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DATA

SHEET

Bulletin SG170 of 20Revision 04Date 29 Nov 2011

Available at Digi-Key

www.digikey.com125 Series Wi125 GPS Receiver

Wi125 Data Sheet #: SG170 of 20 Rev: 04 Date: 11/29/11

© Copyright 2011 The Connor-Winfield Corp. All Rights Reserved Specifications subject to change without notice

TABLE OF CONTENTS

1 INTRODUCTION ----------------------------------------------------------------------- 4

2 SPECIFICATION ---------------------------------------------------------------------5-6 2.1 Performance-------------------------------------------------------------------------------------------5 2.2 RecommendedRatings-----------------------------------------------------------------------------6 2.3 AbsoluteMaximumRatings------------------------------------------------------------------------6 2.4 BlockDiagram-----------------------------------------------------------------------------------------6

3 PHYSICAL CHARACTERISTICS ---------------------------------------------------7-8 3.1 PhysicalInterfaceDetails---------------------------------------------------------------------------7 3.2 Wi125Dimensions------------------------------------------------------------------------------------8 3.3 SolderPadSizeandPlacement------------------------------------------------------------------8

4 SIGNAL DESCRIPTION ----------------------------------------------------------- 9-14 4.1 PowerSignals------------------------------------------------------------------------------------------9 4.2 RFSignals--------------------------------------------------------------------------------------------10 4.3 Emulation/TestSignals----------------------------------------------------------------------------10 4.4 ControlSignals--------------------------------------------------------------------------------------11 4.5 I/OSignals--------------------------------------------------------------------------------------------12

5 SPECIAL FEATURES -----------------------------------------------------------------14 5.1 UserCommands------------------------------------------------------------------------------------14 5.2 Self-Survey------------------------------------------------------------------------------------------14 5.3 Wi125EmbeddedIdentification-----------------------------------------------------------------14

6 TAPE AND REEL SPECIFICATIONS ------------------------------------------------15

7 SOLDER PROFILE -------------------------------------------------------------------15

8 APPLICATION HINTS ------------------------------------------------------------16-17 8.1 PowerSupply----------------------------------------------------------------------------------------16 8.2 RFConnection---------------------------------------------------------------------------------------16 8.3 Grounding---------------------------------------------------------------------------------------------17 8.4 BatteryBackup--------------------------------------------------------------------------------------17

ORDERING INFORMATION ---------------------------------------------------------18



Figure and Table Contents

List of FiguresFigure1Wi125BlockDiagram--------------------------------------------------------------------------------------7Figure2Wi125FormandSize--------------------------------------------------------------------------------------8Figure3Wi125Dimensions------------------------------------------------------------------------------------------9Figure4SolderPadSizeandPlacement-----------------------------------------------------------------------10Figure5RFTrackingExample-------------------------------------------------------------------------------------17Figure6GroundingtheWi125withagroundplane----------------------------------------------------------18Figure7TypicalVBATTSupplies---------------------------------------------------------------------------------19

List of TablesTable1RevisionHistory-----------------------------------------------------------------------------------------------2Table2AdditionalDocumentationList-----------------------------------------------------------------------------3Table3Wi125Specification-------------------------------------------------------------------------------------------6Table4AbsoluteMaximumRatings--------------------------------------------------------------------------------7Table5AbsoluteMaximumRatings--------------------------------------------------------------------------------7Table6Wi125SignalList---------------------------------------------------------------------------------------------8Table7RFTrack&GapWidths-----------------------------------------------------------------------------------17

Revision History of Version 1.0 Revision Date Released By Note 00 07/20/09 KeithLoiselle NewReleaseofWi125DataSheet

01 04/13/10 DaveJahr Updateto1PPS(timing)AccuracySpecification

02 06/16/10 DaveJahr 125SeriesRevised

03 10/20/11 DaveJahr Updateto1PPS(timing)AccuracySpecification

04 11/29/11 DaveJahr RoHSCompliantUpdate

Table 1 Revision History

Other DocumentationThe following additional documentation may be of use in understanding this document.

