APPLICATION SPOTLIGHT: Renesas Human Machine … · Stand-Alone Wi-Fi Module ... to servicing all...
Transcript of APPLICATION SPOTLIGHT: Renesas Human Machine … · Stand-Alone Wi-Fi Module ... to servicing all...
APPLICATION SPOTLIGHT:
Human Machine Interface (HMI)
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P R O D U C T A N D T E C H N O L O G Y N E W S F R O M F U T U R E E L E C T R O N I C S
RenesasRX130 Touch-Enabled MCU:
Best-in-Class 2nd-Generation Capacitive Touch Technology
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InfineonHigh-Performance MEMS
Microphone with 69dB(A) SNR and Lowest Distortion
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ON SemiconductorChanging the Listening
Experience: Ultra-Low-Power Meets a One-Stop Chip
PAGE 10
PanasonicPAN9420: Fully Embedded Stand-Alone Wi-Fi Module
for Highly Integrated and Cost-Effective Applications
Page 13
Register to qualify for:NXP – FREE DEV BOARD (Page 6) Dialight – FREE SAMPLES (Page 18)
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TABLE OF CONTENTSAPPLICATION SPOTLIGHTRenesas Renesas RZ/A1 Series – Designed for Exceptionally Smooth HMI 3
Renesas Synergy™ Platform: Amp Up Your Visual Style with Renesas Synergy Featuring GUIX™ 4
Renesas Introducing the New Renesas RX130 Touch-Enabled MCU: Best-in-Class 2nd-Generation 5 Capacitive Touch Technology
NXP i.MX RT Series: The World’s Highest Performance Real-Time Processor 6
Epson Epson S1D13513 Display Controller with HW Graphics Engine for High-Resolution Color TFT Panels 7
Vishay 3-Channel Slotted Interrupter for Turn and Push Applications 7
Infineon High-Performance MEMS Microphone with 69dB(A) SNR and Lowest Distortion 8
Mallory Sonalert SMT, PC Pin, and Flange Mount Buzzers Deliver Better Functionality at Lower Cost 9
Future Electronics Analog Corner 20-21
Cypress Capacitive Sensing for the IoT 24
COMPONENT FOCUSSusumu New Precision Audio Resistor, the RS Series 9
ON Semiconductor Changing the Listening Experience: Ultra-Low-Power Meets a One-Stop Chip 10
Vishay Solutions for Human Machine Interface Systems 11
Microsemi Award Winning Programmable Solutions from Microsemi 12
Panasonic PAN9420: Fully Embedded Stand-Alone Wi-Fi Module for Highly Integrated and Cost-Effective Applications 13
CviLux CviLux – USB Type-C Connectors and Cables 14
TE Connectivity Flex Grip Wire Connectors 14
TE Connectivity Compact, Sealed Circuit Protection 15
TE Connectivity Potter & Brumfield 30A PCB Relay T9G Series 16
Dialight Vertical Light Pipe for PCB Mount and Panel Mount Applications 18
Indium Solder Fortification® Preforms 18
TECHNICAL VIEWFuture Electronics Mid-Power LEDs: Now a Valid Low-Cost Light Source for Street Lights? 22-23
FUTURE ELECTRONICS’ ADFuture Electronics Learn How You Can Leverage Future Electronics’ System Design Center 17
Future Lighting Solutions We Accelerate Time to Revenue 19
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RENESAS RZ/A1 SERIES – DESIGNED FOR EXCEPTIONALLY SMOOTH HMI400 MHz Arm® Cortex®-A9 Microprocessors with up to 10 MB of SRAM
Key Features eXecute in Place (XIP) from QSPI Flash
1000 DMIPS Arm Cortex-A9 processor
Up to 10 MB of on-chip SRAM for frame buffering or code execution
Support for up to two independent LCD displays and 4-layer graphics overlays with support for alpha blending
RZ/G1E1 GHz
Dual Cortex-A73800 DMIPS
RZ/G1M1.5 GHz
Dual Cortex-A1510500 DMIPS
RZ/G1N1.5 GHz
Dual Cortex-A1510500 DMIPS
RZ/G1H1.4 GHz
Quad Cortex-A15Quad Cortex-A7
25000 DMIPS
RZ/A1L(3 MB)
400 MHz Cortex-A91000 DMIPS
RZ/A1M(5 MB)
400 MHz Cortex-A91000 DMIPS
RZ/A1H(10 MB)
400 MHz Cortex-A91000 DMIPS
RZ/A1LC(2 MB)
400 MHz Cortex-A91000 DMIPS
RZ/A1LU(3 MB)
400 MHz Cortex-A91000 DMIPS
