Challenges and opportunities for FPGA platforms · 1.3 2.7 4.5 6.5 (nm) CD Tox Substrate Gate...
Transcript of Challenges and opportunities for FPGA platforms · 1.3 2.7 4.5 6.5 (nm) CD Tox Substrate Gate...
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Challenges and opportunities for FPGA platforms
Ivo BolsensXilinx Research Labs
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Xilinx
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Xilinx
Outline
• Intro• ASICs buck the tide• FPGA ride the tide• Programmable system platform• Future
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Xilinx
Programmable Logic
4
16 words x 1 bit m
emory
A LookUp Table (LUT)any function of 4 inputs
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Xilinx
Add a register to make aLogic Cell
Out
In4
FF
CE RST
M16 words x 1 bit m
emory
M
M
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Xilinx
Memory and Arithmetic
Out
In
WEDin
4
FF
CE RST
M16 words x 1 bit m
emory
Carry M
M
M
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Xilinx
A Slice …
4
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Xilinx
A Slice: 2 Logic Cells + F(5) …
4
4
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Xilinx
A CLB: 4 Slices + …
4
4
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Xilinx
A CLB: 4 Slices
4
4
4
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4
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4
4
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Xilinx
A CLB: 4 Slices + Input/Output
4
4
4
4
4
4
4
4
40
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Xilinx
A CLB: 4 Slices + Input/Output
4
4
4
4
4
4
4
4
40
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Xilinx
A CLB: 4 Slices + Input/Output
4
4
4
4
4
4
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4
40
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Xilinx
A CLB: 4 Slices + Input/Output
4
4
4
4
4
4
4
4
40
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Xilinx
A CLB: 4 Slices + Input/Output
4
4
4
4
4
4
4
4
40
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Xilinx
Add Interconnect
4
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40
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Xilinx
Build an Array
4
4
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4
4
40
4
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40
4
4
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4
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40
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Xilinx
ASICs buck the tide, FPGAsride the tide
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Xilinx
Moore’s Law
A tale of two numbers
CD
80nm
240nm
320nm
160nm
2.71.3 4.5 6.5 (nm)
CD
Tox
Substrate
Gate
Source Drain
Tox, Gate Leakage
Channel Leakage
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Xilinx
Trend: Line Widths Smaller Than the Wavelength of Light
-
0.100
0.200
0.300
0.400
0.500
0.600
0.700
1988 1990 1992 1994 1996 1998 2000 2002
Proc
ess
Geom
etry
(mic
ron)
Optical Processing Wavelength Process Geometry
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Xilinx
Painting a one cm line with a three cm brush…
Courtesy : IBM
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Xilinx
Gate Oxide
• About 10 molecular layers of SiO2 for this 150nm example• 90nm technology is about half the thickness
