Battery powered Applications: Selection Guide | Infineon Technologies

Selection Guide for Battery Powered Motor DrivesDesigned to Drive Your Innovation

www.infineon.com/motorcontrol

2

Ictam quodita dolorep

300W Motor Control Application KitA High Effi ciency Demonstrator Driving Your Innovation

The 300W Motor Control Application Kit features Infi neon’s OptiMOS™ technology, providing a simple to use Evaluation Board for testing and analyzing any brushless DC motor equipped with hall sensors. The components of the board include 6 pieces of OptiMOS™ (BSC016N06N3 G), an EiceDRIVER™ (6ED003L02-F2) and a Microcontroller (XC836). Together they enable brushless DC motors to run up to 300W without additional cooling.

Key features and benefi ts n High effi ciency MOSFETs and MCU n Easy plug and play software with Graphical User Interface for fast testing of the board

n Suitable for any BLDC motors with hall sensors n Optimized thermal management n Voltage, current and speed control possible

For further information please visit our website:www.infi neon.com/motorcontrolapplicationkit Watch the Video!

3

Solution Matrix

EiceDRIVER™ Compact (2EDL23N06)

XMC 4000

EiceDRIVER™ Compact(2EDL05N06, 6EDL04N02PR, 6ED003L02-F2)

XMC 1000

OptiMOS™ 20V-60V

Small Signal (SOT-363, TSOP-6)

ForkliftLight ElectricVehicle

Cordless Tools

Showing only drives dedicated devices. For complete portfolio, please check our homepage www.infineon.com

OptiMOS™ 60V-150V

Solution Matrix for Battery Powered Motor DrivesOffering Industry’s Leading High Performance Products

MOSFET

Driver ICs

Microcontroller

Based on Industry Leading Technology, highest quality and manufacturing expertise Infineon provides a variety of innovative power semiconductors which enables

designers to develop highly reliable and efficient solutions for all kinds of drive applications.

4

Forklift Solution

Forklift SolutionHighest Performance and Innovative Solutions

Requirements such as highest current capability, optimized thermal performance and reliable operation in harsh environments are essential for all kinds of Forklift designs.

Therefore, Infineon offers a broad range of products demonstrating lowest RDS(on), highest current capability up to 300A and a wide selection of innovative package solutions.

System Voltage Class Voltage Class D2PAK D2PAK 7pin TO-Leadless

24V 60V IPB029N06N3 G IPB010N06N IPT007N06N

36V 80V IPB025N08N3 G IPB019N08N3 G

48V 100V IPB027N10N3 G IPB025N10N3 G IPT020N10N3

72V/ 80V 150V IPB 072N15N3 G IPB065N15N3 G IPT059N15N3

Infineon’s OptiMOS™ for Forklift Applications

BrushlessDC Motor Driver Stage

Sensor

Sensor

Sensor

DC /DCRegulators

Controller

XMC-Microcontroller

OptiMOS™ EiceDRIVER™

5

Forklift Solution

Infineon’s EiceDRIVER™ for Forklift Applications

Infineon’s ARM® Cortex™ based Microcontroller Family

XMC4100 XMC4200 XMC4400 XMC4500

System Core ARM® Cortex™ M4

CPU Frequency 80MHz 80MHz 120MHz 120MHz

Co-Processor Floating Point Unit

Flash Size 128kB 256kB 512kB 1MB

RAM Size 20kB 40kB 80kB 160kB

Cache 4kB 4kB 4kB 4kB

Timers POSIF 1x 1x 2x 2x

CCU4 (4ch) 2x 2x 4x 4x


High-resolution PWM (150ps) Channels 4x 4x 4x -

Signal Processing ADC 12-bit 2x 2x 4x 4x

Δ∑ Demodulator - - 4x 4x

DAC 2x 2x 2x 2x

Communication IEEE 15BB Ethernet MAC - - 1x 1x

USB FS DEV FS DEV FS OTG FS OTG

SDIO/SD/MMC - - -

Serial Channels (UART, SPI, I2C, I2S) 4x 4x 4x 4x

External Memory I/F - - -

CAN 2x 2x 2x 3x

Topology DSO-8 DSO-14

Halfbridge 2EDL05N06PF 2EDL23N06PJ

6

Cordless Tool Solution

Cordless Tool SolutionHighest Power Density and System Efficiency

Depending on the topology, cordless tools require either space optimized designs for system miniaturization or cost optimized solutions to decrease total system costs. For both requirements Infineon offers the right products

with low RDS(on) in compact packages such as SuperSO8 and products at an excellent price/performance ratio without sacrificing product performance and reliability.