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Key Benefits Performance of a microprocessor (MPU) with the design simplicity of a microcontroller (MCU)
Lower BOM cost thanks to no external DRAM, reduced PCB layers, and simple voltage regulator requirements
Accelerated time to market
Linux, RTOS, or bare-metal design flows
RZ/A1 Linux & RTOS
Single-core Arm Cortex-A9 with Large Embedded RAM
2-chip HMI
Easy MCU-like development with MPU performance
To apply for your free “Prepaid by Renesas” TES Guiliani-lite license for Renesas RZ/A1, visit: https://www.renesas.com/en-us/products/microcontrollers-microprocessors/rz/rza/tes-guiliani.html
Design-in 2D effects that look almost like 3D with TES Guiliani-lite Prepaid PlatformTES Guiliani on RZ/A1 is a cross platform C++ framework to develop visually appealing user interfaces. With TES Guiliani on RZ/A1, you can create stunning graphical user interfaces for embedded systems within minutes. TES Guiliani can be used with all RZ/A1 embedded MPUs and evaluated with the Stream it! RZ solution kit. Even better, with the new “Prepaid by Renesas” TES Guiliani-lite program, no GUI framework licensing costs arise for Renesas RZ/A1 customers in production.
Design the HMI on a PC with the Guiliani WYSIWYG editor “GSE”
Simulate the HMI application on the PC
Seamlessly load and execute the HMI application on the target system
Check out the RZ/A1 TES Guiliani-lite prepaid platform on the Stream It! kit (ver. 2) available for purchase through Future Electronics:
Manufacturer Part # YSTREAM-IT-RZ-V2
TES Guiliani-lite on RZ/A1 Platform Stream It! RZ/A1
“Prepaid by Renesas” is for RZ/A1 customers using FreeRTOS and e2 studio
Prepaid by Renesas
For more information or to buy products, go to www.FutureElectronics.com/FTM1.800.FUTURE.1 • www.FutureElectronics.com
Resource-constrained embedded IoT devices have always been forced to make the tradeoff between resource- intensive visual style, low power and performance. However, with the latest GUIX™ and GUIX™ Design Studio solutions from Express Logic running in conjunction with Renesas Synergy S5 and S7 Series MCUs, you can now create fluid and visually appealing user interfaces with small resource footprints and fast execution times.
Graphics accelerators free up valuable CPU resourcesExpress Logic’s GUIX takes advantage of the native graphics accelerators built into the Synergy S5 and S7 Series MCUs. S5 and S7 MCUs provide built-in graphics LCD controllers, which can support many of the TFT LCD screens on the market today for HMI applications. Depending on the number of layers and animations, screens up to WVGA can be supported.
Additionally, S5 and S7 Series devices have 2D drawing engines in hardware, which allow for updating the image frame buffer and offloading of the core CPU. The 2D drawing engine supports vector drawing to make it easier to implement features like anti-aliasing and blurring effects. It also supports bit block transfer (BitBLT) to combine multiple bitmap objects.
Latest GUIX version complements Renesas Synergy hardware and softwareRenesas Synergy supports the latest version of GUIX from Express Logic. Using the GUIX Design Studio WYSIWYG screen design environment, you can create modern and fluid interfaces in a simple drag-and-drop interface. The generated C code is a direct drop-in to your Synergy project, working directly with the Synergy Software Package (SSP) and ThreadX® real-time operating system. Synergy and GUIX allow you to concentrate on the part of your design that matters most – the look and feel your customers will interact with – while taking care of the complex image manipulation behind the scenes.
