AUT-F0615 Automotive Instrument Cluster Solutions - From ... · Automotive Instrument Cluster...

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.

Automotive Instrument Cluster Solutions -From low-line to premium-line

Sep, 2010

FTF-AUT-F0615

Benjamin Xuan 宣晓鸣宣晓鸣宣晓鸣宣晓鸣 [email protected] Automotive Marketing

TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc. 2

Agenda

►Market Trends

►Freescale Roadmap

►Low-line Solutions

►Mid-line Solutions

►High-line Solutions

►Premium-line Solutions

►Instrument Cluster Summary

TMFreescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, CoreNet, the Energy Efficient Solutions logo, Flexis, MXC, Platform in a Package, Processor Expert, QorIQ, QUICC Engine, SMARTMOS, TurboLinkand VortiQa are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © 2010 Freescale Semiconductor, Inc.

Automotive Electronic Content Growth

Sources: Bosch, PSA, Freescale Strategy

Ele

ctr

onic

cost as %

of to

tal car

cost

1950 1960 1970 1980 1990 2000 2005 20101950 1960 1970 1980 1990 2000 2005 2030?

35%

30%

22%

15%

10%

5%2.5%

Electronic

Fuel Injection

Airbag

ABS / ESP

Body Electronics

Multiplexing

Advanced Driver Assistance

Active-Passive Safety

Green Powertrain

Radar / Vision

Telematics

Infotainment

►Electronics are imperative to balancing increasing individual transportation and

reducing fuel

cost, emissions

and casualties

►Higher levels of integrated system design and simulation

►More industry standards and cooperation

50%

?The Road Ahead

“80% percent of innovation is electronic”

“Impossible to comply with regulation

without electronic systems”

-Automotive OEM

3


Technology That Changes the World

Anti-lock

Braking

Camera-based

Collision

Avoidance

Infotainment Control

Transmission Control

Radar

Instrument Cluster

Airbag Control

FlexRay

™

Stability

System

Intelligent Distributed

Control

Engine

Control

Air

Conditioning

Tire Pressure

Monitor

No.2 in total auto ICs

No.1 in auto microcontrollers

No.2 in MEMS sensors


Instrument Clusters – the way it is nowadays in China…


Consumers are surrounded by colour displays

Mobile InternetDevice

Tablets

EnergyGatewaysMedia Phones

Photo Frames

Advanced SmartphonesSmartbooks

Infotainment/Telematics

Connected DevicesDisplay Centric

Portable Media Players

Touch Screen Printers

eReaders

Factory HMI

Auto.

Mobile.

Home.

Industrial.

Home.


Information Explosion Driving Colour Display Adoption

Display and management of hybrid/electric vehicle

battery charging

Traffic sign recognition

Eco-driving

Location-based Services

Advanced speech recognition for

destination entry and music search

“Skinnable” user interface

Diagnostics and remote support

Night vision camera

Panoramic parking assist

camera

Map data as sensor to

powertrain

Applications downloaded from

“Apps Store”

Connectivity to portable device

and WAN

Manage connection to

smart meter for battery charging

User interface for car system control

Digital radio and traffic information


Information Explosion Driving Colour Display Adoption


Examples of Graphics in the Car

9

Citroen C4

Monochrome segment LCD, no gauges

Mercedes E class

Gauges + low-res dot matrix

2009 Range Rover

1280x480 Color LCD, no real gauges

High-resolution color LCD plus gauges

2009 Ford Mondeo

2009 Renault Scenic: no gauges

Opel Insignia with Traffic Sign Recognition


Graphics in Hybrid Electric Vehicles

10

2010 Ford Fusion Hybrid

Gauge + 2 configurable 800x480 displays

VW Toureg Hybrid 2009

Chevrolet Volt reconfigurable cluster

Infotainment screen used to show battery charging

Lexus LS600hdrv2009 Honda Insight

Many color displays for high-tech effect; green leaf to show eco-driving style


► In-vehicle color displays to increase from 20 MU/2009 to 52 MU/2015

• Touch screen volume goes from 6 MU in 2009 to 20 MU in 2015

► OEM navigation systems attach rate increases to at least 30% by 2015

• 800x480 color display will be fitted as standard on mid-level cars

► High-end Infotainment systems moving to higher resolutions: 920x480 or 1280x768, with split screen function or dual-view

