CAM/InCAM The Superior CAM Solution for High-end PCBs · CAM/InCAM ® DFM and analysis ... copper...

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The Superior CAM Solution for High-end PCBs CAM/InCAM ® CAM/InCAM ®

Transcript of CAM/InCAM The Superior CAM Solution for High-end PCBs · CAM/InCAM ® DFM and analysis ... copper...

The Superior CAM Solution for High-end PCBs

CAM/InCAM®

CAM/InCAM®

Get the best out of your CAMInCAM is a comprehensive CAM system for HDI

and IC packaging board makers that performs

fast, high-precision CAM tooling and production

data optimization via powerful design-for-

manufacturing tools, helping manufacturers

meet production challenges in a collaborative

and secure work environment.

InCAM®— The Superior CAM Solution for High-end PCBs

Fast, high-precision CAM toolingManipulate production data with dedicated

DFM tools, Check & Fix, collaborative processing,

background processing and system-wide

automation. Operators can run and edit global

repairs per layer while advanced processes run

in the background. For streamlining operations,

combine standard scripting languages with

InCAM line mode commands.

Improved data integrity and fault indicationEfficiently manage and protect job data:

Store customer preferences to standardize

practices and reduce errors.

Avoid scrap by automatically identifying

discrepancies between customer and InCAM-

generated netlists.

Cleanup tools optimize input data for analysis,

transforming poor quality data into a format

InCAM DFMs can understand.

Quickly react to warnings highlighted in the

ASCII file and in the corresponding graphic file.

Streamlined user interface, easy-to-use toolsExperience InCAM’s fluid, customizable

workspace designed to help you achieve the

results you want quickly and easily. Create a

personalized CAM Guide to take operators step

by step through the process flow, using menu

shortcuts, checklists and automation tools.

CAM/InCAM®

CAM/InCAM®

Collaborative processing

Conventional CAM

Parallel processing

Total Time

Action 1on Layer 1

Action 1on Layer 2

Action 2on Layer 1

Action 2on Layer 2 Verify All Results

Total Time

Verify All Results

Action 1on Layer 1

Action 1on Layer 2

Action 2on Layer 1

Action 2on Layer 2

Inner Layer

EditingOutputInput NC Rout

Editing

Outer Layer

Editing

Total Time

Inner Layer

Editing

Input NC Rout Editing

Outer Layer

Editing

Output

Total Time

Conventional CAM

Collaborative and secure work environmentInCAM is the first and only CAM system with

true collaborative processing. Operators can

co-tool jobs concurrently without conflict,

attaining greater productivity with high data

integrity. Simply lock layers for editing or run

analyses on layers locked by others.

CAM/InCAM®

CAM/InCAM®

DFM and analysis tools for fast and efficient HDI board productionEnhance the speed and efficiency of HDI board

production with dedicated DFM and analysis tools:

Feature Recognition tools include recognition

of SMD, BGA (Ball Grid Array) component pads,

BGA areas on the board, and customer-drawn

teardrops.

Cleanup tools automatically convert drawn

copper areas to surfaces, merge multi-polarity

surfaces to a single polarity surface, and

automatically construct flashes from drawn pads.

Drawn Area Substitution

Signal Layer Repair solves spacing, annular ring

and trace width problems according to user-

defined priorities.

Signal Layer Repair

Solder Mask Repair solves solder mask

clearance, bridge and coverage problems.

Special treatment is given to partially

embedded component pads, SMD and BGA

clearances, and small or partially covered

clearances.

Solder Mask Repair

Silk Screen Repair moves legend texts and

resizes component frames away from solder

mask clearances and ensures minimal line

width after merging or clipping with the

solder mask.

Silk Screen Repair

SIT/ENIG Mask Creation creates the ENIG gold

mask and SIT (Secondary Image Transfer)

mask from a customer-delivered gold mask,

optimized to meet production requirements.

Advanced Dynamic Etch Compensation

is the most advanced etch compensation

solution on the market today, with unlimited

possibilities.

Make the most of your process

Cleanup and analysis tools for IC packaging boardsTake advantage of dedicated cleanup and

analysis tools for IC packaging boards:

The Contour to Circuit Conversion tool converts

layers defined as surfaces or outlines (e.g. from

DXF data) to regular layers defined with pads

and traces.

Customize signal analysis result categories to

suit your needs, according to defined feature

attributes.

Automatic panelization InCAM’s panelization module enables optimum

board placement on the panel and ultra-

economic material use. Verify complex panel

designs to prevent overlapping and ensure that

gold-plated tabs are correctly connected to panel

gold plating bars. Panelization tools include:

automatic part and coupon placement, pattern

fills based on predefined patterns and easy panel

overlay construction with alignment holes, text

and patterns.

Advanced Rout EditorCreate top-quality rout drawings from blueprint

or customer data and put an end to manual edits

in the machine rout file after output. Extensive

built-in drawing tools help you accurately draw

the path of any rout layer, however complex or

unusual.

Integrated NC Drill and Rout ManagerCombine drill and rout files and achieve the

fastest throughput in the CAM department. NC

files can be split over different runs or machines

as needed.

Output moduleEasily prepare job data for output to a range of

machines and systems. Check results in a graphic

postview of the output file and/or using the

Compare Layers feature.

Flex add-on for flex and rigid-flex PCB makersWhen you add the InCAM®Flex option to an

InCAM® seat, that workstation transforms into a

flex and rigid-flex manufacturing powerhouse:

Optimize production data with dedicated flex

DFMs, analysis and editing tools.

Review designs for manufacturability with the

InCAM Flex Design Analyzer.

Define layer profiles per layer; define flex and

rigid zones and buildups per zone.

Flex board panelization combines complex

shape interlocking with the best rotation

angle.

Automatically position tooling hole sets,

defined as pad stacks, on selected blocks in

the panel and automatically repeat them for

similar block patterns.

Create material parts based on the material

layer profile, like stiffener strips or EMI masks.

Automatically scale edge connectors while

re-routing their relative connections on the

board.

Frontline PCB Solutions is the world leader in PCB CAM and Engineering software solutions, offering the only end-to-end preproduction solution in the industry, from design to manufacturing.

A joint venture of two industry leaders, Orbotech and Mentor Graphics, Frontline has the unique expertise to offer customers smart, innovative solutions for transforming complex designs into outstanding end products.

The Company has a strong track record of success, with more than 20 years' experience, thousands of projects and over 10,000 installations worldwide. Frontline’s comprehensive range of products and services seamlessly integrate enabling our customers to implement efficient, straightforward workflows and achieve their fullest potential. We build long-term partnerships and are deeply committed to our customers’ success.

[email protected]

Orbotech America Tel: (617)-480-8208 Orbotech Europe Tel: (32)-2-727-4863 Orbotech China & Taiwan Tel: (852)-2827-6688 Orbotech South East Asia Tel: (65)-6567-5657 Orbotech Korea Tel: (82)-31-410-3939 Orbotech Japan Tel: (81)-3-6367-2505 Frontline Headquarters Tel: (972)-8-932-2183

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