Automotive SBU Update · Company Overview • Establishment • Jan-18-FY1979 • Business scale...

Automotive SBU Update

2018 Rev1.1 Prepared by Stanley Lin Associate Vice President, Automotive SBU

Content

Pages Duration

TSC Company Update

Company overview

23 00h15mn

Footprints of Manufacturing Sites

Product portfolio

Business performance

Automotive Technology roadmap

TSC Automotive Solution

ECU

24 00h20mn Protection

EV Charging

Tier 1 OEM Qualification procedure

TSC Automotive Quality Strategy 7

00h30mn TSC Auto Product Process, flow and SPEC 11

Q & A Open discussion 00h10mn

Company Update


Company Overview

• Establishment • Jan-18-FY1979

• Business scale • FY2017 TSC Group (TSC+TSC Auto ID) $296M • FY2017 TSC $174M

• Headquarter • Xindian Dist., New Taipei City,

• Products • Rectifier, TVS, Small signal diodes, MOSFET, Analog ICs

• Manufacturing sites • Wafer : LiJe/TW; Tianjing/CHINA • Assembly & test : I Lan/TW; Sandong/CHINA

• Employees • 1,800+

• Group Structure

Corporate Organization

Chairman and President Arthur Wang

Quality Reliability Assurance Rexis Manabit

Quality Assurance

Customer Service

Quality System

Marketing/ Sales Andy Chao

Subsidiaries

NPI

Marketing

Sales

AE/FAE

Logistics

Strategic Business Unit (SBU) Stanley Lin

Automotive

Research and Development

Arthur Wang (Act)

RD I (Package I-Lan)

RD II (Wafer Li-Je)

RD III (HQ)

RD V (IC HQ)

Production and Manufacturing

Helen Wang

I-Lan Factory (Package)

Li-Je Factory (Wafer Fab)

Tianjin Factory (Wafer Fab)

Yangxin Factory (Package)

Administration Jerry Wang

Administration

Finance

Legal

MIS

Initial Automotive SBU support Automotive Business SINCE E/Q4-Y17

Revenue – TSC Group - Printer & Semiconductor

83.6 109 122.4

150

162 166

174

190

0

50

100

150

200

250

300

350

400

450

2015 2016 2017 2018

TSC Auto ID TSC

Unit: Million US$

Global Service

Founded in Taiwan 12 Branch Offices Worldwide 4 Production Sites in Asia

TIANJIN

YANGXIN

SEOUL

TOKYO

SHANGHAI

SU ZHOU

SHENZHEN

HONG KONG

TAIPEI/HQ

I-LAN

LI-JE

MUNICH PARIS

MANCHESTER

BALTIMORE, MD

CARMEL, IN

BREA, CA

HEADQUARTERS BRANCH OFFICES PRODUCTION SITES

Footprint of Manufacturing Sites

Tianjin, China / Frontend (4“ Wafer) Li-je, Taiwan / Frontend (4” Wafer; 6” is on the way)

Technology : GPP, Photoglass, SIPOS passivation Technology : GPP, Photoglass, SIPOS/Si3N4 passivation, Planar (Under development, Q1E/FY19)

Capacity : 170,000pcs wafers/month Capacity : 95,000pcs wafers/month

Yangxin, China / Backend (Assembly) I-lan, Taiwan / Backend (Assembly)

SMD/Bridge/Power Pack/Axial SMD/Power Pack/ PDFN (MOSFET)

Capacity : • SMD : 450,000,000 pcs /month • Bridge : 100,000,000 pcs /month • Axial : 240,000,000 pcs /month • Power Pack : 30,000,000 pcs / month

Capacity : • SMD : 20,000,000 pcs /month • Power Pack : 5,000,000 pcs / month

Rectifier Passivation Technologies

Star Level 1 2 3 4 5

Die Construction

Process Diffused wafer (Open Junction)

Diffused wafer +

Silicone rubber protection

Grooves etching + Glass layer on etched grooves

Grooves etching + SIPOS + Glass layer on etched grooves

Grooves etching + Silicon Nitride + Glass layer on etched grooves

Quality rating Low end

Low quality

Low end

Low quality

Medium quality Better than medium quality

High Quality

TSC Remarks NRND

EOL EOL Rectifiers Bridge, HV Rectifier,

HV Rectifier, TVS, Load Dump TVS,

Hi Tj, Hi Surge

P+

N

N+

P+

N

N+

N

P+

N+

N

P+

N+

N

P+

N+

Corporate Milestones

TSCE Office Munich, Germany

1979

Foundation Taipei, Taiwan

1988

1st Production Facility Set-Up I-Lan, Taiwan

1995

TEW Production

Facility Set-Up Tianjing, China

TSCA Office Pomona, CA, USA

2000

Registered OTC Stock market Taiwan

TSCK Office Seoul, Korea

2002

TSC SH Office Shanghai, China

MOS/TR R&D HQ, Taiwan

TSC SZ Office Shenzhen, China

TSCJ Office Tokyo, Japan

2005

TSCH Logistic Office Hong Kong

2007 2012 2010

Diode Assembly

Facility Set-Up I-Lan, Taiwan

MOS Assembly Facility Set-Up I-Lan, Taiwan

2016

Automotive Grade MOS & Car Lighting IC Development HQ, Taiwan

2014

Power Mgmt. IC R&D Set-Up HQ, Taiwan

2017

Li-Je, YEW MES(Manufacturing

Execution System),

QMS(Quality

Management System)

Implementation

Automotive Grade Power Management IC Development HQ, Taiwan

1993

Li-Je Production Facility Set-Up I-Lan, Taiwan

YEW upgrade production Automation Shandong, China

YEW Production

Facility Set-Up Shandong, China

Bridge TMTT(Final Test) Station

Standard SMD Process vs. Matrix Line

SMD TMTT (Final Testing) Station

Clean Room Upgrade In Molding Station

MES (Manufacturing Execution System) implementation

Automotive Equipment Automation System (MES)