AMP UP YOUR VISUAL STYLE WITH RENESAS SYNERGY FEATURING GUIX™
RENESAS SYNERGY™ PLATFORM
Get a Renesas Synergy Starter Kit today.To learn more, visit: www.FutureElectronics.com/Renesas
For more information or to buy products, go to www.FutureElectronics.com/FTM
The new Renesas RX130 32-bit microcontroller includes a 36-channel capacitive touch sensor unit (CTSU) that uses a proprietary new detection method to improve noise immunity, sensitivity, and water resistance in touch-enabled applications. This improved CTSU increases reliability and robustness, allowing touch keys to be applied to a wide range of materials such as wood panels, as opposed to typically used acrylic or glass.
The robustness of the new CTSU found in the RX130 makes it an ideal fit for consumer electronics products that are used in wet
environments such as in the kitchen or bathroom – and the ability to support touch
operation while wearing gloves makes the RX130 well suited for industrial requirements as well.
The RX130 has built-in functional safety hardware and can easily support the IEC/UL60730 safety
RX130 Enables Single-chip Touch Key ImplementationNow offering up to 512 KB of Flash memory and 48 KB of SRAM, the RX130 enables single-chip implementation for many touch applications. Traditionally, touch developers use separate devices for managing the user interface commands and touch key support in touch-enabled designs. But with larger on-chip memory and a wide range of key peripherals, the RX130 can now consolidate these two requirements into one low-cost, low-power 32-bit MCU.
Get Started with the Easy-to-Use Development SystemRenesas makes it easy to get started with touch key development with the RX130 Capacitive Touch Evaluation System. This development platform simplifies the process of evaluating various touch functions (button, slider, wheel, matrix key, and proximity sensor) and even includes an auto calibration tool that accelerates touch key design.
INTRODUCING THE NEW RENESAS RX130 TOUCH-ENABLED MCU BEST-IN-CLASS 2ND-GENERATION CAPACITIVE TOUCH TECHNOLOGY
Get the RX130 Capacitive Touch Evaluation System today.
Ordering Part # RTK0EG0003S02001BJ
standard for consumer electronics. The RX130 also operates at a maximum voltage up to 5.5 volts, a key requirement for home and factory applications requiring touch.
Supports button, slider or wheel – up to 36 channels!
Offering superior touch key technology in a low-power, low-cost 32-bit MCU, including an easy-to-use Touch Development System, the new RX130 has everything needed for today’s touch key applications – and tomorrow’s.
For more information or to buy products, go to www.FutureElectronics.com/FTM
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i.MX RT Series: The World’s Highest Performance Real-Time Processor
The convergence of low-power applications processors and high performance microcontrollers is here. The i.MX RT Series is the industry’s first crossover processor, offering the highest performance Arm® Cortex®-M core, real-time functionality and MCU usability at an affordable price.
By breaking down the technological boundaries between MCUs and the applications processors, a new class of processors that bridges the chasm between high end microcontrollers and low-end applications processors are introduced. These crossover embedded processors targeted for con-sumer, industrial and the growing IoT application, deliver the performance, functionality and capabilities of an applications processor-based design, but with the ease-of-use, low-power, and real-time operation with low interrupt latency of an MCU-based design.
i.MX RT1050
The i.MX RT105x is the industry’s first crossover processor and combines the high performance and high level of integration on an applications processors with the ease of use and real-time functionality of a microcon-troller. The i.MX RT105x runs on the Arm Cortex-M7® core at 600MHz.