System Voltage Class Voltage Class TO-220 SuperSO8 CanPAK™

< 18V 30V BSC011N03LS BSB012N03LX3 G

≥ 18V - 24V 40V IPP015N04N G BSC010N04LS BSB014N04LX3 G

36V 60V IPP024N06N3 G BSC014N06NS BSB028N06NN3 G

Infineon’s OptiMOS™ for Cordless Tools


Sensor

Sensor

Sensor

BrushedDC Motor

DC /DCRegulators

Controller

Driver Stage

XMC-Microcontroller



7

Cordless Tool Solution

Infineon’s EiceDRIVER™ for Cordless Tools


Topology DSO-8 DSO-14 TSSOP-28


3-Phase (B6) 6EDL04N02PR

6ED003L06-F2

XMC1300

System Performance Core ARM® Cortex™ M0

CPU Frequency 32 MHz

Co-Processor MATH

Flash Size 8-200kB

RAM Size 16kB

POSIF 1x

Timers CCU4 (4ch) 1x

CCU8 (4ch) 1x

Signal Processing ADC 12-bit 1x (2x S&H)

Coparator 3x

Communication Serial Channels (UART, SPI, I2, I2S) 2 Channel

Application Specific LED Dimming & Color Control

8

Light Electric Vehicle Solution

Light Electric Vehicle SolutionPerformance Leadership and System Solution

With a broad portfolio of Microcontrollers and power devices Infineon is able to meet a wide range of requirements for Light Electric Vehicles such as e-Scooters,

Pedelecs or Microcars. Our products demonstrate outstanding reliability and quality as well as a very high current capability and excellent thermal performance.

Infineon’s OptiMOS™ for Light Electric Vehicles


Sensor

Sensor

Sensor

DC /DCRegulators

Controller

XMC-Microcontroller


System Voltage Class Voltage Class D2PAK D2PAK 7pin TO-Leadless TO-220

24V 60V IPP032N06N3 G

75V IPB020NE7N3 IPP034NE7N3

36V 80V IPB025N08N3 G IPB019N08N3 G IPP037N08N3

48V 100V IPB027N10N3 G IPB025N10N3 G IPT020N10N3 IPP045N10N3

72V 150V IPB072N15N3 G IPB065N15N3 G IPT059N15N3

9

Light Electric Vehicle Solution

Infineon’s EiceDRIVER™ for Light Electric Vehicles


XMC4100 XMC4200 XMC4400 XMC4500

System Core ARM® Cortex™ M4

CPU Frequency 80MHz 80MHz 120MHz 120MHz

Co-Processor Floating Point Unit

Flash Size 128kB 256kB 512kB 1MB

RAM Size 20kB 40kB 80kB 160kB

Cache 4kB 4kB 4kB 4kB

Timers POSIF 1x 1x 2x 2x



High-resolution PWM (150ps) Channels 4x 4x 4x -

Signal Processing ADC 12-bit 2x 2x 4x 4x

Δ∑ Demodulator - - 4x 4x

DAC 2x 2x 2x 2x

Communication IEEE 15BB Ethernet MAC - - 1x 1x

USB FS DEV FS DEV FS OTG FS OTG

SDIO/SD/MMC - - -

Serial Channels (UART, SPI, I2C, I2S) 4x 4x 4x 6x

External Memory I/F - - -

CAN 2x 2x 2x 3x

Application Specific Touch Control / LED Display Matrix

Topology DSO-8 DSO-14 TSSOP-28


3-Phase (B6) 6EDL04N02PR

6ED003L06-F2

10

MOSFETs

Always a Step Ahead with InfineonLeverage your Performance

Features � High current capability � Lowest RDS(on)

� Easy-to-design products � Outstanding product quality

Benefits � Enables optimized thermal management

� Enables system cost reduction & system miniaturization

� Extending battery lifetime � Reliable operation in harsh environments

Within the motor control market segment low voltage applications include the sub segment battery powered applications. These are high current applications such as Forklift, e-Scooter, Pedelecs or Cordless Power Tools with a wide range of system power from 1W to 50kW.