Polysilicon Gate
Gate Oxide
Silicon crystal
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Xilinx
Mask Layers per Mask Set
05
1015202530354045
# of Mask Layers/ Set
# of Metal Layers/ Set
# of OPC Layers/ Set
# of PSM Layers/ Set
250
180
150
130
100 Est.
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Xilinx
Mask Set Price Trend vs. Technology
Technology Node [nm]
0
2
4
6
8
10
12
14
16
18
250 180 150 130 90
Rel
ativ
e P
rice
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Xilinx
FPGAs in The Forefront ofThe Technology Curve
1999 2000 2002 2003 2004 2005
65 nm90 nm
130 nm
150 nm
180 nm
45 nm
2001
300 mm copper wafers200 mm wafers
ITRS Roadmap
Virtex-EM
Virtex-II
Virtex-II Pro
Spartan-3FPGA Roadmap
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Xilinx
Wafer Starts
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Xilinx
Economy of ‘Scale’
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Xilinx
A decade of progress
1
10
100
1000
1/91 1/92 1/93 1/94 1/95 1/96 1/97 1/98 1/99 1/00 1/01 1/02 1/03
Year
CapacitySpeedPrice Virtex &
Virtex-E(excl. Block RAM)
XC4000
100x
10x
1x
Spartan
1000x
Virtex-II(excl. Block RAM)
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Xilinx
150nm / 200mm ASICs150nm / 200mm ASICs
FPGA/ASIC Crossover Changes
Production Volume
Cost
90nm / 300mm ASICs90nm / 300mm ASICs
150nm / 200mm FPGAs
150nm / 200mm FPGAs
90nm / 300mm FPGAs
90nm / 300mm FPGAs
FPGA Cost Advantage ASIC Cost AdvantageFPGA Cost Advantage ASIC Cost AdvantageFPGA Cost Advantage
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Xilinx
Where are we today
Logic Cells
125K
105K
Block RAM
10Mb
3Mb
Multipliers
556
168
3.125Gb/sMGTs
424
PowerPCCPUs
840Mb/sLVDS
340
442
XC2VP125XC2V8000= 350M tranistors
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Xilinx
Today’s Reconfigurable FPGA Platform
PowerPC™ Processor 400+ MHz
Programmable IO
10Mbit Dual-Port™ RAM
High-speed 3.125 Gbps Serial Transceivers
>500 DSP datapaths 10 Million gates
18 Bit
18 Bit36 Bit
Z
VCCIO
Z
Z
ImpedanceControl
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Xilinx
Design Capability: FPGAs Meet Most Requirements
> 500
200-500
50 - 200
< 50
10%
20%
30%
40%
50%
11%
13%
52%
23%
Source: Gartner Dataquest
> 1M100K-1M
20-100K
< 20K
10%
20%
30%
40%
50%
13%
42%
25%
20%
MHzGates
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Xilinx
FPGA Sweats the Details
Xilinx programmable system platform gives designers the benefits of deep submicron
Rather than focusing on getting the silicon to work, you can focus on getting the design to work
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Xilinx
Complex ASIC DesignThe Shrinking Window of Innovation
Synthesis16%
Simulation14%
Gate Simulation 7%Static Timing
Analysis5%
Floorplanning 5%
Place and Route17%
5%Extraction
Transistor Simulation 5%
Interconnect Analysis 3%
Power Analysis 3%
• Average iterations between design and layout = 20(Source Electronic Systems Jan 99)
Design authoring 20%
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Xilinx
Simpler/Faster Design Flows
• 2:1 proven Time-to-Market Advantage• No silicon design or verification steps• More design flexibility through later design
freeze
SpecASICASICFlowFlow
DesignDesignFreezeFreeze
Design andVerification
SiliconPrototype
SystemIntegration
SiliconProduction
SpecFPGAFPGAFlowFlow
DesignDesignFreezeFreeze
Design andVerification
SystemIntegration
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Xilinx
Today’s Product Lifecycle
• 37% of new digital products were late to market• Entering the market first can result in up to a 40% greater
total profit contribution over the product’s life vs. the #2 entrant
Reduced profit Reduced profit for latecomersfor latecomers
