catalog HT122/132 SMD Placement - Panasonicfa.panasonic.cn/pdf/HT122.pdf · catalog HIGH SPEED...
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2004 SMD Placement Electronic Component Mounting System catalog ●HIGH SPEED PLACEMENT MACHINE Realization of excellent productivity and placement quality enabling high speed placement at a maximum speed of 0.066 s/chip（54 500 cph） , 0603（0201）narrow spacing placement, and CSP all-ball detection placement. ※1： When using 8 mm, 12 mm tape feeder, Inside of （）double tape feeder. ※2： Depend on the board dimensions. ※3： Compatible with 220/380/400/420/480V ※4：Excluding signal tower ※5：Excluding tape feeder ※Values such as Max.speed and placement accuracy may vary depending on operating conditions. ※Please refer to the specifications on details. ※NM-HE31 HT122/132 NM-HE30 / NM-HE31 / NM-HE32 / NM-HE35 / NM-HE36 / NM-HE37 HIGH SPEED PLACEMENT MACHINE HT122 HT132 W D×H NM-HE30 NM-HE31 NM-HE32 0.066 s/chip（depends on component type） 50 μm/3 σ 0603 chip to L 24 mm × W 24 mm, QFP, BGA, CSP 3-phase AC 200 V, 9.5 kVA 0.5 MPa, 220 L/min （A.N.R.） NM-HE35 NM-HE36 2.0 s 2.5 s L 50 mm × W 50 mm to L 330 mm × W 250 mm L 50 mm × W 50 mm to L 510 mm × W 460 mm NM-HE37 7 100 mm 4 950 mm 3 230 mm 7 100 mm 4 950 mm D 1 900 mm × H 1 800 mm ※4 D 2 110 mm × H 1 800 mm ※4 3 230 mm 4 800 kg 4 600 kg 4 100 kg 5 150 kg 4 950 kg 4 450 kg 75+75（150+150） 50+50（100+100） 30+30（60+60） 75+75（150+150） 50+50（100+100） 30+30（60+60） Model No. PCB dimensions Max.speed Placement accuracy No.of component inputs component dimensions PCB exchange time Electric source Pneumatic source Dimensions Mass Model name ※5 ※3 ※2 ※1
Transcript of catalog HT122/132 SMD Placement - Panasonicfa.panasonic.cn/pdf/HT122.pdf · catalog HIGH SPEED...
2004
SMD Placement
Electronic Component Mounting Systemcatalog
●HIGH SPEED PLACEMENT MACHINE
Realization of excellent productivity and placement quality enabling high speed placement at a maximum speed of 0.066 s/chip（54 500 cph）, 0603（0201）narrow spacing placement, and CSP all-ball detection placement.
※1： When using 8 mm, 12 mm tape feeder, Inside of （） double tape feeder. ※2： Depend on the board dimensions. ※3： Compatible with 220/380/400/420/480V
※4：Excluding signal tower ※5：Excluding tape feeder
※Values such as Max.speed and placement accuracy may vary depending on operating conditions. ※Please refer to the specifications on details.
※NM-HE31
HT122/132NM-HE30 / NM-HE31 / NM-HE32 / NM-HE35 / NM-HE36 / NM-HE37
HIGH SPEEDPLACEMENT MACHINE
HT122 HT132
W D×H
NM-HE30 NM-HE31 NM-HE32
0.066 s/chip（depends on component type） 50 μm/3 σ
0603 chip to L 24 mm × W 24 mm, QFP, BGA, CSP
3-phase AC 200 V, 9.5 kVA0.5 MPa, 220 L/min（A.N.R.）
NM-HE35 NM-HE36
2.0 s 2.5 s
L 50 mm × W 50 mm to L 330 mm × W 250 mm L 50 mm × W 50 mm to L 510 mm × W 460 mmNM-HE37
7 100 mm 4 950 mm 3 230 mm 7 100 mm 4 950 mmD 1 900 mm × H 1 800 mm ※4 D 2 110 mm × H 1 800 mm ※4
3 230 mm
4 800 kg 4 600 kg 4 100 kg 5 150 kg 4 950 kg 4 450 kg
75+75（150+150） 50+50（100+100） 30+30（60+60） 75+75（150+150） 50+50（100+100） 30+30（60+60）
Model No.PCB dimensionsMax.speedPlacement accuracyNo.of component inputscomponent dimensionsPCB exchange timeElectric sourcePneumatic source
Dimensions
Mass
Model name
※5
※3
※2
※1
Improvement of productivity
Further evolution of accurate component placement from microchips to BGAs and CSPs.
Compatible with high productivity
● The rigid, low-vibration die-cast frame and weight reduction of placement head, and vibration reduction of the rotary head and X-Y table allow a placement accuracy of 50 μm/3 σ. ● Switching of placement blow timing with every placement speed and nozzle ensures placement under optimum conditions and improves placement quality. ● Control of component placement height with high- accuracy line sensor allows high-quality placement. ● Recognition camera with small and large field of view, reflective and transmissive component recognition as well as coaxial reflective lighting provide high-accuracy recognition and placement of components from 0603（0201）microchips to 24（L） × 24（W） mm QFPs.
● 18 placement heads（6 nozzles）allow maximum placement speed of 0.066 s/chip（54 500 cph） ● Increased speed of the X-Y table realizes high productivity. ● Using the top tape batch removal cap at the tape feeder shortens component exchange time. ● Double tape feeder allows loading of up to 300 different components. ● IPC* enables component recognition automation and reduction of equipment stoppage loss. ● Rotary Magnet（RM）system bulk feeder* allows high-speed aligned reliable feeding and long-term uninterrupted operation.
● Touch panel allows easy operation. ● Cutting down the number of recognition algorithm component assortments to seven groups, that do all the 100 kinds of jobs as before, allows easy assortment selection. ● Convenient, complete library creation method. ・Wizard system based on database search and diagrams. ・Automatic instruction method that teaches and conveys component data.
Rotary head
Placement head configuration:18ST×6 nozzles
Rigid die-cast frame
Seven group component assortments
Recognition camera
Wide field of view camera
Narrow field of view camera
Suction
Line sensor
Recognition
Nozzle selection
Component disposal
θcorrection
Placement
Ambient lighting
BGA/CSP lighting
Transmissive lighting
Coaxial lighting
New model light placement head
* Option RM bulk feederDouble tape feeder
New model high-speed XY table Top tape batch removal cap
NM-HE30 / NM-HE31 / NM-HE32 / NM-HE35 / NM-HE36 / NM-HE37
HT122/132SMD Placement
HIGH SPEEDPLACEMENT MACHINE
※Changes in specifications and appearance may be made without notice for product improvement. ※Printed on recycled paper with soy ink.may.2004
Panasonic Factory Solutions Co., Ltd.Inquiries...
To ensure safety when using this equipment, all work should be performed according to that as stated in the separate Operating Instructions. Read your operating instructions manual throughly.
Safety Cautions
All data as of May. 1, 2004.