These applications require:

� extension of battery lifetime and range � reliable operation in harsh environments � system miniaturization and cost reduction � optimized thermal management

Infineon offers a comprehensive motor control and drives solution portfolio containing leading edge technologies in low voltage Power MOSFETs, Driver ICs, position sensors (hall and angle sensors) and the newest ARM® Cortex™-M4 based MCU. These products enable efficient, robust and cost-effective designs for all types of motors.

OptiMOS™ – the right switch for each battery powered drive application

www.infineon.com/optimos

12 24 36 48 72 80 100 150

300

250

200

150

120

100

75/80

60

40

30

25

0

HOTTER

System Voltage [V]

MO

SFET

Vol

tage

[V]

11

Soloreiust cone pratende

TO-LeadlessA Package Optimized for High Current Applications

Infi neon’s new TO-Leadless package is especially designed for high current applications such as Forklift, Light Electric Vehicles, e-fuse, PoL (Point of Load) and Telecom where highest effi ciency and reliability are required. 300A continuous current can now be handled using just one single part. Furthermore, compared to D2PAK 7pin, this signifi cantly smaller package with 60% size reduction off ers a very compact design and a substantial reduction of 30% in the footprint.

Key features and benefi ts n Industry’s lowest RDS(on), reduced footprint and space

– Enables highest effi ciency and system cost reduction n Highest current capability up to 300A

– Requires less cooling n Reduced package parasitics

– Enables improved EMI-performance – Lower package losses

For further information please visit our Website:www.infi neon.com/toll Watch the Video!

12

MOSFETs

Power MOSFETs OptiMOS™ 20V-300VThe Right MOSFET for Each System

Highest efficiency with SuperSO8Moving from TO-220 to SuperSO8 reduces space consumption drastically and offers lower parasitic, highest efficiency and lo-west design effort due to reduced spikes.

D²PAK optimized for high power applicationsA change from TO-220 to D2PAK 7pin gives several advantages and offers an ideal combination of industry’s lowest RDS(on) and high current capability. Furthermore, it comes with very low package parasitics and enables highest system reliability due to no hot spot.

TO-Leadless – industry’s highest current capabilityTO-Leadless is a package optimized for high current applications with a current capability of 300A. It enables compact de-signs due to reduced footprint and height compact designs.

Infineon provides a comprehensive portfolio of low voltage MOSFETs supporting all requirements for Battery Powered Applications. The Power MOSFET family - OptiMOS™ 20V up to 300V is consistently setting the benchmark in key specifications for drives system designs, including leading on-state resistance or highest current capability which lead to reduced power losses and improved system reliability.Infineon’s OptiMOS™ is available in innovative packages which are either optimized for space saving such as CanPAK™ or SuperSO8 or optimized for high current such as TO-Leadless.

Benefits of Infineon componentsReliable and robust products for highest system durability and reliability

� Lowest RDS(on) 0.7mΩ in TOLL and highest current 300A capability for highest system efficiency

� Small form factors for compact design e.g. SuperS08 30mm², TOLL 115mm² leading to reduction of overall system size and cost

� Evaluation boards for fast prototyping and testing and in-depth system support enable reduction of development time and cost

25 50 100 150 200 250 300 350

2.5

2.0

1.5

1.0

0.5

0

S308

CanPAK™ S/M

SuperSO8

TO-Leadless

TO-220D2PAK 7pinD2PAK

COOLERSMALLER

HOTTER

LARGER

DPAK

Package Area [mm²]

Ther

mal

Res

ista

nce

[K/W

]

