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CATALOGUE ELSOLD 2006
___________________________________________________________________ 20 rue du Petit Chantilly _ BP.05 Sarl au capital de 38 400 € 60510 BRESLES Siret 341 149 011 00031 ℡ : +33 (0)3 44 07 99 48 APE 518J
: +33 (0)3 44 07 99 68 TVA FR4534114901100031 RCS Beauvais [email protected] http://www.sicomel.fr
ELSOLD' advantage by innovationSoft - Solders for special Soldering TechnologyIncreasing minialurizing and requirements lor long - term reliability of the entire electronics with extended effeclivepower require choice solder quality. Therefore ELSOLD€ solders are exclusively made of carefully sêlêcted High puitymetals of first melt.
ELSOLDo Wave Soldering Machines A oyt Melting point/ Operation temperatureMachine Solders Solder circulâtêd Systems Melting Rânge (recommended)
with and without inert gas S-Sn60 Pb40 P 'j83'C-190"C Z4O"C-260,Cphase S-Sn63 pb37 p tB3"C 24O"C-260.C
S-Sn64 Pb36 P 183'C-185"C 240.C-260"CS-Sn62 Pb36 Ag2 178"C'180'C 240.C-26O"C
'further alloys on inquiry
ELSOLD6 Dip Soldering A oys., t etting point / Operation temperatureHigh Temperâture Dip Tinning Melting Range (recommended)Solders High tempefarure S-Sn6O pbCup/HTF 183.C-190"C 240.C-3SO.C
range application S-Pb91 Sng Sb1 280"C"305'C 3S0.C-4S0"CS-Pb93 Sns Ag2 296'C-301"C ùbêr 450"CS-Pb95 Sn3 Ag2 304'C-310"C ùber 450"CS-Pb97 Ag3 305'C ûber 450"C
"as per intêrnal âlloy catalogue further alloys on inquiry
ELSOLDo Lêad{ree soft solders Suitable solders are avâilable lor application specific ând speci-Solders Special Low-melting alloys al manufacturing procêsses to meet your requirements. Further
solders lor static solder dètails lo be taken from the technical data sheêt.baths
ELSOLDo For optimum surface Advantages: minimized formatjon of oxides and solder bridges.Deoxidizing tension in the solder bath Furlhêr details to be taken from the technical data sheet.Tablets
Service Technicaladvice and process support. Problem relaied research and development. Relunand recycling of waste metal. Analysis report of solder baths and evâluation. Certificates ofconformance DIN / EN 10204.
Delivery Standard Width / Height mm Length mm Weigth kgSlandards
Triangular Bars 8x10 400 bundtes of 25 kg
Solder Blocks with 50x18 600 approx 4,3 kgSuspension Eye 50x20 490 approx 3,7 kg
Clippings lor start-up 8x10 ca. 40of Soldering l\rachines
Further Design Thick and Wide Bârs, Ftat Strips, Rods, Thin Bars, Threads,Solid Wires and so forth on inquiry.
Valid Stândards DIN 1707-100. DIN EN 29 453ln addition we are manufacturing in accordance with all common foreign standards. Beyondexisting standards specialalloys can be made availabe upon customer's spezification.
Fluxeslor Soft Soldering
No - clean
halide-free
resinJree
Solids Content
Special-
plâsticized
ELSOLD'
Soldering
I\,1âchine Soldeingof pdnled cùcuit boards
General applications
General applicalionsby Electfic Induslry
D€velopment, lesl and Optlmlzâllon olFluxes Accordlng to CustomeB Requlremsnts
Advice and Support of Users
Oplimum Solder and Wetling PropertiesFleduction oJ lcicie Bddge Formation
Low Solder Consumption
Data sheets are avâilable for lhe Indlvldual Fluxing Agents.
ELSOLD' soft sotd"r wires and Ftux cored wiresConlnuoLs Oualily demands a@ niluencing requ remenls on eeclronc lools and syslems consideraby.
