By: Henry Medina Nanoelectronics Laboratory National Tsing Hua University.
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Transcript of By: Henry Medina Nanoelectronics Laboratory National Tsing Hua University.
![Page 1: By: Henry Medina Nanoelectronics Laboratory National Tsing Hua University.](https://reader036.fdocuments.us/reader036/viewer/2022081504/56649e115503460f94afcfdd/html5/thumbnails/1.jpg)
By: Henry Medina Nanoelectronics Laboratory
National Tsing Hua University
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Riikka L. Puurunen. “Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process”. JOURNAL OF APPLIED PHYSICS 97, 121301 (2005)
Cambridge Nanotech website for ALD◦ http://www.cambridgenanotech.com/ald/
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism2. Growth per cycle (GPC) Effects with T on GPC3. Number of cycles vs. GPC
3. Third Part1. Requirements for Precursors
1. Classes2. Patterning of ALD growing layers (Techniques)
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1. First Part1. What is ALD process
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ALD is a CVD technique suitable for inorganic material layer as oxides (high-k dielectrics), nitrides and some metals.◦ The success of ALD is to divide CVD process in half
Perfect for deposition of very thin layers of the size of a monolayer* coating complex shapes with high quality (good step coverage).
Definition: “Film deposition technique based on sequential use of self terminating* gas-solid reactions” **
• *Definition of Monolayer and Self terminating reaction will be explained later
• ** Definition taken from the main reference
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1. First Part1. What is ALD process2. Applications
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Semi & Nanoelectronics Optical Humidity Barriers MEMS Nanostructures Chemical
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Semi & Nanoelectronics◦ Gate Dielectrics Intel has recently announced that their 45 nm generation
processors will include a high-k HfO2 gate dielectric made by ALD. There are various reasons that ALD has become the method of choice
Unlike ALD, conventional evaporated films suffer from porosity and sputtering creates defects in the sensitive silicon surface layer.
In addition, ALD guarantees extremely uniform and reproducible thickness, low stress, growth on amorphous structure and low defect density.
Besides the industrial silicon platforms, ALD has proven essential to create gate dielectrics on device substrates without native oxides
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Semi & Nanoelectronics◦ Gate Dielectrics and Gate Electrodes
TEM micrograph of 45nm Intel high-k and metal gate pMOS transistor. (Source: IEDM2007 10.2)
Gate Electrode (TiN by ALD)
High K dielectric (HfO2 by ALD)
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• Prevents Cu diffusion into silicon • Refractory nature • Amorphous • Acts as an adhesion promotor for Cu and Co
33 nm
32 nm
Top
Bottom
ALD Tungsten nitride (WN)
Cambridge NanoTech co-authored publication
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Zaitsu et al. Applied Phyics Letters, 80, 2442, 2002
ALD good for AR coatings: large area precision thickness control and batch coating.
=> Graded index coatings posssible by varying the number of Al2O3/TiO2 low n/high n layers inside a nanolaminate stack
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ALD-ZnO transparent conductors advantages:
No costly indium as in ITO Good optical transmission Low resistivity (1 mOhmcm) Large area uniformity Very smooth films in contrast to ITO
Thin film transistors:
ALD of ZnO active matrix thin filmtransistors possible as well.
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Water vapor transmission rate of 25 nm ALD Al2O3 better than 1 mm polymer encapsulation!
WVTR <10−5 g/m2 day demonstrated
Applied Physics Letters, 89, 031915 2006
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SiO2
Dielectric
Top electrode
poly Si
Hausmann et al. Thin Solid films 2003.
3D DRAM needs conformal coatingof high-k dielectric and metal electrode
C=kA/d: Al2O3, ZrO2, Ta2O5
DRAM crown DRAM trench
Samsung uses ALD for DRAM manufacture!
High aspect ratio ALDof Ta2O5 in vias of 170 nm dia, 7 micronsdeep
100 nm
100 nm
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(a) Schematic of finger gated devices. Mo gates (150nm wide 10 nm thick) were defined lithographically on a Si/SiO2 substrate and subsequently coated with 25 nm of HfO2 grown by low-temperature ALD. Nanotubes were grown across these local gates by CVD and contacted with Ti/Au electrodes. Not to scale.
(b) Atomic force micrograph of nanotubes grown across Mo finger gates and contacted (far left and far right) by Ti/Au leads. Note that one finger gate passes directly underneath the nanotube-metal contact. Arrows indicate the location of the nanotube. Finger gates are labeled as in the text.