► Fully reconfigurable clusters will filter down to high-level cars and even some mid-level cars

► Mid-level car clusters moving to gauges + high-resolution colordisplay

11

Automotive Graphics and Display Trends


MPC5125E300 @ 400MHz

Up to XGA displayExternal Flash & DRAM i/f

324 BGA

800 MIPs

DIS MCU Roadmap

Applic

ation P

erf

orm

ance / Inte

gra

tion

64K

128K

S12HZStepper Motor,

LCD drive

25MHz80,112 pin

(ROM 32K-256K

512K

256K

S12XHZStepper Motor,LCD drive

40MHz XGATE

112,144 pin

384K

256K

Stepper Motor,

LCD drive

32MHz

100,64 pin

NOW 2010 2011

MPC560xS512KBZ0h CPU @ 64MHz

DCU on 1MB & 768K

Up to 160KB GRAM

Stepper Motor, LCD drive

144 / 176 pin

1MB

256KB

MPC5645S

2MBZ4d CPU @ 120MHz

DCU (TFT Display Driver)OpenVG Graphic

1MB of GRAM

Stepper Motor Drive

176 / 208 QFP, 324 BGA

MPC5121eE300 @ 400MHz

OpenGL ES1.1 Accelerator

Up to XGA displayExternal Flash & DRAM i/f

516 BGA

800 MIPs

i.MX35GARM1136JF-S CPU @ 400MHz

Open VG 1.1 2D Graphics Accelerator

Ip to SVGA display

External Flash & DRAM i/f

400 BGA

400 MHz

i.MX511200 MIPS

Coretex A8 600MHzOpenVG1.1 & OpenGL2.0 Accel

Up to WXGA display

External Flash & DRAM i/f

530 BGA

S12HY

32K

64K

48K

128K

256KStepper Motor,

LCD drive

32MHz

112, 144 pin

Sin

gle

chip

In

str

um

ent

clu

ste

r M

CU

’sM

ultim

ed

ia M

PU

’s

32K

S08LG8x37 LCD

20MHz48/64/80 Pins16K

Available

Planned

Proposed

In Design

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not

available from Freescale for import or sale in the United States prior to September 2010: i.MX family

TM


Low-line Instrument Cluster Solutions

13


Low-line Cluster

Renault Twingo

Renault EspaceCitroen C4

Citroen C6

No Gauges, LCD only


S08LG Family Overview

►Family overview►Targets low end cluster and general

purpose LCD applications for autos, motorcycles, scooters, marine, etc.

►Integrated LCD, supporting both x8 and x4 mode up to 8 x 37 or 4 x 41 segments

►Dual bank flash for EEPROM emulation

►Multiple time bases for motor control

►Internal Clock Source

• 2% accuracy across temp

►Strong EMC performance in tough environment

►-40◦C to 105◦C and 2.7–5.5V operation available

Device Package Flash LCD ADC GPIO

LG32 80-LQFP Dual 16+16K 8x37, 4x41 16-ch., 12-bit 69

64-LQFP Dual 16+16K 8x29. 4x33 12-ch., 12-bit 53

48-LQFP Dual 16+16K 8x21, 4x25 9-ch., 12-bit 53

LG16 64-LQFP Dual 16+2K 8x29. 4x33 12-ch., 12-bit 39

48-LQFP Dual 16+2K 8x21, 4x25 9-ch., 12-bit 39

Family Differences

GPIO

80 LQFP64 LQFP48 LQFP

ICE BDM

ICS

2 KB RAM

2 x 16 KB Dual Flash

S08 CPU 20 MHz Bus

ATD 12b, 16-ch.

