Challenges and Trends of SSD Design

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Challenges & Trends of Challenges & Trends of SSD Design ADATA SSD Group 5/2

Transcript of Challenges and Trends of SSD Design

Page 1: Challenges and Trends of SSD Design

Challenges & Trends ofChallenges & Trends of SSD Design

ADATA SSD Group 5/2

Page 2: Challenges and Trends of SSD Design

SSD Preference by Applications

Application Capacity Price Performance Quality Reliability SupplyApplication Capacity Price Performance Quality Reliability Supply

Channel 0% and 7% Sensitive Peak Moderate Moderate FlexibleConsumer OP Sensitive Peak Moderate Moderate Flexible

SIODM/OEM 0% OP Sensitive Peak High High ModerateODM/OEM

IPC 0% OP Moderate Moderate High Moderate Consistent

Server 7% and above Moderate Sustain High High Consistent

Page 3: Challenges and Trends of SSD Design

Agenda

Challenges of SSD Designg g– NAND Flash – Performance– O/P & Data Compression– Validation and Failure AnalysisValidation and Failure Analysis

Trends of SSD Design Trends of SSD Design– NAND Flash

PCI E– PCI-E

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Challenge of SSD DesignChallenge of SSD Design

NAND Flash

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Key Challenge for Quality SSD

Failure rates are multiplied proportionately to capacity When combined with other problems, it can easily exceed 1%When combined with other problems, it can easily exceed 1%

DPPM > 1%

~8000

500

5/26

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ConfidentialConsumer-grade NAND Quality

Flash Qty Sorted Bad Blocks Identified Estimated DPPMf 128GB SSDFlash Qty Sorted Bad Blocks Identified of 128GB SSD

16,200 15 blocks in 12 Flash(uECC, High BER x 1) ~12,000 DPPM

DPPM R d dSSD

DPPM Reduced By Flash Sorting

DPPM Reduced By SSD Device Level Testing

DPPM

By SSD Device Level Testing

Target : 1000 DPPMTarget : 1000 DPPM

6/24

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ConfidentialExample of Endurance Verification 2X/2Y/1X NAND

2Y/1X Lot

2Y Quality Lot

2x Quality Lot

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Example of Retention distribution 2Y/1X NAND

2Y/1X Lot

2Y Quality Loty

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Example of Cross-Temp Verification 2Y/1X NAND

2Y/1X Lot

2Y Quality Lot

9Low temp. : 0 degree, High temp. : 70 degree.

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ConfidentialChallenges of Flash Package for Ultrathin

Performance requirement is high but PCB dimension is small.– TSOP is 1 channel design and hard to support high

performance & high density demand.Generic BGA is limited to 2 channel It’s hard to– Generic BGA is limited to 2 channel. It’s hard to meet high performance demand.

Pacakage Channel PerformanceBGA Write Pacakage Channel Performance

TSOP 1 60/40

LGA 2 120/40

100/132/152 Performance

SDP 10 MB/s

DDP 20 MB/sLGA 2 120/40

BGA100/132/152 2 120/40QDP 40 MB/s

ODP 40MB /s

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BGA 272 4 240/80*10MB/s per die

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ConfidentialAdvantage of 4CH Package on High Capacity SSD

mSATA‐4ch4ch flash 2 ch flashBus #1

Write P f

2 ch flashBus #2

Bus #1PerformanceHalf‐mSATA‐4ch4ch flash mSATA‐2ch2ch flash

4 ch flash

Bus #1

Bus #2

Bus #3

Bus #4Half‐mSATA‐2ch2ch flash 

Bus #4

128 GB 256 GB

Ad t f 4 CH Fl h P k Advantages of 4 CH Flash Package– Higher performance of high capacity skew. – Suitable for compact PCB design

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Suitable for compact PCB design.

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Challenge of SSD DesignChallenge of SSD Design

Performance

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ConfidentialPerformance Requirement of Sever SSD Most consumer SSD address “Sequential Read/Write” Server/Enterprise SSD focus on Sustained 4K R/W

and Latency

60,000

70,000

????260 MB/s

10GB Space

30 000

40,000

50,000

=????

150 MB/s

10GB Space

10,000

20,000

30,000= 85 MB/s

25 MB/sFull Space

0

5 20 35 50 65 80 95 110min

Consumer Server

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ConfidentialLatency in Cache-based application

100

120

100.00%

120.00%

2500

3000Max Latency(ms)

times

40

60

80

40 00%

60.00%

80.00%

1000

1500

2000

Qos

0

20

1 1 001 2 001 3 001 4 001 5 001 6 0010.00%

20.00%

40.00%

0

500

1000

event

Qos

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1 1,001 2,001 3,001 4,001 5,001 6,0010 10 20 30 40 50 60 70 80 90 100event Max Latency(ms)

-PS : Max latency are recorded by Iometer 2010 every 15 minutes.