Local gating of carbon nanotubes, Biercuk, Nano Letters 2003
Client: Prof. C.M. Marcus, Harvard University.
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Client: Nobel laureate Prof. Tsui, Princeton University
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Client: Prof. Ohno, Tohoku University, Japan.
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Client: C.M. Marcus, Harvard University.
Cambridge NanoTech co-authored publication, Applied Physics Letters 2003.
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Cambridge NanoTech Inc. Confidential
Nickel nanotubes grown in porous alumina, then alumina etched away
K. Nielsch, Max Planck Institute, 2006
Client: K. Nielsch, Max Planck Germany
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TiO2-Al2O3-TiO2 coaxial nanotubes grown with ALD inside porous alumina.
K. Nielsch, Max Planck Institute, 2006
Client: K. Nielsch, Max Planck Germany
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Nature Materials 2007 Published online: 2 July 2006; doi:10.1038/nmat1673
Client: K. Nielsch, Max Planck Germany
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Cambridge NanoTech Inc. Confidential
Deposition of Al2O3 inside and around tubular shaped tobacco mozaic virus length 300 nm, OD 18 nm, ID 4 nm. Grown < 80C
Client: K. Nielsch, Max Planck Germany
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
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Steps:◦ Self-terminating reaction of the first reactant
(Reactant A)◦ Purge or evacuation to remove non-reacted
reactant and by products◦ Self-terminating reaction of the second reactant
(Reactant B)◦ Purge
This is considered as one reaction cycle
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Cambridge NanoTech Inc. Confidential
In air H2O vapor is adsorbed on most surfaces, forming a hydroxyl group. With silicon this forms: Si-O-H (s)
After placing the substrate in the reactor, Trimethyl Aluminum (TMA) is pulsed into the reaction chamber.
Tri-methylaluminumAl(CH3)3(g)
CH
HH
H
Al
O
Hydroxyl (OH)from surfaceadsorbed H2O
Methyl group(CH3)
Substrate surface (e.g. Si)
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
Al(CH3)3 (g) + : Si-O-H (s) :Si-O-Al(CH3)2 (s) + CH4
Trimethyl Aluminum (TMA) reacts with the adsorbed hydroxyl groups,producing methane as the reaction product
C
H
H
H
H
Al
O
Reaction ofTMA with OH
Methane reactionproduct CH4
H
HH
HH C
C
Substrate surface (e.g. Si)
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
C
HH
Al
O
Excess TMAMethane reactionproduct CH4
HH C
Trimethyl Aluminum (TMA) reacts with the adsorbed hydroxyl groups,until the surface is passivated. TMA does not react with itself, terminating the
reaction to one layer. This causes the perfect uniformity of ALD.The excess TMA is pumped away with the methane reaction product.
Substrate surface (e.g. Si)
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
C
HH
Al
O
H2O
HH C
OHH
After the TMA and methane reaction product is pumped away, water vapor (H2O) is pulsed into the reaction chamber.
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
2 H2O (g) + :Si-O-Al(CH3)2 (s) :Si-O-Al(OH)2 (s) + 2 CH4
H
Al
O
O
H2O reacts with the dangling methyl groups on the new surface forming aluminum-oxygen (Al-O) bridges and hydroxyl surface groups, waiting for a new TMA pulse.
Again metane is the reaction product.
O
Al Al
New hydroxyl group
Oxygen bridges
Methane reaction product
Methane reaction product
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
H
Al
O
O
The reaction product methane is pumped away. Excess H2O vapor does not react with the hydroxyl surface groups, again causing perfect passivation to one atomic layer.
O O
Al Al
2005 © All rights reservedCambridge NanoTech Inc.
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Cambridge NanoTech Inc. Confidential
One TMA and one H2O vapor pulse form one cycle. Here three cycles are shown, with approximately 1 Angstrom per cycle. Each cycle including pulsing and pumping takes e.g. 3 sec.
O
H
Al Al Al
HH
OO
O OO OO
Al Al AlO O
O OO
Al Al AlO O
O OO
Al(CH3)3 (g) + :Al-O-H (s) :Al-O-Al(CH3)2 (s) + CH4
2 H2O (g) + :O-Al(CH3)2 (s) :Al-O-Al(OH)2 (s) + 2 CH4
Two reaction steps in each cycle:
2005 © All rights reservedCambridge NanoTech Inc.
