Automotive Product Portfolio Update - eefocus
Transcript of Automotive Product Portfolio Update - eefocus
External Use
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Automotive Product Portfolio UpdateEUF-IND-T0590
J U N E . 2 0 1 4
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External Use 1
Increased Microcontroller Content in Electronics Systems
Hybrid/EVPowertrainStop/StartRegenerative Braking
Driver InformationInfotainmentTelematicsTheater Quality Multimedia
Powertrain ControlEngine ControlGasoline ManagementFuel Injection
Safety
Body Control ModuleSeat, Door, and Window ControlRemote ControlHVAC ControlLighting Control/Bending/Leveling
Automotive Networking/Communication
CANLINFlexRayEthernetMOST
Breaking SystemsElectronic Power SteeringActive Suspension
Body Electronics
Chassis
Airbags with Faster Impact DetectionElectronic Stability ProgramCollision Avoidance and Adaptive Cruise Control
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Vehicle Architectural Trends
Today Future
Distributed Electronic Control UnitsOne ECU per mechanical function- Connected by
multiple CAN and LIN interfaces Distributed ComputingMajor computing nodes on a high performance network
organized by “domains” which control “zones”
ECU
ECU
ECU ECU
TorqueManagement
Driver Interface(HMI)
Body, Security Lighting
Engine Transmission Electric Motor GeneratorSeats Mirrors Doors Lighting
Navigation Instruments
Multimedia/Telematics
EntertainmentDriver
Controls
SteeringDampers ADAS
(Radar,Camera)Airbags Tensioners
Ped. Protection BrakesDynamics
Sensors
• Up to 80 individual ECUs• Local and proprietary network structures• Increasing software complexity• Increasing cabling weight• Increasing ... everything
• Increasing data traffic• Ethernet as the backbone• Central Gateway will have an Ethernet Switch• Lower power: Partial/pretended networking• Autosar 4.0
Gateway
VehicleDynamics &
Safety
OBD
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Overview Car Network (w/o Ethernet)
• Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, etc.
• Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc.
• Driving force: cost optimization (cable, plug, number of pins, silicon area, etc.)
Instrument cluster, dash
board
Central ECU, Gateway
Audio/Video player
Video disp.
Speaker
Navigation
Telephone
Engine mgmt
Gearbox
Vehicle dynamics
Wheel nodes
Seats
Air condition
Doors
Airbag
Lighting
Sensors Squibs
Electric motors
Electric motors
Lights
Electric motors
LIN
LIN
LIN
LIN
PSI5, DSI
CAN
MOST
FlexRay
OBD
CAN,
CAN,
CAN, FlexRay
Simplified example
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Overview Car Network (w/ Ethernet)
• Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay, Ethernet
• Different characteristics per network: data rate, latency, communication direction (peer-to-peer, single master, multi-master, etc.), quality of service, determinism, etc.
• Driving force: − cost optimization (cable, plug, number of pins, silicon area, etc.)− Bandwidth to program (flash) the car
Instrument cluster, dash
board
Central ECU, Gateway
Audio/Video player
Engine mgmt
Gearbox
Vehicle dynamics
Wheel nodes
Seats
Air condition
Doors
Airbag
Lighting
CamerasSensors Squibs
Electric motors
Electric motors
Lights
Electric motors
LIN
LIN
LIN
LIN
PSI5, DSI
CAN
FlexRaySimplified example
Ethernet
OBD
CAN, Ethernet
Ethernet
Switch
Video disp.
Speaker
Navigation
Telephone
Switch
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S088-bit MicrocontrollerFamilies
S1216-bit MicrocontrollerFamilies
S12 MagniV16-bit with AnalogASSP/MCUs
Qorivva32-bit Single-Core Microcontr.Families
Qorivva32-bit Dual-Core Microcontr.Families
System Basis Chip (SBC), Network Interconnect
High Side Switches (eXtreme Switch), H-Bridges, Switch Monitoring
Door, Window, Seat, HVAC, Other Body
BCM and Gateway
Motor Control, Lighting, etc.
