NGC / CSTC 2009 –

McMaster University 1

Ian McWalter

Canada’s National Design Network – from nano to macro

2

Agenda

•

About CMC Microsystems•

The National Design Network–

Who?

750 Faculty members at 45 Universities

–

What?

Design, Make, Test

•

The opportunity•

Outcomes

•

emSYSCAN•

The Roadmap

3

CMC Microsystems

•

An organization with a 25-year history of stimulating R&D–

Discovery (leading to publications) and –

Innovation (leading to products);–

Involving micro- and nano-scaletechnologies;

–

Through delivery of research infrastructure (tools) and

–

A path to commercialization.

•

A not-for-profit organization:–

Industry, university and other members.–

Headquarters in Kingston (Innovation Park at Queen’s University)

–

National test lab operation (U Toronto, McGill U, U Manitoba, Queen’s U)

–

Photonic project R&D office at the Canadian Photonics Fabrication Centre (NRC, Ottawa)

CMC enables and supports the creation and application of micro-

and nano-system knowledge by providing a national infrastructure for excellence in research and a path to commercialization of related devices, components and systems.

Positioning The National Design Network – Strategic Goals

1.

Enable excellence in microsystems/nanosystems research–

As indicated by scientific advancement and recognition.2.

Enrich the research training environment leading to increasingly

qualified people–

As indicated by post-graduates who join Canadian industry.3.

Foster multidisciplinary activities–

As indicated by collaborative ventures and their Outcomes.4.

Deliver infrastructure for microsystems/nanosystems prototyping–

As indicated by experimental integration prototypes and related quality measures.

5.

Provide a path to proof-of-concept demonstration and commercialization

–

As indicated by startup companies, patents and licenses.

ECE/EE 67%

Mechanical Eng. 9%

Computer Science 10%

Other Engineering 3%

Eng. Physics 2%

Physic 5%Chemistry 3%

Other  1%

Faculty Members by Discipline/Department, 2007

Registered University Users

~750 Registered Faculty Members 2008

More than 60 holders of Canada Research Chairs

5

Trend: The Changing Preferences of NDN Researchers in Areas of Application

Examples of Other include:

Natural Resources (Energy), Environment, Agriculture

Examples of Other include:Natural Resources (Energy), Environment, Agriculture

Registered faculty members whose interests were known -

1999: 163, 2003: 292, 2006: 504, 2007: 639, 2008: 753

7

The Supply Chain: Some of the CMC Suppliers

MOSIS

8

Prototyping Technologies Used for about 400 NDN Projects Annually

•

Advanced and mature CMOS prototype manufacturing services from national and international manufacturers:–

65nm - 90-nm - 0.13 micron

–

0.18 micron - 0.35 micron - 0.8 micron–

Starting to use of 45 nm CMOS

–

2.5 GHz bipolar linear array (single layer metalization)•

MEMS prototyping :Surface/SOI; CMOS

•

Microfluidics prototyping: Dual plane in-channel electrode metallization technology; Closed microchannels glass networks

•

Photonics/Optoelectronics prototyping (silicon or III/V)

Technologies sourced from: CPFC/NRC, DALSA, Sound Technologies sourced from: CPFC/NRC, DALSA, Sound Design Technologies, Micralyne, IBM, MEMSCAP, Design Technologies, Micralyne, IBM, MEMSCAP, STMicroelectronics, TSMC, CMP, MOSIS, IMECSTMicroelectronics, TSMC, CMP, MOSIS, IMEC

9

Operating 4 Test Laboratories

Mixed Signal (McGill )PI: Gord RobertsTeradyne FLEX Tester96 CH digital @ 200 MHz24 bit analog I/O16 bit high speed analogRF to 6 GHz High power pulse

Digital (Toronto) PI: Glenn GulakVerigy 93000 Tester500 channels @ 600-1250 MHz256 channels @ 500 MHz3 channels RF @ 6 GHz (modulated)Digital virtual test via emulation20 GS/s digital storage scope

Photonics (Queen’s)PI: John Cartledge40 GB/s and 10 GB/s BERTsDevice testing for E/O, O/O and O/ESignal characterization

(electrical and optical)System characterization 10-160 Gb/s Multi-channel, multi-span transmission