6-ch. + 2-ch., 16-bit Timer

1-ch., 8-bit MTIM

1xSPI

1xI2C

2xSCI

37x8 / 41X4 LCD

Note: block diagram represents the LG32

RTC

WDG


S08LG – Low-line Cluster Example

Basic Line – Up to 2 Gauges, Segment Display

SegmentDisplay

EEPROMFreescale 9S08LG Offers:•8 bit•20 MHz•Up to 32K flash•Up to 2K RAM•Dual-bank flash for EE emuluation•LCD control with up to 296 sgmt•Gauge driver capability based on timer modules via software•SCI/SPI/IIC I/F

Typical Application Needs:•8 bit•8 – 16 MHz•8K - 32K ROM or flash•512B – 2K RAM•128 – 512 Byte EEPROM•LCD control, 70 – 160 segments•0 – 2 gauge drivers•SCI/SPI/IIC I/F

LCD

DriverGeneric8-bit MCU

Software Driver based

on Timer Modules

Stepper Motor

Buzzer

Indication Lights

9S08LG

TM


Middle-line Instrument Cluster Solutions

17


Middle-end Cluster


FAW Sales Volume by Car Model

19,20929,91923,580总计总计总计总计

6.38-7.68万元2340威姿

7.68-7.68万元3013490威乐

5.38-6.68万元1,6152,7654,678威志

4.39-5.19万元9,24714,75214,023夏利

天津一汽

34.98-68.88万元31198红旗盛世

12.98-18.88万元2,7824,5874,831奔腾B70

9.88-12.58万元5,2317,4440奔腾B50

一汽轿车

参考价格参考价格参考价格参考价格2010/72010/62010/5车型车型车型车型


SCI

GPIO 64 LQFP, 100 QFP

S12HY– Single Chip Cluster Solution

Family Overview

►S12 entry level cluster solution with integrated LCD

driver, gauge driver with SSD, MSCAN and D-Flash

for EEPROM emulation

►On-chip background debug mode and debugger

►CPMU (Clock, Reset & Power Management Unit)

• IPLL

• On chip 1MHz RC oscillator:

2% accuracy from -40~125C, 1.5% from -40~85C

• External oscillator (4-16MHz Pierce with loop control)

►180nm SGF technology with built-in ECC

4K D-Flash

INT DBG

CPMU

64KB Flash ECC

4KB RAM

S12CPU 32MHz

ATD 10b 8ch

Timer 16b 8ch+8ch

PWM 8ch

SPI

MSCAN

IIC

COP

LVI

LCD Driver 4x40

4 ch Gauge Driver

22-key Wake-Up

20x4

40x4

20x4

40x4

20x4

40x4

LCD

3

4

3

4

3

4

Stepper 2)

64 LQFP

100 LQFP

64 LQFP

100 LQFP

64 LQFP

100 LQFP

Package

8ch 10bit2 KB32 KB

6ch 10bit4 KB48 KB

6ch 10bit4 KB64 KB

2 KB

4 KB

4 KB

RAM

32 KB

48 KB

64 KB

Flash

6ch 10bit

8ch 10bit

8ch 10bit

ADC

S12HY48

S12HA48

S12HY64

S12HA64

S12HY32

S12HA32

Device 1)

Family Members

NOTES:1) 9S12HY family has MsCAN. 9S12HA family has none.

2) The third stepper motor driver in 64 pin package has a

restricted output current.


9S12XHY256 – Single-chip Low-line Cluster MCU

► Positioning

• A cost competitive solution to complement the upcoming 9S12HY64/32 devices and address emerging market needs for low-end clusters.