Profit for first Profit for first to Marketto MarketProfit
Time
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Xilinx
Today’s Product Lifecycle
• 37% of new digital products were late to market• Entering the market first can result in up to a 40% greater
total profit contribution over the product’s life vs. the #2 entrant
IRL extendsIRL extendsproduct life in marketproduct life in marketProfit
Time
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Xilinx
Design Starts: FPGAs Rule
200
300
400
500
100
2001 2002 2003 2004
ASICFPGA
Num
ber o
f Des
igns
(tho
usan
ds)
Source: Gartner Group
5 4 2 1.5
500
400
100X
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Xilinx
FPGAs rise to the system-level design challenge
• PLATFORM• FPGA
– Logic, Routing & I/O• Soft CPUs• Hard CPUs• Bus hierarchies• Memory hierarchies multipliers• Gigabit I/Os • RTOS, drivers, network
protocol stacks, embedded real-time s/w
• APPLICATIONS• Streaming multimedia• Network processing• Software defined radio• Third+ generation base
stations• Storage area networks
• DISCIPLINES & DESIGNERS• Systems architects, hardware
& software engineers, DSP & communications specialists
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Xilinx
PPC PPC
Towards programmable platforms
• 32-bit RISC CPU, Harvard Architecture• 130nm CMOS with 1.5V Operation• 456 Dhrystone MIPS at 300MHz• 32 x 32-bit General Purpose Registers• Hardware Multiply / Divide• 5-Stage Execution Pipeline• 16KB D-Cache, 16KB I-Cache• Memory Management Unit (MMU)• High-Bandwidth Interface to Logic• Built-In Hardware Timers• Built-In JTAG Debug and Trace support
IBM PowerPC™ 405 RISC CPU
I-Cache16KB
I-Cache16KB MMU
Fetch & Decode
Timers and
Debug Logic
Execution Unit32x32b GPRALU, MAC
Execution Unit32x32b GPRALU, MAC
D-Cache16KB
D-Cache16KB
3.8 sq mm = 1% of 2VP100
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Xilinx
“ Low PowerPC” : 0.59mW/MIPSP
ower
(m
W)
Performance (Dhrystone MIPS)
50 100 200 300 400150 250 350
100
200
300
400
0
Full-Custom IBM CPU Design1.5V 130nm CMOS Technology
Low-K DielectricIP-Immersion
Full-Custom IBM CPU Design1.5V 130nm CMOS Technology
Low-K DielectricIP-Immersion
100mW = 1 LED Indicator
…or 169 MIPS!
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Xilinx
PPC PPC
System Architecture Options• “Logic-Centric Architecture”
– PowerPC Executes Entirely out of Cache– No FPGA Logic, Memory, or I/O Used– 10-20 Pages of C-Code or More– Use as Complex Algorithmic Engine
• Web Server• Encryption/Decryption• Packet Processor
• “CPU-Centric Architecture”– PowerPC forms Heart of Embedded System– On & Off-Chip Peripherals– External Interfaces
• e.g. PCI, 3GIO, Gb Ethernet, ZBT SRAM– CoreConnect™ On-Chip Bus
• Ties System Together– Peripherals implemented in FPGA Logic– Typically Runs Embedded OS
ExternalDevices
ExternalInterfaces
ExternalDevices
ExternalInterfaces
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Xilinx
IP-ImmersionEmbed multiple IP blocks of arbitrary shape with
high-bandwidth connectivity to FPGA core logic, memory & I/O
Technologies Enabling IP-Immersion
Active Interconnect™Segmented Routing
Metal 1Metal 2Metal 3Metal 4
Metal 5Metal 6Metal 7Metal 8
Silicon Substrate
Poly
Advanced hard-IP block(e.g. PowerPC CPU)
Metal ‘Headroom’
Metal 9
PPC PPC
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Xilinx
HW acceleration
Control Tasks
Control Tasks
Code Stack (C++)
Control Tasks
Interleaver
Reed-Solomon
ViterbiPowerPCProcessor
PowerPCProcessor RAMRAM
PowerPC with Application-SpecificHardware Acceleration
Virtex-II Pro
Concatenated FEC Engine
Viterbi Inter-leaver
Reed-Solomon
Processing time
Traditional
XTREMEProcessing™
Viterbi Reed-SolomonInterleaveViterbi Reed-Solomon
The Virtex-II Pro Advantage
