Ch6 I MOS Inverters Switching Characteristics I 2 13
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Transcript of Ch6 I MOS Inverters Switching Characteristics I 2 13
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8/12/2019 Ch6 I MOS Inverters Switching Characteristics I 2 13
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1
CMOS Digital Integrated Circuits
Ch6 CMOS Inverters:
Switching Characteristics
and Interconnect Effects I
2
CMOS Inverters Dynamic Analysis and Design
Goals
Understand the detail dynamic analysis of the
CMOS inverter.
Understand one set of design from CMOS
equations.
Understand the basic CMOS design process
using the CMOS static and CMOS design form
dynamic equations.
6.1 Introduction
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3
CMOS Dynamic Analysis: Capacitance Model for CMOS
Vout
VDD
Vin
Cgs,p
Cint
Csb,p
Cgs,n
Cgd,n
Cgd,p
Csb,n
Cdb,p
Cdb,n
Cg
FO
Fig. 6.1 Cascoded CMOS Inverter stages
4
CMOS Dynamic Analysis: Capacitance Model for CMOS
The aggregate capacitance driven by the output
node of a CMOS inverter is in detail working from
left to right,
Cload= Cinput+ Cint+ Cg
in which
Cinput= Cgd,n + Cgd,p + Cdb,n + Cdb,p (intrinsiccomponent)
Cint= interconnect capacitance
Cg= thin-oxide capacitance over the gate area
(extrinsic component)
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CMOS Dynamic Analysis: Delay-Time Definitions
PHL
VOH
V50%
VOL
Vin
t
idealized
step input
VOH
V50%
VOL
Vout
tVout
PLH
t0 t1 t2 t3
fallV90%
V10%t
rise
tA tB tC tD
V50% = VOL+(VOH-VOL)/2
. = (VOH+VOL)/2
PHL = t1-t0
PLH = t3-t2
P = (PHL+PLH)/2
V10% = VOL+0.1(VOH-VOL)
V90% = VOL+0.9(VOH-VOL)
fall= tB-tA
rise = tC-tD
Fig. 6.3
Fig. 6.4
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CMOS Dynamic Analysis
Delay-Time Calculation (First Order Estimates)
The simplest approach of calculating the propagation
delay is based on estimating the average capacitance
currentduring charge down/up.
where I
VVC
I
VVC
LHavg
OLloadPLH
HLavg
OHloadPHL
,
%50
,
%50
)(
)(
=
=
[ ]
[ ]),(),(2
1
),(),(21
%50,
%50,
VVVViVVVViI
VVVViVVVViI
OLoutOLinCoutOLinCLHavg
outOHinCOHoutOHinCHLavg
==+===
==+===
6.3 Calculation of Delay Times
8
CMOS Dynamic Analysis
Delay-Time Calculation (More Accurate)(1/4)
The propagation delay can be found more accurately by
solving the state equation of the output node. The current
flowing through Cloadis a function Voutas
PHL: PMOS is off. The equivalent circuit during high-to-low output transition is
iiidt
dVC nDpDC
outout ,, ==
Vin nMOS
iD,n
Cload
Vout
iidt
dVC nDC
outout ,==
VinVout
iC
iD,p
iD,n
Fig. 6.5
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CMOS Dynamic Analysis: Delay-Time Calculation (2/4)
The nMOS operates in two regions, saturation and linear,
during the interval of PHL.
Saturation Region
iD,n=(kn/2)(Vin-VT,n)2=(kn/2)(VOH-VT,n)
2
Plug iD,n into CloaddVout/dt=-iD,n, and integrate both sides,
we get
t1-t0 = 2CloadVT,n/[kn(VOH-VT,n)
2]
PHL
VOH=VDD
V50%
VOH -VT,n
Vout
tt0 t1
nMOS in saturation
nMOS in linear region
t1 Fig. 6.6
10
CMOS Dynamic Analysis: Delay-Time Calculation (3/4)
Linear Region
iD,n= (kn/2)[2(Vin - VT,n)Vout- Vout2]
= (kn/2)[2(VOH- VT,n)Vout- Vout2]
Plug iD,n into CloaddVout/dt=-iD,n, and integrate both
sides, we have
Finally, since VOH=VDD and VOL=0, we have
, ,
, ,
4( )2ln 1
( )
T n DD T nload
n DD T n DD T n D
HL
D
P
V V VC
V V V V V
= +
PHL
VOH
V50%
VOH -VT,n
Vout
tt0 t1
nMOS in saturation
nMOS in linear region
t1
,
, 50%
4( )ln
( )
DD T nload
n DD T n
V VC
V V V
=
'
1 1t t
Fig. 6.6
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CMOS Dynamic Analysis: Delay-Time Calculation (4/4)
PLH: NMOS is off. The equivalent circuit during low-to-
high output transition is
With the similar way (t0t1t10|VT,p|V50%
saturation linear ), we can have
VinpMOS
iD,p
Cload
Vout
VDD
, ,
, ,
2 4( )ln 1
( )
T p DD T pload
p DD T p D D
L
D T p
P H
D
V V VC
V V V V V
= +
12
CMOS Inverter Design
Design for Performance
Keep capacitance small
Increase transistor size
Watch out for self-loading!
