista
nt
cem
ents
; bed
din
g an
d jo
inin
g ch
emic
ally
res
ista
nt
cera
mic
tile
s
Ext
rem
ely
resi
stan
t to
ab
rasi
on a
nd
hea
t
Pre
ssu
re-s
ensi
tive
Hea
ted
by a
ir d
ryin
g fo
r se
vera
l h
ours
or
15–3
0 m
in a
t 21
0°F
—Te
flon
–Tefl
on, T
eflon
–met
al—
Goo
d re
sist
ance
to
acid
s an
d al
kalis
; exc
elle
nt
elec
tric
al p
rop
erti
es
Mis
cella
neo
us
Cer
amic
-bas
edD
ried
for
1/2
hr
at 7
7°C
an
d cu
red
1/2
hr
at 2
00°C
+
1 h
r at
250
°C;
post
cure
d, 1
hr
at 3
50°C
816
Met
als
Stra
in g
auge
s, t
emp
erat
ure
sen
sors
fo
r el
evat
ed-t
emp
erat
ure
wor
k—
TAB
LE 1
2.3.
3 (c
onti
nu
ed)
Pro
per
ties
an
d A
pplic
atio
ns
of A
dhes
ive
Mat
eria
ls
Bas
ic T
ype
Cu
rin
g C
ycle
, Tim
e at
Te
mp
erat
ure
Serv
ice
Tem
per
atu
re
Ran
ge, C
Adh
eren
dsM
ain
Use
sR
emar
ks