Interleave
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Xilinx
HW/SW Interfacing• Provides Specialized Connectivity
Between PowerPC & FPGA Logic• Dual-Port BlockRAM Memory
– CPU & Logic Each Own 1 Port
• High-Bandwidth– 6.4Gb/sec
• Low-Latency• Non-Caching
– Designed for Communications Data Processing
• Enables PowerPC & FPGA Logic to Work together on Complex Problems
BlockRAMs
I-Cache16KB MMU
Fetch & Decode
Timers and
Debug Logic
Execution Unit32x32b GPRALU, MAC
D-Cache16KB
AccelerationLogic
6.4Gb/sec
6.4Gb/sec
6.4Gb/sec
6.4Gb/sec
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Xilinx
Creating Complete Communications Solutions
Gb Ethernet (1000BaseLX/SX/CX)
TCP/IP Stack on PowerPC
TCP
IP
MA
CLink Layer inFPGA Logic(GbE MAC)MAC
RocketIO is PHY(1000Base-SX/LX)
PHY
TCP/IP
ftptelnetrloginmailetc
Upper Layerson PowerPC
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Xilinx
The MicroBlaze™
High Performance Soft CPU
TM
Micr
oBlaz
e
Arbiter
InterruptController
UART
Micr
oBlaz
eLocalOPBBus
LocalOPBBus
Micr
oBlaz
e
Micr
oBlaz
e
Micr
oBlaz
e32-Bit RISC
130nm Process300+ MHz Core
420 D MIPS
PPC 405
32-Bit RISC130nm Process
300+ MHz Core420 D MIPS
PPC 405
CoreConnectTechnology
tm
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Xilinx
System Exploration in Platform FPGA
Line
Coding
Data
Format
Payload
Qualify
Payload
AssemblyTx
Line
Decoding
Data
Alignment
Payload
Quality
Payload
BufferRx
System
Interfaces
Bus
System
Line
System
Payload
Processing
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Xilinx
Traditional Architecture
CPMU-Bus
Other Peripherals
Processor
µP BusSystem
PCI BusSystem
PCI BridgeDevice
RAM
FLASH
EEPROM
G704Framer
AAL5Processor
MemoryInterface
G703LIU
MPC860
Generic Design
CPM = Communications Processor Module
Tx
Rx
LineCoding
DataFormat
LineDecoding
DataAlignment
PayloadQualify
PayloadQuality
PayloadAssembly
PayloadBuffer
PayloadProcessing
SystemInterfaces
Motorola PowerQUICC
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Xilinx
Traditional Architecture
Motorola PowerQUICC
CPMU-Bus
Other Peripherals
Processor
µP BusSystem
PCI BusSystem
PCI BridgeDevice
RAM
FLASH
EEPROM
G704Framer
AAL5Processor
MemoryInterface
G703LIU
MPC860
Generic Design
CPM = Communications Processor Module
Tx
Rx
LineCoding
DataFormat
LineDecoding
DataAlignment
PayloadQualify
PayloadQuality
PayloadAssembly
PayloadBuffer
PayloadProcessing
SystemInterfaces
DataDirection
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Xilinx
Optimized Architecture
Other Peripherals
PowerPCProcessor
µP BusSystem
PCI BusSystem
PCI BridgeDevice
RAM
FLASH
EEPROM
G704Framer
MicroBProcessor
MemoryInterface
G703LIU
Generic Design
FPGA Boundary
Tx
Rx
LineCoding
DataFormat
LineDecoding
DataAlignment
PayloadQualify
PayloadQuality
PayloadAssembly
PayloadBuffer
PayloadProcessing
SystemInterfaces
Dual PortBlockRAM
Fast I/FFIFO
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Xilinx
Optimized Architecture
Other Peripherals
PowerPCProcessor
µP BusSystem
PCI BusSystem
PCI BridgeDevice
RAM
FLASH
EEPROM
G704Framer
MicroBProcessor
MemoryInterface
G703LIU
Generic Design
FPGA Boundary
Tx
Rx
LineCoding
DataFormat
LineDecoding
DataAlignment
PayloadQualify
PayloadQuality
PayloadAssembly
PayloadBuffer
PayloadProcessing
SystemInterfaces
Dual PortBlockRAM
Fast I/FFIFO
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Xilinx
Software Radio Architecture
RF
BB / IFReal/
ComplexDigital/Analog
Aux AuxRepresentativeInformationFlowFormats
AIR
C
I
MONITOR/CONTROL
Call/Message
Processing &
I/O
C
Routing
CommonSystem
Equipment
Clock/StrobeRef, Power
Multimedia/WAP
Voice/PSTN
Data/IP
Flow Ctrl
NSS/Network
Ext. Ref
Remote Control/Display
Local Control
CC
I/O
C
ANTENNA
I
Aux
Bits
BBText
