Breakthrough Technologies For Additive Mass-Manufacturing ...
Transcript of Breakthrough Technologies For Additive Mass-Manufacturing ...
• B r e a k t h r o u g h T e c h n o l o g i e s F o r A d d i t i v e M a s s - M a n u f a c t u r i n g
ioTech: The Next Generation of Multi-Material PrintingBreakthrough Technologies For Additive Mass-Manufacturing
Printed Circuit Boards
SMT Assembly
Conformal Coating
Gaskets and Sealing
High Value Applications
Semiconductor Packaging
EMI Shielding
Etc...
The Material Challenge
COATING MATERIALS EPOXY
CONDUCTIVE BONDING
MATERIALS
Certified industrial-grade materials tend to be too viscous for existing printers, and so material approximations are used. These approximations look like the real thing, but they lack in mechanical properties and functionalities.
The “HOLY GRAIL” of Additive Manufacturing
• Thermoset
• High-viscosity
• High-loading
• Long-chain polymers
• Integrated fillers
• Large-size particles
Industrial materials
Industrial speed
High resolution
High resolution
Multi-material
Meet ioTech … No More CompromiseThe world’s only additive manufacturing solution for standard industrial materials
Innovation powerhouse: 8 granted patents, 24 patents pending
Printing unprintable industrial materials
Polymer SiliconeCeramics Metal Solder
Adhesives
High resolution
Dynamic from20µm to 500µm
Combining polymers, metals & ceramics
Up to 5 materials
Fast & efficient
Up to 3.5m/secOver 7.2M drop/hr
How We Print the UnprintableDeep innovation with 24 patent families
Build Process In-Line Post- Process
Nozzle-free technology
Layered molding process
Multi curing
UV
Thermal
Finishing
Laser sintering
Laser ablation
Delivering Multiple Benefits Across Industries
Commercial-ready functional objects
Enhanced functional properties
Manufacturing flexibility
Beyond prototyping Wide range of currently
unprintable industrial materialsVolume, design, customization,
material properties
Inspiring innovation Lower cost of ownership Faster & simpler production process
Simple maintenance
and no expensive
consumables
Integrating multiple
production steps
Unlimited designs with
multi-material
combinations
Prototyping ProductionSingle machines Manufacturing solution
for industrial applications
Conception only
1 to 5
Indirect sales
Low
Value Added
Systems Sold
Distribution
Expected Profitability
Conception to production
5 to 50+
Direct sales & OEM
High
Business Model
OEM Products
ioTech print engine
integrated in partner solution
Branded Products
Complete solution sold
to end-customers
Initial payment per unit sold Royalty on solution sale
Annual license & maintenance fee
Initial payment per unit sold
Annual lease & maintenance fee
Professional services:customer materials’ configuration
One time
Recurring
Per need
Alternative Disruptive Business Model
Equipment as a Service
One time Recurring Additional services
Initial payment per
system delivered
Revenue per unit manufactured
by customer, linked to the value
added to each specific customer
(incl. system, training, maintenance,
material set up)
Design and supply of
customer specific
materials
Applications - PCBLaser Depositing Conductive Traces and Via Filling:
Flip chips, advanced packaging, RFID tags
Clean solution
• Low waste• No wet chemistry
Trench filling
• Deposit copper inside conductive trenches, below laminate surface, zero height
• Resolution = 60μm/20μm line/space
Via filling
• Filled vias 𝜙 60-140μm• Buried vias, blind vias• Through-holes
Customized finishing
• Improve resolutions in individual areas by ablation, down to 20μm
Applications - SMT AssemblySolder paste deposition:
Speed of screen printers, with digital features of jet printers
Speed comparable to screen printers, 100x faster than state of the art dispensers
Uniform distribution of ball volumes and heights
Solder paste deposition on top of components
Reduced defect rate
Legal Disclaimer
This document is for information purposes only. It does not constitute or
form part of an offer to buy any securities. Any offer or solicitation will be
made only by means of formal confidential offering materials that will
be prepared and furnished to prospective investors at a later date. No
representation, warranty or undertaking, express or implied, is given as
to the accuracy or completeness of the information or opinions
contained herein. This document is confidential and is intended solely
for the information of the person to whom it has been delivered. It is not
to be reproduced or transmitted, in whole or in part, to third parties,
without the prior consent of IO Tech Group.