Body Control Module (BCM)BCM Overview Body control ... 0 Wiper intermittent adjust 1 Input 32 Output...
Transcript of Body Control Module (BCM)BCM Overview Body control ... 0 Wiper intermittent adjust 1 Input 32 Output...
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Body Control Module (BCM)
August, 2009
Marcelo LuppeSales Manager - Automotive
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Agenda
Body Electronics Challenges
BCM Overview
Freescale Solutions
Networking
BCM Example
Where can I find more information?
Q&A
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Body Electronics Challenges
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Enabling More Integration
Benefits:
• Less modules, less cables
• Reduced weight, fuel efficiency
• Reduced manufacturing costs
• Better quality
• Lower total cost of ownership
CAN Gateway
Body Controller (interior features +
lighting)
RF Receiver (key, tires)
Central Body Domain
ControllerFuses Box Replacement
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Challenges of higher integration
Increased performance needs• Use of I/O processor to offload interrupt handling (eg S12XE, MPC5510)
• More sophisticated software architectures (e.g. AUTOSAR)
Increased number of I/O (A/D and timer channels):• Use eSwitches using an SPI to save PWM channels and A/D inputs
• Stay with cost effective QFP packages
Development cycle of more complex modules• Rapid prototyping, use of model based design
• Off-the-shelf low-level drivers (e.g. AUTOSAR MCAL Layer from FSL)
• Initialization tools to help configure more complex MCUs (e.g. RAppID)
Power Consumption in both run and sleep modes• Need advanced low-power modes (e.g. S12XE and MPC5510)
• Use smart analog chips with wake-up features (e.g. MSDI, Romeo3)
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Centralized vs Distributed
Centralized architectures refer to fewer modules with more functionality than distributed architectures featuring smaller modules
with more communication interfaces
Benefits as perceived by Freescale:
Centralized Architectures:
• Simpler networking
• More cost effective for low-end cars
• Optimized number of ECUs
Distributed Architectures:
• Greatest flexibility w/ car options
• Designed for reuse and scalability
• Facilitates power cables routing
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BCM Overview
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BCM Overview
Body control electronics cover a wide range of comfort, security, lighting
and access technologies, inside and outside the passenger cabin
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Low End BCM - Block Diagram
MCU
S12XEFamily
2
RKE
RKE Receiver
Wiper Motor2
Washer Motor1
Ignition Key Position4
Exterior Light Switch6
Wiper Switch4
Interior Light Switch1
Power Window Switch8
* Total IO - 55
Central Lock Switch1
Rear Window Defrost Switch1
Door Ajar Status1
Driver Seat Belt indicator1
8
Power Window Relay
Turn Lamp / Hazard2
Lo/Hi Beam & Side light3
Interior /Salute light2
Rear Defrost Relay1
Central Lock Relay2
Alarm Beeper1
Power Window disable0
Wiper intermittent adjust1
Input32
Output
22
IGN
CAN
Door
Window
Light
Wiper
Door
Window
Light
Wiper
Current Protection4
Alarm
CAN SBCMC33742
+12V+5V
7
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35mΩΩΩΩ HSD
35mΩΩΩΩ HSD
35mΩΩΩΩ HSD
35mΩΩΩΩ HSD
SPI/Diag/Wdog
LIN TcvrLIN Tcvr
LIN Tcvr
High End BCM – Example diagram
LIN Tcvr
CAN TcvrCAN Tcvr
CAN TcvrCAN Tcvr
CAN Tcvr
Vreg1
Vreg2
Watchdog
Wake-up
inputs
High side driver
SBC - MC33742
4x MC33661
4x MC33902
Flexray Tcvr
Switch detection interface
Flexray Tcvr
Switch detection interface
2x MC3397244 Switch inputs
0.7mΩΩΩΩ HSD/LSD
MC33879 8xLSD/HSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
0.7mΩΩΩΩ HSD/LSD
SPI / Diag.