Flow Cntl
Channel Selector/
Combiner
BasebandProcessing
DSPC
I/O I/OI/O
RF/IF
C
C
C
I I I
Aux Aux
I: InformationC: Control/Status
Aux: (Optional)I/O for Antenna Diversity,Adaptive Antenna Control Selective Encryption, etc.Link Processing Control
IF: Intermediate Freq
PSTN: Public Service TelephoneNetwork
Network SwitchingSystem
NSS:
BB: Baseband
* Figure reproduced with permission of SDR forum: www.sdrforum.org
Antenna
I/O
RF/IF
I/O
Channel Selector/ Combiner
I/O
BasebandProcessing
DSP
I/O
Call/Message
Processing & Routing
I/O
RF
Bits
BBText
Flow Cntl
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Xilinx
Re-invent the Signal Processing Platform
3.125Gb serialnetwork connectivity
50 ΩΩΩΩ
ImpedanceController
XCITEImpedance Control
PolyphaseTransformDemod 1Demod 2Demod N
TCCViterbi
PPC405- Decision oriented tasks- CORBA- Java Virtual Machine- NBAP- SCA
High MIPs processingin logic fabric
ADAD
ADAD
AD
DADA
DADA
DA
Connectivity to - Other components- Other FPGAs
Radio PHY
MAC (Media Access)MAC
• Heterogeneous platform• Address complex signal
processing systems
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Xilinx
Application Space
Architectural Space
Application Instance
Platform Instances
Platform-Based Design
Algorithm DevelopmentControl FunctionsSystem Level Modeling
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Xilinx
System Generator for DSP• Visual data flow paradigm• Polymorphic block libraries• Arbitrary precision fixed-point• Bit and cycle true modeling
• Seamlessly integrated with Simulink and MATLAB
– Test bench and data analysis
• Automatic code generation– Synthesizable VHDL– IP cores– HDL test bench– Project and constraint files
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Xilinx
Heterogenous Implementation
HDL co-simulation
Hardware in the loopco-simulation
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Xilinx
Where We Are GoingFPGA 2005
Process TechnologyTransistorsLogic CellsBlock RAMIO SpeedEmbedded ProcessorsEmbedded DSP BlocksEmbedded Mixed Signal Blocks
65 nm, 10 layers Cu1B200K15Mb10Gb/sManyVery ManyYes
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Xilinx
Combining the Best of FPGA and ASIC
100% Programmable 100% Fixed Logic
Traditional FPGA Market Traditional ASIC Market
• Flexible, but expensive • Inflexible, but highestperformance/integration
BlockRAM
Special Functions
PowerPCCore
BlockRAM
EmbeddedFPGA Core
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Xilinx
Reconfigurable Chips for Digital Signal Processing
(FPGAs, PLDs, Reconfig. Data Paths)
0
100
200
300
400
500
600
700
800
900
2002 2003 2004 2005 2006 2007
2002-2007 CAGRof 26.0%
Source:Forward ConceptsFebruary, 2003
Shipments($M)
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Xilinx
Fabric69%
IOB7%
BRAM13%
Mul t11%
Power Analysis
• Typical design– 5.9uW/CLB/MHz [FPGA00]– Fabric power is ~69% of total power– 2V6000 = 5.9uW/CLB/MHz ⋅ 8448CLBs
⋅ 100MHz ÷ 69% = 7.5W
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Xilinx
Dynamic Power
• Normalized to 2001– Best fit is a quadratic trend line– Predicts 5X by 2007
Dynamic Power
0
1
2
3
4
5
6
1994 1996 1998 2000 2002 2004 2006 2008
1996: 4000EX 1997: 4000XL1998: 4000XV1999: Virtex2000: Virtex-E2001: Virtex-II
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Xilinx
Static Power
• Normalized to 2001– Best fit is a power trend – Predicts 100X by 2007
• Future data points projected using linear trend for 1/VTHStatic Power
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
0 2 4 6 8 10 12 14
\
1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007
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Xilinx
Platform-Based DSP Design
API Platform
Architecture Platform
Application Space