Increase VDD
6.4 Inverter Design with Delay Constraints
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CMOS Inverter Design: Delay as a Function of VDD
VDD increases PHL/PLHdecreases. However,
the power consumption also increases.
0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.41
1.5
2
2.5
3
3.5
4
4.5
5
5.5
VDD
(V)
pHL(normalized)
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CMOS Inverter Design: Device Sizing (1/5)
2 4 6 8 10 12 142.
0
2.2
2.4
2.6
2.8
3.2
3.4
3.6
3.8x 10
-11
S
p(sec)
3.0
Self-loading effect:
Intrinsic capacitances
dominate
(for fixed load)
16
CMOS Inverter Design: Device Sizing (2/5)
NMOS/PMOS Ratio
R = Wp/ Wn
1 1.5 2 2.5 3 3.5 4 4.5 53
3.5
4
4.5
5x 10
-11
R
p
(sec)
PLH PHL
P
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CMOS Inverter Design: Device Sizing (3/5)
Self-Loading Effect
Cload = Cgd,n(Wn) + Cgd,p(Wp) + Cdb,n(Wn) + Cdb,p(Wp) + Cint+Cg
= f(Wn,Wp)
Using the junction capacitance expressions in Chapter 3, we have
Cdb,n = (WnDdrain+xjDdrain)Cj0,nKeq,n+(Wn+2Ddrain)Cjsw,nKeq,n
Cdp,n = (WpDdrain+xjDdrain)Cj0,pKeq,p+(Wp+2Ddrain)Cjsw,pKeq,p
Therefore, Cloadcan be rewritten as
Cload = 0+ nWn+ pWp
where
0 =Ddrain(2Cjsw,nKeq,n+2Cjsw,pKeq,p+xjCj0,nKeq,n+xjCj0,pKeq,p)+Cint+Cg
n =Keq,n(Cj0,nDdrain+Cjsw,n)
p =Keq,p(Cj0,pDdrain+Cjsw,p)
small
18
CMOS Inverter Design: Device Sizing (4/5)
Therefore, PHL and PLHare
The ratio between the channel widths Wn and Wp is
usually dictated by other design constraints such asnoise margins and the logic inversion threshold.
Lets this transistor aspect ratio be defined asR
Wp/Wn. Then, the propagation delay can be
represented as
( )( )
( )( )
,,
, ,
,,
,,
0
0
42ln 1
42ln 1
DD T nT nnPHL
ox DD T n DD T n DDn
DD T pT pp
P
n n p p
n
n
LH
DD T p DDox DD T pn
n p p
p
W W
W
W
V VVL
C V V V V V
V VVL
V V VC V V
W
W
= +
=
+ +
+ +
+
0
0
( )
( )
PH L
PL H
n p n
n
n
np p
p
p
R W
W
WR
W
+ +
+ +
=
=
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CMOS Inverter Design: Device Sizing (5/5)
As we continue increase the values of Wn and
Wp, the propagation delay will asymptotically
approach a limit value for lager Wn and Wp,
The propagation delay times cannot be
reduced beyond the above limits, and the
limit is independent of the extrinsic
capacitances.
( )
( )
limit
PHL
limit
P
n n p
npH pL
R
R
=
=
+
+
20
CMOS Inverter Design: Impact of Rise Time on Delay
pHL(nsec)
0.35
0.3
0.25
0.2
0.15
rise(nsec)10.80.60.40.20
( )
( )
2(step input)
2(step input)
2
2
2
2
PHL PHL
P
r
f
LH PLH
= +
= +
Propagation delay increases
since both PMOS and
NMOS are on during the
charge-up and charge-down
events.
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CMOS Inverter Design
Impact of Channel Velocity Saturation
The drain current is linearly dependent on VGS
Isat= Wn (VGS-VT)
Propagation delay only has a weak dependence on the
supply voltage VDD
( )
( )
50%/2load DD
n
load
PHD T
Lsat D
C V
W V
C V
I V =
22
CMOS Dynamic Analysis: Dynamic Power Dissipation (1/2)
The dynamic power dissipation can be derived as
follows.
Pdyn,avg= VDDIDD,avg
WithIDD,avgtaken over one clock period T. The
capacitance current which equals the current from the
power supply (assumingIDn = 0 during charging) is
Rearranging and integrating over one clock period T
Gives
IDD,avgT = CloadVDD
dt
dVCI
outloadD=
= V
outload
T
D
DD
dVCdtI00
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CMOS Dynamic Analysis: Dynamic Power Dissipation (2/2)
Solving forIDD,avgand substituting inPavg:
In terms of SPICE simulation, the authors offera circuit called power meter.
It should be noted here the our simple Cload
may underestimate the power dissipated. In terms of SPICE simulation, it offers a circuit
called power meter.
fVCVCT
P DDloadDDloadavg221 ==
24
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