Bosch Sensortec BMC150 6-Axis MEMS eCompass teardown reverse costing report by published Yole...

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Electronic Costing & Technology Experts

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December 2013 – Version 2 – Written by Romain Fraux

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mailto:[email protected]

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Bosch BMC150 6-Axis eCompass

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Glossary1. Overview / Introduction 4

– Executive Summary– Reverse Costing Methodology

2. Company Profile 7– Bosch Sensortec– BMC150 Characteristics

3. Physical Analysis 19– Synthesis of the Physical Analysis– Physical Analysis Methodology– Package

– Package Views, Dimensions & Pin Out– Package Opening– Wire Bonding Process– Package Cross-Section

– ASIC Accelero Die– View, Dimensions & Marking– Delayering– Main Blocks Identification– Cross-Section – Process Characteristics

– MEMS Accelero Die– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section (Sensor, Cap & Bonding)– Process Characteristics

– Magnetometer Die– View, Dimensions & Marking– Hall sensor and fluxgate sensors– Delayering– Main Blocks Identification– Cross-Section (CMOS & Sensor)– Process Characteristics

4. Manufacturing Process Flow 90– Global Overview– ASIC Accelero Front-End Process– MEMS Accelero Process Flow– Magnetometer Process Flow– Wafer Fabrication Unit– Packaging Process Flow– Package Assembly Unit

5. Cost Analysis 111– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC Accelero Front-End Cost– ASIC Accelero Back-End 0 : Probe Test & Dicing– ASIC Accelero Wafer & Die Cost– MEMS Accelero Front-End Cost– MEMS Accelero Front-End Cost per process steps– MEMS Accelero Back-End 0 : Probe Test & Dicing– MEMS Accelero Wafer & Die Cost– Magnetometer CMOS Front-End Cost– Magnetometer Sensor Cost– Magnetometer Sensor Cost per process steps– Magnetometer Back-End 0 : Probe Test & Dicing– Magnetometer Wafer & Die Cost– Back-End : Packaging Cost– Back-End : Packaging Cost per Process Steps– Back-End : Final Test & Calibration Cost– BMC150 Component Cost

6. Estimated Price Analysis 144– Manufacturer Financial Ratios– Estimated Selling Price

Contact 149


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package is analyzed and measured.

• The package is opened to get overall dies data: dimensions, main characteristics, device markings.

– Pictures of selected area are made in order to understand the connections between the MEMS and the ASIC.

• The ASICs are separated to get overall dies data: dimensions, main blocks, pad number and pin out,die marking.

– Removal of metal layers (step by step) to measure the minimum dimensions.

– Pictures of selected areas to identify the nature of the transistors.

– SEM photographs to measure the transistors dimensions.

• The MEMS are separated to get overall dies data: dimensions, main blocks, pad number and pinout, die marking.

– SEM pictures of mechanical structures.

– Cross section of MEMS to measure thicknesses.


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Package Side View

• Package: LGA 14-pin

• Dimensions: 2.2 x 2.2 x 0.95mm

• Pin Pitch: 0.4mm

• Marking:

00A

2A

Package top view

Package back view

Orientation of Axes(from datasheet)


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• The die marking includes the logo of Bosch and:

BAA255CA

BOSCH

2012

ASIC Accelero Die Marking


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• The die marking includes the logo of Bosch and:

BAM150AB

BOSCH

2012

Magnetometer Die Marking


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Si wafer

•Thinning 300µm

•Pad oxide (Oxide1) deposit

Si wafer

•Buried Poly (Poly1) deposition

• Ion implantation

•Pattern & etch

Si wafer

• Sacrificial Oxide 1 (Oxide 2) deposit

•Pattern & etch

Si wafer

• Seed Layer (Poly 2) Deposition

• Ion implantation

•Pattern & Etch


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:USA Office

• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178Email: [email protected]

• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986-Email: [email protected]

Japan Office• Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr

European Office• Yves Devigne, Europe Business Development Manager, Cell: +33 6 75 80 08 25 -Email : [email protected]• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service,

Tel: +33 472 83 01 90, Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 -Cell: (82) 10 4097 5810

Fax: (82) 2 2010 8899 Email: [email protected]

Bosch Sensortec BMC150 6-Axis MEMS eCompass teardown reverse costing report by published Yole...

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Transcript of Bosch Sensortec BMC150 6-Axis MEMS eCompass teardown reverse costing report by published Yole...