Product Portfolio – Focus On Solutions

Overview about Avaliable Products

Power Management ICs

• Amplifier & Comparator

• Analog IC

• Reset IC

• Voltage and Current Controller

• Hall Effect Sensor

• Omni-Polar

• Unipolar

• Latch

• Linear

• Lighting IC

• AC-DC LED Lighting IC

• DC-DC LED Lighting IC

• Linear LED Driver

• Linear Voltage Regulator

• Standard Linear Voltage Regulator

• Low Dropout Voltage Regulator

• Ultra Low Dropout Voltage Regulator

Discrete Devices

• Bridge Rectifier

• Standard Bridge

• Fast Recovery Bridge

• High Efficiency Recovery Bridge

• Super Fast Recovery Bridge

• Schottky Bridge

• Diode

• Standard Rectifier

• Auto Rectifier

• Fast Recovery

• High Efficient Recovery

• Super Fast Rectifier

• Ultra Fast Rectifier

• Schottky

• ESD Capability Rectifier

• Switching Diode & Array

• TVS

• Zener Diode & Array

• ESD Protection Diode & Array

• MOSFET

• Super Junction

• N-Channel

• P-Channel

• P-Channel Integrated Schottky

• Complementary

• Transistor

• NPN Bipolar Transistor

• PNP Bipolar Transistor

• Complex Digital Transistor

• Switching Regulator

• DC/DC Converter (Integrated Switch)

• DC/DC Controller (External Switch)

• Voltage Reference

• 1.24V Reference Voltage

• 2.495V Reference Voltage

http://www.taiwansemi.com/home/en/products/products.php

TSC Products Overview

Product Family Active PNs AECQ PNs AECQ/Active PNs

TVS 2145 2145 100%

Power Zener 339 339 100%

Schottky 975 656 67%

Bridge 418 220 53%

Standard 252 177 70%

ESD capability rectifier 4 4 100%

FRD 158 99 63%

HER 286 237 83%

Superfast 353 307 87%

Ultrafast 90 84 93%

Total 5020 4268 85%

Diode Package Schottky Standard Fast

Recovery High

Efficient Super Fast

Ultra Fast

Zener TVS

Micro SMA - - - -

Sub-SMA - -

SOD-123HE - - - -

SOD-123W

(07/2018)

(07/2018)

SOD-128 -

(07/2018) -

(07/2018)

(07/2018)

ThinSMA

(07/2018) - - -

(07/2018) -

(07/2018)

(07/2018)

SMA

SMB

SMC

D²-Pak - - - -

AEC-Q qualified in qualification planned - not planned

Status: April. 2018

Automotive Product Portfolio

Industrial Bosch

Danfoss

Grundfos

GE

Rockwell

Schneider

Siemens

Power Supply & Consumer Bosch Siemens

Braun

Delta Electronics

Dyson

Flex Power

LG

Miele

Panasonic

Sharp

Samsung

Sony

Whirlpool

Automotive (Behr-)Hella

Continental

Delphi

Kostal

Lear

Sumitomo

Wabco

Lighting BAG

Helvar

Osram

Panasonic Lighting

Philips Lighting

Sharp Lighting

Tridonic

Universal Lighting

Vossloh-Schwabe

Applications, Split & Reference Customers

PWR 33%

Lighting 16%

Auto. 20%

IND. 12%

CON. 10%

Others 9%

CN 41%

EU 21%

KO 16%

TW 8%

US 6%

JP 5%

R.O.W 3%

FY 17 Revenue $USD 174M

FY 17 Revenue $USD 174M

Infotainment

Safety system

Body control

Chassis system

Engine Transmission

Applications, Split & Reference Customers

Navigation

Audio

Air Bag

TPMS

ADAS

Lighting

Air-CON

ABS

IVI Transmission

Window lift Body control

Mirror

Chassis control

EPAS

OBD

AEC

Fuel Injection

Ignition

ECU

Air supply

3 Years Package Technology Roadmap

Current Rating

100(A)

10(A)

1.0(A)

0.1(A)

Y2018 Y2019 Y2020

Thin SMA/SOD-128

DO-218AB

TO-263-2 Thin DPAK DO-247

GUFP 5-pins

Three phase Bridge

Load Dump TVS

Specific design for OBC

High current density design

Package Trends SMD Packages

SMA

SOD-123W

• 45% in space

• 50% in height

• 60% of the current rating

MicroSMA

• 24% in space

• 30% in height


SMB ThinSMA

• 69% in space

• 50% in height


SMC ThinSMA

• 29% in space

• 40% in height


D-PAK

ThinDPAK (Under

developing)

• 100% in space

• 67% in height


SMPC4.6

• 45% in space

• 50% in height


D2PAK ThinDPAK

(Under developing)

• 85% in space

• 42% in height


Automotive Solution Update


Automotive Electronics Development Trend

Sensing Technology implementation

ADAS development and phase in More ECUs usage

MCU upgrade

Powerful and more function integration Consolidation of ECUs to drive high performance computing platforms Telematics

Communication/Interface

Enhance reliability Maintenance Autonomous cars

Safety, Environment, Efficiency

Automotive Power types change Design topologies change Proliferation of sensors and ECUs for compliance (NCAPs, NHTSA,..)

Data Collection

Execution ECU

ECU, control a growing list of vehicle functions

ECU = Engine Control unit = Electronics Control Unit = Micro Computer = Brain of a Car !!