RF(mm-wave) (Manitoba)PI: Greg Bridges40 MHz to 110 GHz RF test capabilitySemi-automatic wafer proberSignal characterization to 110 GHzSignal generation to 110 GHzNoise figure analysisPower measurement

10

Photonics Products and Services Overview

•

CAD tools for–

Mode solving–

BPM simulation–

Design optimization–

Physical layout and verification of optical components, customized for CMC’s prototype fabrication services

•

Prototyping–

III-V and silicon-based prototyping services provided in partnership with the Canadian Photonics Fabrication Center (CPFC)

–

New: SOI passive waveguide photonics through IMEC (Belgium)

•

Extensive test resources, including–

Laser/waveguide test station–

Vertical fibre coupling–

Advanced Photonic Systems Lab

•

Training–

Silicon Nanophotonics Fabrication Graduate Course (in partnership with UBC)

11

Microfluidics

Microelectronics

MEMSPhotonics

Embedded Software

Opportunity…Microsystems Influence All Sectors: Jobs, Growth, R&D

Health Care

Environment Transportation

Aerospace

Security Agriculture

Energy

BiotechnologyCommunication

s

This Conclusion, in 2003 for the NDN, shown here from the ITRS in 2007 and used at Semicon West in 2008, has been re- affirmed globally and continually.

13 <Project Name> DP1

Design Hardware Infrastructure and IP 70% increase in FPGA-based platforms; 20X- 60X increase in CAD tool disk capacity • FPGA-based System-level Prototyping Systems (700)

o Xilinx Virtex-II Pro FPGA (310 systems) • ARM Rapid Prototyping Platforms with Mentor RTOS (58) • Multi-Processor SOC Methodology Platforms (8)

o System-level simulation and FPGA implementation • MEMS-FPGA Platforms (8)

o Analog-interfacing, HV amplifier • Tensilica-configurable processor IP

o FPGA netlist generation • Supported Technology Configuration (STC) Disks (36):

o 3TB (23)/2TB (4)/1TB (1) ; 50GB-219GB (8) • MIPS microprocessor (6) • Tensilica-configurable processor IP

o FPGA netlist generation

Design Tools 2.5X increase in capability from 2004 Microelectronics/microsystems • Cadence - 38 universities • Mentor HEP - 36 universities • Synopsys - 37 universities • Xilinx - 36 universities • Celoxica - 23 universities • Coware - 27 universities • Forte - 16 universities • Matlab - 34 universities MEMS/microfluidics • ANSYS - 16 universities • MEMSPro - 22 universities • COMSOL - 9 universities • Coventor - 9 universities Photonics • Design Workshop - 18 universities

• Optiwave - 7 universities •Rsoft - 9 universities

Training and Support2X training events with focus on MEMS and photonics CAD Training Courses

2004-2005: Matlab , Altera MIPS Microprocessor

• 2006-2007: ANSYS; Coventor ; MEMSPro; Tensilica Microprocessor

• 2007-2008: Design Workshop ; Tensilica; Xilinx

• 2008-2009: ANSYS; Comsol ; Coventor; MEMSPro

• Over 1000 support interactions annually

Methodology and KitsStrong emphasis on accelerating research results through development and dissemination of flows, user guides and Application Notes • Embedded Software,

Memory Integration and DFT Flows

• 52 Application Notes • 20 Tutorials • 40 Getting-Started/User

Guides • 10 Methodology Guides • 100 kits and kit upgrades

• 10 Reference Designs • Digital, Analog, RF and MEMS

Flows

Custom Integration Projects Support for 64 custom ntegration projects in areas such as:

Flip chipping Surface functionalization Ceramic carriers Photonic packaging Folded PCBs Selective encapsulation Implantable electrodes Vacuum packaging

NATIONAL DESIGN NETWORK 2008 Impact

Over 750 academic faculty and 2000 PhD and MSc students at 45 universities benefitted from NDN services in areas related to microsystems

research. More than 450 CAD tool licenses were distributed,

370 chip designs fabricated, some 200 test transactions conducted and 35 custom

integration projects completed.