SPI/Diag/Wdog
15mΩΩΩΩ HSD
15mΩΩΩΩ HSD
15mΩΩΩΩ HSD
15mΩΩΩΩ HSD
10mΩΩΩΩ HSD
10mΩΩΩΩ HSD
12mΩΩΩΩ HSD
12mΩΩΩΩ HSD
SPI/Diag/Wdog
3x Quad eSwitch12 High side drivers
e200z1Core
80MHz
e200z0
Core80MHz
Peripheral Bridge
FCUFlash (ECC)
512KB-1.5MB
RAMController
RAM (ECC)64KB-80 KB
VREG
eDMA
FlexRay
FMPLL
Oscillators
eMIOSADC
3xDSPI
I²C
SIU
6xFlexCAN
BAM
PIT
EBI
Crossbar Switch (XBAR)Memory Protection Unit (MPU)
NDIJTAG
INTC
6x eSCI
MPC5516
1x SPI5x GPIO3x ATD.
12x PWM (Optional)
1xSPI1xGPIO.2x PWM
RF transceiver
Echo+
H-bridge
Shared SPI
1xSPI2xGPIO.2x INT2x ATD 1xSPI
2xGPIO.4xGPIO.
4xCAN (TX & RX)12x GPIO (EN, STB, ERR)
Wake signals
Wake
Wake
1xSPI (Shared)2xGPIO.1xINTRST
4xSCI (TX & RX)4xGPIO (EN)
1x Flexray
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Freescale Solutions
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CAN P/L
LIN P/LLIN P/L
LIN P/L
Generic body control module – Communication and power supply
Output blocksProcessing blockInput / Output blocks
Vreg
CAN P/L
Watchdog
CAN
Wakeup
S08
S12X
MPC55XX
MPC560X
SPI
SPI
Motor
drivers
Communication
+ power supply
LIN P/L
CAN P/LCAN
LIN
Switch inputs
Analog inputs
High side
drivers
Low side
drivers
Factors to consider:
•Amount of physical layer
communications
channels required.• PCB space available.
• Power supply
partitioning on the
module.
• Low power
requirements of the
module.• Diagnostics required for
the communication
channels.
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Communication + Power Supply (SBC – System Basis Chip)
ECU_A ECU_B ECU_D
RF
No low power mode
Low / medium complexity
CAN & local wake-up
High complexity.
Multiple wake up
Periodic scan (wake up)
MCUVdd
CAN P/L
Vreg
BUS
INH
CAN P/L
Vreg
Vbat
CAN+Vreg
MCUVdd
BUS
ECU_C
LIN_a
CAN_2
MCUVdd
Vbat
RST/INT
CAN P/L
SW
Vreg
OSC
BUS
SBC
MSDI
CAN_2LIN RF
ECU: A & BECU: B (partial A & C)
ECU: C, D (partial B)
LIN-b
Medium/high complexity
CAN, LIN wake-upLow power modes attributes
•Low consumption.
•Detection of “wake up events”
•Wake up time
•Periodic scan function (wake up event detection) prior to full network wake up
FSL CAN HS/LIN
portfolio
Separated transceiver and regulator.
Integrated transceiver and regulator with
additional simplified
functionality.
SBC CAN (33742)
SBC LIN (MC33910 – ‘912)
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CAN P/L
LIN P/LLIN P/L
LIN P/L
Generic body control module – handling inputs
Output blocksProcessing blockInput / Output blocks
Vreg
CAN P/L
Watchdog
CAN
Wakeup
S08
S12X
MPC55XX
MPC560X
SPI
SPI
Motor
drivers
Communication
+ power supply
LIN P/L
CAN P/LCAN
LIN
Switch inputs
Analog inputs
High side
drivers
Low side
drivers
Factors to consider:
•Amount of switches (switch to GND / VBatt)
• Amount of analog
inputs• Wakeup capable inputs
(digital and analog).
• Wetting current
characteristics.
• PCB space available.
• Power dissipation
constrains
• Low power requirements of the
module.