Safety System ($4.9B, 16.8%) Airbag ECU AFS ECU Parktronic ECU Radar ECU Camera ECU

Body Control System ($4.4B, 15.1%) Dashboard ECU Air CON ECU Window lift ECU Seat ECU HID ECU Smart key ECU

Infotainment System ($5.2B, 17.8%) Navigation ECU Multimedia system ECU ETC ECU

Powertrain System ($4.8B, 16.4%) Engine ECU Sensor ECU Transmission ECU

Chassis System ($4.5B, 15.4%) Braking ECU ABS ECU, ESC ECU Speed sensors Suspension ECU Power steering ECU

ECU, Brain of a CAR !! How a SMART Car !!

ECU Block Diagram

Signal input ADC, Interface

DC-DC converter

Drive circuit Output, IGBT,

Bridge, Injector

Load Motor, LED, Solenoids,

Lamp

MPU

HI load

12V load

HV load

Signal line protection

Fre

ewh

eel

ing

Rectification

Polarity protection

Seco

nd

ary

pro

tect

ion

Load

Du

mp

Battery Alternator

Analog Signal ex.transducer

Digital Signal ex.Switch state

ECU, Brain of a CAR !! How a SMART Car !!

Polarity protection Load Dump protection Rectification

Definition • Protect from reverse polarity connection • reverse transient voltage penetration

• Clamping surge voltage to acceptable low voltage to protect electronic circuits.

• Load dump function is required for almost all automotive electronics

• boost or buck type DC/DC converter or inverters

• 12/24 V to 5 V voltage converting for MPU of most electronic units

• 12/24 V to HV converting for air-bag igniter, engine ignition, LED, HID Ballast

Test Standard

• ISO 7637-2 :2010 pulse 1 and pulse 3a • JASO D001 : 94

• ISO 7637 : 2004, ISO • 16750-2 : 2010, JASO, Toyota TSC7001.

N/A

Design Concern

• Peak reverse voltage • Continuous forward current • IFSM capability

• Clamping capability (min 10% margin) • Load dump test capability

• Peak reverse voltage • Continuous forward current • IFSM capability

Products • STD, ESD Rectifier, BYG series • Load Dump TVS, High Power TVS • Planar/Trench SKY, Utrafast 200-600V

Secondary protection Signal protection Freewheeling

Definition

• Clamping surge voltage to acceptable low voltage to protect electronic circuits.


• Protect from reverse polarity connection • reverse transient voltage penetration

Protect circuits from induced high voltage by inductance load in operation mode

Test Standard

• ISO 7637-2 :2010 pulse 1 and pulse 3a • JASO D001 : 94

• ISO 7637-3 • IEC 61000-4-2

N/A

Design Concern

• Peak reverse voltage • Clamping capability (min 10% margin) • Load dump test capability

• Peak reverse voltage • IFSM capability • ESD capability

• Peak reverse voltage • IFSM capability at freewheeling operation • Avalanche capability

Products • STD, ESD Rectifier, BYG series • TVS (PG), ESD • Planar/Trench SKY, Utrafast 200-600V

Design TSC into Automotive Electronics P

ola

rity

pro

tect

ion

Serial connection With load Dump With Load Dump

• Low current and high impedance load • No protection of forward high voltage

• Common application • For low current load

• For high current load

TSC Products in Polarity Protection

Load

Load

Load

Product 1A 1.5A 2A 3A 4A 5A

Standard

S1xM (MicroSMA)

S1xLW (SOD-123W)

S1xL (SubSMA)

S1x (SMA)

S1xB (SMB)

S15xLW (SOD-123W)

S2xA SMA)

S1xB (SMB)

S3xB (SMB)

S3x (SMC) S4x (SMC)

S5xB (SMB)

S5x (SMC)

ESD rectifier TSDGLW (SOD-123W)

TSD1G (SMA) TSD2G (SMB) TSD3G (SMC)

Avalanche BYG20/21/23 (SMA)

Protection Solution For Automotive Application

MCU/MPU

CO

MM

CAN

LIN

I/O

Data Port

Lighting Body & Chassis Electronics

LCD LED

I/O Port

RF 3G Module Wifi/Bluetooth/GPS Audio

Power V Boost V Buck V Digital

Vbat

TVS Protection (ISO7637-2 / ISO16750-2)

ESD Protection (IEC61000-4-2/ ISO10605)

Display

TVS/ESD Protection (ISO7637-2 / ISO16750-2/ IEC61000-4-2/ ISO10605)

ESD Protection (IEC61000-4-2/ ISO10605)

ESD Protection (IEC61000-4-2 ISO10605) U

SB2

.0

HD

MI

SIM

SD

Dig

i I/O

O

N/O

FF

Ke

ypad

G

PIO

TVS/ESD Protection (ISO7637-2/ ISO16750-2) (IEC61000-4-2/ ISO10605)

Output Driver

Threats Of Automotive Electronics –ESD(Transient wave)

ESD Standard

Vehicle test ISO 10605 vs. IEC 61000-4-2

Object Standard Evaluation Cause Automotive Customer

Electronic equipment

IEC 61000-4-2 Malfunction Human body VW(TL82466)

Vehicle Components

ISO 10605 Malfunction

Break Human body

GM(GVM3097), VW(TL82466), Ford(ES-XW7T), Citoren(B21-7110), BMW(GS95002)

Vehicle Components

SAE J1113-13 Malfunction

Break Human body

Standard Module Test Sensitivity Level

Test

ISO 10605

• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000Ω

• 150pF/330Ω • 330pF/330Ω • 150pF/2000Ω • 330pF/2000

IEC 61000-4-2 • 150pF/330Ω • 150pF/330Ω

SMD Type TVS Product Portfolio

Above Load Dump

TVS 3.6KW 4.6KW 6.6KW

5KW 5.0SMDJxx

3KW SMDJxx

1.5KW 1.5SMCxx

SMCJxx TVSPBRxx

1KW 1KSMBxx

600W SMA6Fxx SMA6Sxx SMA6Jxx P6SMBJxx

SMBJxx TPSMBxx

400W S4Fxx SMA4Fxx SM4Sxx P4SMAxx SMAJxx

200W SMFxx

150W MSPxx

PKG

MicroSMA SOD-123W ThinSMA SOD-128 SMA SMB SMC SMPC DO-218AB

Threats Of Automotive Electronics – Transient pulse

Vehicle test - Electrical disturbance by conduction and coupling ( Standard ISO 7637/ISO 16750)

