CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in...

48
CESCIT 2015 2nd Conference on Embedded Systems, Computational Intelligence and Telematics in Control Digitising European Industry EC programmes and calls related to Cyber-Physical Systems Maribor, 23 June 2015 1 Dr. Jerome Dethier Complex Systems & Advanced Computing European Commission – DG CONNECT [email protected] This presentation only serves for explanation purposes and is not to be considered an official legal document. Legal basis are the official documents for Horizon 2020, ERDF, etc.

Transcript of CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in...

Page 1: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

CESCIT 2015 2nd Conference on Embedded Systems,

Computational Intelligence and Telematics in Control

Digitising European Industry

EC programmes and calls related to Cyber-Physical Systems

Maribor, 23 June 2015

1

Dr. Jerome Dethier Complex Systems & Advanced Computing

European Commission – DG CONNECT [email protected]

This presentation only serves for explanation purposes and is not to be considered an official legal document. Legal basis are the official documents for Horizon 2020, ERDF, etc.

Page 2: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

2

Page 3: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

3

Page 4: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Europe in the Electronics Components and Systems (ECS) value chain

4

8% EU

30% EU

Page 5: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Value creation from digitisation: Products, Processes and Business models

5

• "Digital inside": Innovations in all types of products

• Smart connected objects (or IoT) powered by e.g.

• Sensors, wearables, embedded software, Connectivity, Big data, Cloud …

• Large opportunities in all sectors (Non-tech, high-tech, SMEs, etc)

• Digital transformations of processes

• From logistics and product design to shop floor automations and CRM

• Increasing resource efficiency, productivity, ..

• Built on IoT, digital design, robotics, laser technologies, big data,..

• Radical/disruptive changes in business models

• Blurring the boundaries (products-services), reshuffling value chains

• XaaS, 3D Printing & customisation, CRMs, maintenance, A Value services

• Built on real time information, data analytics, etc..

Page 6: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Electronic Components

ICTdevices

~25% of Added Value

~33% of Added value

~40% of Added Value

~25% of Added Value

The 'digital inside' value chain

Critical Value chains

Page 7: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Digital process innovation: e.g. manufacturing

Robotics and automation

Modelling, Simulation, Analytics and big data Cyber-physical systems for

process (chain) optimisation

Laser-based manufacturing

Page 8: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Transforming the business model Blurring boundaries: products-services

8

Game-changing technologies - simulation and data analytics - sensing and control - digital automation - 3D manufacturing - Seamless connectivity and Cloud

Trends in business models − "Reintegration" across the value chain − Expansion to services − Expansion to "systems of systems" − "Sharing" economy − Des-intermediation

Products Services

ICT sector

Products Services

ICT sector

The trend

Page 9: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Our instruments

• Financial:

– R&D&I instrument toolbox (Horizon 2020)

• RTD projects, innovation actions, pilot lines, large-scale demonstrators, pre-commercial procurement, SME scheme, …

– European Structural and Investment Funds (ESIF)

• Bringing regions to dedicate investments to ICT, to foster the emergence of specialised clusters

• Mobilisation and coordination

– Stakeholder engagement, community building

– Political drive to mobilise stakeholders, investors, policy makers

• Act as game changers in Europe

• Web entrepreneurs, skills coalition, , etc.

• Regulation

– Telecom Single Market, Digital SM, but also Energy, Health, transport, etc..

– State-Aid rules

Page 10: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

EU investment in Electronics Components and Systems so far

• In 2007- 13: Around 1.7 B€ of EU investment • Embedded systems, CPS: ~800M€ (from embedded computing to

Systems of Systems)

• Components:~900 M€ (from equipment and material to MEMs,..)

• ICT work programme: • about 150 M€ per year

• Total normal calls in FP7: 1065 M€

• JTIs: • 635 M€ EU investment for period 2008-2013

• 866 M€ Member States

• + ~ 4 B€ of private investment • High leverage effect in Pilots lines and Artemis Innovation Pilot

Projects (AIPPs)

