Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk...

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Case Studies in MEMS Technology Transduction or Bulk micromach. Piezoresistive sensing + bipolar circuitry of diaphragm deflection Surface micromach. Capacitive detection of Me proof of mass motion Surface micromach. Electrostatic torsion of splays + XeF 2 release suspended tensile beams Surface micromach. Cantilever actuation Glas tion Bonded etched glass Pressure driven flow Microcap across T-controlled zones Bulk & Surface Electrophoresis & Microf micromachining electrowetting & Polymers

Transcript of Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk...

Page 1: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Case Studies in MEMS

Case study Technology Transduction Packaging

Pressure sensor Bulk micromach. Piezoresistive sensing Plastic + bipolar circuitry of diaphragm deflection

Accelerometer Surface micromach. Capacitive detection of Metal canproof of mass motion

Electrostatic Surface micromach. Electrostatic torsion of Glass bondedprojection displays + XeF2 release suspended tensile beams

RF switches Surface micromach. Cantilever actuation Glass bonded

DNA amplification Bonded etched glass Pressure driven flow Microcapillarieswith PCR across T-controlled zones

Lab on a chip Bulk & Surface Electrophoresis & Microfluidics micromachining electrowetting & Polymers

Page 2: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Analog Devices: Capacitive Accelerometer

- Microsystems have a smaller mass and are more sensitive to movement- capable of detecting 0.02 nm displacement (10% of an atomic diameter)- Issues: Bandwidth/Speed, Resolution and Accuracy

Page 3: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

MEMS Accelerometers Applications & Design goals

The detection of acceleration:- useful for crash detection and airbag-deployment- vibration analysis in industrial machinery- providing feedback to stop vibrations …..

Design goals:

- Accuracy, Bandwidth and Resolution- Large dynamic range desired ( 1 nanogram – 100 grams)- Minimize drift (time and temperature)

Open loop vs. close loop (with feedback)

Courtesy: Boser, UCB

Page 4: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL accelerometers/inertial sensors: new applications

www.analog.com

E-book/Digital magazineIntegrating ADXL 311 with Toshiba’s Portégé M200/205 series tablet PCs

Hard-drive protection technologyIBM ThinkPad® (The accelerometer detects shocks/free fall conditions, and within a fraction of a second signals the drive’s read/write heads to temporarily park, helpingprevent contact with the disk drive until the system is stabilized

Digital blood pressure monitors (Omron)ADXL202E (the accelerometer senses the angle and height of the users elbow and starts measurements only after the wrist is set at the right position)

Vibration control, optical switching ….

Page 5: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Principal ConceptDisplacement xcan be used to measure acceleration

• Sensing of acceleration by sensing a change in position• Sensitivity dictated by mass (m) and nature of spring (k: material dependent)

x

acceleration

Proof mass

For dynamic loads (Simple Harmonic Motion): a = x

Hooke’s law for a spring: F = kx = ma

Page 6: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Position control system

Position errorDisturbance

In Out

External

ForceIn Out

Actual position

Measurement Noise

Position Sensor

Measured position

Set point+

-

In Out

Controller

+

++

+

Open loop, with force feedbackClosed loop, no force feedback (most accelerometers on the market)

MEMS device

Object

Page 7: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Modeling a MEMS accelerometer

2o

n

ω

a

k

FF x

F: Applied forceFn: Johnson/Brownian motion noise force: resonant frequencya: acceleration

• Design the accelerometer to have a resonance frequency > expected maximum frequency component of acceleration signal

Greater sensitivity (x) by increasing ,

e.g 50 g accelerometer: (o ) 24.7 kHz, xmax: 20 nm

1 kHz, xmax: 1.2 m

(BW) Tk4F B n

@ 24.7 kHz, noise = 0.005 g/Hz

1 mg - 220 picograms

bandwidthtemperature

Good signal to noise ratio

Page 8: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Sensitivity- Determined by noise (fluidic damping, circuit noise, shot noise …)

Johnson/Thermal agitation noise

Page 9: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Electrical capacitance change can be used to measure displacement

Parallel plate Inter-digitated electrodes

Two schemes used for position sensing:

g

x

Co = Ag

C1 = Ag - x

C = C1 - Co

Change in Current IQcan be measured by an ammeter

t

Q = C V

Page 10: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

The parallel plate capacitor

+

-V

I

Area (A)

z

There are two counter-balancing forces, a electrical force and an mechanical forcein a capacitor, an Electro-Mechanical system

A force of attraction

Page 11: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

A MEMS cantilever

Mechanical displacement using an electrical voltage

Voltage source

Applied voltage (Electrostatics) causes a Mechanical force which moves the cantilever

Si substrateV

Spring + + + +

- - - -

Fmech = k x; Felectrostatic = Q2

+Q

-Q

2A

Displacement (x) = 2A k

Q2

Q= CV

Displacement sensitivity: 0.2 Å (0.1 atomic diameter)- can be used for single molecule sensing (NEMS)