Document By Note Wi125UserManual Connor-Winfield

Wi125DevKitUserManual Connor-Winfield

Table 2 Additional Documentation List



1 INTRODUCTION

The125SeriesWi125isasmallOEMsurfacemountGPSmodulespecificallydesignedforuseinsynchronizationandtiminginWiMaxapplications.Thiscompactmodulehasanon-boardprogrammableNCOoscillatorthatoutputsasynthesizedfrequencyupto30MHzthatissteeredbyaGPSreceiver.Theself-surveymodeofoperationallowsthereceivertoenterapositionholdmodeallowingaccuratetimingtobecontinuedwithonlyonesatellitebeingtracked. Additionally,the125SeriesWi125hasphasealignmentof1PPS/10MHzwithaverystableholdover.The1PPS/10MHzoutputsmaintainphasealignmentwithholdoverbeingbaseonlyonthelocaloscillator,dismissingspuriousGPSmeasurementsduringreacquisition.WhenthereceiverregainsGPSlockafteraperiodofholdover,the1PPSand10MHzoutputsmaintainphasealignmentandareoffsetinfrequencyatthemaximumrateof100ppbuntilthe1PPSalignswiththatoftheGPSsolution.ThisslowrecoveryfromholdoverallowsforuninterruptedoperationoftheWiMaxbasestation. TheWi125hasahighlyaccurateoutputfrequency,whichcanachievefullPRCMTIEperformance.AdditionallyitcantracksatellitesandprovideGPSsynchronizationinweaksignalareasincludingindoorapplications,reducingtheneedforhighantennaplacement. TheWi125isRoHScompliantandanexceptionallysmallsurfacemountpackagewithahighlyintegratedarchitecturethatrequiresaminimumofexternalcomponentsallowingeasyintegrationintohostsystems.

Key information includes: •SystemBlockDiagram •MaximumRatings •PhysicalCharacteristics Wi125Dimensions,castellationinformation SolderPadandplacementinformation •SignalDescriptions •SpecialFeatures •ApplicationInformation Powersupplymodes RFconnections Grounding BatteryBack-up OverVoltageandReversePolarity LED’s

ThespecificationsinthefollowingsectionsrefertothestandardsoftwarebuildsoftheWi125.TheperformanceandspecificationoftheWi125canbemodifiedwiththeuseofcustomizedsoftwarebuilds.

Features•1PPS/10MHzPhasealignment•StableHoldover•HoldoverRecovery•1PPS&NCOFrequencyOutput•GPS/UTCtime/scalesynchronization

to25nsRMS•Stableprovendesignwithlongterm

availabilityandmulti-yearsupport•12channelhardwarecorrelator

processordesign•OEMSMfootprint25x27mm•Automaticentryintoholdover•Loss-of-lockandentry-into-holdover

indication•RoHSCompliant



2 SPECIFICATION 1

2.1 Performance Physical Moduledimensions 25mm(D)x27mm(W)x4.2mm(H) Supplyvoltages 3V3(DigitalI/O),3V3(RF),1V8(Coreoption),3V (StandbyBattery) OperatingTemp -30°Cto+85°C StorageTemp -40°Cto+85°C2

Humidity 5%to95%non-condensing MaxVelocity/Altitude 515ms-1/18,000m MaxAcceleration/Jerk 4g/1gs-1(sustainedforlessthan5seconds)

Sensitivity Acquisitionw/networkassist -185dBW Tracking -186dBW AcquisitionStandAlone -173dBW

Acquisition HotStartwithnetworkassist Outdoor:<2s Time Indoor(-178dBW):<5s StandAlone(Outdoor) Cold:<45s Warm:<38s Hot:<5s Reacquisition:<0.5s(90%confidence)

Accuracy Position:Outdoor/Indoor <5mrms/<50mrms Velocity <0.05ms-1

Latency <200ms RawMeasurementAccuracy Pseudorange<0.3mrms,Carrierphase<5mmrms Tracking Codeandcarriercoherent

Power 1fixpersecond 0.6Wtypically ComaModeCurrent 10mA (RF3V3+DIG3V3) StandbyCurrent(VBATT) 1.5µA

Interfaces Serial 3UARTports,CMOSlevels Multi-functionI/O 1PPSandFrequencyOutputavailableonGPIO[0] EventCounter/TimerInput Upto4xGPIO(multi-function) 2xLEDStatusDrive I2C,ExternalClock(onspecialbuild) Protocols NetworkAssist,NMEA0183,ProprietaryASCIIand binarymessageformats 1ppsTimingOutput 25nSrmsaccuracy,<5nSresolution Userselectablepulsewidth EventInput 30nSrmsaccuracy,<10nSresolution FrequencyOutput(GPIO[0]) 10Hzto30MHz(Wi125) ReceiverType 12parallelchannelx32tapsupto32pointFFT. Channels,tapsandFFTcanbeswitchedoffto minimizepowerorsimulatesimplerdesigns.