1,5 B€, total public

10

Page 11: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

11

Page 12: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Horizon 2020

Excellent Science

Competitive Industries

Tackling Societal Challenges

Climate ERC

FET

Marie Curie

Research Infrastructures

ICT

Access to finance

Innovation in SMEs

Health

Food Energy

Transport Inclusion

Components and systems

Advanced computing & Cyber-Physical Systems

Content technologies

Robotics Nanotechnologies, Photonics

Cross-cutting

Horizontal ICT innovation

Fast track to innovation

International cooperation

Future Internet

LEIT

Taxonomy of H2020

cPPPs ECSEL

32% 38% 22%

Page 13: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Horizon 2020

Excellent Science

Competitive Industries

Tackling Societal Challenges

Climate ERC

FET

Marie Curie

Research Infrastructures

ICT

Access to finance

Innovation in SMEs

Health

Food Energy

Transport Inclusion

Components and systems

Advanced computing & Cyber-Physical Systems

Content technologies

Robotics Nanotechnologies, Photonics

Cross-cutting

Horizontal ICT innovation

Fast track to innovation

International cooperation

Future Internet

LEIT

Taxonomy of H2020

cPPPs ECSEL

32% 38% 22%

Estimate EU investment for ECS 2014-20, ~ 3B€

all encompassing

( ~2.5 B€ without FET Flagship Graphene)

+1.2 B€ from MSs in ECSEL

Already in 2014-15: ~700 M€

Page 14: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Cyber-Physical Systems

14

Photonics

Cyber-Physical Systems ECSEL - CPS

(Joint Technology Initiative) driven by ARTEMIS

Low power Computing

Internet of Things

CPS in Manufacturing Following

ARTEMIS-IA Agenda

Robotics…

5G

Big Data

EPoSS IA SRA

AENEAS SRA

EFFRA SRA

Cloud

ITEA: Software Intensive Systems Societal Challenges

Member States

Initiatives

Page 15: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Short description of the 8 RIAs CPS 2014 TAPPS: Trusted Apps for open CPS • Area: development of a platform for open CPS Apps with high security

standards • Challenges: extensibility, pervasive trusted environment • Use cases: health (based on a smart trolley as a hub for monitoring devices

from the patient’s room or hospital wards), automotive (control of electrical motorbike’s internals throughout an App)

• Coordinator: FORTISS GMBH

• EU contribution: € 3,885,484

SAFURE: SAFety and secURity by design for interconnected mixed-critical cyber-physical systems • Area: safety and security by construction, for mixed–critical systems. Design

and run-time • Challenges: thermal aware scheduling, safe access to shared resources • Use cases: automotive (low level), telecommunications • Coordinator: TECHNIKON FORSCHUNGS UND PLANUNGSGESELLSCHAFT MBH

• EU contribution: € 5,231,375

Page 16: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

UnCoVerCPS: Unifying Control and Verification of Cyber-Physical Systems • Area: modeling, verification, conformance testing, code generation, tool chain • Challenges: integrated runtime control and verification • Use cases: automotive (self driving cars), smart grids, wind turbines,

manufacturing with robots • Coordinator: TECHNISCHE UNIVERSITAET MUENCHEN

• EU contribution: € 4,932,902

U-TEST: Testing Cyber-Physical Systems under Uncertainty: Systematic, Extensible, and Configurable Model-based and Search-based Testing Methodologies • Area: building dependable CPS, testing for uncertainty • Challenges: dealing with uncertainty in CPS • Use cases: Sports (athlete health monitoring), Handling and logistics • Coordinator: OSLO MEDTECH FORENING

• EU contribution: € 3,713,233.75

Short description of the 8 RIAs CPS 2014

Page 17: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

AXIOM: Agile, eXtensible, fast I/O Module for the cyber-physical era • Area: HW/SW techniques to allow easy programmability of multi-core multi-

board systems • Challenges: convergence between HPC (high performance computing) and

Embedded computing (EC) • Use cases: smart video surveillance (coordination of multiple cameras

towards a single event), smart living/home (new smart thermostat) • Coordinator: UNIVERSITA' DEGLI STUDI DI SIENA

• EU contribution: € 3,945,937.50

IMMORTAL: Integrated Modelling, Fault Management, Verification and Reliable Design Environment for Cyber-Physical Systems • Area: Reliable design and real time fault management in multi core CPS • Challenges: Minimisation of verification efforts, speeding up fault detection,

maintaining system stability with part of the resources failing • Use cases: Aerospace (satellite control) • Coordinator: TALLINNA TEHNIKAULIKOOL

• EU contribution: € 3,996,652.50

Short description of the 8 RIAs CPS 2014

Page 18: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

INTO-CPS: INtegrated TOol chain for model-based design of CPSs • Area: Integrated tool chain for comprehensive model-based design of CPS. • Challenges: support for co-model construction and co-simulation: model,

software, hardware in the loop • Use cases: automotive, agricultural, railway and building automation • Coordinator: AARHUS UNIVERSITET