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MOSFETs

Small SignalThe Perfect Fit for your Battery Powered Application

www.infineon.com/smallsignal

Voltage

SOT-223 TSOP6 SOT-89 SC-59 SOT-23 SOT-323 SOT-363

P-Ch

anne

l MO

SFET

s

-250BSP317P4Ω, -0.43A, LLBSP92P BSS192P BSR92P12Ω, -0.26A, LL 12Ω, -0.19A, LL 11Ω, -0.14A, LL

-100

BSP321P900mΩ, -0.98A, NLBSP322P800mΩ, -1.0A, LLBSP316P BSR316P1.8Ω, -0.68A, LL 1.8Ω, -0.36A, LL

-60

BSP612P 1)

120mΩ, 3A, LLBSP613P BSS83P130mΩ, 2.9A, NL 2Ω, -0.33A, LLBSP170P BSS84P BSS84PW300mΩ, -1.9A, NL 8Ω, -0.17A, LL 8Ω, -0.15, LLBSP171P300mΩ, -1.9A, LLBSP315P BSR315P800mΩ, -1.17A, LL 800mΩ, -0.62A, LL

-30

BSL303SPE 1) BSR303PE 3)

~30mΩ, ~-6.6A, LL ~30mΩ, ~-3.3A, LLBSL305SPE 1) BSR305PE 3)

~50mΩ, ~-5.3A, LL ~50mΩ, ~-2.7A, LLBSL307SP BSS308PE43mΩ, -5.5A, LL 80mΩ, -2.1A, LL, ESDBSL308PE BSS314PE80mΩ, -2.1A, LL, dual, ESD 140mΩ, -1.5A, LL, ESDBSL314PE BSS315P BSD314SPE140mΩ, -1.5A, LL, ESD, dual 150mΩ, -1.5A, LL 140mΩ, -1.5A, LL, ESD

BSS356PWE 2) BSD356PE 2)

~560mΩ, ~0.73A, LL ~560mΩ, ~0.73A, LL

-20

BSL207SP BSS209PW BSV236SP41mΩ, -6A, SLL 550mΩ, -0.58A, SLL 175mΩ, -1.5A, SLL BSL211SP BSS223PW BSD223P67mΩ, -4.7A, SLL 1.2Ω, -0.39A, SLL 1.2Ω, -0.39A, SLL, dual

BSS215P150mΩ, -1.5A, SLL

Com

plem

enta

ry -20/20BSL215C BSD235CN: 140mΩ, 1.5A, SLLP: 150mΩ, -1.5A, SLL

N: 350mΩ, 0.95A, SLLP: 1.2Ω, -0.53A, SLL

-30/30

BSL316CN: 160mΩ, 1.4A, LLP: 150mΩ, -1.5A, LLBSL308C BSD356C 2)

N: 57mΩ, A, LLP: 80mΩ, A, LL,

N: 350mΩ, 0.95A, LLP: ~560mΩ, ~0.73A, LL

N-C

hann

el M

OSF

ETs

20

BSL802SN BSR802N22mΩ, 7.5A, ULL 23mΩ, 3.7A, ULLBSL202SN BSR202N BSS806NE22mΩ, 7.5A, SLL 21mΩ, 3.8A, SLL 57mΩ, 2.3A, ULL, ESDBSL806N BSS806N BSD816SN57mΩ, 2.3A, ULL, dual 57mΩ, 2.3A, ULL 160mΩ, 1.4A, ULLBSL205N BSS205N BSD214SN50mΩ, 2.5A, SLL, dual 50mΩ, 2.5A, SLL 140mΩ, 1.5A, SLLBSL207N BSS816NW BSD840N70mΩ, 2.1A, SLL, dual 160mΩ, 1.4A, ULL 400mΩ, 0.88A, ULL, dualBSL214N BSS214N BSS214NW BSD235N140mΩ, 1.5A, SLL, dual 140mΩ, 1.5A, SLL 140mΩ, 1.5A, SLL 350mΩ, 0.95A, SLL, dual

30BSL302SN BSR302N BSS306N25mΩ, 7.1A, LL 23mΩ, 3.7A, LL 57mΩ, 2.3A, LLBSL306N BSS316N BSD316SN57mΩ, 2.3A, LL, dual 160mΩ, 1.4A, LL 160mΩ, 1.4A, LL

55 BSS670S2L650mΩ, 0.54A, LL

60

BSP318S BSL606SN BSS606N BSR606N BSS138N BSS138W90mΩ, 2.6A, LL 60mΩ, 4.5A, LL 60mΩ, 3.2A, LL 60mΩ, 2.3A, LL 3.5Ω, 0.23A, LL 3.5Ω, 0.28A, LLBSP320S BSS7728N120mΩ, 2.9A, NL 5Ω, 0.2A, LLBSP295 SN7002N SN7002W300mΩ, 1.8A, LL 5Ω, 0.2A, LL 5Ω, 0.23A, LL

2N7002 2N7002DW3Ω, 0.3A, LL 3Ω, 0.3A, LL, dualBSS159N8Ω, 0.13A, depl.