Pulse Description

1 Connected directly to an inductive load in parallel

2a

Transient interruption of a device connected in parallel, due to hardness inductance

2b Transients from DC motor acting as a generator when ignition is switched off

3a/3b Switching transients due to distributed inductance and capacitance of hardness

4 Voltage dip due to starter-Motor current during cranking (Excluding spikes)

5 Load Dump

Wiper

Airbag

ABS

EEC

Motor

ESP

Alternator

Conventional

Central Load Dump

ISG (BSG/IMG)

Design TSC into Automotive Electronics Lo

ad D

um

p p

rote

ctio

n

Definition Test Standard Design concern

• Clamping surge voltage to acceptable low voltage


• ISO 7637 : 2004, ISO • 16750-2 : 2010, • JASO, Toyota TSC7001.

• Clamping capability (min 10% margin) • Load dump test capability

TSC new Product – Load Dump TVS

Wafer Design Backend Design Key Note

SiN Passivation DO-218 1. Benchmark to competitor samples, set its actual PPPM performance as internal SPEC target

2. Implement Silvaco TCAD simulation to support design direction 3. Junction Passivation optimized design with passivated SiO2+SiN Technology 4. Nitride PV Layer brings better anti-humidity capability 5. High surge capability 6. Better thermal stability, operating Tj max. up to 175°C 7. Suitable for high reliability and automotive requirement

Part No. Polarity PPPM (10/1000us) PPPM (10/10000us) Tj AECQ Competitor MP Schedule

TLD5S10~36A Uni 3,600W 2,800W 175℃ Y SM5S series E-Q2, 2018



Non-Epi Load Dump TVS SOA Comparison

The relationship of peak clamped current and TVS

Ipp = (Us – Vc) / Ri

• Ri : Alternator resistance • Ipp : TVS load dump peak clamping current • Us : alternator output peak voltage • Vc : TVS load dump peak clamping voltage

Vxx SM8S24A vs. TSC TLD8S24A Vxx SM8S36A-7000 vs. TSC TLD8S36A-01

• ISO16750-2 pulse A @ 12V System Us=101V Td=400ms 10 pulses @ 1 minute internal

• ISO16750-2 pulse A @ 24V System Us=202V Td=350ms 10 pulses @ 1 minute internal

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

178 184 190 196 202

Ri (

oh

m)

Us (V)

Vxx SM8S36A-7000 application noteTSC TLD8S36A-01

Vxx SM8S36A-7000

0.5

0.7

0.9

1.1

1.3

1.5

1.7

79 84.5 90 95.5 101

Ri (

oh

m)

Us (V)

Vxx SM8S24A application note

TSC TLD8S24A

Vxx SM8S24A

Load Dump Performance @ 12V & 24V Power System is Competitive

Automotive Alternator Types

Conventional Central load dump ISG(BSG/IMG)

Output voltage 12V and 24V 12V, 24V and 48V

Output current 50 to 200A

Alternator diode type Rectifier Rectifier with Zener function IGBT, MOSFET

Peak output voltage at load dumping status

12V : 79 to 101V 24V : 150 to 202V

12V : Typ. 35V 24V : Typ. 65V

TBD

TSC Products

TLD5A27/6A27/8A27 TLD5A27/6A27/8A27 TLD5A27/6A27/8A27

TLD5S/6S/8S series TLD5S/6S/8S series TLD5S/6S/8S series

SMDJ series (PG) SMDJ series (PG)

1.5SMC series (PG) (ARTC Test*)

TVSPBR series (PG)

Related tests of electric and electronic units in powertrain

Load dump test ISO 7637-2 pulse 5a ISO 16750-2 : 2010 pulse a JASO D 001 – 94 type A & D

ISO 7637-2 pulse 5b ISO 16750-2 : 2010 pulse b

Common test ISO 7637-2 : 2010 pulse 1, 2a, 2b, 3a and 3b ( Pulse 6 & 7) JASO D 001 – 94 type B,C, E and F

Design TSC into Automotive Electronics R

ect

ific

atio

n &

Fre

ewh

ee

ling

Definition Test Standard Design concern

• Boost or buck type DC/DC converter or inverters

• 12/24V to 5 V voltage converting for MPU of most electronic units

• 12/24V to HV converting for air-bag igniter, engine ignition, LED, HID Ballast

• Protect circuits from induced high voltage by inductance load in operation mode

• N/A

• Peak reverse voltage • Continuous forward current • IFSM capability • Avalanche capability

TSC new Product – Superfast Rectifiers @ SMPC4.6 low profile SMD package

Part No. VR IF(AV) IFSM trr Tjmax MP

Schedule AECQ

Cross Applications

(V) (A) (A) (ns) ℃ Vishay DII

TPMR10xx 200/400/600 10 150 35/40 175 Q3, 16’ Yes - -

ECU HID Lighting ABS System

TPMR6xx 400/600 6 100 35/40 175 Q3, 16’ Yes - PUD620

TPMR5xx 200/400/600 5 80 35 175 Q4, 17’ Yes - PDU540

TPMR3xx 200/400/600 3 70 35 175 Q4, 17’ Yes AU3xx PDU340

Freewheeling, Pumps/Solenoid Injectors Driver HV Boost,Injection HV & Airbag

Design TSC into Automotive Electronics R

ect

ific

atio

n &

Fre

ewh

ee

ling

Schottky for Automotive Electronics Test Standard

• 12V system, target <=100V • 48V system, target up to 200V • Schottky for Automotive Applications

Flywheel diodes for EPS (Electric Power Steering), ABS and motor driving units as fuel pump

DC to DC converters of

1. Car display

2. ECU (Electronic Control Units)

3. Rectification of DC boost of LED head lamp & Daylight driving lamps

TSC Schottky Rectifiers

IF Config.