• Amount of components on the PCB.
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MSDI - Multiple Switch Detection Interface33993 / 33972 / 33975
32 SOICW
• The Multiple Switch Detection Interface is a monolithic silicon
integrated circuit (IC) that performs switch monitoringfunctions. The device can be used to detect the closing and opening of up to 22 switch contacts.
• One MSDI device can replace 66 SMD devices
• MSDI can handle multitude of common I/O needs in
embedded systems (Analog mux, FETs, LEDs, power sensors)
Excellent GoodGround Offset Protection
GoodPoorBoard Space Utilization
Excellent PoorQuiescent Current with Wake up
Excellent (138 solder joints)
Poor (352 solder joints)
Number of Solder Joints
Excellent PoorOperating Voltage Range
Good (<1W)*Poor (>8W)*Power Dissipation
MC33972 Switch Inputs
Discrete Switch Inputs
Customer Benefits
* Considering the 22 switches closed.
Switch Input
To MCU
12VSW
R1
875
R2
22K
R3
14.5K
C1
33972
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CAN P/L
LIN P/LLIN P/L
LIN P/L
Generic body control module - High side & Low side drivers
Output blocksProcessing blockInput / Output blocks
Vreg
CAN P/L
Watchdog
CAN
Wakeup
S08
S12X
MPC560X
MPC55XX
SPI
SPI
Motor
drivers
Communication
+ power supply
LIN P/L
CAN P/LCAN
LIN
Switch inputs
Analog inputs
High side
drivers
Low side
drivers
Factors to consider:Amount of high side and
low side outputs
Current profile of each of
the outputs
Protection and
diagnostic requirements
PWM requirements for
each outputs.
PCB space available.
Power dissipation
constrains
Variability between the
loads been driven.
Reliability requirements
Failsafe characteristics of
the outputs.
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SMARTMOSTM
Protection and diagnostic• Over temperature• Over current• Over/Under Voltage• Short circuit• Reverse battery• Loss of ground/Vbat• Energy discharge protection
SPI Interface• Easy connection to the uP• Programmability• Daisy chain using SPI• Programmable overcurrent trip level• Watchdog
HDTMOSTM
Best in Class MOSfet•1.7mOHM typ. at 25°C•2.9mOhm typ at 150°C
Protection in the power stage• Temperature sensor• Current sensor
PQFN
Low cost power package• 0.5 mm thick leadframe• Die soldered attached• Rthj-c < 0.5°C/W
Design FlexiblilityAlu Power wires
• Low series resistance• Current capability > 200A
High reliability
eSwitch family
ADVANTAGES OF 2 DIE SOLUTIONS :REDUCE TEMPERATURE OF CONTROL DIEAVOID PARASITIC SUSBTRATE EFFECTSUSE EACH TECHNO AT EFFICIENT LEVELREDUCE STAND BY CURRENT
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CAN P/L
LIN P/LLIN P/L
LIN P/L
Generic body control module – Processing block
Output blocksProcessing blockInput / Output blocks
Vreg
CAN P/L
Watchdog
CAN
Wakeup
S08
S12X
MPC560X
MPC55XX
SPI
SPI
Motor
drivers
Communication
+ power supply
LIN P/L
CAN P/LCAN
LIN
Switch inputs
Analog inputs
High side
drivers
Low side
drivers
Factors to consider:
•Scalability & Flexibility:•Platform approach
•Compatibility (reuse)
•Migration options
•Peripherals
• MCU selection:•Flash, ROM, EEPROM
•Pin-out
•Package options
•Functionality
•Low Power
•Development support
•Cost
•Quality
•Software availability
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Automotive Performance & Integration
8
Cost Reducing Low-End S08
Building on Our
16-bit Strength S12-S12X
• Expanding on-chip peripherals with XGATE co-processor
• Extending flash memory sizes and CPU performance
• FlexRay™ integration
16• Cents not dollars for
automotive quality and control.