Body Solutions – Freescale Portfolio Overview
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External Use 7 ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.
Kinetis for Automotive 32-Bit ARM® MCU
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Kinetis 32-Bit ARM® MCU Comes to Automotive
• Kinetis E Auto provides an automotive grade scalable 32-bit portfolio with ARM− 32-bit M0+ and M4 optimized for high performance and low
power− 8K to 2M embedded flash, pin to pin compatible− Peripherals including CAN, LIN(SCI), SPI, IIC…− AEC Q100 certificated, automotive IP on board − Ta = -40˚C to 125˚C− Vdd = 2.7 - 5.5V, 3.3V or 5V convenience
• Start your design easily today!− Complete ARM ecosystem− Massive options of development tools, SW and HW
references− Samples and Evaluation Boards (8K to 128KB) available now!
More info on Kinetis Auto
ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved.
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KEA Block Diagram - KEA128
• Applications:− Automotive general purpose
• Operating Characteristics− Voltage range: 2.7 to 5.5 V− Temperature range (ambient): -40 to
125°C• Key Features:
− ARM Cortex M0+ core− Up to 128K embedded flash− Up to 16K RAM− External OSC and internal ICS for
clock− System functions: LVD, WDG, CRC,
SWD, BITBAND, BME, LP modes− Communication interfaces: SPI, SCI,
IIC, CAN− Multiple timers: FTM, PWM, PIT, PWT,
RTC− 12-bit ADC and ACMP
• Packages:− 16TSSOP, 24QFN, 32LQFP, 64LQFP,
80LQFP− Pin compatible within KEA family
Communications I/O System
6+2+2ch16bit Flex
Timer(2)
2I2C
2SPI
3SCI (LIN)
2KBI
12ch,12bit ADC w/8 FIFO
1PWT
2AnalogComp-arators
Peripheral Bus
SWDDebugger
DebugSystem
PeripheralBridge
Flash >128KB
1xWDT
1-Cycle GPIO
BME(1)
RAM>16KB
PMC2.7-5.5V
POR
Ext Osc (1-20M, 32K)
FLL Clk Mult
Int R/C OSC(~32KHz 2%)Int LP Osc
(1KHz)
LVD NV
IC
1-C
Y M
UL
ARM Cortex M0+ 48MHz Core Freq
(1) Support bit operation in RAM(2) Faster timer running 2 x core clock
1MSCANRTC
Open-Drain IO,
KBI,GPIO
1PIT
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Applications:• Infotainment connection module• GPS/Radio companion MCU• Motorcycle CDI/EFI• Pump/Fan controller• Passive keyless Push Start• BCM/HVAC• Windows/Door/Sun-roof• Seats/Mirror/Wiper Ambient lighting• DC/BLDC Motor control
Reference Solutions:• Fan controller with DC motor control• Pump controller with BLDC motor control• HVAC BLDC blower motor control• Vehicle Ambient lighting• Low power LIN/CAN nodes and gateway• Motor cycle CDI/EFI
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Functional Safety for Automotive & Industrial
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Functional Safety Simplified
• Functional safety is the absence of unreasonable risk due to hazards caused by malfunctioning behavior of electrical/electronic systems
Simplifies the process of system complianceSolutions designed to address the requirements of automotive and industrial functional safety standards
Reduces the time and complexity required to develop safety systems Comply with ISO 26262 and IEC 61508 standards
Supports the most stringent Safety Integrity Levels (SILs)Enabling designers to build with confidence
Zero defect methodologyFrom design to manufacturing to ensure our products meet the stringent demands of safety applications
More info functional Safety
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Functional Safety for Automotive & Industrial ApplicationsQorivva MPC574xP( 2x e200z4 200MHz, 2.5M Flash) 32bit Power Architecture™ Processor
• MPC574xP meets highest functional safety− Built around safety concept, targeting ISO 26262 ASIL D− Safety architecture with cores, DMA in delayed lock step− End-to-end error correction coding (e2eECC), − Duplicated periphery, start-up self-test (LBIST and MBIST)− Voltage regulator redundancy and supply monitoring− ADC self-test, and a fault collection unit (FCCU)− Sample available now!
