Bav21 Diodes (Fairchild)
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Transcript of Bav21 Diodes (Fairchild)
BAV19 / BAV20 / B
AV21
BAV19/20/21, Rev. C
BAV19 / 20 / 21
Small Signal DiodeAbsolute Maximum Ratings* TA = 25°C unless otherwise noted
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.NOTES:1) These ratings are based on a maximum junction temperature of 200 degrees C.2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics
DO-35Color Band Denotes Cathode
2001 Fairchild Semiconductor Corporation
Electrical Characteristics TA = 25°C unless otherwise noted
Symbol
Parameter
Value
Units VRRM Maximum Repetitive Reverse Voltage BAV19
BAV20 BAV21
120 200 250
V V V
IF(AV) Average Rectified Forward Current 200 mA IFSM Non-repetitive Peak Forward Surge Current
Pulse Width = 1.0 second Pulse Width = 1.0 microsecond
1.0 4.0
A A
Tstg Storage Temperature Range -65 to +200 °C TJ Operating Junction Temperature 175 °C
Symbol
Parameter
Value
Units PD Power Dissipation 500 mW RθJA Thermal Resistance, Junction to Ambient 300 °C/W
Symbol
Parameter
Test Conditions
Min
Max
Units
VR Breakdown Voltage BAV19 BAV20 BAV21
IR = 100 µA IR = 100 µA IR = 100 µA
120 200 250
V V V
VF Forward Voltage IF = 100 mA IF = 200 mA
1.0 1.25
V V
IR Reverse Current BAV19
BAV20 BAV21
VR = 100 V VR = 100 V, TA = 150°C VR = 150 V VR = 150 V, TA = 150°C VR = 200 V VR = 200 V, TA = 150°C
100 100 100 100 100 100
nA µA nA µA nA µA
CT Total Capacitance VR = 0, f = 1.0 MHz 5.0 pF trr Reverse Recovery Time IF = IR = 30 mA, IRR = 3.0 mA,
RL = 100Ω 50 ns
BAV19 / BAV20 / B
AV21
BAV19/20/21, Rev. C
Typical Characteristics
Small Signal Diode(continued)
°
275
300
325Ta=25 C
3 5 10 20 30 50 100
Rev
erse
Vol
tage
, V R
[V]
Reverse Current, IR [uA]Figure 1. Reverse Voltage vs Reverse Current
BV - 1.0 to 100uA
0
10
20
30
40
50
55 100
Ta= 25 C
Rev
erse
Cur
rent
, I
R [n
A]
Reverse Voltage, VR [V]
°
GENERAL RULE: The Reverse Current of a diode will approximatelydouble for every ten (10) Degree C increase in Temperature
°
Figure 2. Reverse Current vs Reverse VoltageIR - 55 to 205 V
20
30
40
50
60
70
80
90
100
180 200 220 240 255
Ta= 25 C
Rev
erse
Cur
rent
, I
R [n
A]
Reverse Voltage, VR [V]
250
300
350
400
450
1 2 3 5 10 20 30 50 100
Ta= 25 CFo
rwar
d Vo
ltage
, V
R [m
V]
Forward Current, IF [uA]
Figure 3. Reverse Current vs Reverse RoltageIR - 180 to 225 V
GENERAL RULE: The Reverse Current of a diode will approximatelydouble for every ten (10) Degree C increase in Temperature
Figure 4. Forward Voltage vs Forward CurrentVF - 1.0 to 100uA
450
500
550
600
650
700
0.1 0.2 0.3 0.5 1 2 3 5 10
Ta= 25 C
Forw
ard
Volta
ge, V
F [m
V]
Forward Current, IF [mA]
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
10 20 30 50 100 200 300 500 800
Ta= 25 C
Forw
ard
Vol
tage
, V F [
mV
]
Forward Current, IF [mA]
Figure 5. Forward Voltage vs Forward CurrentVF - 0.1 to 10mA
Figure 6. Forward Voltage vs Forward CurrentVF - 10 to 800mA
° °
°°
BAV19 / BAV20 / B
AV21
BAV19/20/21, Rev. C
Typical Characteristics (continued)
Small Signal Diode(continued)
°
100
200
300
400
500
600
700
800
900
0.001 0.003 0.01 0.03 0.1 0.3 1 3 10
Ta= -40 C
Ta= 25 C
Ta= +80 C
For
war
d V
olta
ge, V
F [m
V]
Forward Current, IF [mA]
Figure 7. Forward Voltagevs Ambient Temperature
VF - 1.0 uA - 10 mA (-40 to +80 Deg C)
0 2 4 6 8 10 12 140.8
0.9
1.0
1.1
1.2
1.3Ta= 25 C
Tota
l Cap
acita
nce
[pF]
Reverse Voltage [V]
Figure 8. Total Capacitance
1.0 1.5 2.0 2.5 3.020
30
40
50
IF = IR = 30 mARloop = 100 Ohms
Rev
erse
Rec
over
y T
ime
[nS
]
Reverse Recovery Current, Irr [mA]0 50 100 150
0
100
200
300
400
IF(AV) - AVERAGE RECTIFIED CURRENT - mA
C
urre
nt [m
A]
Ambient Temperature, TA [ C]
Figure 9. Reverse Recovery Time vsReverse Recovery Current
Figure 10. Average Rectified Current (IF(AV))versus Ambient Temperature (TA)
0 50 100 150 2000
100
200
300
400
500
DO-35 Pkg
SOT-23 Pkg
Pow
er D
issi
patio
n, P
D [m
W]
Average Temperature, IO [ C]Figure 11. Power Derating Curve
°
°
°
°
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHERNOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILDDOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCTOR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENTRIGHTS, NOR THE RIGHTS OF OTHERS.
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LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices orsystems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can bereasonably expected to result in significant injury to theuser.
2. A critical component is any component of a lifesupport device or system whose failure to perform canbe reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety oreffectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications forproduct development. Specifications may change inany manner without notice.
This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.
This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design.
This datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.
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