General Processor ARM966E-Sona0.18µprocessatupto120MHz.Note: 1. The features listed above may require specific software builds and may not all be available in the initial release. 2. Please contact factory for other temperature options.

Table 3 Wi125 Specification



2.2 Recommended Ratings Symbol Parameter Min Max Units

RF_3V3 RFSupplyVoltage +3.0 +3.6 Volts

DIG_3V3 DigitalSupplyVoltage +3.0 +3.6 Volts

DIG_1V8 DigitalSupplyVoltage +1.65 +1.95 Volts

VBATT BatteryBackupVoltage +2.7 +3.5 Volts

ANT_SUPPLY AntennaSupplyVoltage +3.0 +12 Volts

Table 4 Recommended Maximum Ratings

2.3 Absolute Maximum Ratings Symbol Parameter Min Max Units

RF_3V3 RFSupplyVoltage -0.3 +6.5 Volts

DIG_1V8 DigitalSupplyVoltage -0.3 +2.0 Volts

DIG_3V3 DigitalSupplyVoltage -0.3 +3.7 Volts

VBATT BatteryBackupVoltage -0.5 +7.0 Volts

ANT_SUPPLY AntennaSupplyVoltage -15 +15 Volts

DIG_SIG_IN AnyDigitalInputSignal -0.3 +5.5 Volts

RF_IN RFInput -15 +15 Volts

TSTORE Storagetemperature -40 +85 °C

IOUT DigitalSignalOutputCurrent -6 +6 mA

Table 5 Absolute Maximum Ratings

Figure 1 Wi125 Block Diagram

2.4 Block Diagram

RF Block

Front End Filter

Clock

RF25IC

IF Filter

Regulator& Reset

BB25IC

Regulator

ANT_SUPPLY RF_3V3 DIG_3V3

RF_IN

DIG_1V8/+1V8_OUT

RTC & EEPROM

I2C

Control

Emulation

Comms & I/O

NPOR VBATT

TRIM/EXT_CLK

2 SPECIFICATION continued



O

.

: . - - HIROSE H.FL CONNECTORPART NO: H.FL-R-SMT

Figure 2 Wi125 Form and Size

3.1 Physical Interface DetailsTheinterfacetotheWi125isvia1mmcastellationsona2mmpitch.Thereare42connectionsinall.ThereisalsoanRFconnectorforconnectingtotheGPSantenna.Thedetailsoftheinterfaceconnectionsaregivenbelow. Pin Function Pin Function Pin Function

1 TX[0] 15 NTRST 29 N2WDA

2 RX[0] 16 NPOR 30 USBP

3 TX[2] 17 RFV_OUT 31 USBN

4 RX[2]/EV2_IN 18 RF_GND 32 FREQ_OUT3

5 TX[1] 19 RF_3V3 33 +1V8_OUT

6 RX[1] 20 TCK 34 DIG_1V8

7 EXT_CLK 21 JTAGSEL/RTCK 35 DIG_GND

8 LED_RED 22 TMS 36 DIG_3V3

9 LED_GRN 23 RF_GND 37 EVENT_IN

10 NRESET 24 RF_IN 38 1PPS

11 BOOTSEL 25 RF_GND 39 GPIO[0]/PWM_OUT

12 TRIM 26 ANT_SUPPLY 40 GPIO[1]/TIME_SYNC

13 TDO 27 VBATT 41 GPIO[2]/NEXT_INT

14 TDI 28 N2WCK 42 GPIO[3]/FREQ_INNote: 3. Frequency Output is available on pin 32 (FREQ_OUT) with custom software only.

Table 6 Wi125 Signal List

3 PHYSICAL CHARACTERISTICS

The125SeriesWi125isamulti-chipmodule(MCM)builtonanFR4fiberglassPCB.Alldigitalandpowerconnec-tionstotheWi125areviacastellationsonthe25x27mmPCB.TheRFconnectionisviacastellationsoranRFcon-nector.ThegeneralarrangementoftheWi125isshowninthediagrambelow.Dimensionsareinmm(inches/1000).



3.2 Wi125 DimensionsThefigurebelowprovidesthedimensionsofthepositioningoftheWi125castellations.Dimensionsareinmm(inches/1000).