VRRM Packages Application Position

(A) (V)

1 Single 45 MicroSMA Body Electronics Infotainment, Navigation, Audio, Interior LED Lighting

1 Single 60 MicroSMA Exterior Lighting LED Fog Lighting, Rear and Signal LED Lights

2 Single 45 SOD-123HE/W Exterior Lighting Day Lighting

3 Single 45 SOD-123HE/W Powertrain 12/24V, Powertrain Body Electronics, Passive Safety,

Exhaust Emission Control System, Comfort, Door, Window Controls, Airbag Control Systems, Restraint System Power Supplies, Fuel Pump Control

1 Single 200 SOD-128/ThinSMA Chassis Control Transmission ECU, Double Clutch BLDC

3 Single 200 SOD-128/ThinSMA Powertrain I Direct Injector Control (Solenoid)

5 Single 45 SOD-128/ThinSMA Passive Safety Restraint System Power Supplies

5 Single 100 SMPC Exterior Lighting LED Headlight Units

15 Single 45 SMPC Powertrain 12/24V HVAC

15 Single 45 SMPC Chassis Control Electric Power Steering

20 Single 45 TO263(D2PAK) Start / Stop (12 V) Boardnet Stabilizer DC/DC Converters

30 Single 45 TO263(D2PAK) Chassis Control Brake and Active Safety Control

30 Dual 45 TO263(D2PAK) Powertrain 12/24V Engine Cooling

Global Green Car Growth Trend By Power Type

0

5

10

15

20

2015 2016 2017 2018 2019 2020

48V Mild hybrid FHEV PHEV EV

Unit : M units

100% EV HEV

Motor

Inverter

Battery

Motor

Inverter

Battery

Engine

Gener-ator

FHEV : 42.4% 48V : 34.4%

Overview of 48V Powernet

Core team LV 148 Standard

48 architecture (12V architecture upgrade type)

Classic 12V Boardnet 48V Boardnet

48V high power Electronics

Core

BMW

VW Audi

Bosch Hella

Daimler Porsche

Continental

Ford

PSA

Renault

Below 60V, no need extra protection system In same power, working current of 48V is only ¼ of

12V, loss is only 1/16 With BSG/ISG, can reduce size of engine, noise and

vibration Alternator size is 5KW to 20KW Support bigger power automotive devices Bidirectional DC/DC converters48V Belt Starter

Generator (BSG) easily replace original 12V Belt Starter Generator

CO2 reduction for vehicles

12V Battery system

Audio Lamp

12V

48V Battery system

DC/DC (Bidirectional)

48V starter/generator

eBooster

EPS/EHPS

Roll stabilization

AC compressor

Air bag Seat control

Door lock

EV (Electrical Vehicle) Charging

On Board Charger

AC Charging

DC(Fast) Charging

AC

DC

DC

AC Motor

HSG ISG

AC Charging • 7.2KW (32A, 1-phase) • 22KW (3-phases) • Charging time, 7.2KW, 3-4hrs DC Charging • >50KW @ >100A • 80%, 30-60mins

HV Battery Pack

Fast Charging Module

PCU

Inverter

Inverter (Motor)

Boost Converter

DC-DC Converter

Inverter (HSG)

EV (Electrical Vehicle) Charging Market Trend

• DC charging • Storage charging • Mobile Charging • Convenient Charging

EV (Electrical Vehicle) Charging Market Scale

EV Market Demand

China EV Charging Station Demand

0

100,000

200,000

300,000

400,000

500,000

600,000

700,000

800,000

FY'17 FY'18 FY'19 FY'20

Hybrid PHEV BEV

0

500,000

1,000,000

1,500,000

2,000,000

2,500,000

3,000,000

FY'17 FY'18 FY'19 FY'20

• Power Module 3.3KW-20KW • Key Module Maker: Infypower, Increase • Key component of EV Charging Module:

Low VF Bridge, SJMOS (For PFC, with FRD fro DC-DC), Ultrafast 30A/600V-1200V DO-247, SiC 10A/600V TO-220

OEM End Customer

Kostal VW, GM, BMW, BenZ, 長城, 吉利

UAES Audi, VW, 上汽, 北企, 東風

Emerson GM, Ford, 上汽, 一汽

Valeo VW, GM,上汽, 一汽, 東風, BYD, 長安

Delphi VW, GM,上汽, 一汽, 日產, 奇瑞

Topologies for EV (Electrical Vehicle) Charging

AC/DC+PFC DC-DC Auxiliary SMPS

Singe phase +

Full Bridge LLC

Vienna +

Full Bridge LLC

Put TSC into Design

• Single phase Bridge rectifier • Ultrafast rectifier • TVS • Super junction MOSFET • SiC SBD