► Product Overview

• 0.18 um Technology, most IP are re-used from previous generations

• Enhanced LCD driver and timer module compared with S12HY256

• 100 LQFP and 112 LQFP

• Full temperature range: -40~125°C

► Tentative Schedule

• Alpha Sample: Now

• Qualification: Q1’11

• Mass Production:

Q2’11

21

2 LIN/SCI

1 SPI

2 MSCAN ATD 10b 12 ch.

Timer 16b2x8 ch. 16b

PWM 8b 8 ch.

1 I2C

LCD 40x4

4 Gaugeswith SSD

GPIO

COP

25 KWP

100 LQFP112 LQFP

INT DBG

CRG

12 KB RAM

S12X CPU 32 MHz

8 KB D-Flash

256 KB RAM

Device Package Stepper LCD Flash CAN SCI RAM ADC

9S12XHY256112 LQFP 4 w/ SSD 40x4 256 KB 2 2 12 KB 12-ch., 10-bit

100 LQFP 4 w/ SSD 38x4 256 KB 2 2 12 KB 8-ch., 10-bit

9S12XHY128112 LQFP 4 w/ SSD 40x4 128 KB 2 2 8 KB 12-ch., 10-bit

100 LQFP 4 w/ SSD 38x4 128 KB 1 1 8 KB 8-ch., 10-bit


S12HY – Middle-line Cluster Example

Value Line – Up to 4 Gauges, Segment Display

SegmentDisplay

CAN

EEPROM

Freescale S12HY Offers:16 bit32 MHzUp to 64K FLASHUp to 4K RAM4K D-FlashLCD Control with up to 160 sgmtUp to 4 integrated gauge driversIntegrated CAN, SCI I/F

Typical Application Needs:8 or 16 bit8 – 24 MHz16K - 64K ROM or FLASH1 – 4K RAM128 – 512 Byte EEPROMLCD control, 70 – 160 segments2 – 4 gauge driversCAN , SCI I/F

LCD

Driver

CAN Transceiver Generic8-16 bit MCU

with CAN Controller

Stepper Motor Driver

Stepper Motor

Buzzer

Indication Lights

S12HY


High-line Instrument Cluster Solutions


High-line Cluster

Audi A8

Peugot 807TFT transmissiv, 5 inch ,320x240 dots


MPC560xS►Family Overview

►Target Applications• Automotive: instrument cluster and central display

applications

• Industrial: Display control, robotics

►Display Control Unit• Enables direct drive of WVGA

• Works independently of CPU to fetch, process, and display graphics data directly from multiple sources

� Not just from Graphics RAM

� Don’t need huge (expensive) graphics RAM

• Can move graphics data from external serial flash via QuadSPI directly into RAM for DCU too.

►SSD is key for cluster • Needles calibrate themselves automatically

►Low Power Design• Designed for dynamic power management of

core and peripherals

• Software-controlled clock gating of peripherals

• Multiple power domains to minimize leakage in low power modes

64x6

64x6

40x4

LCD

No

No

Display Control Unit (DCU) with

Parallel Data Interface (PDI)

TFT Drive

No

No

QuadSPI

Mem Exp

24K SRAM

48K SRAM

48K SRAM + 160K

Graphics RAM

SRAM

256 KB

512 KB

1 MB

Flash

144, 100 24KB1xFexCAN 2xSCI

3xDSPI 2xIIC

MPC5602S

176, 144Nexus2xFexCAN 2xSCI

3xDSPI 4xIIC

MPC5606S

144, 100 28KB2xFexCAN 2xSCI

2xDSPI 2xIIC

MPC5604S

Serial PinsDebugDevice

CROSSBAR SWITCH

48KBSRAM

Power

Architecture

e200z0h core

VReg

Communications I/O System

Crossbar Slaves

Interrupt

Controller

Crossbar Masters

Nexus

JTAG

Debug

1 MBFlash

BootAssist

Module (BAM)

Oscillator

Memory Protection Unit (MPU)