Figure 3 Wi125 Dimensions

3.3 Solder Pad Size and PlacementItisrecommendedthatthefootprintofthesolderpadundereachcastellationbe2mmx1mm,centeredonthenominalcentrepointoftheradiusofthecastellation.Thecastellationsaregoldplatedandsoareleadfree.NotethatiftheRF_INconnectorisbeingused,thereshouldnotbeapadorsolderresistundertheRF_INcastella-tion.IftheRF_INcastellationistobeused,thepadshouldbeshortenedby0.5mmunderneaththeWi125andstandardRFdesignpracticesmustbeobserved.Thediagrambelowshowstheplacementofthepadsunderthecastellations.

RF_INPIN 22

Figure 4 Solder Pad Size and Placement

3 PHYSICAL CHARACTERISTICS continued



RF_3V3 Type:Power Direction:Input Pin:19

TheRFSupplyInput.This3.3V±10%inputsuppliesthe2.9VLDOregulatorintheRFsectionoftheWi125.Itisimportantthatthissupplyiswellfilteredwithnomorethat50mVpeaktopeaknoisewithrespecttoRF_GND.

RF_GND Type:Power Direction:Input/Output Pins:18,23,25

TheRFInputGround.ThisisthereturnpathfortheRF_3V3supplyandthegroundfortheantennafeed.TheRF_GNDmustbetiedtotheDIG_GNDexternallytotheWi125.

RFV_OUT Type:Power Direction:Output Pin:17

TheoutputfromtheLDOregulatorthatispoweredbytheRF_3V3signal.ThissuppliesthepowertotheRFsubsystemoftheWi125.ThismayalsobeusedtopowerexternalRFcomponentsbutcaremustbetakennottoinjectnoiseontothissignal.Nomorethananadditional30mAmaybetakenfromthissignalbyexternalcircuitry.

ANT_SUPPLY Type:Power Direction:Input Pin:26

TheAntennaSupplyVoltage.ThismaybeusedtosupplypowertotheRF_INsignal,forusebyanactiveantenna.Themaximumvoltageshouldnotexceed±15Vandthecurrentshouldbelimitedto50mA.

DIG_3V3 Type:Power Direction:Input Pin:36

TheDigitalSupplyInput.This3.3V±10%inputsuppliestheI/OringoftheBB25ICchipandtheLDOregulatorinthedigitalsectionoftheWi125.Itisimportantthatthissupplyiswellfilteredwithnomorethat50mVpeaktopeaknoisewithrespecttoDIG_GND.

DIG_1V8 Type:Power Direction:Input Pin:34

The1.8V±5%digitalcoresupplyfortheBB25IC.Thisisnormallyconnecteddirectlytothe+1V8_OUTsignal.However,ifanexternal1.8V±5%isavailable,aloweroverallsystempowerconsumptionmaybeachievedbyusinganexternalsupply.

+1V8_OUT Type:Power Direction:Output Pin:33

The1.8VoutputfromtheLDOregulatorthatispoweredbytheDIG_3V3signal.Normally,thisisconnectedtotheDIG_1V8signal.Thismayalsobeusedtopowerexternallogicbutcaremustbetakennottoinjectnoiseontothissignal.Nomorethananadditional50mAmaybetakenfromthissignalbyexternallogic.

DIG_GND Type:Power Direction:Input/Output Pin:35

TheDigitalGround.ThisisthereturnpathfortheDIG_3V3supplyandthegroundreferenceforallthedigitalI/O.TheDIG_GNDmustbetiedtotheRF_GNDexternallytotheWi125.

4 SIGNAL DESCRIPTION

ThesignalsontheWi125aredescribedinthetablebelow.

4.1 Power Signals



VBATT Type:Power Direction:Input/Output Pin:27

TheBatteryBackupSupply.TheWi125hasanonboardRealTimeClock(RTC).ThisispoweredfromtheVBATTsignal.Asupplyoftypically3v(greaterthan2.5VandlessthanDIG_3V3)shouldbeappliedtothissignal.Thissignalcanbeleftfloatingifnotrequired.Theinputhasablockingdiodeandsorechargeablebatterieswillneedanexternalcharg-ingcircuit.Typically,a1KresisterinserieswiththissignalandtheexternalbatterywillprovideaneasymethodofmeasuringthecurrentconsumptionfromVBATTduringtest.

