ODMEO Technical Assistance Overview DoD Funding Opportunities
Are You Leveraging DoD Funding?
Transcript of Are You Leveraging DoD Funding?
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Ken GoodsonProfessor & Vice Department ChairMechanical Engineering Stanford University
Are You LeveragingDoD Funding?
EXECUTIVE BRIEFINGMarch 18, 2013
Visit us atnanoheat.stanford.edu
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ABC News October 2011
“Hot” electronics are in the news…
NY Daily News 2010March 2012
APCmagazine March 2012
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But Where’s the Money?
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Electronics Thermal Challenges
portables
servers
transportation defense
energy efficiency
hotspot mitigation
heterogeneousintegration
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portables
servers
transportation defense
Electronics Thermal ChallengesOur corporate sponsors
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portables
servers
transportation defense
Electronics Thermal Challenges
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DARPA Thermal Management Programs Timeline
Heat Removal by Thermo-Integrated Circuits (HERETIC)
• 1998: DARPA PM Towe• 2001: DARPA PM Radack• 2002: HERETIC ends
Micro Cryo Coolers (MCC)• 2006-2011: DARPA PM Dennis Polla
Technologies for Heat Removal in Electronics at the Device Scale (THREADS)
• 2005-2006: DARPA PM Rosker• 2009-present: DARPA PM Albrecht
ACMMACENTI
TGP
98 00 02 04 06 08 10 12
TMT
MCC
THREADS
THREADS
Thermal Management Technologies (TMT)• 2007-2010: DARPA PM Kenny• 2010-present: DARPA PM Bar-Cohen
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Embedded Cooling (NJTT and ICECool)• 2011 - 2015: DARPA PM Bar-Cohen• NJTT and ICECool explore novel, disruptive,
chip/package level – embedded - thermal technologies in Si and non-Si electronics
Generation 1: Exploratory Studies ‘98-’07
Generation 2: Remote Cooling ’07-’12
Generation 3: Intrachip Cooling ’12 -
Distribution Statement A, Approved For Public Release, Distribution Unlimited
Embedded Cooling
NJTTICECool Fun
ICECool Apps
Special Thanks to Avi Bar- Cohen and Joe Maurer, DARPA MTO
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Thermal Management Technologies (TMT)Program Goals
Task Areas :Microtechnologies for Air-Cooled Exchangers (MACE): Active surfaces and jets for enhanced heat sinksThermal Ground Plane (TGP): Nanostructured wicks and cases for 2-phase vapor chambersNano-Thermal Interfaces (NTI): Engineered, reworkable nanostructures for low resistivity TIMsActive Cooling Modules (ACM): High COP cooler using novel TE materials and refrigeration concepts
Distribution Statement A, Approved For Public Release, Distribution Unlimited
Special Thanks to Avi Bar-Cohen and Joe Maurer, DARPA MTO
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Chemical, Bioengineering, Environmental, and Transport Systems (CBET)
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Chemical, Biochemical, and
Biotechnology Systems
Biomedical Engineering and
EngineeringHealthcare
Transport andThermal Fluids
Phenomena
Process and Reaction Engineering
Luke Achenie
Catalysis andBiocatalysisGeorge Antos
EnvironmentalEngineering and
Sustainability
Chemical andBiological Separations
Rose Wesson
Thermal Transport Processes
Sumanta Acharya
Interfacial Processes and Thermodynamics
Bob Wellek
Particulate andMultiphase Processes
Ashok Sangani
Fluid DynamicsHenning Winter
Combustion, Fire, and Plasma SystemsRuey-Hung Chen
EnvironmentalEngineering
Debra Reinhart
Environmental Health and Safety of
NanotechnologyBarbara Karn
Energy for Sustainability
Ram Gupta
EnvironmentalSustainabilityBruce Hamilton
Deputy Division DirectorBob Wellek
Division DirectorSohi Rastegar (A)
Biotechnology, Biochemical, and
Biomass EngineeringFriedrich Srienc
Biomedical EngineeringKaiming Ye
BiophotonicsLeon Esterowitz
General & Age-Related Disabilities
Engineering Ted Conway
BiosensingEddie Chang
http://www.nsf.gov/div/index.jsp?org=CBET
Special Thanks to Sumanta Acharya, NSF
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NSF Directorate for Engineering | Division ofChemical, Bioengineering, Environmental, and Transport Systems (CBET)
Transport and Thermal Fluids Cluster
Thermal Transport ProcessesProgram Director – Sumanta Acharya‐ [email protected] IPA from Louisiana State University
Unsolicited(Spring Window, Jan 15‐Feb 17)CAREER (July window) Targeted InitiativesEAGERWorkshopsTravel
Fundamentals Applications *
* Pictures taken from NSF reportsCBET-Thermal Transport
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NSF-DOE Thermoelectrics Partnership Automotive Thermoelectric Modules
Faculty & StaffProf. Kenneth Goodson (Stanford), PIProf. George Nolas (USF)Dr. Boris Kozinsky (Bosch)Prof. Mehdi Asheghi, Stanford Mechanical EngineeringDr. Winnie Wong-Ng, NIST Functional Properties GroupDr. Yongkwan Dong, USF Department of PhysicsStudents:Michael Barako, Lewis Hom, Saniya Leblanc, Yuan Gao, Amy MarconnetLeveraged Support:Northrop Grumman, AMD/SRC, NSF Graduate Fellowships, Stanford Graduate Fellowship, Stanford DARE Fellowship, Sandia National Labs Fellowship
Bosch
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Outline
So Where’s the Money?