Inte
grate
d Dig
ital
Controlle
rsTotal Solution
Integration
32
Expanding Our 32-bit Power Architecture™ FamilyControl and Communications
• First 32-bit MCUs with Integrated FlexRay™for vehicle networking
• New low-cost solutions widen entry point
• New application areas for body, safety and gateway
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Relative Performance/Features Positioning
Features, I/O functionality
Co
mp
uti
ng
Need
s
S12XS
S12XE(S12X w/ XGATE)
S08D
S12P
S08S/S08E
MPC5510(z1 + z0 dual-core)
MPC560xB(z0 single core)
8bit
16bit
32bit
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Highly Integrated BCM – MPC5510 or S12XE
Integration level depends on OEM needs
Diversity of architectures
• Distributed vs centralized
• AUTOSAR or not
• Networking requirements
Low power management
Reuse of legacy software and tools
Scalable product families
I/O Processor support for
maximum flexibility
AUTOSAR MCAL available for both architectures
High-performance AND low-
power!
Standard architectures supported by a strong
ecosystem of tools and software partners
Application Challenges Freescale Solutions
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Freescale Automotive Multi-Core Architectures
I/O Processor Solutions(In production today)
• CPU offloading of specific low-level tasks
• Peripheral emulation and flexibility
• Parallel Gateway communications processing
Hi-Performance Symmetric dual-core Processing(In Development)
• Increased MIPS/MHz
• Simplified Application level tasks partitioning
• Improved current consumption and EMC performance
Periph.
Crossbar / Bus
S12X
Mem.
XGATE
eT
PU
Periph.
Crossbar / Bus
Mem.
Mem.
PowerArchitecture
e200
Periph
PowerArchitecture
e200
MPC5554S12X MPC5510/MPC56xxG/C
MPC57xx
Crossbar / Bus
Mem. Periph
MPC56xxIntegrated Safety Architectures(In Development)
• Lockstep functionality
• Self test diagnostics
• Dual redundant systems with Error Correction
Crossbar / Bus
PowerArchitecture
e200
PowerArchitecture
e200
PowerArchitecture
e200
PowerArchitecture
e200
PowerArchitecture
e200
eT
PU
Mem. Periph
Crossbar / Bus
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The Crossbar Architecture, a Turbo for Gateways
Page buffers& Flash
Controller
CPUe200z6
SR
AM
FLASH
Platform = cores + crossbar + system support functions (INTC, debug, timers, semaphores…)
The crossbar switch allows concurrent accesses between masters and slaves resources
Widening the memory bottleneck: Separate SRAM blocks Flash controller with separate page
buffers to emulate dual-ported flash
Peak data bandwidth of the MPC5668G crossbar architecture is 3.5 Gbytes/sec at 116 MHz clock speed
CPUe200z0
FE
C
Fle
xR
ay
ML
BD
IM
eD
MA
SR
AM
IP B
us
Brid
ge
IP B
us
Brid
ge
Crossbar
Example of the MPC5668G Platform with a 6Mx6S crossbar configuration:
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XGATE Co-processorXGATE• 16-bit 100Mhz Co-Processor to offload main CPU
Benefits• Higher Throughput: Dual core drives higher performance
without increased bus speed• Low-EMC, Low-Power: main CPU can run lower
frequency- reduces overall emission
Applications- existing XGATE applications include:• IO Coprocessor• Interrupt Processor
Interrupt nesting capability• Smart DMA controller
Manipulate data or change memory source before storing to memory
• Virtual peripheral driver Build LIN protocol layer, virtual PWM, SCI, SPI, etc.
• TFT Driver Drive TFT Display directly from XGATE
• Onboard Safing Micro Monitor main CPU with XGATE
• Manchester Decoding
Flexibility• What can the XGATE do for you?
TFT
DISPLAY
XGATE on can directly drive 1/8 VGA (30K
pixels) at 75Hz refresh rate.
No need for external graphics accelerator chip or associated DRAM!