FEATURES
• Highest performing Arm Cortex-M7• 3020 CoreMark/1284 DMIPS at 600MHz• Up to 512KB Tightly Coupled Memory (TCM)• Real-time, low latency response as low as 20ns• Industry’s lowest dynamic power with integrated DC/DC converter• Low-power run modes at 24MHz• Advanced multimedia for GUI and enhanced HMI• 2D graphics acceleration engine• Parallel camera sensor interface• LCD display controller (up to WXGA 1366 x 768)• 3x I2S for high-performance, multichannel audio• Extensive external memory interface options: NAND, eMMC,
QuadSPI NOR Flash, and Parallel NOR Flash• Wireless connectivity interface for Wi-Fi®, Bluetooth®, BLE, ZigBee®
and Thread™
i.MX RT1050 Evaluation Kit
The i.MX RT1050 EVK is a 4-layer through-hole USB-powered PCB. At its heart lies the i.MX RT1050 crossover processor, featuring NXP’s advanced implementation of the Arm Cortex-M7 core. This core operates at speeds up to 600MHz to provide high CPU performance and best real-time response.
FEATURES
• Highest performing Arm Cortex-M7• 3020 CoreMark/1284 DMIPS at 600MHz• Up to 512KB Tightly Coupled Memory (TCM)• Real-time, low-latency response as low as 20ns• Industry’s lowest dynamic power with integrated DC/DC converter• Low-power run modes at 24MHz• Advanced multimedia for GUI and enhanced HMI - 2D graphics acceleration engine - Parallel camera sensor interface - LCD display controller (up to WXGA 1366 x 768) - 3x I2S for high-performance, multichannel audio• Extensive external memory interface options: NAND, eMMC, QuadSPI
NOR Flash, and Parallel NOR Flash• Wireless connectivity interface for Wi-Fi, Bluetooth, BLE, ZigBee
and Thread
Register to qualify for a FREE development Board Sample
Learn more about NXP’s i.MX RT Series To watch the video “i.MX RT Crossover Processors,” go to: www.futureelectronics.com/FTM
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Epson S1D13513 Display Controller with HW Graphics Engine for High-Resolution Color TFT Panels
Flagship display controller IC offers rich graphics functions and easy-to-use develop-ment tools to reduce time-to-market.
The S1D13513 from Epson’s broad LCD controller portfolio is a highly integrated display controller capable of supporting TFT LCD panels up to XGA resolutions. With the flexibility of an external SDRAM memory interface, the low-power, cost effective IC supports a wide variety of MCUs and display panels of all major suppliers.
Powered by the built-in hardware graphics engine, the S1D13513 offers several image processing capabilities including 2D BitBLT, sprite, multiple-layer and double buffered windows, alpha blending, gamma correction, mirror/rotation functions and 4-channel PWM for backlight control. In addition, a dual port
camera interface with resize function and raw JPEG capture is supported to handle digital video. These features aid to offload the host CPU, and offer superior, easy-to-use display capabilities in target applications.
The S1D13513 is part of Epson’s broad portfolio of color TFT display controllers including the popular S1D13781, S1D13L01 and S1D13517 that support QVGA to XGA display resolutions. Reference designs with popular MCUs and panels, evaluation boards supporting Arduino® and mbed®, and development tools including SEGGER emWin® are available to enable fast prototyping and short time-to-market.
S1D13513 FEATURES
• QVGA to XGA (1024 x 768 at16bpp) resolutions• External SDRAM support up to 64MB• RGB interface to panels (16/18/24-bit TFT)• Multi-layer PIP, alpha blending, gamma correction• Hardware acceleration for 2D BitBLT, sprite• 4-ch PWM for backlight control
APPLICATIONS
Ideal for color TFT displays in:• Home and building automation• Industrial controls• Home appliances• Medical monitoring devices
To buy products or download data, go towww.FutureElectronics.com/FTM
3-Channel Slotted Interrupter for Turn and Push Applications
The TCUT1630X01 has two phototransistors for resolving the speed and direction of the encoding media and a third phototransistor below them to sense a push or a rotation flag. Ideal for push-and-turn knob applications or counting revolutions.