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The surface must be in a controlled state, e.g. heated
Parameters to be adjusted: ◦ Reactants (precursors)◦ Substrate◦ Temperature
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism
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Both have been seen in ALD applications
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Self terminating Reaction
Both have been seen in ALD applications but Chemisorption by ligand exchange is preferred because is associated with (a)
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For ALD process ligand exchange is preferred
◦ For ligand exchange saturation in the process is due to 2 factors: (a) Steric Hidrance (b) Number of Reactive
Surface Sites
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism2. Growth per cycle (GPC) Effects with T on GPC
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Unit used in ALD system to describe different process.
Ideal would be growth one monolayer per cycle but this is not true due to steric hindrance
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3 Models to describe the effect of steric hindrance on GPC
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Model I: Just few processes can be assumed as model I ( GPC is around 25% of a monolayer)
Model II: Often used to model many ALD processes. (Gives growths of GPC under 20% of a monolayer)
Model III: Is applied only for some ideal ALD processes as AlMe3/H2O. Most optimistic (GPC around 30% of a monolayer)
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Basically depends on the surface and the reactant, an there are 4 possibilities
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Most of the papers said AlMe3/H2O for Al2O3 over SiO2 is rather insensitive to T, there are documentation from 80oC to 300oC so it’s assumed as model (b)
This is not completely true because T affect the adsorption time on surface so the cycle time per precursor should be adjusted to wait for the self terminating reaction*.
*On FAQ of ALD Savannah is possible to find some information related of how to fix this problem
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism2. Growth per cycle (GPC) Effects with T on GPC3. Number of cycles vs. GPC
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Due to the substrate there are 4 types:
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism2. Growth per cycle (GPC) Effects with T on GPC3. Number of cycles vs. GPC
3. Third Part1. Requirements for Precursors
1. Classes
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Ligand precursor◦ To prepare the surface for next layer, and define
the kind of material to growth i.e. H2O for oxides, N2 or NH3 for nitrides, etc.
Main Precursor (metallic precursor)◦ Highly reactive (usually this means volatile
precursors), thermally stable, and full-fill the requirement for self terminating reaction
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◦ For Oxides H2O this is the material preferred because of its physical properties
Easily decompose at low temperature by ligand exchange on H2 (Gas) and O attached to the substrate
O2 O3 ROH (Alcohols with organic Chains)
◦ Nitrides NH3 N2
◦ To growth pure materials the ligand precursor should be selected depending on the main precursor
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Cambridge NanoTech Inc. Confidential
Recent Cambridge NanoTech experiment: replacement of H2O with
beer
+ =
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Cambridge NanoTech Inc. Confidential
Al2O3 grown with beer/TMA
Al2O3 grown with H2O/TMA
Both same thickness. Beer LD is similar because the water vapor is distilled from the cylinder with beer, and thus pure H2O.This demonstrates how the intrinsic distillation of the vapor draw process in the system reduces the need for high purity precursors.
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◦ Inorganic Elements
React with nonmetal compounds and hidrogen compoundsAs elements don’t carry extra ligands*Selective reactivity (just few elements)
* Free ligands are associated with impurities grown in the film
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◦ Inorganic Halides
Variety of materials grown ReactiveStable in TemperatureNo extra ligands
Drawbacks: gaseous byproducts containing hydrogen nonmetal reactants e.g. HCl Corrosive etching the film and can be readsorb at the surface
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Metal Organic Non direct metal carbon bounds Organometallic
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Metal Organic Non direct metal carbon bounds
◦ Alkoxides◦ ß-diketanones◦ Aminidates
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Metal Organic Non direct metal carbon bounds
◦ Alkoxides Decompose at low temperature, usually lower than
200oC The decomposition produces the oxide already
If deposited on the surface the process lose the conformality
Alcohol as by-product, promote readsorption The chains have high content of carbon and
hydrogen
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Metal Organic Non direct metal carbon bounds
◦ Alkoxides