4.2 RF Signals

RF_IN Type:RF Direction:Input Pin:24

TheRFInputSignal.ThisattachestotheGPSantenna.StandardRFdesignrulesmustbeusedwhentrackingtothissignal.ThissignalhasanRFblockedconnectiontotheANT_SUPPLYsignal.ThisisthesamesignalpresentedontheRFconnectorontheWi125.Onlyoneantennaconnectionshouldbemade.IftheRFconnectoristobeused,thenthereshouldbenoconnection,evenanunconnectedpad,tothiscastellation.

TRIM Type:RF Direction:Input Pin:12

ThissignaltrimstheoutputfrequencyoftheVCTCXO.Thissignalisnormallyleftopen.Whenfloating,thissignalisbiasedtothecontrolvoltageoftheVCTCXO.Anynoisein-jectedintothissignalwillseverelycompromisetheperformanceoftheWi125.Thissignalshouldonlybeusedinconjunctionwithspecificapplicationnotes.

EXT_CLK Type:RF Direction:Input Pin:7

Thisinputistheexternalclockinput.ThissignalistobeusedonlyinspecialbuildsoftheWi125thatarenotfittedwithaninternalVCTCXO.Forthenormalbuild,containingtheVCTCXO,donotconnectthisinput.Theexternalclockisa9MHzto26MHzclippedsinewaveinputwithanamplitudebetween1Vand3Vpeaktopeak.ThereturnpathforthissignalisRF_GND.

4.3 Emulation/Test Signals

TDI Type:Test Direction:Input Pin:14

TheTestDataInSignal.ThisisthestandardJTAGtestdatainput.ThesignalreturnpathisDIG_GND.

TDO Type:Test Direction:Output Pin:13

TheTestDataOutSignal.ThisisthestandardJTAGtestdataoutput.ThesignalreturnpathisDIG_GND.

TCK Type:Test Direction:Input Pin:20

TheTestClockSignal.ThisisthestandardJTAGtestclockinput.ThesignalreturnpathisDIG_GND.

4 SIGNAL DESCRIPTION continued

4.1 Power Signals cont’d



TMS Type:Test Direction:Input Pin:22

TheTestModeSelectSignal.ThisisthestandardJTAGtestmodeinput.ThesignalreturnpathisDIG_GND.

JTAGSEL/RTCK Type:Test Direction:Input/Output Pin:21

ThisisaDualFunctionSignal.WhentheNPORsignalisasserted(low),thissignalisaninputandselectsthefunctionoftheJTAGinterface.Whenhigh,JTAGemulationintotheembeddedARM9processorisselected.Whenlow,theBB25ICchipboundaryscanmodeisselected.ThevalueonthissignalislatchedwhenNPORde-asserts(goeshigh).WhenNPORisde-asserted(high)andtheJTAGemulationmodehasbeenlatched,thissignalprovidesthereturnclocktotheARMMulti-ICE.BecausetheARM9functionsoffasingleclockdomain,theTCKhastobeinternallysynchronizedintheARM9.ThiscancauseavariablelengthdelayinthevalidityoftheTDOsignal.TheRTCKisasynchro-nizedversionoftheTCKsignal.TheMulti-ICEusestheRTCKoutputsignaltoindicatewhentheTDOsignalisvalid.ThesignalreturnpathisDIG_GND.

NTRST Type:Test Direction:Input Pin:15

TheTestResetSignal.ThisistheactivelowJTAGtestresetsignal.ThesignalreturnpathisDIG_GND.

4.4 Control Signals

NPOR Type:Control Direction:Input/Output Pin:16

ThePowerOnResetSignal.Thisactivelow,opencollectorsignalisthemasterresetfortheWi125.TheWi125canbeheldinresetbyassertingthissignal.Thesignalcanbeusedtoresetexternalcircuitry,butcaremustbetakentoensurenoDCcurrentisdrawnfromthissignalastheinternalpull-upresistorvalueis100K.

NRESET Type:Control Direction:Input/Output Pin:10

TheSystemResetSignal.Thisactivelow,opencollectorsignalisgeneratedbytheBB25ICchipinresponsetotheassertionoftheNPOR.ItmayalsobedriventoresettheARM9processorintheBB25ICwithoutcompletelyre-initializingthechip.