FEATURES
• Surface mount package • AEC-Q101 automotive qualified• Moisture sensitivity level of 1• Operating temperature of 105°C• Typical output current, IC = 1.3 mA• Encoder gap of 3 mm
TCUT1630X01
5.8
7.1
5.5
1.800.FUTURE.1 • www.FutureElectronics.com 1.800.FUTURE.1 • www.FutureElectronics.com
APPLICATION SPOTLIGHTAPPLICATION SPOTLIGHT
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High-Performance MEMS Microphone with 69dB(A) SNR and Lowest Distortion
The IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortion and a high acoustic overload point is required.
IM69D130 is a high-performance digital MEMS microphone making use of Infineon’s Dual Backplate MEMS technology to deliver 105dB dynamic range and high output linearity up to 130dBSPL. The application benefits are crystal-clear audio signals, extended pick-up distance and sensitivity to both soft and loud signals – from whispered speech to rock concerts.
Infineon’s Dual Backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar to studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105dB. The microphone distortion does not exceed 1% even at sound pressure levels of 128dBSPL. The flat frequency response (28Hz low frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.
The digital microphone ASIC contains an extremely low noise preamplifier and a high-performance sigma-delta ADC. Different power modes can be selected in order to suit specific current consumption requirements.
Each IM69D130 microphone is trimmed with an advanced IFX calibration algorithm, resulting in small sensitivity tolerances (±1dB). The phase response is tightly matched (±2°) between microphones, in order to support beamforming applications.
Minimal Audio Signal Latency Enabled by an Ultra-Low Microphone Group Delay
The IM69D130 is designed to be an extremely low latency digital microphone – aimed at applications such as active noise cancellation, where audio data must be processed extremely quickly.
By delivering best-in-class group delay performance, the IM69D130 brings the system design benefits of digital microphones to many areas which had to use analog up to now.
FEATURES
• 69dB(A) signal-to-noise ratio• Below 1% distortion at 128dBSPL (130dBSPL AOP)• Digital (PDM) interface with 6μs group delay at 1kHz• Tight sensitivity (-36 ±1dB) and phase (±2°) tolerances• 28Hz low frequency roll-off• 980μA current consumption (300μA in low-power mode)
BENEFITS
• Far field and soft audio signal pick-up• Clear audio signals even at high sound pressure levels• Enabling precise steering of audio beams for advanced audio algorithms
APPLICATIONS
• Voice User Interface (VUI): e.g. smart speaker, home automation and IoT devices
• Active Noise Cancellation (ANC): headphones and earphones• High-quality audio capturing: e.g. cameras, camcorders, conference
systems• Audio pattern detection: industrial or home monitoring
Signal-to-noise ratio (SNR)
IM69D130
THD below 1%
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63
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Next best alternative
[dB
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IM69D130 Next best alternative
Clear far field and low volume audio pick-up
Below 1% distortion even if exposed to loud audio signals
[µs]
Frequency [Hz]
Group delay
1
10
100
1000
100 1000
IM69D130
Next best alternative
To buy products or download data, go towww.FutureElectronics.com/FTM
In order to keep up with the growing needs of industrial, medical, measurement, and consumer applications, Mallory Sonalert has expanded their board level buzzer offering again!
Mallory is offering four new SMT buzzers with circuitry. Part numbers ASI09N27M-05Q (cut-tape) and ASI09N27M-05TRQ (tape-n-reel) utilize electromagnetic technology and have a voltage range of 3Vdc to 7Vdc, a 2700Hz freq., a min sound level of 80dB at 10cm, and a very small 9.5 x 9.5 x 5mm package size. Part numbers ASI12N35MQ (cut-tape) and ASI12N35MTRQ (tape-n-reel) feature piezo technology which means an ultra-low current draw of 10mA at 12Vdc, a wide voltage range of 3Vdc to 15Vdc, a minimum sound level of 83dB at 10cm, and a small 14 x 14 x 7.3mm size.
Mallory is also offering five new electromagnetic buzzers with circuitry (PB Series), eight new
piezoelectric buzzers with circuitry (PK Series), ten new piezoelectric transducers with no circuitry (PT series), and four new electromechanical buzzers with circuitry (PK Series). All new buzzers offer increased functionality or better cost.