• EU contribution: € 7,956,804.25

COSSIM: A Novel, Comprehensible, Ultra-Fast, Security-Aware CPS Simulator • Area: open-source framework to simulate the networking and the processing

parts of the CPS more accurate, faster and including security and CPS simulation

• Challenges: performance and accuracy of the simulation • Use cases: smart Grids, visual search • Coordinator: SYNELIXIS LYSEIS PLIROFORIKIS AUTOMATISMOU &

TILEPIKOINONION MONOPROSOPI EPE

• EU contribution: € 2,882,030

Short description of the 8 RIAs CPS 2014

Page 19: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Overview RIA use cases Aero-

space

Auto-

motive

Tele-

commun

ication

Health Surveill

ance

Smart

Buil-

dings

Logi-

stics

Smart

grids

Manufac

turing

Rail

way

Agricul

ture

Visual

search

SAFURE X X

COSSIM x

x

Tapps X X

IMMOR

TAL X

AXIOM X X

UnCoVer

CPS X X X

U-Test X X

Into CPS X X X X

Page 20: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

ICT Cross-Cutting Activities / 2014-2015

Internet of Things and platforms for Connected Smart Objects (51 M€), ICT 30

• Cutting across several LEIT-ICT areas (smart systems integration, smart networks, big data)

• Bringing together different generic ICT technologies and their stakeholder constituencies

Cyber-security, Trustworthy ICT (38 M€)

• Focuses on security-by-design for end-to-end security and a specific activity on cryptography

• Complementary to Cyber-security in Societal Challenge 7

20

Page 21: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Sneak preview ICT Work Programme 2016-17 (still draft and likely to change)

2016:

• Smart Cyber-Physical Systems

• SSI - Smart System Integration

• Robotics and autonomous systems

2017:

• Smart Anything Everywhere

• Robotics and autonomous systems

21

Page 22: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Sneak preview Cross-cutting (focus area) WP2016-17 (still draft and likely to change)

22

2016:

• FoF: Digital automation

• IoT: Large Scale Pilots and horizontal activities

2017:

• FoF: ICT Innovation for Manufacturing SMEs (I4MS phase3)

• R&I on IoT integration and platforms

• Smart and sustainable cities

Page 23: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

23

Page 24: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

What is ECSEL?

• A public-private partnership to support R&D&I

• Implementing an industry-designed roadmap for R&D&I

• Total Budget: ~5 B€ for 2014-20

• 1.170 B€ from the EU

• 1.170 B€ from Member States

• 2.34 B€ from industry (at least)

• Covers the whole value chain for components and systems

• From material and equipment to embedded systems

• Managed by a Joint Undertaking: ECSEL JU

• Balanced governance structure, Industry, MSs, Commission

24

Page 25: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Implementation in JTI

Implementation in H2020 WPs

Inte

nsity o

f in

vestm

ent

Industrially-driven R&D

Capital-intensive R&D&I,

Pilot lines, Demonstrators /

Applications

Pan-European Innovation: Take-up,

Assessment, Infrastructure, Design services

Advanced R&D

Focus: High TRLs, Large scale Pilots, demos

25

Page 26: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

ECSEL MASP: Multi-Annual Strategic Plan

Research and Innovation Actions (RIA)

• R&D projects addressing lower TRL’s (TRL 2 to 5)

Innovation Actions (IA)

• R&D&I projects addressing higher TRL’s (TRL4 to 8)

• Pilot lines and test beds (micro- & nano-electronics)

• Demonstrators, innovation pilot projects and zones of full-scale testing (integration of ECS)

26

Page 27: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

ECSEL MASP: Multi-Annual Strategic Plan

Innovation Actions (IA)

• Zones of full scale testing of new and emerging discoveries in the ECS domain

• Address the comprehensive investment in equipping and/or upgrading infrastructures for both the private and the public space, including homes, offices, transport systems, schools, hospitals, and factories.

• Can supplement the existing smart cities European Innovation Partnership and the Energy Efficient Building initiatives under Horizon 2020

• Can also prepare for future large-scale innovative pre-commercial public procurement actions in the area of ‘Smart Everything Everywhere’.

