Blair Ratcliff SLAC

Blair Ratcliff, SLACUS R&D Meeting, Sept. 3, 2008

Blair RatcliffSLAC

Detector R&D: Overview and OpportunitiesDetector R&D: Overview and Opportunities

• Detector Overview (some old news!).• Present System Conveners• Vertex Detector (SVT)- Rizzo• Drift Chamber (DCH)- Finocchiaro• Particle Identification (PID)- Leith• Electromagnetic Calorimeter (EMC)- Hitlin• Instrumented Flux Return (IFR)- Calabrese• Electronics,Trigger,DAQ- Breton/Dubois-Felsmann• Computing- Rama/Morandin• MDI- Paoloni/Biagini• Integration -WIsniewski•Towards a TDR•R&D Opportunities•Summary


Detector Overview

Current B-Factory detectors have proven to be extremely effective instruments over the very broad physics program accessible at the (4S). Two (+1) examples: BaBar, Belle (Cleo-II). Serve as “world class prototypes” for SuperB! Optimized differently, but all were (are!) effective physics

instruments. Comparisons between them help to define optimal strategies for subsystems in a SuperB detector.

CDR detector design based on BaBar (with re-optimization).

SuperB machine acceptance limits similar to PEP-II: BaBar’s geometry, field, and portions of several subsystems are rather close to optimal,

Re-use of BaBar gives excellent performance and saves money.

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Directions for Detector Optimization From Machine and Environment:

• Smaller Boost (7x4 GeV; =0.28) Smaller radius beam-pipe to retain adequate vertex

resolution. Larger barrel acceptance. More particles backward in

detector with somewhat softer spectrum forward.• Some (though not all) components of machine background

components will be substantially larger. Improve detector segmentation Improve detector speed Improve radiation hardness and machine monitoring

o From physics goals, which emphasize rare decays, LFV in physics, and recoil () physics Would like best possible hermeticity, with good subsystem efficiency

and performance. ~x100 Luminosity

Improved trigger, DAQ, & computing (~15 years later)

Last, but not least, must replace aging components and technologies.

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CDR Detector Layout – Based on BabarBASELINE

OPTION

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New detector elements


Detector Evolution-B Factory to SuperB Factoryo With careful attention machine design and shielding in the

IR, the backgrounds at a SuperB should be ~ to those we know (and love?) at BaBar

An excellent SuperB detector is possible with ~ today’s technology

CDR Baseline based on BaBar. It reuses Fused Silica bars of the DIRC DIRC & DCH Support Barrel EMC CsI(Tl) crystal and mechanical structure Superconducting coil & flux return (with some redesign).

Some elements have aged and need replacement. Others require moderate improvements to cope with the high luminosity environment, the smaller boost (4x7 GeV), and the high DAQ rates.

Small beam pipe technology Thin silicon pixel detector for layer 0, and a new 5 layer SVT? New DCH with CF mechanical structure, modified gas, cell size, cluster

counting? New Photon detection for DIRC fused silica bars? Forward PID system (TOF in Baseline option) ? New Forward calorimeter crystals (LYSO?). Backward EMC? Technology? Minos-style extruded scintillator for instrumented flux return Electronics and trigger- x100 real event rate Computing- to handle massive date volume

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CDRTDR

• What decisions must be taken before the TDR can be written?• What is the mechanism for reaching those decisions? How can missing information be obtained?• What simulation tools are needed?• What specific R&D is needed? • What detailed design is needed? When can it begin?• What are the time scales for the decisions. If options are open, how can they be resolved and on what time scale?• How many physicists are involved now ? How many are needed? When?• Support for R&D, technical and design personnel?• How does the subgroup interact with the other subgroups and incorporate general detector design considerations


Examples of Decisions needed for TDRInternal System versus General DetectorExamples Internal:

What is the SVT layer 0 technology?

How is the beam pipe constructed?

What is the technology for the backward EMC?

What is the DCH cell configuration?

DIRC Barrel SOB?

General:

Will there be forward PID in SuperB?

What is the effect of material on EC EMC?

What is the front end data volume?

Where is the interaction point?

Where do the in-detector electronics reside?

Not always a clean separation, but general decisions will usually need an early resolution before the TDR. Some (not too many?) internal subsystem choices could remain in TDR.


R&D and TDR areas with (some) US involvementR&D and TDR areas with (some) US involvement

Subsystems• Particle Identification (PID)- Cincinnati, SLAC, Hawaii• Electromagnetic Calorimeter (EMC)- Caltech

General Detector Systems• Electronics,Trigger,DAQ- SLAC• Detector Optimization and Bench Marking• Computing and Simulation- SLAC, LBL• MDI- SLAC, Ohio State• Integration –SLAC• TDR

General Status: Lots of impressive progress right before Elba especially in the general computing systems areas. (But limited since!) Note the general Detector meetings begin again tomorrow (Thursday, Sept 4 at 8:30).

R&D Manpower available has been limited, especially from US. All existing US R&D areas welcome new people.


A brief review of Ongoing System R&D

• Vertex Detector (SVT)• Drift Chamber (DCH)• Particle Identification (PID)-see Jaroslav’s talk• Electromagnetic Calorimeter (EMC)- see Dave Hitlin’s talk• Instrumented Flux Return (IFR)• Computing • MDI• Integration


SVT R&D- Italy


MAPS selected resultsBasic CMOS MAPS R&D (most challenging

option for the Layer0): Optimization of the Deep NWell MAPS

pixel S/N up to 25 with power consumption

reduced (~30 uW/ch) Fast readout architecture (sparsifycation

and timestamp) implemented in a 4k pixel matrix.

Preliminary test encouraging. Noise and threshold dispersion at the

same level ~ 65 e- Good sensitivity to e- from Sr90 and to

from Fe55 source

90Sr electrons

Landau

mV

S/N=23

Cluster signal (mV)Noise events

APSEL4D - Fe55

5.9 keV calibration peak

APSEL4D – Sr90 test

Fired pixel map with threshold @ ½ MIP

Good uniformity (the source was positioned on the left side of the matrix

APSEL4D - 32x128 pixels 50m pixel pitch


Test Beam Starting now at CERN

All the parts are getting ready:

CMOS MAPS chip with sparsified readout received and tested (G.Rizzo)

Beam telescope and striplets module in preparation (L. Vitale)

DAQ system under test (M. Villa) Reco Software under development

(N.Neri)

Main goals: DNW MAPS matrix

resolution & efficiency Thin (200 um) striplets

module with FSSR2 readout chips (baseline option in the CDR)

Demostrate LV1 copability with tracker information sent to Associative Memories

New DAQ system developed for data push architecture

beam

T-1,2,3,4 :reference telescope modules

S1

S2

S3

T-2,1T-4,3

Striplets-1

Striplets-2

MAPS-1

MAPS-2


Update on Thin Mechanics/Cooling R&D for Layer0 (F.Bosi)

Design of a pixel module with integrated cooling and low material (< 1% X0)

Crucial for a low material Layer 0 design with both MAPS & Hybrid Pixel options

Development of support structures with cooling microchannel integrated in the Carbon Fiber/Ceramics support

The total thickness of the support structure + cooling fluid + peek + glue is: 0.35 % X0.35 % X0 0

Consistent with the requirements Thermal simulation of the prototype

module in progress Testbench for thermoidraulic

measurements in preparation.

Prototype module simulated

Blair Ratcliff SLAC

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