System Integration

I/OBridge

2 FlexCAN

4LINFlex

36 ChADC10bit

eMIOS24ch

2I2C

3 SPI

RTC

4 x 16EEE

Family Differences Note: block diagram represents the MPC5606S

Display

Control Unit

FMPLL16chDMA

RGB / Control

PDI

PowerMgmt

160KGraphics

SRAM

QuadSPISerial FlashController

6 GaugeDrivers

Stall Detect40x4LCD

Key features circled in blue


Traditional Double Frame-Buffer Graphics

26

LCD Panel

400 x 24018 bits per pixel

Display Controller

Fast

Graphics RAM

Active Frame Buffer400x240x32 bits =375KBytes

“Build” Frame Buffer400x240x32 bits =375KBytes

Temporary storage of images, scratchpad, etc. @ 32bpp: > 400KBytes

> 1 MB RAM

requirement

CPU or

2D GPU

DMA

Controller

Large off-chip flash for image

database


Fragmented Frame-Buffer with DCU on MPC5606S

27

LCD Panel

400 x 24018 bits per pixel

DCU

Fast

Graphics RAM

Temporary storage of partial images @ minimum bpp: up to 160KBytes

Only 160 KB

on-chip RAM

CPU

DMA

Controller

Low-cost Quad-SPI flash for

image database

1 MB On-chip Flash

Up to 16 partial images fetched, converted

to correct format, and blended on-the-fly


DCU Layers and Planes

►Layer priority is fixed

► Layers arbitrate for 4 planes on per pixel basis

► The active layer that has the highest priority loads in the foreground

plane 1, the next loads in foreground plane 2, etc….

► If no layer qualifies for the BG plane the BG color is loaded in the

BG plane

28


Animation Library: Functional Overview

►Position Animation

►Transparency Animation

►Color Animation

►Scrolling Animation

►Scaling Animations

29


MPC5606S – High-line Cluster Example

30

MPC5606S

6 Stepper Motor Drivers with patented stall detection

40x4LCD seg driver

LEDs

SerialFlash

QuadSPI

DCU

PDI

EEPROM

1MB FLASH

GP I/O

48kbRAM

PWMssound

2x CAN

2x LIN

160kbRAM

VIDEOINPUT

SEE “MPC5606S” DEMO ON

• QFP package enables 2-layer PCB

• On-chip 1.2V regulator for internal supply


MPC560xS Reference Design: Cluster

� Power Architecture™ MCU (MPC5606S)

in Next-generation Dashboard

� Driving TFT displays up to WVGA

resolution with digital camera input for

cost-effective solution

� Stepper motor drivers up to six gauges

with patent SSD function

Freescale can offer:

• Demo board & Reference design with schematics

• Modules application notes

• Sample codes


MPC560xS Reference Design: HVAC

32

TM


Premium-line Reconfigurable Cluster Solutions

i.MX family application processors

33


What does it take to make a fully reconfigurable cluster ?

High-quality needle animation

with no strobe effect

Clear & scalable fonts even with

dynamic text

High-performance 3D Rendering

Video overlay & resizing for

Navigation map display and rear-

view camera

►Fast start-up from cold boot

►Up to 1600x600 display resolution

►Automotive bus interfaces

►Good HMI development tools

►Up to 100C ambient temperature for short periods


i.MX5x Reconfigurable Instrument Cluster Solution

35

Market Requirement i.MX5x Solution

High-performance 3-D rendering ►AMD Z430 GPU @ 166M Hz (Up to 27 Mtri/s and 166 Mpixel/s)

►Up to 1.6 Gbyte/s peak external memory bandwidth

Video overlay & resizing for navigation map display and rear-view camera

►2 camera ports

►Video resize/rotation/conversion & blending in hardware

High-quality needle animation with no strobe effect ►2D GPU can be dedicated to needle animation at 60 fps

►3D GPU is decoupled – only needs to run at 20-30 fps

Clear & scalable fonts even with dynamic text ►Native rendering of true-type fonts with AMDZ160 OpenVG GPU

Fast start-up from cold boot ►Autonomous display of splash-screen or rear-view camera – can be initialized early in boot sequence

Support large display resolution ►Up to 1280 x 720, supports 2 displays

Good HMI development tools ►Open API support: OpenGL|ES1.1, OpenGL|ES2.0, OpenVG1.1

►Rich ecosystem: TAT, EB, QT, Altia, etc.