27

Page 28: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

ECSEL MASP: Multi-Annual Strategic Plan

Strategic approach for CPS:

• Architectures principles and models for safe and secure CPS

• Autonomous, adaptive and cooperative CPS

• Safe and robust perception of environment

• Evolving, continuously adapting systems through learning and adaptive behaviour

• Optimal control using autonomous CPS: agents should be able to self-diagnose, self-reconfigure, self-repair, self-maintain.

• Reliable and trustable decision making and planning

• Cooperation with humans as well as other CPS.

28

Page 29: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

29

Page 30: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Digitising European Industry: Proposal for four key lines of action

Speech of Commissioner Oettinger

at Hannover Fair 14 April 2015

Europe's future is digital:

Digitising European Industry:

Proposal of four key lines of action

complementing our efforts on a Digital Single Market

http://europa.eu/rapid/press-release_SPEECH-15-4772_en.htm

30

Page 31: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Digitising European Industry: Proposal for four key lines of action

31

Page 32: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Digitising European Industry: Next steps for Action Line 1

Digital innovation hubs

• "One world class innovation hub in every region"

• Empower any business in EU to master its digital transformation

• Exploit the regional dimension

Next steps:

1. Reinforce the link between the existing competence centres in I4MS, SAE, etc. and their (mostly highly developed) regions

2. Provide the glue/networking between EU, national, and regional "Industry 4.0"-type initiatives

3. Stimulate the dynamic growth of the ecosystems through "exporting excellence in innovation"

• Innovation hubs in less developed regions

• Link to smart specialisation

• Mobilise investments from structural funds, and others 32

Page 33: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Competence-centre based innovation hubs

EU-wide networks of competence centres

Acting as the heart of Digital Innovation Hubs

33

Regional Nodes/Projects

• Feasibility studies

• Best practice experiments

• Local dissemination

• Skills development

• Infrastructure provisioning

• H2020 Funding augmented through regional/structural funds, e.g. ESIF

• Focus on regional strengths/smart specialisation • Flexibility/little synchronisation needs + access to finance

for SMEs and Mid-Caps

Page 34: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Starting Point: EU Innovation Schemes

ICT inside of products and

services

Digital

Manufacturing

Processes

and others:

ACTPHAST, ECHORD, …

I4MS event 22 May 2015 SAE event 27 March 2015

Smart Anything Everywhere

Page 35: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Innovation hubs - an example to build on: ICT Innovation for Manufacturing SMEs

Objective: Enhancing digital transformation in manufacturing SMEs and mid-caps

Phase 1 + 2: 75 + 35 M€ of EU funding 7 + 4 large projects 40 + 30 competence centres 140 + 80 experiments 22 Members States and Ass. Countries Focus on 4 areas of ICT adoption in the FoF:

HPC cloud-based modelling, simulation and analytics services

Industrial robotics systems Laser-based manufacturing Smart sensors systems, CPS and IoT

Expanding the ecosystem Provide "glue" for natl/regl initiatives Expand into "all" regions

Page 36: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Innovation hubs - an example to build on: ICT Innovation for Manufacturing SMEs

Page 37: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Smart Anything Everywhere Initiative

37 https://smartanythingeverywhere.eu/

Application centres (CPS,

simulation, robotics, lasers etc.)

Electronic systems, cloud,

HPC centres of excellence

Infrastructure

and access

to it

Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment

Cross value chain

design experiment

Building an ecosystem

Page 38: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Smart Anything Everywhere Initiative

start February 2015 4 IAs from ICT1 and 2: 25 M€ / ~100 Experiments

Target involvement of SMEs/mid caps: +-200 EuroCPS [8.2M€]: A network of design centres boosting and initiating synergies between SMEs, major CPS-platforms and competency providers to capture the emerging markets of IoT products. 30 experiments initiated and led by SMEs. CPSELabs [7.5M€]: CPS engineering infrastructure, knowledge and tools for realising novel CPS-based products and services. The CPSELabs marketplace provides an open forum for sharing platforms, architectures and SW tools for the engineering of dependable and trustworthy CPS. 20 Focussed experiments (3-6 partners) and fast-track (12-18 months) with innovation objective. GateOne [5.4M€]: Innovation service for European smartization by SMEs. 20% of bioelectronics technologies. 50 small scale experiments to deliver innovation concept as demonstrators with SMEs engaged in testing phase. Smarter-SI [4.5M€]: Smart access to manufacturing for systems integration. To develop a RTO Community Foundry Model (CFM) that will accelerate a wider deployment of SSI with greater access to design, manufacturing capabilities for prototyping, early validation and first production for SMEs to exploit in niche markets (low volume high value). A test bed to realise 10 application experiments

