Bosch SMI130 6-Axis Automotive MEMS IMU 2015 teardown reverse costing report published by Yole...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

March 2015 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Bosch SMI130 6-Axis MEMS IMU

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– Bosch

– SMI130 Characteristics

3. Physical Analysis 11– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package

– Package Views, Dimensions & Pin Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– ASIC Gyro & Accelero Dies

– View, Dimensions & Marking

– Delayering

– Main Blocks Identification

– Cross-Section

– Process Characteristics

– MEMS Gyro & Accelero Dies

– View, Dimensions & Marking

– Bond Pad Opening & Bond Pad

– Cap Removed & Cap Details

– Sensing Area Details

– Cross-Section (Sensor, Cap & Bonding)

– Process Characteristics

4. Manufacturing Process Flow 103– Global Overview

– ASIC Gyro & Accelero Front-End Process

– MEMS Gyro & Accelero Process Flow

– Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

5. Cost Analysis 129– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– ASIC Gyro & Accelero Front-End Cost

– ASIC Gyro & Accelero Back-End 0 : Probe Test & Dicing

– ASIC Gyro & Accelero Wafer & Die Cost

– MEMS Gyro & Accelero Front-End Cost

– MEMS Gyro & Accelero Front-End Cost per process steps

– MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing

– MEMS Gyro & Accelero Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test & Calibration Cost

– SMI130 Component Cost

6. Estimated Price Analysis 170– Manufacturer Financial Ratios

– Estimated Selling Price

Contact 175


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the Bosch SMI130 6-Axis MEMS IMU.

• It is the first MEMS 6-Axis IMU manufactured by Bosch for automotive applications (non-safety-

critical applications). It combines a 12-bit 3-Axis accelerometer and a 16-bit 3-Axis gyroscope in a

4.5x3.0mm LGA package. The measurement range of the yaw rate sensor can be adjusted in up to

five steps between ±125°/s and ±2000°/s; the acceleration sensor offers four different

measurement ranges between ±2g and ±16g.

• The SMI130 is a specific version of the Bosch Sensortec BMI055 6-Axis IMU used for consumer

applications.

The gyro integrates a new process for the capping. Indeed, the classic "glass-frit" wafer

bonding has been abandoned in favor of an eutectic Aluminum-Germanium bonding.

The accelerometer features a new design which uses now only one mass structure for the

moving parts compared to three for the previous generations.

• Typical application of the SMI130 include in-dash navigation and telematics systems such as toll,

eCall, and alarm systems. The sensor accepts supply voltages between 2.4V and 3.6V and can be

operated in a temperature range between -40°C and +85°C. The SMI130 is RoHS compliant and

qualified according to AEC-Q100.


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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Package top view Package bottom view

Package Side View

3.0mm

0.95mm

4.5mm

• Marking: 134

A1404

010

• Package: LGA 16-pin

• Dimensions: 4.5 x 3.0 x 0.95mm

• Pin Pitch: 0.5mm


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

• Consulting and Specific Analysis

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.Email: [email protected]

– RoW: Jean-Christophe Eloy, President & CEO, Yole DéveloppementEmail: [email protected]

• Report business

– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.Email: [email protected]

– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: [email protected]

– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.Email: [email protected]

– Korea: Hailey Yang, Business Development Manager, Korean OfficeEmail: [email protected]

• Financial services

– Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

– Email: [email protected]

Bosch SMI130 6-Axis Automotive MEMS IMU 2015 teardown reverse costing report published by Yole...

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Transcript of Bosch SMI130 6-Axis Automotive MEMS IMU 2015 teardown reverse costing report published by Yole...