Atmospheric Plasma - NCCAVS Usergroups...Plasma treatment increases wettablility of polymers to...
Transcript of Atmospheric Plasma - NCCAVS Usergroups...Plasma treatment increases wettablility of polymers to...
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Atmospheric PlasmaApplications in Electronic Packaging
Be Equipped for Tomorrow‘s Materials
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Surface treatment toolThe PlasmaPen™ is an atmospheric gas plasma system used to clean and modify the surface properties of a material.
The PlasmaPen™ is ideally suited for in situ precision cleaning and activation of materials during manufacturing assembly and packaging.
Basic Function of PlasmaPen™
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Dielectric Barrier Discharge channel
Cooling gas
Quartz tube
Process gas
High Voltage, 3.5kV(1.2-0.9kV/<100mA)
5 to 7 mm
Plasma Plume
PlasmaPen™ schematic
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Treatment are regimesPlasmaPen™ technology niche
Micro pointDiam. = (sub-mm)
SpotDiam. = (10 – 20 mm)
Spot Array(30 – 100 mm) x (10 – 20mm)
Linear(100 – 2000 mm) x (10-20)
PlanarDiam. = (100 – 2000 mm) x (100 – 2000)
PlasmaPen™
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Treatment are regimesPlasmaPen™ technology niche
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Control Features and OptionsHardware - RoboPen
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Applications
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>BILDFELD<
Atmospheric Plasma Applications in Device PackagingPlasma pre-wirebonding
Plasma Pre-Wirebonding
• Maximizes bond strengths• Minimizes non-sticks• Minimizes bonding power for
delicate dies
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Atmospheric Plasma Applications in Device PackagingPlasma pre-wirebonding - Wire Pull strengths
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Wire bond pull strength distributions are shown for before and after plasma treatment. Component distributions for lead lifts and heel breaks are also shown under each main curve. The insert shows a graphic for the increased percentage wire break after plasma treatment
ApplicationsTreatment prior to wirebonding
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ApplicationsTreatment prior to thin die wirebonding
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ApplicationsTreatment prior to thin die wirebonding
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Atmospheric Plasma Applications in Device PackagingPlasma pre-wirebonding - Ball shear strengths
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Atmospheric Plasma Applications in Device PackagingPlasma pre-wirebonding - Non stick elimination
PBGAGigaBatch 690
Elimination of non-stick after MW plasma
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ApplicationsDie attach
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Post shear
90% Adhesive-adhesive failure mode
10% Au-adhesive failure mode
Namics U844314 cured at 150o C for 1 hr.
Taiyo solder mask
Dage die shear system
ApplicationsDie attach
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Die size, 193x185x4
K. 1x1 Kovar coupon substrate without PlasmaPen™
C1. 1x1 Kovar coupon substrate with PlasmaPen™
ApplicationsDie attach
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ApplicationsReduction of oxides on copper and nickel
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B-IV. Plasma Applications in Device PackagingPlasma pre-underfill
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How does plasma improve potting?
Plasma treatment increases wettablility of polymers to potting compounds by chemically adding polar functional groups to the surface. The result is no skips, voids, blisters, or bleeding caused by incomplete wetting of the encapsulant. For other materials, (glass, ceramics, metals etc) a more wettable surface results primarily because oily surface residues are removed by the plasma.
Typical PlasmaPen™ Process ApplicationsPotting / Encapsulation / Conformal Coatings
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Aircraft cable repair
Aircraft and other heavy cable insulation can be repaired in situ using the PlasmaPen™ .The damage can be overmolded or encapsulated successfully by the adhesion promotion properties of the plasma.
Typical PlasmaPen™ Process ApplicationsPotting / Encapsulation / Conformal Coatings
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Modes of operation
Hand Held
Robotic arm / Cartesian table
Inline
On-board
PlasmaPen™ modes of operation
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Evolution of plasma surface treatment in manufacturing
Low pressure batch processing
Low pressure in-line processing
Atmospheric in-line processing
Atmospheric in-situ / on-board processing
PlasmaPen™Mount
PlasmaPen™Power Supply
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DispensersDispensers
Adhesive
Inking / marking
Potting
Encapsulation
Flip chip under-fill
Patterning circuitry
Assay / reservoir fill
Market ApplicationsHigh potential for OEM partnerships
BondersBonders
Mounting
Welding
Soldering
Wire bonding
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Advantages of in-situ treatment
Easy integration either in-line or on-boardNo substrate staging means faster production flowPlasma applied locallySubsequent processes performed immediately after treatmentNo voltage or current in plasma plume means no damage to electronic devicesLow operating costs – compressed airLow capitol cost compared to vacuum plasma
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Reactant gas: Compressed air (6 Bar, (88 psi), 1000 liters/hour (15 f3/h))Other gases: N2, N2/H2, O2, CO2, He
Treatment width: 8-10 mm at 10 mm distance
No voltage or current in plasma plume
Lifetime of the electrode tip: >1500 hours
Standard umbilical length: 9 feet
Electricity: 115 VAC, 1 phase, 60 Hz or 230 VAC, 1 phase, 50 Hz
CE Certified
PlasmaPen™ Overview
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Standards and Compliances
NFPA79, NFPA70
CEDirectives:
2006/95/EC, Low Voltage DirectiveStandard IEC EN 61010
2004/108/EC Electromagnetic Compatibility Standard IEC EN 61326
CISPR 55011
ISOISO9001: 2000
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