• Ultrafast rectifier • TVS • Super junction MOSFET • SiC SBD

• Ultrafast rectifier • Schottky rectifier

SiC for xEV Applications

Market Trend Estimation

FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022

On Board Charger

DC-DC Converter

Main Inverter

SiC SBD + SiC MOSFET SiC SBD + Si MOSFET

SiC MOSFET Si MOSFET

SiC MOSFET Si-IGBT + Si-FRD

Market Competition Status

600V JBS Jul-2009

1700V SBD Apr-2010

1700V/50A SBD

Mar-2014

SBD Gen 3 Feb-09

650V SBD Gen 5

Sep-2012

1200V SBD Gen 5

Jul-2014

SBD Gen 1 May-2010

SBD Gen 2 Jul-2012

600V SBD Feb-09

1200V SBD Sep-2012

Dual 600V SBD

Jan, 2014

1200V SBD Nov, 2012

600V SBD Jan-2012

650V SBD Apr-2013

1200V SBD 2400V SBD Dec-2010

600V/1200V SBD

Sep-2013

1200V SBD Gen 1

Dec-2012

Gen 1 Dec-2013

650V/1200V SBD Gen 2 Jan-2014

650V SBD Gen 3

Sep-2015

1200V SBD Gen 3

May-2016

2009 2010 2011 2012 2013 2014 2015 2016

Automotive Quality Strategy


2017 : Auto Program, Zero Defect Culture, Risk-Based, Process Robustness

QMS Standards IATF–Lije, ILAN,TEW, RSL VDA 6.3 AEC Q101/100 ZVEI Zero Defect Culture 5M Holistic Approach Employee Communication Quality Awareness Drive Automotive Organization Automotive Quality Manual Risk-Based Quality System Project Risk Management Change Risk Management Risk-Driven Quality Audit Process Robustness Critical Defect Firewall Auto Specific Controls Error-Proofing Systems Automation - Manufacturing Systems - Quality Management Continuous Improvement Project Management PFMEA/ DFMEA Problem Solving/8D Lessons Learned Program

2018 : Auto Program Proliferation, Supplier Zero Defect, Product Robustness

QMS Standards IATF– YEW Supplier Zero Defect QMS Foundry Subcontractor Raw Material Global Audit Program Cross-Functional Cross-Site Internal and Suppliers Automation Databases Product Life Cycle APQP/NPI Phase Reviews Reliability Product Robustness Corner-Point Charzn Test-To-fail Charzn Enhanced Design Rule Continuous Improvement Failure Mechanism Design of Experiments Reliability Failure Model/Simulation

2019 : Technical and Operational Excellence

Core Expert Team Engineering Quality Engineering Product Development Manufacturing Process Knowledge Management Quality/Technical Forums Quality Improvement Value Engineering 6 Sigma Program Systemic Improvement Kaizen Programs President Quality Award Cultural and Leadership Team Building Program Management/Leadership Decision Making Continuous Improvement Material Science Advance Statistics Predictive Maintenance Lean Manufacturing

2020 : Innovation

Technical Advancement Design Thinking Built-in Quality Design Tools Innovation Program Product Innovation Process Innovation Systems Innovation Leading Edge Technology Product Design Process Controls Systems Automation Eqpt/Tooling Automation

Quality Excellence Roadmap

Automotive Strategy and Investment

TSC is investing in People and Machineries to materialize and support the Quality Strategy

Quality Strategy and Tactics Zero Defect Quality Culture

• Zero Defect - Holistic Approach (5M)

• Zero Defect Philosophy Visibility

• Vertical and Horizontal Communication • Automotive Organization

Risk Centered Quality System • Project Quality Management (QM)

• Manufacturing Operational Excellence

• Supplier Quality Development and Management • Change Control and Management

• Risk Driven Quality/ Technical Audit

Product and Process Robustness • Critical Defect Firewalls

• Error-Proofing/ Defect Prevention Controls • Corner Point/Test-to-Fail Characterization

• Systems Integration and Automation

• Design for Manufacturability/ Reliability and Testability

Continuous Improvement

• Knowledge Management • Lessons Learned

• Proliferation of BKM (Best Known Methods)

• Competency and Skills Development

Co

mp

any

Inve

stm

en

t

Work Culture and Organizational Transformation

Zero Defect Philosophy

Employee Communication Media

Cross-Functional Automotive Organization

People Skill Enhancement

Hiring More Skilled/ Experienced Personnel

Employees Training

Facility and System Automation

MES - Manufacturing Execution System

PLM - Product Launch Cycle Management

CRM – Customer Relationship Management

QIMS –Quality Integrated Management System

SPC – Statistical Process Control

Zero Defect Culture

Video Intranet/Internet Posters/Screen Saver

Executive Management Attention

Operational Excellence

Manufacturing Automotive Specific Control - Production Operators

Consumer Automotive

• 3 months experience • Yearly re-qualification • Basic Training

Tightened Qualification/Re-Qualification • Operation experience more than half year • Re-qualification half a year Automotive Personnel Special Training : • Training for Zero Defect concept • Training for Basic Quality tools : Ishikawa diagram,

Pareto chart, Histogram, Checklist… • Automotive requirement certification : PFMEA,

Control Plan, Customer Specific Requirement, SPC • Interview exam on Automotive Quality Concept

Operational Excellence (Automotive Manufacturing Specific Control )

Established requirement personnel experience

Tightened operator qualification/re-qualification

Zero Defect Concept MES system to error proof

Operator identification


Manufacturing Automotive Specific Control - Assembly and Test Engineers

Consumer Automotive

• Re-qualify each year • Minimum Junior college graduates • Quality tools : Ishikawa diagram, Pareto chart,

Histogram, check list…

• Re-qualify half a year • Minimum bachelor graduate • Zero Defect concept • Quality tools : Ishikawa diagram, Pareto chart,

Histogram, check list… • Automotive Standards Certification : APQP, PPAP,

FMEA, MSA, SPC, Control Plan, Customer Specific Requirement, VDA6.3, VDA6.5, Problem Solving, IATF16949 and CQI series knowledge…

Competency and Skills Enhancement link to Zero Defect Concept

Zero Defect Concept

Technical skills enhancement training

Automotive Quality Tools Training

External certification (VDA6.3, IATF 16949)


Continuously Drive for Zero Defect and Continuous Improvement Demonstration of Zero Defect Initiative at Assembly

Use of Team and Systematic Problem Solving Approach

Zero Defect and Problem Solving

Significant scratch improvement

• The SKY wafer surface scratch have been found after wafer mounting.