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Metal Organic Non direct metal carbon bounds
◦ ß-diketanones Before Cyclopentadienyls were widely used to grow
alkaline-earth metals Bulky chains, causing a marked steric hindrance so
GPC very low As alkoxides the M-O ligand is difficult to remove or
change for Nitrogen so is not suitable for nitrides
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Metal Organic Non direct metal carbon bounds
◦ ß-diketanones Before Cyclopentadienyls were widely used to grow
alkaline-earth metals Bulky chains, causing a marked steric hindrance so
GPC very low As alkoxides the M-O ligand is difficult to remove or
change for Nitrogen so is not suitable for nitrides
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Metal Organic Non direct metal carbon bounds
◦ ß-diketanones
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Metal Organic Non direct metal carbon bounds
◦ Amidinates New… from 2003 not widely studied Decomposition at around 300oC Seems to be self terminating process but GPC larger
than a monolayer has been reported Maybe for decomposition or readsorption
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Metal Organic Non direct metal carbon bounds Organometallic
Alkyls Cyclopentadienyls
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Metal Organic Organometallic
◦ Alkyls: M-Cn-H2n+1
The reactivity of Alkyls reactant based is considered of the highest in ALD process e.g. AlMe3/H2O has a GPC of 30% of a monolayer at 300 oC
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◦ Alkyls: M-Cn-H2n+1
The reactivity of Alkyls reactant based is considered of the highest in ALD process e.g. AlMe3/H2O has a GPC of 30% of a monolayer at 300 oC
![Page 64: By: Henry Medina Nanoelectronics Laboratory National Tsing Hua University.](https://reader036.fdocuments.us/reader036/viewer/2022081504/56649e115503460f94afcfdd/html5/thumbnails/64.jpg)
Metal Organic Organometallic
◦ Cyclopentadienyls : M-5 Carbon ringFor deposition of pure metals as Ru (RuCp 2/O2). These
reactants have been used since long time but gain popularity after 2000 however there are few information about the process.
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Metal Organic◦ Cyclopentadienyls : M-5 Carbon ring
For deposition of pure metals as Ru (RuCp 2/O2). These reactants have been used since long time but gain popularity after 2000 however there are few information about the process.
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1. First Part1. What is ALD process2. Applications3. Basic Characteristics of ALD
2. Second Part1. Chemical adsorption Mechanism2. Growth per cycle (GPC) Effects with T on GPC3. Number of cycles vs. GPC
3. Third Part1. Requirements for Precursors
1. Classes2. Patterning of ALD growing layers (Techniques)
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Photoresist PMMA Surface modification chemicals to become
hydrophobic Etching
On the other hand surface modification is also used to promote adhesion (hydrophilic)
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Photoresist*◦ Rhodium growth Rh(acac)3/O2.◦ Temperature too high for photoresist ??(300oC)◦ Additional the use of HMDS inhibit the film
growth.◦ Film grown over Oxide
* K. J. Parka and G. N. Parsons. “Selective area atomic layer deposition of rhodium and effective work function characterization in capacitor structures”. Applied Physics Letters 89, 043111 2006
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PMMA*◦ Titanium Dioxide TiCl4/H2O and Ti(OCH(CH3)2)/H2O.◦ At 160oC◦ For TiCl4.
Cl React with PMMA, PMMA difficult to remove when more than 150 cycles are applied.
◦ For Ti(OCH(CH3)2). No reaction with PMMA, PMMA easy to remove by normal
solvents. ◦ There’s no specification about the substrate
* Ashwini Sinha, Dennis W. Hess, and Clifford L. Henderson. “Area selective atomic layer deposition of titanium dioxide: Effect of precursor chemistry”. J. Vac. Sci. Technol. B 24(6) Nov/Dec 2006
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Surface Modification*◦ APS ◦ HMDS
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APS treatment at 150oC
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APS treatment at 150oC
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Surface Modification*◦ APS
Not good results but I never try to modify parameter 150oC too high for APS??
◦ HMDS
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Surface Modification*◦ ODTS and Octadecene. Liquid and are baked for
thermal reaction◦ For positive and negative patterning.◦ Surface treated before growth
* Rong Chen, Stacey F. Bent. “Chemistry for Positive Pattern Transfer Using Area-Selective Atomic Layer Deposition”. Adv. Mater. 2006, 18, p.1086–1090
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Surface Modification◦ Surface treated before growth to increase
adhesion
◦ For Si. Piranha treatment (H2SO4/H2O2 7:3) HF 2%Note: Sample are immediately transfer to next process
Generate Hydride termination (Si-H).
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Etching
After coating the surface with ALD film, the excess can be removed by wet etching or dry etxhing
Wet etching: NaOH for Al2O3 has given good results