Electromechanical Buzzers: Flange Mount (with Circuitry)PK-26N04W-03VQPK-26N04W-06VQPK-26N04W-12VQPK-26N04W-24VQ
MALLORY SONALERT PRODUCTS, INC.
Surface Mount (SMT)ASI09N27M-05QASI09N27M-05TRQASI12N35MQASI12N35MTRQ
Electromagnetic: PC PIns (with Circuitry)PB-1220P-05QPB-12N23MPW-03QPB-12N23MPW-05QPB-12N23MPW-12QPB-12N32MP-12Q
Piezoelectric: PC Pins (with Circuitry)PK-11N40PQPK-20A35EW-24AQPK-21N31PQPK-27H25PQPK-35A29W-24VQPK-35H29W-24VQPK-35H29WQPK-35N29W-24VQ
Piezo Transducers (No Circuitry)PT-1241PFQPT-1245P-PQPT-1340P-P10-PQPT-2725FPQPT-2725PQPT-2735FPQPT-2736FPQPT-3110P-05QPT-3529WQPT-4175PQ
SMT, PC Pin, and Flange Mount Buzzers Deliver Better Functionality at Lower Cost
New Precision Audio Resistor, the RS Series
Susumu, an innovative precision thin film chip resistor manufacturer, introduces the RS series, a new chip resistor series specially created for audio applications.
Thin film resistors have been known to have better frequency characteristics, less noise, and less signal distortion than other types of resistors. It seems clear that for audio applications, the natural choice should be a thin film resistor. However until now, the usage of thin film resistors has been limited to high end audio despite the fact that the most popular audio devices on the market today are smartphones and automotive audio systems. Susumu contends that the sound quality of these popular audio systems can be improved significantly by utilizing thin film resistors, such as Susumu’s RG series. However, Susumu wanted to make the
RG series even better for all audio systems. After numerous prototypes, simulations, and evaluations by sound professionals, Susumu discovered that design methods of resistive patterns and terminal materials had the most impact on sound quality. The RS series was born as a series of thin film resistors targeted specifically for high quality Hi Fi audio applications.
The RS series is a perfect solution for any sound circuits including digital analog converter circuits. If you are interested in improving the sound quality of your audio devices, from high end to personal mobile devices, Susumu’s RS series is the answer to your needs.
PERFORMANCE CHARACTERISTICS
• Current noise: -40dB or less (typical)• Frequency performance: up to GHz level
(depending on resistance value)• Tolerance: ±0.1%, ±0.5%• TCR: ±25ppm• Resistance range: 47-100KΩ• Power ratings: 1/16W (1005 size),
1/8W (2012 size)• Gold terminal available upon requestThin film resistors
Typical digital analog converter circuit
DAC
To buy products or download data, go towww.FutureElectronics.com/FTM
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APPLICATION SPOTLIGHT
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Changing the Listening Experience: Ultra-Low-Power Meets a One-Stop Chip
In the last couple of years there has been a re-evolution of the audible space. Small wearable speakers now sit on the wrist and listening home assistant devices sit on the coffee table. What is changing? Consumers are finding immense value with computers that are able to fit in the ear and play music well. Standard audio playback, touch/tap interface, voice trigger, wireless connectivity, motion detection, call handing, and health monitoring are now becoming integrated into the same consumer device.
The modern design discussion is not whether the device is wired or wireless but rather what audible resolution can you push out of a low powered device? What physical or audible control systems are being utilized? What additional sensors can be integrated? And how can features like noise cancellation and sound synchronization enhance the listening experience?
ON Semiconductor’s LC823450 is an ultra-low-power single-chip solution for the re-evolution in the audible space. Compared to the next large-scale integration (LSI) solution the LC823450 has a 1.7 times longer battery life. This device can provide over 120 hours in playback off of two AAA batteries. This is packaged into a small 5.33 x 5.52mm device that integrates an ARM® Cortex®-M3 dual core MCU, proprietary 32-bit DSP, ADC/DAC, high resolution playback, and memory.
Make sure to integrate the RSL10 with the LC823450 for ultra-low-power Bluetooth 5 connectivity.