Example: Extreme Cooling for Radar
Example: Nanostructured Packaging for Portables
Expanding the Thermal Management Toolset
[email protected]://www.nanoheat.stanford.edu
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Liquid CoolingTeam: General ElectricChallenge:• Eliminate impact on device electrical properties due
to time varying dielectric constant of liquid
High Thermal Conductivity Diamond Teams: TriQuint, BAE, Raytheon, RFMD, NGASChallenges:• Integrate lattice-mismatched heat spreaders• Minimize thermal boundary resistance (TBR)• Match coefficient of thermal expansion of electronic material
Substrate
Drain
Gate
Source
Near-Junction Thermal Transport (NJTT)
NJTT Vision: Provide localized thermal management within 100 µm of the device substrate to increase Output Power from GaN PAs by >3x
DARPA’s Near-Junction Thermal Transport (NJTT) is an effort inside DARPA’s Thermal Management Technology (TMT) portfolio• Start Date: Fall 2011• Teams: TriQuint, BAE, Raytheon, RFMD, NGAS, GE
NJTT Approaches
Schematic of NJTT HEMT Device
Distribution Statement A, Approved For Public Release, Distribution Unlimited
Special Thanks to Avi Bar- Cohen and Joe Maurer, DARPA MTO
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DiamondMicrochannel
Array
MEMS Silicon ManifoldRouting Liquid and Vapor
ICECool: HEMT Cooling Geometry
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Microfluidics Cooling Trajectory
1985 1990 2000 20102005
IBM Thermalconduction module
Tuckerman & Pease microchannel demonstration
Microchannel implementation in laser diode cooling
Extensive single/two-phase flow research
DARPAPrograms
Toshiba &HitachiLaptops
Apple G5
Liquid Cooling goes primetime
100W/Cm2
300+W/Cm2
3D microfluidics
Two-phaseflow
Fluid Design
Nano SurfacesMulticore
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R245FA Channel Wall Heat Transfer Coefficient (kW/cm2K)
Hotspot
Temperature
Rise (K)
DARPA: ICECool & NJTT Temperature Rise Due To GaN‐Diamond Boundary
100 m2K/GW20 40
2
NJTT TBR
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AlGaN
Diamond50 nm
Diamond substrate
Stanford Collaborators / Primes under NJTT:
DARPA NJTT and theGaN-Diamond Boundary Resistance
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GaN-Diamond Boundary Resistance0.1 1 m2K/GW10 100
Translated ICECoolResistance Target
AlGaN
Diamond50 nm
DARPA NJTT and theGaN-Diamond Boundary Resistance
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GaN-Diamond Boundary Resistance0.1 1 m2K/GW10 100
GaN-diamond
GaN-SiC
GaN-Si
20102011,2012
10 ps TDTR
withNORTHROP GRUMMAN
with RAYTHEON
with RAYTHEON
Cho, Altman, Asheghi, Goodson, Electron Device Letters (2012)Cho, Asheghi, Francis, Ejeckam, et al., IEEE Trans. CPMT (2013)Cho, Altman, Asheghi, Goodson, et al., Physical Review B (under review)
DARPA NJTTDATA
with GROUP4RAYTHEON,
RFMD, BOEING
DARPA NJTT and theGaN-Diamond Boundary Resistance
Pre NJTT
Pre NJTT
Translated ICECoolResistance Target
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ICECool TeamStanford Mechanical& Chemical Engineering
Prof. Ken GoodsonProf. Juan SantiagoProf. Mehdi AsheghiDr. Damena Agonafer bilayer physics/fabDr. Yoonjin Won MEMS/3D manifoldMichael Barako electrodepositionTom Dusseault bilayer chemistryMatthew Hoffman micro convectionKen Lopez bilayer transportViktor Schkolnikov micro/nanofluidics
DARPA MTO Dr. Avi Bar-CohenDr. Joe Maurer
Raytheon IntegratedDefense Systems
Dave Altman diamond/reliability
Dr. Ralph Korensteindiamond fab and etching
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Outline
So Where’s the Money?