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ConfidentialLatency in File-based application

35

40sec

25

30

20 SSD #1SSD #2SSD #3

10

15

0

5

0 200 400 600 800 1000 1200 1400 1600 1800 20000 200 400 600 800 1000 1200 1400 1600 1800 2000

Multi-tasking environment mixing R/W processes of large & small files. Latency may be up to 35 sec if controller FW is not good. Abnormal long latency causes bad user experience and the risk of failure Abnormal long latency causes bad user experience and the risk of failure.

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Challenge of SSD DesignChallenge of SSD Design

O/P, Data Compression, p

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OP - Over Provisioning

OP Usage– Buffer SpaceBuffer Space– Garbage collection– SSD controller firmware storage (small %)

-0% : 64/128/256/512 GB

-7% : 60/120/240/480 GB

– Spare blocks (small %) – Data protection (ex: LSI RAISE™)

-28%: 50/100/200/400 GB

Advantages of higher OP:– Higher write performance

OP Data

– Higher write performance – Lower “Write Amplification”– Longer Flash life (Endurance)

User Data

– Space for data protection beyond ECC

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ConfidentialPerformance Comparison of OPs

IOmeter IOPS IOmeter IOPS (50% compressible)

50,000

60,000

50,000

60,000

20 000

30,000

40,000

30,000

40,000

0

10,000

20,000

10,000

20,000

0

1 26 51 76 101 126 151 176

OP 0% OP 7% OP 28%

01 26 51 76 101 126 151 176

OP 0% OP 7% OP 28%

-Higher OP has more buffer and gives better sustained performance . -With 50% compressible data(typical case), sustained performance is up to 3~5X

-PS : Data is recorded by Iometer 2010 every 5 minutes.

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ConfidentialData Compression, Gives More OP Space

Data compressor provides bigger and reliable over-b gge a d e ab e o eprovisioning than the general SSD controller.

f

SSD with compressor

SSD w/o compressor

More OP gives more space for buffering and garbage collection.

Free Space (OP)Larger due to compressor

Free Space (OP)

p p

collection. If data is highly compressible,

SSD will have more OP so True Valid Data

True Valid Data

that the performance and reliability will be better.

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ConfidentialData Compressor + OP improve Reliability

7.0

WAF with In-compressible data1.4

WAF with 50% Compressible data

5.0

6.0

1

1.2

2 0

3.0

4.0

0 4

0.6

0.8

0.0

1.0

2.0

0

0.2

0.4

Hi h OP l i b tt WAF d ld t d d i lif ti

1 26 51 76 101 126 151 176

OP 0% OP 7% OP 28%

1 26 51 76 101 126 151 176

OP 0% OP 7% OP 28%

-Higher OP also gives better WAF and could extend device life time. -With 50% compressible data(typical case), drive life time can be extended at least 3X.

-PS : Data is recorded by Iometer 2010 every 5 minutes.

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ConfidentialData Compressor + OP improve Performance

IOPS

LSI SandForce Balanced Read/Write PerformanceBased on data entropy 

Data entropy

40,000

45,000

50,000py

Compressible

30,000

35,000

15,000

20,000

25,0000-70%

5,000

10,000

0

0 10 20 30 40 50 60 70 80 90 100Random Read/Write %

10% 70% 100% Samsung 840 Samsung 840 Pro OCZ Vertex 4 OCZ Vector

100/0 90/10 80/20 70/30 60/40 50/50 40/60 30/70 20/80 10/90 0/100

Random IOPS after Random Writes SSD #1 SSD #2 SSD #4SSD #3Read/Write

10% 70% 100% Samsung 840 Samsung 840 Pro OCZ Vertex 4 OCZ VectorpreconditioningData collected using VDBench

SSD #1 SSD #2 SSD #4SSD #3

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Challenge of SSD DesignChallenge of SSD Design

ValidationFailure Analysis

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ConfidentialSSD Validation & Trouble Shooting

Validation– Totally different to previous UFD, y p ,

SD, and exHDD.– Hard to cover all testing during

validation

Flash Vendorvalidation.

Trouble-Shooting– Not easy to identify failure due to

??Not easy to identify failure due to the failure can be anything, such as HW, SW, FW, Protocol, Flash

Module Hose

Controller VendorFlash……

– Need system engineering to narrow down the issue and find h

Hose

the root cause.