THE TOOLS TO HELP
• Evaluation kit• Reference design• Application notes• Firmware/software support
THE END APPLICATIONS
• Truly wireless headphones• Fitness/activity trackers• Sports headphones• Single ear headsets• AR/VR headsets• Wireless speakers
DIFFERENTIATING FEATURES
• Highly-integrated system on chip (CPU+DSP+Audio)• Over 120 hours playback with 2*AAA batteries• MP3 hardware decoding at 4.8mA (128Kbps)• Integrated low power D-class amplifier• Low-power DSP operation
Audio DSPLC823450Class D Amplifier
FAB3103Battery Fuel Gauge
LC709203
SwitchingBattery Charge
NCP1854
RSL10 (BLE5)
Electronic Assistant/Voice Interface Solution
LC823450XGEVK - System Evaluation Board Kit
LC823450 - Low-Power & High-Resolution Audio Processing System LSI
SOLUTIONS FOR HUMAN MACHINE
INTERFACE SYSTEMS
Offering components
that meet the
challenges of
increasingly complex
HMI applications: face
recognition, voice
triggering, and gesture
sensing…
INDUCTORS DIODES
IHLD-4032KB-5A Low profile, high current dual inductors save space and
offer high temperature range for Class D Amplifiers
PLZ Series Zener Diodes500 mW Zener diodes in low profile
MicroSMF (DO-219AC) eSMP® series package
IHLD-4032KB-5ALow profile, high current dual inductors save space and
offer high temperature range for Class D Amplifiers
PLZ Series Zener Diodes500 mW Zener diodes in low profile
MicroSMF (DO-219AC) eSMP® series package
INDUCTORS DIODES
For more information or to buy products, go to www.FutureElectronics.com/FTM1.800.FUTURE.1 • www.FutureElectronics.com
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COMPONENT FOCUS
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COMPONENT FOCUS
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Award Winning Programmable Solutions from Microsemi
Mi-V/RISC-V Ecosystem
The Future Electronics Creative Board with the Igloo2 FPGA now brings RISC-V to another level! A 32 bit RISC-V processor is pre-programmed into the IGLOO2 on the RISC-V Creative Board. Firmware engineers can start developing their C/C++ code out of the box using SoftConsole IDE version 5.1 or higher. The complete Microsemi Mi-V RISC-V ecosystem contains the following: • Out of the box reference design runs a hello world demo on the
Creative Board• Recently introduced RISC-V IP core• Libero development software to modify FPGA logic for your design• SoftConsole 5.1 IDE for Linux – and Windows. Includes a compiler and
debugger for Microsemi’s RISC-V IP core• Microsemi IGLOO2 FPGA 25k LE device to develop your design
FEATURES
• Igloo2 FPGA with 25K logic elements, offering more resources in low-density devices.
• Lowest-power, highest reliability, SEU immune flash-based FPGA
Microsemi‘s Award Winning PolarFire FPGA
The Avalanche Development Kit allows developers to quickly prototype for the lowest-power mid-range FPGA platform on the market. At the heart of the kit is a 300k LE (logic element) PolarFire non-volatile FPGA from Microsemi. The PolarFire FPGA family is a cost optimized, lowest-power mid-range density FPGA family with proven security and exceptional reliability.
There are hundreds, if not thousands, of peripherals that can be connected to the Avalanche kit. Developers can work with all kinds of sensors, drivers, displays, wireless modules, etc.
FEATURES
Best in Class Features of PolarFire FPGAs• Lowest-power Flash-based FPGA• Lowest cost 10G SERDES based FPGA• Lowest cost DDR4 and high-speed I/O solutions • Smallest form factors
- 11 x 11mm 100KLE - 11 x 14.5mm 200KLE - 16 x 16mm 300KLE
• Highest security• SEU immune fabric• Flash-based, no configuration chip required• 2-5x more 3.3V I/O
FUTUREM2GL-EVB
ONLY $9995
(USD)
AVMPF300TS-02-NA (comes with Gold Libero License)
ONLY $17995
(USD)
To buy products or download data, go towww.FutureElectronics.com/FTM
PAN9420: Fully Embedded Stand-Alone Wi-Fi Module for Highly Integrated and Cost-Effective Applications
Introducing Panasonic’s fully embedded stand-alone Wi-FI Module, the new PAN9420 Series!