• Targeted ApplicationsAutomotive IndustrialElectric Power Steering (EPS) Aerospace and Defense
Electronic stability control Non-Automotive Transportation
Vehicle dynamic and chassis control Factory Automation
Safety domain control
Adaptive Cruise Control
Blind spot detection
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MPC574xP 2.5 MB Block Diagram• Core
− Dual up to 200MHz PowerTM ISA e200 zen4 core ( Z420)− 32 bit Reg File, 64 bit BIU with E2E ECC, − 64kB RAM of D-LMEM with MPU for fast context switch + local
data− 8KB 2-way I-cache / 4KB 2-way D-Cache− 1x Scalar FPU (compiler supported) per core− Safety enhanced Cores – VLE only− No Signal processing unit extension + NO MMU− Delayed Lock Step configuration only
• Memory− 2.5 MBytes NVM with ECC (with add. Safety measure for address). − 64kB EEE (Data Flash) available incl. ECC− Up to 384 Kbyte global system SRAM with ECC (Addr + Data)
• I/O− 3 x FlexCAN (64+2x32 message buffers)− 1 x FlexRay (Dual Channel 64 msg. buffers)− 2 x LINFlex (Uart/Lin protocol driver)− 4 x DSPI (4 cs each) − 2x FlexPWM (2x 12ch for 2 independent Motors Controlled)− 3 x eTimer modules (18 channel total)− 4 x SAR ADC – 1MS/s target 5V input capable− 2 x Cross-triggering unit for motor control automatism− 2x SENT
• System− Interprocessor I/F SIPI (– approx 300Mbaud)− Safe DMA − Fault Collection unit, WDG, T-sens, & CRC computing unit− Nexus debug interface – Aurora− Dual-PLL (Peripheral + System Core)− 3.3 V Single supply: internal regulator with external power stage
or External supply− 3.3 V I/Os (ADC 5 V capable)− 144 LQFP / 257 MAPBGA 0.8 mm pitch / Tj = 150°C . Extended
Temperature at 165”C Option (separate P/N)
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PowerSBC10 – MC33907
Voltage Supervisor
Case study – MPC574xP & PowerSBC Functional Safety interactions
Vcca - 3.3 / 5.0V
VI/O - 3.3 / 5.0V
Vcore 2.4MHz1.2 to 3.3V configurableBoost Driver
Vpre440kHz Buck
Battery sense
ConfigurableI/Os (6)
Fail Safe Inputs
SecuredSPI
INT
Analog Multiplexer
Energy Management
State Machine
Fail Safe Output
Vcan - 5.0V
RSTFail Safe
State Machine
CAN Physical Layer
Fail Safe Inputs
MCUChallengerAnalog
& DigitalBIST
2.5 VRef.
Temp.
MPC574xP
Data & Instruction System
Systemintegration
e200z4CPU SPE
Communications
Timed I/O System
Vcore supply• OV, UV detection• Independent checkerVcca
Interrupt• error informed• diagnostic
Battery Mngt• Sense : AMUX• Own FSM supply
Analog Mux• 2.5V reference• Battery Sense• Temperature• I/Os
Fail Safe Inputs• FCCU monitoring• bistable protocol
Fail Safe Outputs• Safety output driver in case of MCU lock• ABIST safety check
Secured SPI• 8-bit check• parity• register read back
Challenger• algorithm of WD refresh• RST counter• LBIST
IndependantFS state Machine
Lock Step Mode• Dual core• self check• fit for ASILD
Reset• config timing• error generator• diagnostics• ABIST checks
Fault Collection and Control Unit
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New
Integration, Low Power, Security &
SafetyFunctional Safety and SecuritySecurity modules protect ECUs against various attack scenarios and Safety modules ensure robust operation per ISO 26262
Low Power ManagementNew low-power modes, analog comparators, and pretended networking support help meet stringent next generation power budgets and ensure greener vehicles
Unprecedented IntegrationSingle-chip solution offering multicore architecture and advanced networking protocols for next generation communication requirements while reducing the quantity of body control/gateway ECUs