75 BSP716N BSL716SN 1)

160mΩ, 2.3A, LL 150mΩ, 2.5A, LL

100

BSP373N BSL373SN 1) BSS169 240mΩ, 1.8A, NL 230mΩ, 2.0A, NL 12Ω, 0.09A, depl.BSP372N BSL372SN 1) BSS119N230mΩ, 1.8A, LL 220mΩ, 2.0A, LL 6Ω, 0.19A, LL

VGS(th) 1.8V to 2.3VBSP296N BSL296SN 1)

600mΩ, 1.2A, LL 460mΩ, 1.4A, LLBSS123N6Ω, 0.19A, LLVGS(th) 0.8V to 1.8V

200BSP2971.8Ω, 0.66A, LLBSP1493.5Ω,0.14 A, depl.

240

BSP88 BSS87 BSS1316Ω, 0.35A, 2.8V rated 6Ω, 0.26A, LL 14Ω, 0.1A, LLBSP896Ω, 0.35A, LLBSP1296Ω, 0.05A, depl.

250 BSS13930Ω, 0.03A, depl.

400BSP2983Ω, 0.5A, NLBSP32425Ω, 0.17A, LL

500 BSP2994Ω, 0.4A, NL

600BSP125 BSS225 BSS12745Ω, 0.12A, LL 45Ω, 0.09A, LL 500Ω, 0.023A, LLBSP135 BSS12660Ω, 0.02A, depl. 700Ω, 0.007A, depl.

800 BSP30020Ω, 0.19A, NL

1) Coming Q2 2014 2) Coming Q3 2014 3) Coming Q4 2014

14

Driver ICs

EiceDRIVER™ Compact600V Half Bridge Driver ICs for Battery Powered Applications

Features � High creepage distance in DSO-14 � Integrated low-ohmic bootstrap diode � Specific undervoltage lockout levels for MOSFET

� Rail-to-rail output

Applications � Fans, Pumps � Forklift and Low Speed Cars � e-Scooter, e-Bikes

Developers of battery powered applications continuously strive for higher efficiency of applications and smaller form factors. One area of interest is, that the switching behavior and power losses of new Power MOSFETs can be optimized by dedicated driver ICs.

Infineon’s new 2EDL EiceDRIVER™ Compact is a 600V half bridge gate driver IC family. Its level-shift SOI (Silicon-On-Insulator) technology supports both design goals. With the monolithic integrated low-ohmic and ultrafast bootstrap diode this new generation 2EDL is a benchmark for driver ICs in the market with more than 2A output current.

2EDL05N06PF (DSO-8) and 2EDL05N06PJ (DSO-14) are driver ICs with the same features, but with undervoltage-logout for MOSFETs. These two parts are recommended for low voltage drives such as e-Bikes.

2EDL23N06PJ (DSO-14) is a 2.3A half bridge driver ICs for MOSFETs. It provides interlock, deadtime and in addition enable, fault and overcurrent protection. It is well performed for e-Scooter and Forklift.