BOOTSEL Type:Control Direction:Input Pin:11

TheBootSelectSignal.TheBB25IChasfourbootupmodes,butonlytwoaresupportedbytheWi125.ThissignalissampledwhentheNPORisde-asserted.IftheBOOTSELsignalishighorleftfloating,thentheWi125bootsfromitson-chipFLASHmemory.IftheBOOTSELsignalispulledlow,theWi125bootsfromitson-chipROM.


4.3 Power Signals cont’d



4.5 I/O Signals

TX[0] Type:I/O Direction:Output Pin:1

TheTransmitSignalforUART0.ThisisastandardUARToutputsignal.ThesignalreturnpathisDIG_GND.





RX[0] Type:I/O Direction:Input Pin:2

TheReceiveSignalforUART0.ThisisastandardUARTinputsignal.ThesignalreturnpathisDIG_GND.

RX[1] Type:I/O Direction:Input Pin:6

TheReceiveSignalforUART1.ThisisastandardUARTinputsignal.ThesignalreturnpathisDIG_GND.

RX[2]/EV2_IN Type:I/O Direction:Input Pin:4

ThisisaDualModeSignal.Normally,thisisthereceivesignalforUART2,astandardUARTreceivesignal.Undersoftwarecontrol,itcanalsobeusedasgeneralpurposeI/Oortodetectevents.Itcanbeusedtodetectthetimingoftheleadingedgeofthestartbitoftheincomingdatastream.ThesignalreturnpathisDIG_GND.

FREQ_OUT Type:I/O Direction:Input/Output Pin:32

OptionalFrequencyOutputSignal.ThisisNOTthesamesignalaspin39.Thissignalisturnedoffbydefault.ThisisacomplexsignalwhichundersoftwarecanprovideanyofeitheranNCOgeneratedoutputfrequency,aPWMsignal,aGPSalignedEPOCHpulseorgeneralpurposeI/Osignal.ThesignalreturnpathisDIG_GND.

1PPS Type:I/O Direction:Input/Output Pin:38

The1PulsePerSecondSignal.Thisisnormallya1pulsealignedwithGPStime,butcanundersoftwarecontrolalsoprovidegeneralpurposeI/Ooranadditionaleventinput.Thepulsewidthofthe1PPSissoftwareselectablewithadefaultof100µs.ThesignalreturnpathisDIG_GND.

EVENT_IN Type:I/O Direction:Input/Output Pin:37

TheEventInputSignalwithinternalconnectiontoPin39(GPIO[1]/TimeSync)allowsphasemeasurementoftheFrequencyOutput.ThesignalreturnpathisDIG_GND.




4.5 I/O Signals cont’d

N2WCK Type:I/O Direction:Input/Output Pin:28

TheNavSync2WireClockSignal.ThisistheopencollectorI2CcompatibleClockSignalforthe2wireserialinterface.ThesignalreturnpathisDIG_GND.

N2WDA Type:I/O Direction:Input/Output Pin:29

TheNavSync2WireDataSignal.ThisistheopencollectorI2CcompatibleDataSignalforthe2wireserialinterface.ThesignalreturnpathisDIG_GND.

USBP4 Type:I/O Direction:Input/Output Pin:30

ThepositiveUSBSignal.ThesignalreturnpathisDIG_GND.

USBN4 Type:I/O Direction:Input/Output Pin:31

ThenegativeUSBSignal.ThesignalreturnpathisDIG_GND.

LED_RED Type:I/O Direction:Output Pin:8

ThisisaDualFunctionSignal.NormallythissignalisusedtodrivearedLED.StandardsoftwarebuildsusethissignaltoindicateGPSstatus.Inspecialsoftwarebuilds,thissig-nalcanbeusedasGPIO.Thissignalhasa3.3VCMOSdrive.Aserieslimitingresistorisrequiredtolimitoutputcurrentto±5mA.ThesignalreturnpathisDIG_GND.

LED_GRN Type:I/O Direction:Output Pin:9

ThisisaDualFunctionSignal.NormallythissignalisusedtodriveagreenLED.Stan-dardsoftwarebuildsusethissignaltoindicateGPSstatus.Inspecialsoftwarebuilds,thissignalcanbeusedasGPIO.Thissignalhasa3.3VCMOSdrive.Aserieslimitingresistorisrequiredtolimitoutputcurrentto±5mA.ThesignalreturnpathisDIG_GND.