IC

T2

IC

T1

Page 39: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Smart Anything Everywhere: Key Characteristics

Collaboration across value chains: competence centres and experiments

• Microelectronics

• Smart systems

• Cyber-physical systems / IoT

• Application classes

• Sector-specific applications

Dynamic scheme

• Supporting fast innovation cycles

• Call for new experiments in batches during course of the initiative

• Simplicity and flexibility: Cascading funds to third parties

Open to actors across Europe

• Across Member States and regions

• Across industrial Sectors from SMEs and mid-caps to large industries

Access to "infrastructures" and services

• Microelectronics pilot lines

• Smart system and Cyber-physical systems development tools

39

Page 40: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Action Line 2: Leadership in digital platforms for industry

Appropriate Instruments: • ECSEL Pilot Projects • PPP Work Programmes – FoF, … • I4MS and alike

Estimated EU-level investment: - At least 1 B€ through H2020 - Leveraging up to 3B€ in total

Page 41: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Blahblahcar

eBay

Convergence of Platforms: Automotive sector example

41

Amazon

Google (search, youtube,

gmail, drive, android, …)

Apple

Facebook

Criteo

Embedded Platforms EU with significant WW market share

Online Platforms dominated by non-EU

AUTOSAR

Page 42: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Action Line 3: Fill the skills gap and prepare our workforce for the 21st century

• Goal: Concerted effort to promote digital skills

• What's new: Get commitment from ministers to a roadmap

• EU added value: Act as catalyst across MSs and regions

• New EU-level actions: Work as catalyst for "digital" education, reskilling and learning

Agree on a charter of actions across EU, MSs, regions

Promote exchange of Best Practices

Launch a new EIT-KIC

• Starting Point: Grand coalition for digital jobs

• Expected complementary actions:

• MSs: Stimulate national and regional initiatives

• Industry: identify essential components of a digital skills set

42

Page 43: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Action Line 4: Smart legislation for smart industry

• Goal: Make regulation fit for the digital world

• What's new: Explore further "emerging" regulatory issues

• EU added value: Stimulate regulatory dialogue on smart digitisation issues towards a single EU-level playing field

• New EU-level actions: Start dialogue with stakeholders on:

Liability issues for autonomously acting digital systems

Safety issues for autonomous cars, robots, … working with humans

Big data issues: ownership, data and IPR protection, innovative use

• Starting Point:

• Digital Single Market Package

• EP working group on a legal framework for robotics and automation

43

Page 44: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Outline

1. Introduction - What is at stake?

2. Funding opportunities in H2020

3. The ECSEL Joint Technology Initiative

4. Digitising European Industry

5. Conclusions

44

Page 45: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Conclusions

• High political momentum for digitising European industry

• CONNECT has taken first steps towards better pan-EU collaboration – to be continued

• Collaboration with GROW, RTD, …

• Four key issues need to be addressed:

1) Wide-spread adoption & best use of digital technologies in all industrial sectors

2) Increase emphasis on pan-European platform building

3) Filling the skills gap and preparing the workforce for change

4) Provide the best framework conditions

• Success depends on a strong collaborative effort

• Between EU, national and regional initiatives

• Across DGs and programmes (H2020, DSM, industrial policy, EIT, …)

• Across all actors: industry, RTOs, social actors, …

45

Page 46: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

Conclusions

46

EUROPE needs YOU!!! Please Join…

Page 47: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

THANK YOU

Digital Agenda for Europe – Components and Systems: https://ec.europa.eu/digital-agenda/en/science-and-technology/components-systems DG CONNECT (Communications Networks, Content and Technology): http://ec.europa.eu/dgs/connect/index_en.htm Horizon 2020 on the web: http://ec.europa.eu/research/horizon2020/index_en.cfm ECSEL Joint Undertaking: http://www.ecsel.eu/web/index.php ICT Innovation for Manufacturing SMEs: www.i4ms.eu Smart Anything Everywhere SAE: https://smartanythingeverywhere.eu/ Structural Funds 2014-2020 and Smart Specialisation: http://ec.europa.eu/regional_policy/index_en.cfm

47

[email protected]

Page 48: CESCIT 2015cescit2015.um.si/Presentations/KN_Dethier.pdf · • "Digital inside": Innovations in all types of products • Smart connected objects (or IoT) powered by e.g. • Sensors,

QUESTIONS ?

48