Microsystems FabricationOver 1800 designs fabricated for 160 researchers in 27 universities Microelectronics • CMOS (nm): 65 , 90 • CMOS (micron): 0.13; 0.18;

0.35; 0.5 ; 0.8 • 2.5 GHz Linear Array Photonics • InP; GaAs ; SOI MEMS • PolyMUMPs ; SOI ;

MetalMUMPS Microfluidics • Glass-based, single channel Integrated electronics • MEMS post-processing

on 0.8-micron CMOS • Microfluidics with

embedded electrodes MNT Lab Access • MNT Facilities Catalog • MNT Travel & Fabrication

Awards

Test and MeasurementNational Microelectronics and Photonics Testing Collaboratory implemented and MEMS/microfluidics testing solutions delivered. • Microfluidics System

Prototyping Carrier Platform • 140-pieces leading-edge

photonic test equipment including 10 GB/s and 40GB/s BERTs, DQPSK

• Industry-standard ATE o Verigy 93000 Digital /RF

SOC Tester o Teradyne FLEX mixed –signal

tester • RF Test capability spanning

40MHz to 110 GHz • MEMS/microfluidics parametric

testing, high-speed actuation analysis

Denotes products/ services introduced to the NDN during the 2004-2009 period

14 14

Designs• Microelectronics• Microsystems

Fabricated Designs• Microelectronics• Microsystems

Tested Prototypes• Microelectronics• Microsystems··

• An Increasingly Competitive Microsystems Industry(both Nationally and Internationally) with SignificantEconomic and Social Benefits for Canada

• More Highly Skilled Microsystems Professionals Enabled

Deliver Products and Services

Ulti

mat

eO

utco

mes

(5+

year

s)

Inte

rmed

iate

Out

com

es(2

-4 y

ears

)

Imm

edia

teO

utco

mes

(<1

year

)

Out

puts

Act

iviti

es FabricationServices

Design Tools andMethodologies

Testing Productand Services

Deliver Trainingand Support

Promoting, Liaising,Networking with Clients, Industry,

and Other Stakeholders

LegendUG: undergraduatePG: postgraduateCRC: Canada Research Chairs

Performance Management MODEL –

Outcomes 2008

Updated: 31 March 2009

285 University collaborations with Canadian industry for $14.9M Support; 22 Licenses; 72 Patents; 6

Startups; 75 University collaborations with foreign industry for $2.7M

Support

753 Faculty (including 68 CRCs, 7 NSERC Chairs, 3 both)

339 PG Courses 362 UG Courses

1997

PG Students

268 Faculty• Tutorials• Workshops• Forums• User Groups

• Meetings/Symposia• Promotional Material• Success Stories• Newsletters• Collaboratory• Discussion Groups

• Cost-effective Research Excellence Enabled• Students More Capable of Using Industry Standard Tools• Students More Skilled in Microelectronic/Microsystems

Design, Build and Test

• Increased Awareness of CMC’s Role• More Timely, Informed, and Consistent Messaging

Among Partners and Stakeholders• Better Alignment of CMC and Client Expectations

• Increased Commercialization of MicrosystemsResearch Including Spinoffs

• A Larger Pool of Highly Skilled Microsystems Professionals

• More Integrated, Multi-sectorial Teams of Innovators• Increased Opportunities and Resources for

Collaborative Research in Microsystems

503

PG students move to Canadian Industry180 Awards 2275 Publications

15

NDN Researchers’ Preferred Areas of Technology Application, 2008 and Projected to 2014

2008: Actual for 753 Researchers 2014: Projected for 1185 Researchers

Form-Factor Relevant Integrated Microsystem Prototypes

Example: Validation, Proof-of- Concept, Development System

Optical Analysis Instrumentation

Microfluidic Interfacing:• Programmable pump/valve• Flow sensor• Pressure sensor• Tubing, fittings, adapters