Example: Extreme Cooling for Radar
Example: Nanostructured Packaging for Portables
Expanding the Thermal Management Toolset
[email protected]://www.nanoheat.stanford.edu
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IBM-3M Press Release
September 2011
3D NanoPackaging
LogicMemoryMemory
Chip Carrier
Materials Needs
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SRC Interconnect & Packaging Summer Review 2012 ‐ Task 1966
DRAM DRAM
lnterposer
Logic
Chip Carrier
LogicMemoryMemory
Chip Carrier
TIM 1 &2 (metal alloys, particle filled organics, aligned CNT films)‐ High thermal conductivity‐Mechanical compliance
Flowable Underfill‐ Electrically insulating‐Mechanical stiffness‐ Viscosity and capillary forces‐ High thermal conductivity
3D Chip Attachment (Adhesives, Thermal compression bonding)‐ High thermal conductivity‐ Electrically insulating‐ Thermal cycling stability
Encapsulation‐ High thermal conductivity‐ Electrically insulating (on the side facing the chip)‐Mechanical compliance
Material Requirements – 3D Packging
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LogicMemoryMemory
Chip Carrier
Primary ThermalInterface
2011
Removable backer
Nanofibers
Low melting temperature binder (e.g. alloys of Ga, In, Sn)
Adhesion layer
Adhesion layer wets nanotubes and promotes adhesion of binder (Pd, Pt, or Ti).
~100 nm is the typical variation in CNT height.
Hu, Fisher, Goodson, et al., J. Heat Transfer (2006)SRC Patent: Hu, Jiang, Goodson, US Patent 7,504,453, issued 2009SRC Patent: Panzer, Goodson, et al., 2009/0068387 (pending)
3D NanoPackaging
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Carbon 2012
LogicMemoryMemory
Chip Carrier
Primary ThermalInterface
2010
3D NanoPackaging
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LogicMemoryMemory
Chip Carrier
3D Stacking Interfaces
2011
CNT Composites
3D NanoPackaging
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LogicMemoryMemory
Chip Carrier
Carbon 2012
Primary ThermalInterface
2010
3D NanoPackaging
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10-3 10-2 10-1 10010-1
100
101
102
103
104
Volume Fraction
Ther
mal
Con
duct
ivity
[W m
-1 K
-1]
(Wang et al., 2007a,b)(Yu et al., 2005)(Pop et al., 2006)(Li et al., 2009)(Choi et al., 2006)(Pettes et al., 2009)(Kim et al., 2001)(Fujii et al., 2005)(Li et al., 2009)(Choi et al., 2005)(Panzer et al., 2008)(Akoshima et al., 2009)(Hu et al., 2006)(Yang et al., 2002,2004)(Tong et al., 2007)(Tong et al., 2006)(Pal et al., 2008)(Borca-Tasciuc et al., 2005)(Ivanov et al., 2006)(Xie et al., 2007)(Okamoto et al., 2011)(Jakubinek et al., 2010)(Y. Xu et al., 2006)(Cola et al., 2007)(Zhang et al., 2005)(Zhang et al., 2007)(Pettes et al., 2009)ki = 3000 W/m/K
ki = 30 W/m/K
Marconnet, Panzer, Goodson, Reviews of Modern Physics (accepted & in press 2013)
Thermal Conductivities of Individual CNTs and Aligned Arrays
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Mechanical & Thermal Properties of Aligned CNT Films
750 µm
50 µm
Thermal MechanicalPump Laser Doppler
Vibrometer (LDV)
Piezoelectric Shaker
Probe
Si substratePolysiliconOxideAl2O3FeCNT
Yoonjin Won, Matt Panzer, Amy MarconnetCarbon (2012). SRC 1640 (ended), 1966
MEMS Resonator
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GOAL
Thermal Interface Materials (TIM) Properties
Thermal Resistivity (m K / W)1.00.1
Elas
tic M
odul
us (M
Pa)
Greases & Gels
Phase Change Materials
Indium/ Solders Adhesives
0.01
Nano-gels
Lifetimethermal cycling
104
103
102
101
Latest Stanford CNT Data1
1 Gao, Goodson, et al., J. Electronic Materials (2010). Won, Goodson, et al., Carbon (2011) 30
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Outline
So Where’s the Money?