Sales Code and Package (150mil)

2EDL05N06PF (DSO-8) 2EDL05N06PJ (DSO-14)

2EDL23N06PJ (DSO-14)

Applications LV-Drives, e-Bike, Battery, Forklift, Power Tools (Cordless)

Battery, e-Scooter, Forklift, Power Tools (Cordless)

Blocking Voltage 600V 600V

Output Current 0.25A /-0.5A 1.8A / -2.3A

Integrated Bootsrap Function Ultrafast BS diode and BS resistor Ultrafast BS diode and BS resistor

UVLO (latest turn-off) MOSFET (7.5V) MOSFET (7.5V)

Features Deadtime, interlock Deadtime, interlock enable, fault, OCP

www.infineon.com/eicedriver

RLIM DBSVDD

GND

VB CBS

VBUS

HO

VS

LO

2EDL-family

15

Microcontroller

XMC – 32-bit Industrial MicrocontrollerOver 100 Devices Arranged in a Portfolio Optimized for Industrial Applications

XMC 32-bit MCU portfolio offers a wide and scalable set of products delivering outstanding real-time performance, powerful features and high integration, high quality standards and long-term product availability as well as high oper-ating temperature.

XMC1000 Family � Up to 32MHz ARM® Cortex™-M0 � 64MHz Math Co-Processor (CORDIC) � 8kB to 200kB Flash � 16kB SRAM � Up to 32 general purpose IOs (GPIOs) � Rich analog-mixed signal (ADC, CMP) � Precision Timing/PWM (up to 64MHz) � Configurable communication interfaces � Application specific peripherals � Brightness Color Control Unit (BCCU) � LED Matrix and Touch (LEDTS) � Position Interface (POSIF)

Operating Conditions � Temperature: -40°C to 105°C TAMBIENT

� Voltage: 1.8V to 5.5V

XMC4000 Family � Up to 120MHz ARM® Cortex™-M4 � DSP, FPU, DMA and MPU � 64kB to 1MB Flash with ECC � 20 to 160kB SRAM with up to 4kB Cache � Up to 91 general purpose IOs (GPIOs) � Rich analog-mixed signal (ADC, DAC) � Precision Timing/PWM (up to 120MHz) � Configurable communication interfaces � Application specific peripherals � Delta-Sigma-(Δ∑)-Demodulator � High Resolution PMW (150ps, HRPWM) � POSIF, EBU, USB, SD/MMC, Ethernet

Operating Conditions � Temperature: -40°C to 125°C TAMBIENT

� Voltage: 3.13V to 3.63V

XMC1100Basic Series

XMC1200+ BCCU+LEDTS

XMC1300+ CORDIC

+ ERU

XMC4100Basic Series

XMC4200+ MEMORY

+GPIOs

XMC4400+ MEMORY+ ETHERNET

XMC4500+SD Card

+ EBU

Feature Integration

Perf

orm

ance ARM® Cortex™-M4

with DSP, FPU, MPU, DMA

More than 100 device

s

www.infineon.com/XMCwww.infineon.com/DAVEwww.infineon.com/IEC60730

New ARM® Cortex™ based Microcontroller Family

XMC MCUs are architectured for embedded industrial applications and characterize by � Application specific feature – Delta-Sigma-(Δ∑)-Demodulator (DSD), High Resolution PWM, Brightness Color Control Unit

� Precision and Control – Timer/PWM (CCU) can run up to 120MHz, up to 64-bit width offering fault inputs and binary / floating clock prescaler

� Real-Time and Process Parallelization – Module Interconnect Matrix, interaction between peripherals to offload CPU

� Quality and Robustness – Error Code Correction (ECC), Margin Check, Oper-ating Temperature up to 125°C TAMBIENT, >=20 years Data, Retention, Built-in Safety Feature (Window Watchdog, Broken Wire Detection) and free IEC60730 Class B library

Ecosystem � The wide ARM® Ecosystem (Atollic, IAR, Keil MDK, Rowley, TASKING and others) � Free Infineon DAVE™ � Eclipse CDT based IDE � ARM® GNU compiler � Free debugger and Flash loader � Data visualization tool called xSPY � Providing a resource solver � DAVE™ Apps – a tailored and object-oriented software library of 170 Apps to efficiently use the innovative set of peripherals of the XMC MCUs

Published by Infineon Technologies Austria AG9500 Villach, Austria

© 2014 Infineon Technologies AG.All Rights Reserved.

Visit us:www.infineon.com

Order Number: B152-H9712-G1-X-7600-DB2014-0004Date: 02 / 2014

Attention please!The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warran-ties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.

InformationFor further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).

WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technolo-gies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reason-able to assume that the health of the user or other persons may be endangered.

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Battery powered Applications: Selection Guide | Infineon Technologies

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