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256kSRAM
(with ECC)
256kSRAM
(with ECC)
MPC5748C/G - Development Device and High End Gateway/BCM Solution
• Applications:− High end Gateway and Body Modules
• Key Characteristics:− 2x e200z4 + 1x z2 cores, FPU on z4 cores− 160 MHz max for z4s and 80 MHz on z2 − HSM Security Module option supports both
SHE and EVITA low/medium standard− Media Local Bus supports MOST
communication − 2 x USB 2.0 (1 OTG and 1 Host module)
support interfacing to 3G modem and infotainment domain
− 2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB
− Ethernet switch− CAN module optionally supports CAN FD− SDHC provides standard SDIO interface− Low Power Unit provides reduced CAN, LIN,
SPI, ADC functionality in low power mode− Designed to ISO26262 process for use in
ASIL B − -40 to +125C (ambient)− 3.0V to 5.5V
• Packages:− 176 LQFP, 256 BGA, 324 BGA
Communications I/O System
48ch*ATD10bit
eMIOS96ch
4I2C,
3 SAI
4 DSPI
6SPIs
8CAN
18LINFlex
32ch*ATD12bit
CTU
3AnalogComp-arators
CROSSBAR SWITCHMemory Protection Unit (MPU)
Crossbar Masters
3x NexusClass 3+
JTAG
DebugSystem
PeripheralBridge
HSM
256kSRAM
(with ECC)
Flash controller
SIUL16xPIT+RTI
3xSWT
3xSTM
SSCM
STCU(MBIST/LBIST)
FCCUBAF/BAR
16xSemaphore
DMA MUX
6MFlash
incl EE emulation(with ECC)
VReg
RTC/API
8-40MHz Osc
FMPLL
32KHz Osc
16MHz IRC
128KHz IRC
MLB
SDH
C
Flex
Ray
2x U
SB
2.0
Ethe
rnet
e200z2Core
e200z4Core
e200z4Core
*Mixture of internal and external channelsFeatures available depend on package and device version
1CRC
5747C 5748C 5747G 5748G
Cores 2 2 3 3
Flash 4M 6M 4M 6M
RAM 512k 768k 768k 768k
MLB N N Y Y
USB N N Y Y
Low PowerUnit
Interface
32ch
eD
MA
Ethe
rnet
X
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Performance Analog Portfolio
System PowerManagement
Embedded System Power Management (PF0100/0200)System Basis Chips (SBC): power mgmt + comm + safetyCAN bus and LIN connectivity transceivers
Battery & Energy Management
Battery Monitoring System (BMS): 12V Pb, 14V Li-ion, 24V+Alternator Regulator ChipStop/Start MOSFETsLi-Ion Linear Battery Charger
System Management &
Automation
Engine ManagementBraking: ABS, ESC, WSS controlAirbag: power mgmt + comm + safety, squib driversMillimeter Wave Radar: 77GHz transmit & receiveDSI sensor Interfaces
Power Drivers
High & low voltage H-Bridge driversLow side driversProgrammable solenoid controllersH-Bridge and 3-phase motor pre-driversIntelligent Distributed Controllers (IDC)
Power Analog Switches
18V & 36V/24A eXtreme Switches: High side FET w/ smart controlMulti-Switch Detect Interface (MSDI)Mini/Micro Hi-Speed USB2.0 Switch Interface
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Features• Pin-to-pin compatible with MC33399 & 33661 • Excellent EMI performance thanks to bus active
wave shaping • High EMC immunity and ESD robustness• Very low emissions:
‒ 50dBµV max in low frequency‒ 7dBµV max in high frequency
• Fast slew rate selectable (>100kb)• J2602 / LIN2.1 options part number selectable• Automatic compatibility w 3.3 and 5.0V MCUs• Low sleep current (typical @ 6µA)• Short to ground proof• Single battery supply (no 5.0 Vdd required)• Dedicated dual edge sensitive wake-up input • Control of external voltage regulator through INH• Tx permanent dominant timeout
One Page Overview – MC33662 LIN 2.1 / J2602-2 Physical Layer
Key characteristicsBus TypeData RateIQ Low Power ModeLIN ESD/150pF, 330ΩOperating voltageOperating temp.