Example: Extreme Cooling for Radar
Example: Nanostructured Packaging for Portables
Expanding the Thermal Management Toolset
[email protected]://www.nanoheat.stanford.edu
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Restrict the conduction lengthscale using nanofabrication
Restrict the conduction lengthscale using high speed optics
Modern SemiconductorThermal Management Lab
Sample Complexity
Rig
Com
plex
ity
How can we “see”thermal phonons?
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Sample Complexity
Rig
Com
plex
ity
SiC / Diamond
GaN
12 ps pumpdelayed probe
Students: Cho, Bozorg-GrayeliElectron Device Letters (2012)
Students: Li, Lee, KodamaNano Letters (2012b)
Students: Yoneoka, Li, KodamaNano Letters (2012a)
Student: MarconnetACS Nano (2011)
Rowlette, Kekatpure, Brongersma, Goodson, et al., Physical Review B (2009)
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Nanobridge Measurements
ALD Pt
SiO2
Si
10 nm
Free-standing
WFL
Bulk
Thermal conductivity (W/mK)
Bridge Thickness (nm)
SiO2Si3N4
nanotube Pt
Pt gate
2 μmnanotube on substrate suspended
over trench
0 0.2 0.4 0.6 0.8 1 1.20
2
4
6
8
10
12
14
16
I (A
)
V (V)
On Substrate
Suspended
L = 3 m
Cur
rent
(A
)
Voltage (V)
On substrate
Suspended
Single Wall Carbon Nanotube FETsPop, Dai, Goodson, et al., Physical Review Letters (2005), Nano Letters (2006)
Metal Interconnects down to 7.3 nm Students: Yoneoka & Lee, Nano Letters (2012, in press)
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Kaeding, Skurk, and Goodson, Applied Physics Letters 65 (1994)Goodson & Ju, Annual Review of Materials Science 29 (1999)
Panzer et al., Journal of Heat Transfer (2008)
DELAYSTAGE
PUMP LASER
PROBE BEAM FOR ns PUMP AND CW PROBEPulse Duration = 10 ns. Decay Time ~ 2 s.
PROBE LASER
PHOTODETECTOR
METAL LAYERPROBE BEAM FOR ps PUMP-PROBE10 ps / 2 ns
Short-Timescale PhotothermalCharacterization of Packaging Properties
Sam
ple
film
Subs
trat
e
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Thermal Characterization
400 m
Back Side Front Side
Doped Si Sensor
Al Heater
100 m
Kramer, Flynn, Fogg, Wang, Hidrovo, Prasher, Chau, Narasimhan, Goodson. “MicrochannelExperimental Structure for Measuring Temperature Fields During Convective Boiling,” ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, USA, November 13-19, 2004, IMECE2004-61936.
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Instrumented Microfluidic PlatformKramer, Flynn, Fogg, Wang, Hidrovo, Prasher, Chau, Narasimhan, Goodson. “MicrochannelExperimental Structure for Measuring Temperature Fields During Convective Boiling,” ASME International Mechanical Engineering Congress & Exposition, Anaheim, CA, USA, November 13-19, 2004, IMECE2004-61936.
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IEEE Transactions on Components and Packaging Technology (2002)
2000 2002 2004
DARPA fundingIntel
AppleAMD
Research Background
CooligyStartup(VC funding)
MicroCoolers for Computers
AcquisitionBy Emerson
2006 2008
~600W total~ 1kW/cm2
Best Paper at SEMITHERM 2001
Product Win100K+ Units
Trajectory of a Startup (Cooligy)
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2000 2002 2004
DARPA fundingIntel
AppleAMD
Research Background
Trajectory of a Startup (Cooligy)
Zhou et al., Proc. SEMITHERM 2004, Proc. ITHERM 2004
Si chip
Fluidinlet
Outlet Thermalattach3D
CooligyStartup(VC funding)
Product Win100K+ Units
MicroCoolers for Computers
AcquisitionBy Emerson
2006 2008
~600W total~ 1kW/cm2
LiquidCoolingChallenge
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Current Group Ken GoodsonJosef Miler Elah Bozorg-Grayeli Lewis HomMichael Barako Amy Marconnet Aditja Sood (MSE)Jaeho Lee Shilpi Roy (EE) Woosung ParcSri Lingamneni Yuan Gao Saniya Leblanc Yiyang Li (MSE) Dr. Takashi KodamaJungwan Cho Zijian Li Dr. Yoonjin Won
Prof. Mehdi Asheghi
Visit us atnanoheat.stanford.edu
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Last-Minute VC Demo, 2001Microchannel Chip
Electroosmotic Pump
Heat Rejecter Coil & Plate
Sony VAIO Laptop Demo
Shulin Zeng with help from Evelyn Wang, Linan Jiang, and Abdullahel Bari (Stanford)