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ConfidentialFailure Analysis Categories

3 Analysis Categories

1 SATA Interface:

Flash2

1 SATA Interface:

a. SATA Protocol Analysis

b. Signal Integrity Analysis

SATA

b. Signal Integrity Analysis

2 SATA Controller & Power Circuit :

a Controller logging informationController Flash

1

a. Controller logging information

b. Power-on timing analysis

3 Fl h C t

Flash

PowerCircuit

3 Flash Component :

a. Uncorrectable ECC identification

b Physical address Flash testb. Physical address Flash test

c. BER analysis through tester

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Flash and SSD TrendsFlash and SSD Trends

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2X/2Y/1X/1Y NAND Trend

Spec Nov Dec Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Intel-L84A(20nm) 64Gbit, 8KB MP

2012 2013

Intel L84A(20nm) 64Gbit, 8KB MP

Intel-L85A(20nm) 128Gbit, 16KB ES CS

Intel-L84C(20nm) 64Gbit, 16KB ES CS

Intel-L85C(20nm) 128Gbit, 16KB ES CSIntel L85C(20nm) 128Gbit, 16KB ES CS

Micron-L83A(20nm) 32Gbit, 8KB

Micron-L84A(20nm) 64Gbit, 8KB MP

Micron-L85A(20nm) 128Gbit, 16KB ES CSMicron L85A(20nm) 128Gbit, 16KB ES CS

Micron-L84C(20nm) 64Gbit, 16KB ES CS

Micron-L85C(20nm) 128Gbit, 16KB ES CS

Hynix A-die(20nm) 64Gbit, 8KBy ( ) ,

Hynix B-die(20nm) 64Gbit, 16KB

Hynix D-die(1xnm) 64Gbit, 16KB ES CS

Hynix A-die(3D) 128Gbit, 16KB ES CSy ( ) ,

Hynix M-die(1xnm) 128Gbit, 16KB ES

Sandisk 19nm 64Gb, 16KB

Sandisk 1Ynm 64Gb, 16KB ES

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,

Sandisk TLC1Ynm 128Gbit,8KB,4P ES

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ConfidentialMLC Flash Pricing of Mainstream Capacity

$12.00

32 32 GbitGbit 64 64 GbitGbit 128 128 GbitGbit

$10.00

$6.00

$8.00

32Gbit

64Gbit

$

$4.00

64Gbit

128Gbit

$0.00

$2.00

NAND Price go uptrend from 2013/Q4 128Gbit mono-die MLC ready in 2013/Q3

Source: DRAMExchanges

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y 1Y to begin another cycle

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ConfidentialNAND Getting WorseHigher Requirement for Controller

3xnm MLC 2xnm MLC 2y/1x nm MLC 2y/1x nm TLC 3D Flash

C it 32Gbit 64Gbit 64/128Gbit 64/128Gbit ?Capacity 32Gbit 64Gbit 64/128Gbit 64/128Gbit ?

ECC 12 bit / 512 Bytes 24 bit /1024 Bytes 40 bit /1024 Bytes LDPC ?

PE 5K 1K~5K 1K~3K 500 ~ 1K ?

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Page 29: Challenges and Trends of SSD Design

ConfidentialPerformance PCI-E SSD to the Mass Market

150018002100

3 X 3 X

600900

1200ReadWrite

SATA III bandwidth

0300

SATA 128GB PCIE 128GB SATA 256GB PCIE 256GB

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Up to 3x read performance, comparing SATA SSD

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ConfidentialPCI-E SSD Plan in 2013

PCI-E SSD will be more focus from 2013/H2 Advantages :

– Bandwidth lead– Multi-lane for scalability (x2, x4, …..)

Software compatible PCI E SSDs can be built as one AHCI device– Software compatible PCI-E SSDs can be built as one AHCI device

M.2 2280M.2 2280 SFF 8639, 2.5”SFF 8639, 2.5”SATA Express, 2.5”SATA Express, 2.5”

PCI-E

Page 31: Challenges and Trends of SSD Design

ConfidentialAdvantage of ADATA SSD Solutions In-house Flash Testing Infrastructure and Component

EngineeringFlash quality management– Flash quality management

– Fast adoption of new Flash technology

Dedicated System Engineering & Validation Team to perform System Analysis: right specification targeting and quick debugging for customers’ time-to-market

D di t d HW D l t T f d i t Dedicated HW Development Team: focused in custom form-factor developments (allow ~ 6-wks lead time) and product-optimization such as EMI.p p

Provide all SSD solution for SI, ODM/OEM, IPC and Server customers

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Page 32: Challenges and Trends of SSD Design

ConfidentialADATA SSD Solutions

Retail ConsumerS

SI/ODM/OEMS / S– 2.5” SATA

– mSATA / mSATA mini– M 2 SATA

– mSATA / mSATA mini– M.2 SATA / PCI-E

– M.2 SATA

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Page 33: Challenges and Trends of SSD Design

ConfidentialADATA SSD Solutions

IPC SATA DOM

ServerServer2 5” SATA– SATA DOM

– MO-297– mSATA / mSATA mini

– 2.5 SATA– 2.5” PCI-E

– CF / CFast

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