• Wafer scratch always exists in the past. • Ppm, ranges from 33~47ppm in Y2017. • Wafer scratch may cause high leakage,

reliability failure and other failures.

Problem Description (Defect) :

Root Cause Analysis :

Effectiveness Tracking :

Team Formation :

3X5Why Analysis

Failure Mechanism

Corrective Action : Technical, Systemic and Replication

Non-Contact Mount

Auto Product Development Process


Pilot run Prototype Project

Approval Initial

Approval

Product Quality Planning Timing Chart (APQP)

Launch

Phase 0 Concept

Phase 1 Planning

Phase 2 Product design & development

Phase 3 Process design & development

Phase 4 Product & Process Validation

Production

Phase 5 Feedback, Assessment and Corrective Action

• DFEMA • DCP

• PFEMA • PCP

• MSA • SPC • CP • PPAP

• MSA • SPC • CP

EVT DVT PVT MP IBP Pre-IBP

Verification & Validation

Product Development Strategy – First time Right

Customer Requirement

Technical Specification

DOEs

Design rule

Each requirements is reliably fulfilled

Automotive Grade

• Key Criteria :

o Compliancy to the guidelines of

AEC-Q101 (Product Qualification)

AEC-Q001 (PAT, Part Average Testing)

AEC-Q002 (SYA, Statistical Yield Analysis)

o Availability of PPAP documents

o Application of specific manufacturing and process rule

o Implementation of specific screening and test methods during manufacturing based on risk management

Prevention & Detection are the key to Robust Processing

Risk Centered Quality System

Enhanced Project Management systems

Product Development Flow

APQP Committee Review

Product Design Drawing Design/ Finished Good Drawing

Design Failure Mode and Effect Analysis (DFMEA)

Drawing Review (Simulation)

Material/Equipment Requirements Determined and Selection

Material/Equipment Evaluation and Buy-off

Prototype Build

Qualification

Phase Review & Change Notice

Reject Approve

Output

1. DFMEA 2. Design for Manufacturability and Assembly 3. Design Verification 4. Design Reviews 5. Engineering Drawing 6. Engineering Specifications 7. Material Specifications 8. Drawing and Specification 9. New Equipment, Tooling and Facilities requirements 10. Special Product and Process Characteristics 11. Gages/Testing Equipment Requirements 12. Team Feasibility Commitment and Management Support

Input

1. Design Goal 2. Reliability and Quality Goads 3. Preliminary Bill of Material 4. Preliminary Process Flow Chart 5. Preliminary Listing of Special Product and Process 6. Product Assurance Plan 7. Management Support

Process Development Flow

APQP Committee Review

Product Design Characterization Identify

Process Flow Chart

Process Failure Mode and Effect Analysis (PFMEA)

Manufacture and Inspection Equipment/Tools Develop

Layout Planning

Control Plan

Inspection Standard and Plan

Phase Review & Change Notice

Reject

Approve

Output

1. Packaging Standards 2. Process Flow Chart 3. Floor Plan Layout 4. Characteristics Matrix 5. Process Failure Mode & Effect Analysis 6. Pre-Launch Control Plan 7. Process Instructions 8. Measurement Systems Analysis 9. Preliminary Process Capability Study Plan 10. Packaging Specification 11. Management Support

Input

1. Design Failure Mode and Effect Analysis 2. Design for Manufacturability and Assembly 3. Design Verification 4. Design Reviews 5. Engineering Drawing 6. Engineering Specifications 7. Material Specifications 8. Drawing and Specification 9. New Equipment, Tooling and Facilities Requirements 10. Special Product and Process Characteristics 11. Gages/Testing Equipment Requirements 12. Team Feasibility Commitment and Management Support

Operator Instructions

Pilot Run

Qualification (AEC-Q101: EOL)

Product and Process Robustness

Assembly & Test Process

Enhanced Automotive Process control and detection

Wafer Fab Process

Tightened process control & detection: • Automated Optical Inspection • Final Test Dynamic PAT

Tightened process control & detection: • Non-contact wafer mount • Automated On-line Inspection • 1XReflow • Static & Dynamic PAT • 3D Final Visual Inspection

Wafer Start

Phos. Drive In

Boron Drive In

HTO

Au

tom

otive P

rocess Flo

w

1st Photo

AOI (Automated Optical Inspection)

Grid Etch

Glass firing

LTO

3rd Photo

AOI (Automated Optical Inspection) A

Au

tom

otive P

rocess Flo

w

A

Oxide Etch

Metallization

Dynamic PAT Spec Calculation

Wafer Electrical Probing

V/M Inspection

OQC

Package

Storage

Non-contact Wafer Mount

Sawing/ Cleaning

D/A + Soldering (Post AOI Process)

AOI (Automated Optical Inspection)

Au

tom

otive P

rocess Flo

w

Cleaning

Auto Mold

Post Cure

100% 1x Reflow

Plating

Singulation/ Trim & Form

A

Au

tom

otive P

rocess Flo

w

A

Testing

Marking

V/M Inspection

Testing

3DSS Vision

In-tape vision

Taping

Product and Process Robustness (ex. Etching)

Special process controls in Wafer Fabrication

Etching Control point Control method

Specification

Consumer Automotive

Grid depth, grid width

Xbar-S Chart By Run

CPK>1.33 By Run

CPK>1.67

Temp. stability Overall

Maintenance CPK > 1.33

1. CMK>2.0 Once/monthly/Mc. 2. Recalculation after Mc. shut down over half year

Freezing capability Freezing test (from RT to -3OC)

Every month Every month

Temperature, Machine Auto Alarm

Start up when temperature within -3±1oC

Start up when temperature within -3±1oC

water resistivity Calibrate/Auto-Alarm

Calibrate every season Calibrate every month

Etching Acid Life Time Defined Quantity ± Tolerance

Less Then Defined Piece, No Tolerance

Product and Process Robustness (ex. Final Test)

Special process controls established in Assembly and Test

Testing, Marking, Testing and Taping

Control point Control method Specification

Consumer Automotive

Peeling Force Xbar-R Chart Once/Mc/Day

CPK>1.33 Once/Mc/Shift

CPK>1.67

3D5S Vision Calibration N/A Golden Samples Cal.