LIN 2.1 / J2602-210kb or 20kb / >100kb6 µA ±15kV5.5V - 27V -40°C<Tamb<125°C
8 SOIC-NB
Target MarketAll LIN Nodes
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Part Number 33662 3391xG5 33902 33903 33903S 33903D 33904 33905S 33905DProduct Status QS PPAP PPAP PPAP PPAP PPAP PPAP PPAP PPAP
VMCU (Vdd) - 5.0V110mA
- 5.0V/3.3V100mA+/‐2%
5.0V/3.3V150mA+/‐2%
5.0V/3.3V150mA+/‐2%
5.0V/3.3V150mA+/‐2%
5.0V/3.3V150mA+/‐2%
5.0V/3.3V150mA+/‐2%
VMCU Pw Sharing. - - - ‐ Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA Yes/+300mA
Vaux (ballast) - - - - - - 5.0/3.3V 5.0/3.3V 5.0/3.3V
Vcan - - 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA 5V/100mA
CAN HS P/L - - 1 1 1 1 1 1 1
LIN2.1 / J2602 P/L 1 1 - - 1 2 - 1 2
I/Os 1 2 1 1 3 3 4 4 4
LowQ Voff/Von 6µA 33µA 15µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA 15/25 µA
Battery sense - Yes - - Yes Yes Yes Yes Yes
AMUX - Yes - - Yes Yes Yes Yes Yes
Fail Safe - - - - Yes Yes Yes Yes Yes
Watch Dog - Yes - Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv Yes / Adv
SPI - 8b pseudoSPI 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe 16b / Safe
Package SO8 LQFP32 SO14 SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC32eP SOIC54eP
Attach strategyMCU Supply
- SO8S12XS
Low endSO8
SO8S12XSS12XE
S12XEMPC5604BMPC5604PMPC5634M
S12XEMPC5604BMPC5604PMPC5634M
S12XEMPC5604BMPC5604PMPC5634M
S12XEMPC5604BMPC5604PMPC5634M
S12XEMPC5604BMPC5604PMPC5634M
Freescale SBC Solutions – Features Table Overview
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Motor Control Integrated Solutions
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Introduction to MagniV S12ZVMBLDC, PMSM & DC Motor Control
• Innovative single chip MCU with HV Analog − LL18UHV Technology: Low leakage 180nm + 40V UHV− NVM, EEPROM, S12Z core, SCI/SPI, A/D, Timers…− Low-High Side, Relay/MOSFET Drivers, Voltage Reg,
LIN/CANPhy
• Accelerate your design, save on cost− Reduced BOM− Improved Quality− Lower power consumption− Reduced PCB Size
• Build a demo in record time− No need to be a motor control expert− S12ZVM provides unique combination of hardware
integration and a complete tools and software ecosystem.− S12ZVM enables extremely compact and sophisticated 12V
motor control solutions with Ta up to 150˚C
S12ZVM Complete Enablement
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Target Application:
Benefits:
Enablement:
HVAC BlowerWipers
AC Compressor
FuelWater
Oil Pump
Sliding DoorsPowered Liftgate
CompactSingle chip
saves PCB space
PerformanceLower power/ noise
High temp (Ta 150˚C)Sensorless
Scalable32 to 128K Flash
CAN & LINHW & SW re-use
HardwareEval Board
MC Development Kit Mini Eval Board
SoftwareDevelopmentProduction
Compiler, Debugger
LibrariesOptimized Math &
Motor Control algorithms
Motor Control with MagniV S12ZVMIntegrated solution for BLDC, PMSM & DC Motor Control
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VREG(8pin)
LIN phy(8pin)
MCUor
DSC(48pin)
Gate Driver(48pin)
Op-amps
Discrete Solution
20+3+
2+
S12ZVM Solution:• ~ 50 fewer solder joints• - 4 to 6 cm2 PCB space
S12ZVM Concept : Replace up to 5 IC
4cm~1 ½ in.