Page 12: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

The parallel plate capacitor

Charge stored (Q) = C (capacitance) · V (voltage)

Az

Electrical work (dW) = ∫ V dQ = Q2 2C

= Q2z2A

At equilibrium, electrostatic force (Fel) = mechanical force (Fmec)

Electrostatic force (Fel) = dWdz

= Q2

2AMechanical force (Fmec) = k z

Dispacement (z) = Q2

2Ak V2

2g2=

Charge controlled Voltage controlled

Page 13: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Electrostatic virtual work

Increased stored energy due to capacitance change UV2 C

Work done, due to mechanical force (Wmech) = F x

Work done by voltage source (Wsource) = V·Q = V2·C

12

CV

+

-

Wmech + Wsource = U

Electrostatic force (Fele) = - V2

2

1 ∂C∂x

Page 14: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Principle of capacitive sensing-Differential sensing (Overcomes common mode noise, with linearization)

Page 15: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL Accelerometers- Construction

Page 16: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Slide courtesy: M.C. Wu

Differential Capacitive Sensing

Page 17: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Differential Capacitive sensing

Page 18: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Electrical capacitance change as a function of displacement

g

x C = Ag - x

Electrostatic force (Fele) = - V2

2

1 ∂C∂x

∂C∂x

= oA(g – x)2

Restoring force (Fmec)= - k x

Equating, Fele = Fmec we get,

(g-x)2x = AV2 2k

At a critical voltage, Vpull-in

when x = g/3 the capacitor plates touch each other

Page 19: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Bi-stable operating regime of electrostatic actuators

Page 20: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Voltage controlled gap-closing actuator

S. Senturia, Microsystem design

Page 21: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL Accelerometers- Construction

Page 22: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Process flow: iMEMS technology

-24 mask levels (11: mechanical structure and interconnect 13: electronics, MOS + Bipolar)

(necessary to preventelectrostatic stiction)

(2)

(1) Initial electronics layout

Deposition of poly-Silicon (structural element)

Partially amorphous toinsure tensile stress(prevents warping/buckling)

Page 23: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

(3) Deposition and patterning of CVD oxide and nitride,opening of contact holes and metallization

(2)

(4) Schematic of final released structure

Page 24: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

www.analog.com

Functional block diagram

Page 25: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Electrical detection of signal

Page 26: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL Accelerometerswww.analog.com

100 million acceleration sensors shipped through September, 2002

Page 27: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL Accelerometers

Page 28: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

ADXL accelerometers/inertial sensors: new applications

www.analog.com

E-book/Digital magazineIntegrating ADXL 311 with Toshiba’s Portégé M200/205 series tablet PCs

Hard-drive protection technologyIBM ThinkPad® (The accelerometer detects shocks/free fall conditions, and within a fraction of a second signals the drive’s read/write heads to temporarily park, helpingprevent contact with the disk drive until the system is stabilized

Digital blood pressure monitors (Omron)ADXL202E (the accelerometer senses the angle and height of the users elbow and starts measurements only after the wrist is set at the right position)

Vibration control, optical switching ….

Page 29: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Comb-Drive ActuatorsWhy?

- larger range of motion- less air damping, higher Q factors- linearity of drive ( V)- flexibility in design, e.g. folded beam suspensions

Page 30: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Movable electrode

Ct = 2 gt - x

h w

Cs = 2 gs

h (t + x) X Nteeth

w: width, h: heightt: initial overlap

displacement

Scale: 5 m

Electrostatic model of comb drive actuator

Fixed electrode

Cs

Ct

wx

t

gtgs

Higher N, lower gt and gs higher Force

Page 31: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Comb-Drive Actuators: Push-Pull/linear operation

VL (Vbias – v)

(Felec)L VL2

VR (Vbias + v)

(Felec)R VR2

(Felec)total (Felec)R – (Felec)L (VR2 – VL

2) 4 Vbias· v

Page 32: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Displacement vs. Applied voltage

Dis

pla

cem

ent

Control voltage (v)- gt

gt

Vbias

400

V

300

V

200

V

100

V

-Expanded linear range- bias voltage to control gain

Page 33: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Comb-Drive Actuators

Page 34: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Comb-Drive Actuators: Fabrication

Page 35: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Instabilities in comb-drive actuators

Lateral instability- increases at larger voltages- proportional to comb-spacing

Courtesy: M. Wu, UCLA

Page 36: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

To increase lateral stability, at small gaps

- Optimized spring design - Use circular comb-drive actuators

Page 37: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Is there a limit to the gap size?- breakdown

Paschen’s law VB (breakdown voltage) = A (Pd)

ln (Pd) + BP: pressured: gap distance

Very few ionizing collisions

1 m @ 1 atmosphere

Many ionizing collisions

Page 38: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Why electrostatic actuators are better thanmagnetic actuators for micro-systems

- larger energy densities can be obtained

Page 39: Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Why electrostatic actuators are better thanmagnetic actuators for micro-systems