Architectural Space
Application Instance
PlatformInstances
ApplicationSpecification
ArchitectureExploration
Goal: Provide a software platform to support the Platform FPGA
MATLAB
SimulinkSystem Generator
HDL SynthesisFPGA Implementation
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Xilinx
Future use model
iPAQ - ICNinterface
tile
Applicationtile 1
Applicationtile 2
Interconnect Network on FPGA Real-Time Operating
System with Hardware
Support
Multimedia Applications
VideoVideo Decoder
3D GameIMEC Gecko demonstrator
Swappable Hardware
tasks
1
2
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Xilinx
Partial Runtime ReconfigurationFPGA
ConfigurationMemory
PowerPC
Core
Conn
ectO
PBDual-port
BlockRAM
ControlLogic
ICAP
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Xilinx
Application Code
Level 0
Level 1
Level 2
Level 3
Embedded Microprocessor External (on Windows/Unix)
Hardware Independent
HardwareDependent
Software Stack
EDK
ICAP API
Emulated ICAPDevice DriversDevice Drivers
ICAP Controller
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Xilinx
Self Reconfiguration Under LINUX
Request & claim ICAP device driver
Configure &readback LUTs
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Xilinx
Partial ReconfigurabilityFPGA Flexibility for the Field
• Re-program part of an FPGAwhile it’s still running
011011
User Definable Boundaries
FixedLogic
PRLogic
PRLogic
FixedLogic
FixedLogic
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Xilinx
JBits 3.0 for Virtex II is available (FOC)
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Xilinx
Market requirementsA mass market for one person…
FPGA is reconfigurable
Business
Multimedia messagingGames
Video
Web
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Xilinx
Technology ThatWill Change People’s Lives
#1#1 Chameleon chipsChameleon chips#2 Custom Kids#3 Protein maps #4 Fractal models #5 Off-planet production#6 Nanotechnology#7 Virtual reality#8 HIV Antivirals#9 Optical computing #10 Ambient Intelligence
Top Technologies That Will Change Our Lives –Field programmable chameleon chips ranked #1. Ahead of cloning! BusinessWeek 50: Masters of Innovation, April 7, 2001
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Xilinx
Performance Scaling
0
5
10
15
20
25
30
35
40
45
0 200 400 600 800 1000
Line Width (nm)
Del
ay (
ps)
Gate Delay
Wire Delay (Al)
Total Delay (Al)
Wire Delay(Cu+Low k)
Total Delay(Cu+Low k)
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Xilinx
Best design practice to benefit from Moore’s Law
Regular architecture
Parallel architecture
Highly testable
Distributed memory
Highly pipelined
Architecture Requirements
λλλλ λ/2λ/2λ/2λ/2
+ +
+ +
store
+ ++ ++ ++ ++ ++ ++ ++ +
store
λ/2λ/2λ/2λ/2
++ + +
++ + +++ + +
++ + +
V /λ/λ/λ/λ3 3Heat/area
Interconnect Delay ρρρρ.l /λλλλ2 2
FPGA is future proof
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Xilinx
Performance requirementsFrom sequential to spatial computing
Data Out
RegData In
....C0
Data Out
C1 C2 C255
Reg0 Reg1 Reg2 Reg255Data In
FPGA provides highest MOPS/Watt/$
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Xilinx
Alternative Architectures…
• Cell based design– Deep submicron ends
‘composability’ of design
• Processors– Not scalable because of data
transfer bottleneck
• Application Specific Standard Products (ASSP)– Bull’s eye market
• ‘Structured’ ASICs– Worst of both worlds
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Xilinx
Conclusions
• Today : FPGA’s ride the tide of Moore’s Law• Future proof architecture• Opportunities :
– Programmable System Platform– DSP
• Challenges– Low Power– Design technology – Use model to exploit time dimension
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Xilinx