64pin
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Key Features:• S12Z CPU @ 50MHz bus speed
• 6ch Gate Drive Unit (GDU) with 50-150nC total Gate Charge drive capability, incl charge pump for High-Side, Bootstrap diodes for charging external bootstrap capacitors
• Embedded VREG with switchable 5V/20mA sensor supply
• LIN PHY, LIN2.1 / 2.2 / J2602 compliant
• Dual 12bit list-based ADC (LADC), synch with PWM through Programmable Trigger Unit (PTU)
• 2x Op-amp for current sensing
High-VoltageComponents
DigitalComponents
5V AnalogueComponents
MCU Coreand Memories
Options:• Package: 64-LQFP-EP, 48 LQFP-EP• Memory: 16kB / 32kB / 64kB / 128kB Flash• Option -L with LIN phy• Option -C with 2nd Vreg for external CAN phy• Temperature: V / M / W (up to 150°C Ta per
AEC-Q100 Grade 0)
Target applications:• Sensorless BLDC or PMSM motor control
• Bidirectional DC motors (H-Bridge)
• Various pumps (oil, fuel, water, vacuum)
• Cooling fan and HVAC blower
SPI
SCI 0SCI 1
MSCAN
512B EEPROM
(ECC)
16-128 KB Flash (ECC)
S12Z 50MHz Bus
2-8kB RAM(ECC)
PLLRCosc.+/-1.3%
PierceOsc.
VsupsenseVreg
1#EVdd
12-Bit LADC
TempSense
12-Bit LADC
LIN/HV -PHY
Current Sense(2 x Op-Amp)
GDU 6chMOS-FET-Predriver
Charge Pump
2chPTU
6ch PMF(PWM)
TIM 16b4ch
GPIO
BDMBDC KWU Win
Wdog
Bootstrap Diodes
Product Summary - S12ZVM FamilyBLDC/PMSM motor control
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S12ZVL - familyIntegrated General Purpose LIN Node - Summary
Key Features:• S12Z-core (up to 32MHz bus frequency) compatible within
MagniV• On chip 12V Vreg with Supply-capability:
‒ 70mA total (170mA with ext. Ballast)
• LIN-PHY, LIN2.x / J2602 compliant• On chip RC Oscillator; trimmed to +/- 1,3% tolerance over
full temperature range• Robust 12V inputs Vsup-sense & HVI (with ADC)• 1x E-Vdd (20mA source capability)• 1-3x N-GPIO (25 mA sink capability)• 5x5mm footprint 32QFN-package optional• ASIL-A compliancy
KNOXS12ZVL S12ZVLS
Application orientation generic small sensorsPackage 48LQFP 32LQFP 32QFNFlash Memory (ECC) 32/16/8 kB 32/16/8 kB 32/16 kBNGPIO (GPIO with 25mA NMOS) 3 1 310‐Bit ADC 10ch 6ch 6ch
SPI
TIM 16b6+2ch 128B
EEPROM(ECC)
8-32KB Flash (ECC)
S12Z 32MHz BusIIC
LIN-PHY 10-Bit ADC
TempSense
1kB RAM(ECC)
PLLRCosc.+/-1.3%
PierceOsc.