GPIO[0]/PWM Type:I/O Direction:Input/Output Pin:39

NormallytheGPIO[0]/PWMoutputprovidesaFrequencyOutputthatdefaultsto10MHz,andisuserconfigurablefrom10Hzto30MHzsignal.Theoutputisenabledonpower-upandissteeredbytheGPSsolution.CustomsoftwareversionscanalsoconfigurethispinforgeneralI/O,PWMorEPOCHoutput.ThesignalreturnpathisDIG_GND.

GPIO[1]/TIME_SYNC Type:I/ODirection:Input/Output Pin:40

TheGPIO[1]/TIME_SYNCpinprovidesasynchronizationpulsegeneratedbytheon-boardRTC.CustomsoftwareversionscanalsoconfigurethispinforgeneralpurposeI/O,oranadditionalPPSoutput.ThesignalreturnpathisDIG_GND.

Note: 4. USB is not supported in the current software build.





4.5 I/O Signals cont’d

GPIO[2]/NEXT_INT Type:I/O Direction:Input/Output Pin:41

TheGPIO[2]/NEXT_INToutputprovidesanactivehighstatusindicatorfortheFrequencyOutputavailableonpin39(GPIO[0]/PWM).CustomsoftwareversionscanalsoconfigurethispinforgeneralpurposeI/O.ThesignalreturnpathisDIG_GND.

GPIO[3]/FREQ_IN Type:I/O Direction:Input/Output Pin:42

TheGPIO[3]/FREQ_INoutputprovidesanactivehighstatus3Dfixindicator.Thisindi-catorcanalsobeusedtodeterminethevalidityofthepin38(1PPS)output.ThesignalreturnpathisDIG_GND.

5 SPECIAL FEATURES

WhilemostofthefeaturesontheWi125arejustasubsetofthecapabilitiesoftheWi125andsoaredescribedintheWi125DataSheetandtheWi125UserManual,therearesomeadditionalfeaturesspecifictotheWi125thatrequireexplanation.

5.1 User CommandsTheWi125canacceptanumberofspecificusercommandsforsettingreceiverparameterssuchasUARTbaudrateandNMEAmessagesubset,outputfrequency,etc.ManyoftheseparametersarestoredinNon-VolatileMemory(NVM)sothatthesettingsareretainedwhenthereceiverlosespower.TheavailablecommandsaredefinedindetailintheWi125UserManual.

5.2 Self SurveyTooptimizetimingperformance,theWi125performsa10-minutesurveyeachtimethereceiverispoweredupandafterobtainingaGPSfix.Whenthesurveyiscomplete,thereceiverautomaticallyentersfixedtimingmode.Forapplicationswithspecifictimingperformancerequirements,itmaybenecessarytoallowthesurveytocom-pletebeforeusingthe1PPSandfrequencyoutputs.ThestatusofthesurveycanbedeterminedbyqueryingthereceiverdynamicssettingasdescribedintheWi125UserManual.

5.3 Wi125 Embedded IdentificationThehardwareversionnumberishardcodedontotheWi125;firmwarealsocontainsaversionnumberallowingforeasyidentificationofthehardwareandsoftwareversioninembeddedapplications.



6 TAPE AND REEL SPECIFICATIONS

(I) Measured from center line of sprocket hole to center line of pocket.(II) Cumulative tolerance of 10 sprocket holes is ± 0.20.(III) Measured from center line of sprocket hole to center line of pocket.(IV) Other material available.

ALL DIMENSIONS IN MILLIMETERS UNLESS OTHERWISE STATED

General Tolerance ±0.2Drawing not to Scale

7 SOLDER PROFILE

0

50

100

150

200

250

300

0 50 100 150 200 250 300 350

Time (sec)

Tem

p (

°C)

221°C

Reflow Zone30/90 sec (Min/Max)

Peak Temp.245°-255°C for 15 sec Typ.

Soaking Zone60-90 sec Typ.

(2 min Max)

Ramp Slope not to exceed ±3°C/sec

Figure 5 Tape and Reel

Figure 6 Solder Profile



8 APPLICATION HINTS

ThefollowingarealistofapplicationhintsthatmayhelpinimplementingsystembasedontheWi125.