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Benefits of I/O Processors
Performance Improvement
Full chipcyclic wakeup
Small 2nd core or 2 cores running reducing time ON
z1z0
ARM7
z1+z0 x 0.8
Low Power
Current Consumption and EMC Peripheral Emulation
GPIOPort
ADCInputs
Multiple smart PWM channels emulated on GPIO portI/
O
Pro
cesso
r
Single core, high frequency operation
Main core running at reduced speed and Second core periodically helping
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Networking
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1990’s : The Birth of Networking into Cars
Body Controller
Engine Management
CAN, VAN or J1850 depending on car makers
Anti-lockBraking
Proprietary communication, K-line
Instrument Cluster
Airbag
Immobilizer Radio
The Challenge: Get to some consistency, Reuse
Lighting
Alarm
Trailer Connection
Air conditioning
Window lift
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2000’s : CAN and LIN Standards Dominate
RKE and TPMS Rx
Engine Management
CAN
Anti-lockBraking
LIN
Instrument Cluster
Airbag
Immobilizer
Infotainment
SJB
Body Controller / Gateway
Seat modules
Door module
DisplayMotors
Motors
Sunroof
HVACFlaps
Lighting
The Challenge: Manage the complexity, limited
bandwidth and non-determinism
Transmission
Power Steering
Fuel Pump
GlowPlug
OccupantClassification
Radio
Seat BeltPretent.
MotorsMotors
Motors
FlapsFlaps
Flaps Blower
MotorsMotors
MotorsMotors
Steering column
Alarm
MOST
Diagnostic CAN
Amplif.
Rear module
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2010’s : Hierarchical Networks
RKE and TPMS Rx
Engine Management
CAN
Anti-lockBraking
LIN
Instrument Cluster
Airbag
Immobilizer
Display
Body Controller / Gateway
Seat modules
Door module
VideoMotors
Motors
Sunroof
HVACFlaps
TransmissionPower Steering
Fuel Pump
GlowPlug
OccupantClassification
Radio
Pass. Seat Belt Pretent.Motors
MotorsMotors
FlapsFlaps
Flaps Blower
MotorsMotors
MotorsMotors
St. column
Alarm
MOST
Diagnostic CAN
Amplif.
Rear module
FlexRay
The Challenge : Overcome the complexity of “super
nodes” through new design methodologies, standard
software…
Cooling fan
Integrated Chassis Management
SuspensionSuspension
SuspensionSuspension
VideoVideo
Adaptive
Cruise Ctrl
Driver Seat Belt Pretent.
Battery
management
Active Steering
SJBLighting L
Door moduleMotorsMotors
MotorsMotors
Nav
Lighting R
Rain sensor
MotorsMotors
Motors
4x4
Temp
Park Assist
Rear Lighting
Blind Spot Det.
Wipers
Flaps
Flaps
NOX
Sensor cluster
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Automotive Networking Overview
Freescale is a leader in defining next generation communicationsspecifically for Automotive
• Freescale is a founding member of the LIN Consortium
• Freescale is a founding member of the FlexRay Consortium
Single/DualSingleSingleChannels
YesNoNoTime triggered
TDMACSMAMasterArbitration
YesYesYesDevices available from Freescale today
20 Kbit/s
LIN
10 Mbits/sec<= 1 Mbit/secSpeed
FlexRayCAN
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BCM Example
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• Controls all exterior lighting, up to 16 channels• CAN interface• 55A current capability at 85ºC• Very small size (business card) and high power density• Efficiency of about 99%• Small footprint allows it to be used as a sub-module• Uses wiring harness for heatsinking• Wiring harness protection allows
• the reduction of wiring harness gauge• omission of fuses
• Adds new features such as • PWM control for lamp dimming and protection• wiring, lamp and harness diagnostics
Light Control Module
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Light Control Module
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Power Distribution Module
4.25” x 5.0” board
High Power Outputs - 18 outputs, 80A total @ 85ºC
22 switch inputs
High Speed CAN and J-1850 Communications
PC Master GUI Interface
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