HV Input1#E-Vdd
1-3#NGPIO
SCI 1 SCI 0
GPIO
Vreg
70, or up to 170mAwith ext. Ballast
PWM 8ch 8bor 4ch 16b
Vsupsense
BDMBDC KWU Win
Wdog
High-VoltageComponents
DigitalComponents
5V AnalogueComponents
MCU Coreand Memories
Target Applications:• Any kind of automotive LIN-node• LIN-sensors / actuators• LIN switchpanel / userinterface• LIN RGB LED lighting• Ultrasonic sensors• …
Family options:• Flexible Memory Options: 8kB to 32kB Flash version
• 32-LQFP , 48-LQFP or 32QFN-Packaging
• C / V / M Temperature options (up to 125°C Ta)
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Target Applications
LIN-Sensors LIN-switchpanels LIN-Actuator
Product Function• Hooking up sensors into
automotive LIN-Network (with signal pre-conditioning
Market Requirements• LIN-PHY, 12V-Vreg, MCU• Small formfactor (QFN)• ADC, SPI
Product Function• Reading multiple switch-
positions and feeding into LIN-network
Market Requirements• LIN-PHY, 12V-Vreg, MCU• Multiple GPIOs• ADC
Product Function• Converting LIN-
command into an activity (eg driving LEDs)
Market Requirements• LIN-PHY, 12V-Vreg, MCU• Drivers (3x25mA drive
strength in case of RGB-LED)
• ADC
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High Temperature and Automotive Qualification
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AEC Q100
All Freescale Automotive MCU are certified AEC Q100
125˚C
All Freescale Automotive MCU
support up to 125˚C ambient temperature
150˚C
Extended temperature up to 150˚C ambient on
several product lines (S08SG, S12G, S12ZV, Qorivva)
Low PPM
Benefit of one of the lowest PPM level in
the industry
Largest portfolio with automotive qualification gradeHigh temperature for space constraint applications•Fuel, oil, water pumps, sensor and actuators…
Automotive Grade for Challenging Environment
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Software and Enablement
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Prototype in 24 Hours: Typical Development Flow
choose your hardware
Install Development Suite
1
2
3 Prototype with Demo Code
• Demo boards • Reference solutions• USB Starter Kits
• Low-level drivers: CAN, LIN, Flash• Demo code: CAN wakeup, LIN comms• Peripheral enhancement routines
• Initialisation / autocoding• Compiler• Debug
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Body Chassis/Safety
Software Products Overview by Segment
Autosar 3.x
Powertrain
MCAL
OS
MCAL
OS
MCAL
OS
560xB/C/D, 564xB/C, 5668G
Non-Autosar Ethernet/AVB
Camera Appl SW
Instruction Set Self Test (Power Arch e200 cores)
Autosar 4.0
560xP, 5604E, 564xL, 567xK
560xP, 564xL, 567xK 563xM, 564xA, 567xF
563xM, 564xA, 567xF560xB/C/D, 564xB/C, 5668G
MCAL
OS
MCAL
OS
MCAL
OS
560xB/C/D, 564xB/C574xB/C/G
560xP, 564xL
560xP, 564xL, 567xK 564xA, 5676R
563xM, 564xA, 567xF
5604E
5604E
Initialization
Motor Ctrl TB 564xL, 567xK
RAPPID for 560xP, 564xL, 567xK
e200 Power Arch MCUs
560xB/C/D, 564xB/C574xB/C/G
Math & MC LibMath & MC Lib
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Development Tools (expl. MPC5646B/C) Part number Price Description
XPC56xxMB2 $375 generic motherboard with connectors for Mini-Modules
XDC564B256BSB3M $120 Mini Module with 256MAPBGA socketed siliconXDC564B208QSB3M $120 Mini Module with 208LQFP socketed siliconXDC564B176QSB3M $120 Mini Module with 176LQFP socketed silicon
XKT564B256BSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.
XKT564B208QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.
XKT564B176QSB3M $497 Motherboard + 256MAPBGA mini module + CW CD + wiggler + debugger + doc. Free permanent Compiler/debugger license limited to 128KB code.
CodeWarrior Compiler Free Free permanent license limited to 128KB code.
Rappid pin wizzard Free I/O allocation tool with graphical interfaces, and outputs documentation, saves engineers a few hours.
U-MULTILINK $119 USB interface to PC, Universal Multilink Development Interface
USB Multilink (P&E)
U-MULTILINK-FX $399 USB interface to PC, Universal Multilink FX High-Speed Development Interface
USB Multilink (P&E)
CYCLONE_MAX $899 Programming tool, see options and add-ons on P&E website (eg automatisation for series prod, Ethernet extension…)
CYCLONE_MAX_PE $899 powerful stand-alone in-circuit programmer and debugger for Freescale’s high-end architectures
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External Use 35
Making the World a Smarter Place.
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