8.1 Power SupplyThepowersupplyrequirementsoftheWi125canallbeprovidedfromasingle3.3Vsupply.Tosimplifysystemintegrationon-boardregulatorsprovidethecorrectvoltagelevelsfortheRFandoscillator(2.9Vor3.0V)andlowvoltagedigitalcore(1.8V).InpowersensitiveapplicationsitisrecommendedthattheDIG_1V8supplyisprovidedfromahighefficiencyexternal1.8Vsourcee.g.switchmodepowersupply,ratherthantheon-boardlinearregula-tor.IfthesourceimpedanceofthepowersupplytotheWi125ishighduetolongtracks,filteringorothercauses,localdecouplingofthesupplysignalsmaybenecessary.CareshouldbetakentoensurethatthemaximumsupplyrippleatthepinsoftheWi125is50mVpeaktopeak.

8.2 RF ConnectionTheRFconnectiontotheWi125canbedoneintwoways.ThepreferredmethodistousestandardmicrostripdesigntechniquestotrackfromtheantennaelementtotheRF_INcastellation.Thisalsoallowsthesystemsintegratortheoptionofdesigninginexternalconnectorssuitablefortheapplication.TheusercaneasilyfitanexternallymountedMCX,SMAorsimilarconnector,provideditisplacedadjacenttotheRF_INcastellation.Ifthetrackingguidelinesgivenbelowarefollowed,theimpedancematchwillbeacceptable.Thediagrambelowshowshowthiscouldbeachieved.Inthisdiagram,thecentreviaoftheRFconnectorispresumedtobeplatedthroughwithaminimalpadtopandbottom.ThePCBmaterialisassumedtobe1.6mmthickFR4withadielectricconstantof4.3.Twosituationsareconsidered;onewithnogroundplaneandonewithagroundplaneonthebottomoftheboard,underneaththeRFconnector.InbothcasesthereisnoinnerlayertrackingundertheRFconnector.

SMA Connector

RF_IN

Top Tracking

Ground Plane (if used)

PIN 22

Figure 7 RF Tracking Example

ThewidthsoftheRF_INtrackandtheassociatedgapsaregiveninthetablebelow.

Scenario Track Width (1/1000Inch) Gap Width (1/1000Inch) Withoutgroundplane 37 6 56 8

Withgroundplane 32 6 43 8

Table 7 RF Track & Gap Widths

Alternatively,theusercanattachtheantennatotheHiroseH.FL-R-SMTusingaflyingleadfittedwithasuitableplug.



Figure 8 Grounding the Wi125 with a Ground Plane

Double via to host system ground at this one point. Digital and RF grounds common at this point.

8 APPLICATION HINTS continued 8.3 GroundingInconnectingtheWi125intoahostsystem,goodgroundingpracticesshouldbeobserved.Specifically,groundcurrentsfromtherestofthesystemhostingtheWi125shouldnotpassthroughthegroundconnectionstotheWi125.Thisismosteasilyensuredbyusingasinglepointattachmentfortheground.TheremustalsobeagoodconnectionbetweentheRF_GNDandtheDIG_GNDsignals.WhilethereisnotaspecificneedtoputagroundplaneundertheWi125,highenergysignalsshouldnotbetrackedundertheWi125.ItishoweverrecommendedthatagroundplanebeusedundertheWi125.Inthiscase,thefollowingwouldbeanexampleofthepatternthatmaybeused

VBATT

DIG_GND

CR2032 Cell

1K VBATT

DIG_GND

0.47F Supercap

1K VBATT

DIG_3V3 100R

Figure 7 Typical VBATT Supplies

8.4 Battery BackupTheWi125hasanon-boardrealtimeclock(RTC).ThisisusedtostoredateandtimeinformationwhiletheWi125ispowereddown.HavingavaliddateandtimespeedstheTimeToFirstFix(TTFF),allowingtheWi125tomeetitsquotedTTFFspecification.TheWi125reliesonanexternalpowersourcetopowertheRTC(VBATT)whentheDIG_3V3isnotpresent.Iftheuserapplicationdoesnotrequirethewarmorhotfixperformance,ortherequiredinformationisprovidedbynetworkassistance,thereisnoneedtoprovidetheVBATTsignal.TheVBATTsignalmustbegreaterthan2.6VandlessthanDIG_3V3+0.6V.Typically,a3Vlithiumprimarycellorahighcapacity“supercap”willbeused.TheWi125hasaninternalblockingdiode,soifa“supercap”orrechargeablebatteryisused,anexternalchargingcircuitwillberequired.

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Wi125 -010.0M OutputFrequency

125 Series Wi125 GPS Receiver

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