Doe lhe lrcreâsing use oi assembly eemenls wth more precise connêxons on lhe one sid€ ând relabiilyol lhe producl asked lor on lhe olher hand opl mLm so der ng capabi ity becomes more and more rnpodanl.Substantial crileions for this in contorm ly with env ronmenl and recyclng - âre choice of adequale so ders
Everybody having in ûrind lo parlicipâle n lhe lechnicallulure has to meel lhs lask.
JL Gosrar w lr assisr yoù tô lind your individuâlsôfi sôlder prodocr.
snlPb cu las orherc
lrelting
s-sn60Pb38cu260 38 2 183 190 Electr cal equipmenl, eleclron cs,
s-sf62Pb36Ag2
s-sr60Pb36Ag4
62
60
36
36
2 178 180
178 I80
8,4 sl\47
for capacilor coalngs, oscilaiing cryslâls,
Hl9h s-Pb60sn40
S-Sn70Pb30
S-Sn63Pb37
S-Sn60Pb40
S-Pb50Sn50
S-Sn90Pb10
40
70
63
60
50
90
60
30
37
40
50
1 0
183 235
183,192
183
183 r 90
183,215
183 215
9,3
8,4
8,5
Special so der, componenl labrication
Special so der, componenl labrication
prinled c rcLil boards, SMT
Fine solder linnng, pnnted ctcuit boards
tnned or copper - plaied parls
S-Sn50Pb32Cd18
S'Sn96Ag4
S Sn95Sb5
s'Pbg1Sn8Sbl
s'Pbg3snsAg2
s-Pbgssn3Ag2
s-Pb97Ag3
50
96
95
8
5
3
32
9 l
97
93
95
2
2
3
18Cd
5Sb
1 S b
221
234-240
280 30s
296 301
304-310
305
8,5
7,3
7,3
10,6
11,2
1 1 , 0
panicularly qenlle solderng on siver plaled
e eclrical induslry el€ctromolors
e eclrical induslry elecÛomolors
e ecl ca!indùslry êlectromotors
e eclrica induslry, electrornotors
ELSOLD'97
949
3
5
230-250
220-235
7,3
7,3
wilh high leâkage resistanceh gh resistance lo cenlrilugal iorces
Fuiher al loys special solders lor lead-l 'ee solder,ng and hrgh lenperature solder joints on i lquiry
Ffux-cored solders to DIN EN 29454-'l ELSOLD'DIN EN 29 454-1
Deslgnatlon
DtN EN tSO 9455-12
rype descdption and teâturês
1.1.1. (F-SW 31) 0 Pure naluE ros n WW
1.1.3. (F SW 32) c
Q2
c3
c5
FS 28
0
0
0
0
0
0
rosin wilh âdded organ c,halide-lree activator sùbslances
Specialrosin ilùx, ony suitable forELSOLD F iLxpor Soderwrc
on bas s of modified resines lof SMT
2.2.3. (F-SW 34) 105 0
1.1.2. (F-SW 26) A2 0,50
o,75
1,00
l',4ade lrom mod fied rosin wilh additivesol carboxylc acd and olganic, haide-conranng
2.1.3. (F,SW 24) 0 Made from urea wilh addedhaldenee orgânic âcids
2.1.2. (F-SW 2s) T 240 Produced on bâsis oi orgânic cârboxyiic acid
Flux content ol cored sode6
Selection irom 0,5% 4,5% in sleps oi 0,5o/o
This niormalion appies to solders witlr one llux core only
Delivery Slandardr one-wây plaslic rcelssell'supporling rinqs:othêr r€êls on app icâlion
Soft Solders to lnternational Standards
In addilion lo lhe soft solders and soder wircs to DIN EN 29 453 andDIN 1707 100 ând EN ISO 12224-1 we manufacrure ro lhe moslmportânt Intemational Slandards.