Up to 100°C ambient temperature for short periods ►Tjmax = 125C

►CPU freq. can be reduced to allow higher ambient temperature


i.MX514/516 Applications Processor for Automotive

36

i.MX516

CPU Platform

PeripheralsSystemControl

Cortex A8

Timers

Security

Sahara v4

Trust Zone

RTIC

SCC v2

SRTC

Multimedia

Imaging Processing Unit

Secure JTAG

Power Mgmt

PLL

Clock Reset

Watch Dog

Timers

PWMs

Ext Memory I/FmDDR 200 MHzDDR2 200 MHz

Fast IrDA

High Speed SDIO

High Speed CSPI

UARTs

High Speed I2C

SSI/I2S

1-Wire

ATA-6

USB OTG HS+PHY

USB HS

SPDIF Tx

GPIOs

Keypad

Ethernet MAC

HW HD Video Codecs

Image Signal Processor

Resizing & Blending

Inversion / Rotation

Image Enhancement

Camera

32KBi-cache

32KBd-cache

256KBL2-cache

Vector FloatingPoint Unit

Open VG 1.1 Engine

OpenGL ES 2.0 Engine

►Specifications:• CPU: Cortex A8, 600 MHz

• Process: 65 nm, LP/GP• Core Voltage/ Temp: 0.7-1.1V, -40/85°C• Package: 19x19 0.8 mm

►Key i.MX51 Features and Advantages• High performance CPU: Cortex A8

� Advanced speech and navigation

• Low power multimedia� Audio playback <12 mW

� HD720 playback <155 mW

• Delivers rich graphics and UI in hardware� OpenGL ES 2.0 3-D accelerator (AMD Z430)

� OpenVG 1.1 graphics accelerator (AMD Z160)

� Neon Vector floating point co-processor

� Dual display up to WXGA

• Drives high resolution video in hardware (i.MX516)� Multi-format D1 video encode

� Multi-format HD720 video decode

• Mixed signal integration - HD720 TV out (i.MX516) and high speed USB with embedded Phy

►Availability:• Sample: Now • Production: Now


i.MX514/516 – Premium-line Cluster Example

37

Analog / Digital Inputs

COM ICs

Power Management

IC

MC33902MC33662

Speed Sensor

Fuel Level Sensor

Oil Level / Coolant

Battery

Ignition Voltage

LIN

Ethernet

MOST

System Bus Connections

CAN

Sig

na

l Co

nd

ition

ing

MC

33972

S08S12

MPC5604S

SystemMicro

i.MX514

LEDs

Colour TFT LCD(s)

Main Micro

AudioAmp.

Camera Sensor(s)

Head Up Display

External Memories

Camera input

CAN

PWM

PWMSPI/I2C

LED Backlight DriverMC33996


Freescale Multimedia Markets

Automotive

Smart Mobile Devices

eReaders

► Historic leadership in Telematics

►Ramping in radio and infotainment

►Initial designs in advanced clusters

► Dominant market share in emerging

eReader market

Aligned with market leaders

► Pioneer in portable media players

►Thought leader for smartbooks

►Focused investment in tablets

Embedded Multimedia

► Broad traction in the embedded market►Connected display based devices in

consumer and industrial markets


Ford SYNC

► Version 1 – 12 Ford Models in 2008

• Focus on brought in devices

� Bluetooth Hands-free Phone

� SMS message TTS

� iPod, Zune, MTP player integration

� A2DP/AVRCP media phone integration

� USB storage media playback

► Version 2 – Almost all 2010 Ford, Mercury, and Lincoln models

• Introduces safety, security and customer relationship

� Emergency Assistance

� Vehicle Health

� Traffic and Other Information

� Turn-by-Turn Navigation

TM


Instrument Cluster Summary

40


Instrument Cluster Summary

►Automotive Instrument Cluster market is changing fast:

• Increasing importance of graphics

• Becoming a showcase for the car, not just an information display

►Challenge is to deliver exciting, functional and safe designs while

keeping system costs at acceptable levels

►Freescale has solutions from low-line to premium-line

41


Western Hemisphere vs. BRIC

Criteria Unit USA EU27 JapanTotal or

Avg.Brazil Russia India China

Total or Avg.

Ratio

Population Mil hab 307 491 127 925 198 140 1166 1338 2842 3.07

GDP per capita

US$ $47,000 $33,400 $34,200 $38,024 $10,100 $15,800 $2,800 $6,000 $5456 0.14

Land area Mil sq km 9.1 4.3 0.374 13.774 8.4 16.9 2.9 9.3 37.5 2.72

Total road ‘000s of km 6465 5454 1196 13115 1751 933 3316 1930 7930 0.60

Car park Mio of cars 240 250 61 551 24 38 13 37 111 0.20

Car density# cars per 1000 hab.

782 509 480 596 123 268 11 27 39 0.07

Car density# cars per km of road

37 46 51 42 14 40 4 19 14 0.33

Source: US Central Intelligence Agency – CIA, world fact book

Developed Infrastructure for Transportation Management will be Critical


Backup


Freescale Automotive–Today’s Innovation

Chevy Camaro

MCF5251

PDIM

Note: Representative only. All of these products have multiple Freescale devices in many applications.

Mercedes S Class

MPC5200

Night Vision

Lincoln MKS

S12

Body Control

Chevy Malibu

MCP5200

OnStar

Cadillac CTS

MPC5566

Direct Injection

Aston Martin DB9

Sensors

Airbag

BMW X5

MPC5567 & S12X

Dynamic Drive

Toyota Prius

DBUS

Master/Slave Airbag

Dayun

S12

Fuel Injection

Peugeot 407

MPC561

ECU

Honda StepwagonPictus MCU & Ocotillo

Sensor Airbag

Ford Fiesta

S12XHZ

Cluster

Chery A516

S12

HVAC, Powertrain

Opel Corsa

Sensors

Airbag

Ford Fusion

i.MX31

Sync

Mazda Alexa (3)

SPC5565

Start/Stop System

Ducati 696

S12 & Pressure Sensor

ECU

BYD F3

MCU

Body, Cluster

Ford F150

SPQ1035

eSwitch Body

BMW 7-Series

MPC5567

Body Gateway


C&I vs Auto Qualified Parts

► In general, FSL offers two types of qual tiers for MCUs – Auto qualification and C&I qualification.

► Products that follow the Auto or C&I qual tier vary by both the qualification

process and the production test flow that they receive.

► Auto qualified parts follow a much more demanding qualification process –AEC (Automotive Electronics Council) Q100 Grade 1 qual flow. The AEC Q100 qual flow is an Auto standard qualification process that all of the major OEMs and Tier 1 suppliers require for nearly all of their applications.

► The results of an AEC Q100 qualification are documented in a product’s PPAP (Production Part Approval Process).

► PPAPs only exist for Auto qualified products.


Qualification Stress Tests for C&I and Auto Tiers

Please note the extended stress teststhat are done on theAuto tier product (circled in Green)compared to the Consumer (Commercial)Tier (Circled in Orange).

Typically ~500 hrsat 125C

Typically ~250 hrsat 125C

Auto qualed productsreceive a more stringent qualification process.

AUT-F0615 Automotive Instrument Cluster Solutions - From ... · Automotive Instrument Cluster...

Documents

Transcript of AUT-F0615 Automotive Instrument Cluster Solutions - From ... · Automotive Instrument Cluster...