Fixture interface formicrofluidic chip

FPGA-based Co- processing and Control Microfluidic Chip

Control, Data Acquisition:host computeruser interface

Dedicated Instrument Drivers and Controllers

Example: Proof-of-Concept Development

reverse side viewchip antenna EMR shield layer

Sensor head

3-axisaccelerometer

Master processor and radio

Data acquisition

IDC20

Example: Form-Factor Relevant Proof- of-Concept Development System

Intermoduleconnections

DAQ

Masterprocessorand radio

Gyroscope andaccelerometer

Power source

System interfaceand datacoms

Signalfiltering

Thermistor

Data cable

TI cc2430processor/radio SOC

Wireless TempSensor

20

Compact, low energy, wireless-enabled microsystem development platform

emSYSCAN National Infrastructure for 37 Universities

MicrosystemsRapid-Prototyping,Characterizationand Integration Labs

4 Universities:• UBC• UManitoba• Queen’s• École Polytechnique

Management & OperationsIncludes selection; procurement; configuration; installation and delivery; access and utilization management; engineering/technical support; Train-the-Trainer events; emSYSCAN Advisory Group coordination; reporting, legal and financial administration.

License ManagementServer (LMS)

All 37 Universities

Secure,Managed Access

Real-Time Embedded Software Lab

University of Waterloo

Multi-Technology Design Environment

Development Systems• System validation and

proof-of-concept demonstration

• System architecture exploration • Multi-technology simulation• Design of custom devices for

manufacturing

DevelopmentSystem

HardwareLicenseManagement

Appliance• Minimized development

cycle prototyping and performance measurement

• Integration for field testing

• Design, analysis, debug of real-time software on next-generation processor systems

InstalledDesign

Environment

The Resulting Infrastructure Technology Roadmap

2009 20112010 20132012 2014Roadmap Period of Interest: April 2009 to March 2015

Technology for Devices, Structures and Transducers (sensors and actuators)

Integrated Microsystem Architecture Attributes

Design Methodology

Test Methodology

Legend: Arrows indicate continuing enhancement or new options.

Kit: digital

Kit: RFKit: analog

Footprint: 10 cm3 (includes folded PCB)Stack: 5 layers, boardsPower: mWRF centre: 430MHz, 870MHz, 2.5GHz

Footprint: 1 cm3

Stack: TSV devicesPower: nW

Design-for-assembly (flow)

Interposer: embedded passives

Fixturing: microfluidics

GaN:

0.8µm Ft~ 20GHz CMOS: 800nm to 45nm

GaN:

0.4µm Ft~ 60GHz GaN:

Ft~ 125GHzCMOS: 32nm

Substrate: LTCC

Power: battery Power: scavenging Power: scavenging/implantable

Coatings: bio-compatibleCoatings: organic

Fixturing: 600MHz digital

Interposer: embedded activeCoatings: inorganic

Power: PV/solar

Photonic crystals/SOI III-V Qdot lasers III-V Qwell intermixing Photonics/GaN III-V Qcascade structures

Si-photonics Si-fluidicsMicrofluidicsMEMS

Standard, scalable system driver and test interface

High-speed clock and data recovery modules

Interfaces optimised for bench-top multi-sensor system prototyping

Substrate: RF signal optimised

Substrate: RF+ microfluidic optimised

Substrate: photonic+ microfluidic optimised

Si-other enhancements

Kit: MEMSKit: microfluidics

Kit: Multi-tech prototyping flow

New baseline instrumentation cage and racked instruments

Extend rack options for select technologies (photonics/microfluidics)

Instrument signal sensitivity on femto-scale

100 GHz BERTPortable environmental test chambers

Fixturing: multi-technologyFixturing: photonics

Fixturing/assembly: small footprint optics

SiC substrate technologies

passive, COTS, chip-scale … Antenna …active, tunable, monolithically integrated

Hours/days .. Operating time … Years/indefinite2 (accelerometer, temp) .. Add-in sensor options … 8

Programmability: small footprint flash, register setup

Programmability: SDR, reconfigurable hardware

SIP test interface

MEMS test module (optical, 20 KHz)

MEMS resonator

Visible λ

test 100 Ghz Telecom test THz component test

Simulation: co-simulation methods and portfolio of point simulators on-demand

Embedded software debug and on-line lab.

Condition telemetry (hardware, software)

Nanotechnology region epi lift-off

Nano-scale wire interconnect

Near IR λ

test

Multi-processor debug Code parallelization tools Kit: real-time operations Communications protocol stack tools

Mixed-signal FPGA