Once/Mc/Shift

SYL/SBL Control Statistical

Control SYL Robust -4sigma

SBL Robust +4 sigma SYL Robust - 3sigma

SBL Robust + 3 sigma

Statistical Bin Analysis

Review and Improve

1. Monthly Review 2. SBL Trigger

1. Weekly Review 2. SBL Trigger

Test parameter setup

PAT Static PAT

Robust ± 6sigma Dynamic PAT

Robust ± 4sigma

Static PAT(±6Sigma) and Dynamic PAT(±4Sigma)

Data Sheet Spec. ±6σ Spec. (Static PAT) ±4σ Spec. (Dynamic PAT)

Dynamic PAT enhance elimination of outliers


Automotive Equipment with Tightened Requirements and Automation

Automotive Equipment Controls • Equipment Maintenance : established lifetime • CMK>2.0 • Equipment evaluation per month • Predictive Maintenance • Sawing Blade or punch die lifetime control

more stricter to assure CPK>1.67 Automotive Equipment MES Automation Control • Auto Recipe down load • License control (Man and Machine) • Auto machine parameter check • Tool plan & lifetime management • Equipment setting control & monitor • PPM or Yield limited monitoring • Real time parameter monitor • Inline SPC Note : Consumer • Equipment Maintenance per year • CPK > 1.33

Machine abnormality handling Flow:

Machine abnormal

Involve the

material?

Maintain for the machine

Risk lot identify

Yes

No

Conditional accept Sorting Scrap

Risk Assessment

Predict Maintenance

Non-conformity products Flow


Tightened Electrical Testing Maverick Control – Assembly and Test

Electrical Maverick Control

Maverick Control Consumer Automotive

Statistical Yield Limit Robust Mean – 6*Sigma(ENG Disposition) Robust Mean – 3*Sigma (ENG Disposition) Robust Mean – 4*Sigma (Scrap)

Statistical Bin Limit Robust Mean + 6*Sigma(ENG Disposition) Robust Mean + 3*Sigma (ENG Disposition) Robust Mean + 4*Sigma (Scrap)

SYL Consumer Automotive

GPP 90% 94%

SKY 90% 94%

TVS & ZENER 85% 90%

SBL Consumer Automotive

Open/Short DVF Open/Short DVF

GPP 0.5% 2% 0.3% 1%

SKY 0.5% 1% 0.3% 0.8%

TVS & ZENER 0.5% 2% 0.3% 1% If Yield less than SYL or Bin Failure Rate higher than SBL will trigger for OCAP.

Machine Auto Alarm Machine alarm trigger

Die Attach/ Clip Bond • AOI before soldering to monitor the N side solder paste diameter and die rotation, while

detected abnormal the machine will alarm. • While alarm for continuous 3 times, the machine will stop and trigger for the OCAP.

AOI after soldering • AOI after soldering monitor the die shift/ rotation and clip shift/ rotation, while detected

continuous 3pcs abnormal the machine will stop. • Ask the machine vendor to develop the SYL control function for each piece and each lot.

TMTT

• 3D5S Vision system monitor the body void, surface scratch and other dimensions, while detected continuous 3pcs abnormal or the yield less than SYL the machine will stop.

• While the Test Yield less than SYL or the Bin Failure Rate higher than SBL, the machine will stop and trigger for the OCAP.

Software Simulation Model

Flo Therm (Thermal Analysis)

Autodesk Inventor Nastran In CAD (Thermal & Cutting Stress Analysis)

Risk Centered Quality System

Validation Flow

APQP Review

Process Capability Study

Package evaluation

Qualification Review

PPAP

Phase Review

Input Output

Process Flow Facility DFMEA Pre-Launch Control Plan Characteristics Matrix MSA Packaging Management Support

Pre Production Run Process Capability (Cpk, Cmk) PPAP PFMEA Production Control Plan

Process

Simulation Softwares

Advanced capability for Package Validation

Pass

Fail

Summary

TSC is READY for AUTOMOTIVE

Penetrating into Automotive since FY2002 85% rectifier products is Automotive grade, TVS (Protection) is 100% Engaged with 1st tier WW Automotive OEM manufacturing companies Complete product portfolio to fulfill Automotive application (ECU,

Powertrain, On/Off board charging, Protection solution) DO-218 Load Dump TVS is ready, and penetrate into EU/US/JPN/CN 1st tier

automotive ECU makers Technology migration – GPP to Planar, Si to Wide band Gap device/SiC

THANK YOU

Taiwan Semiconductor Co., Ltd. Headquarters Address: 11F. No. 25 Sec. 3, Beishin Rd, Shindian District, New Taipei City, Taiwan R.O.C. Telephone: +886-2-8913-1588 E-mail: [email protected] Website: www.taiwansemi.com

mailto:[email protected]

http://www.taiwansemi.com/

Automotive SBU Update · Company Overview • Establishment • Jan-18-FY1979 • Business scale...

Documents

Transcript of Automotive SBU Update · Company Overview • Establishment • Jan-18-FY1979 • Business scale...