J - STD - 004/ 005 /006ASTlv lB32-00ESA PSS - 01 ,708 / ECSS Q 70 - 08AE C S S ' O - 7 0 - 3 8 AJ|s 2 3282 ,99
ELSOLD'soft sode6 have also proved then valùe in space. Alspace vêhices aunched by lhe EUROPEAN SPACE AGENCY(ECSS)are soldered wth ELSOLOeSon solders to rhe ECSS solderstandard and hâve won â cam fôr lheir great relabiity and ong
Upon reqLesl solderwûes wth 3 4, or 5flux cores can bê supplled,
lrom 0,25 mm and upwards
100q 2509l00g 25095kg 10kg
rxs1ks
20kg
5009500915kg
ELSOLD' sotd", PastesContinuous innovations for optimum applictiontechnique in the field of micro electronics
Wlth continuous development oi SIVID components, as well âs speciai lypes of construction requirements lor structuralcomponents manufacture are increasing- lvosi important for the first operation step is the optimum choice of solderpasle for the enure process qualily and produciion result. JL Goslar experienced in production and dêvelopment ol highquality solder pastes for years wil assist you to select lhe best suitable solder paste.
Solder al loys Composit ion in % Melt ing Point in'C UseDescription Sn Pb Ag In Solidus Liquidus
S-Sn 62 Pb 36 Ag2 62 36 2 179 179 Hybrid circuits
S-Sn 63 Pb 37 63 37 183 183 S[/D-Circui ls
S-Sn 54 Pb 26 In 20 54 26 20 132 149 Temperature-sensilive componenls
S-Sn 96,5 Ag 3,5 96,5 3,5 221 221 Eulectic lead{ree alloys
Reaction solder pastes for lead{ree soldering ând heal resistant solders.
Further aloys olr nquiry.
Method of application Metal conlent in % Viscosity in Pa.s Powder Type Metal particle size
Dispenser 88 200-400 2 45-75 pm
Screen printing 88-90 400-600 3 20-45 pm
l\,4ask pr nting 88-90 600-900 4 15-25 pm
The paste-types 2, 3 and 4 are available in the previously listed application forms.
Activaiion varianiELSOLD" solder pasles are available with the following flux formulations:
Flux Type/Numbers Description
RMA / 1.1.3. Pure natural rosin with organic, halide-free aclivator additives, without amines,{F-SW 32) diamines or urea. The llux residues are non-corrosive and can remaln
al the solder joinl.
RA / 1.1.2. Pure natural rosin to which organic halide-containing activators have been(F SW 26) added. Fluxes can remain al the solder joinls.
No Clean / 2.2.3. Low residue flux on basis of halide{ree organic acids with naiural rosin{F-SW 34) but withoul amines. diamines or urea.
Packing OrderingInformation
AiFtight glassjârs with
Dispensercartridges
Soldering
109 309 1009 10009
1009 2509 500q
Reflow solderingand / or nihogen
Shelt llfe / StofageProcessingDirections
ELSOLD electronic solder pasles with guaranteedshelf life of 6 month min. if stored in sealed originalglass jars / dispenser carlridges at room lempera-ture. upright storage of cartridges. Procêssing tem-perature 20-25 "C. Solder paste to be well tempe-red and mixed prior to use.
by means of lR, convection, airand vapoÊphase soldering a.s.o.
Results Excellênt solderjng ând wetting properties, low residues, oulstanding pressure and dosing, lcicleBridge Foamation.
Seruice Individual optimization of solder pâstes to custo-mers requirements.
Advice and support of users.
Analysis of soldered joint by means ol metallogra-phy, scannjng electron microscope, cathode beamm|cro probe.
Quality / Reliability Control of electronic compo-nents
Chemical analytic
Fâult and process analysis in the solderingtechn ique
Ouality Guafantee Conlinuous quality controls by means of latest ana-tytic methods guârantee a constant product qualjtyof each single charge of solder paste.
Quality System DtN EN tSO 9001