The PAN9420 is a 2.4GHz 802.11 b/g/n embedded Wi-Fi module with integrated stack and API that minimizes firmware development and includes a full security suite. It is specifically designed for highly integrated and cost-effective applications.
The module includes a fully shielded case, integrated crystal oscillators and a chip antenna. The PAN9420 Series combines a high-performance CPU, high-sensitivity wireless radio, baseband processor, medium access controller, encryption unit, boot ROM with patching capability, internal SRAM and in-system programmable flash memory.
The modules’ integrated memory is available to the application for storing web content such as HTML pages or image data. Parallel support of access point and infrastructure mode allows easy setup of simultaneous Wi-Fi connections from the PAN9420 to smart devices and home network routers.
The pre-programmed Wi-Fi SoC firmware enables client (STA), micro access point (μAP), and Ad-hoc mode (Wi-Fi direct) applications. With the transparent mode, raw data can be sent from the UART to the air interface to smart devices, web servers or PC applications.
APPLICATIONS
• White goods• Vending machines• Home appliances
The PAN9420 evaluation kit is available with one PAN9420 mother board (MB), one PAN9420-ETU daughter board (includes the PAN9420 FCC version module), and one USB-cable packaged in a large case.
FEATURES AND BENEFITS
• Fully embedded: integrated full-featured network stack • Contains all necessary IoT functionality (place and play) • Integrated webserver with AJAX/JSON for Web applications • No stack or software implementation needed on a host MCU • Simultaneous support of access-point and infrastructure mode • Fully automatic IP configuration • DHCP server offers IP configuration in AP mode • Access by names (http://Yourdevice) • Integrated TCP/IP network stack: Ipv4, ARP, and AutoIP • Supports tls/ssl, https, and Wi-Fi security (Wpa2) for secure
data connection • Over-the-air firmware update • Two UART interfaces (command and transparent data) • Integrated QSPI Flash memory for customer Web contents and
configuration file • Programming via standard Jtag • Evaluation kit with pre-installed Web application for quick
prototyping available • Evaluation and development tool WiFigurator for Windows • Getting started tutorials, PC tool, Quickstart guide • Wide temperature ranges of -40°C to +85°C • RoHS and REACH compliant
Part Numbers Description Series Name
ENW- 49C01A3KF
Fully embedded stand-alone Wi-Fi module IEEE 802.11 b/g/n
PAN9420Supported channel: Channel 1 ~ 11, 2412 ~ 2462MHz
ENW49C01AYKF1x Motherboard, 1xUSB-stick, manual, 1x USB-cable in a large plastic case FCC version
PAN9420KIT
PAN9420 Fully Embedded Stand-Alone Wi-Fi Module and Evaluation Tool
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COMPONENT FOCUS
14
Flex Grip Wire Connectors
TE Connectivity’s (TE) Flex Grip wire connector is one connector for a broad range of solutions.
These push-in connectors have operating levers for fast, easy and releasable wire termination and accommodate for a combination of 24AWG to 14AWG (0.2 to 4.0mm2) solid and stranded wires. The transparent body allows users to visually confirm the proper wire strip length and insertion for good electrical installation.
APPLICATIONS
• Lighting and commercial building equipment• Indoor, interior, retrofit lighting• Home automation applications• Residential wiring system
TE Connectivity, TE and TE connectivity (logo) are trademarks.
KEY BENEFITS
• Allows for fast and easy termination to decrease installation time
• Provides flexibility to rework wiring and reuse the connector
• Accommodates for many combinations of solid and stranded wires
• Confirm wire insertion and proper strip length visually with clear housing
• Achieve results with built-in test slot
ELECTRICAL
• Current rating: 16A• Voltage rating: 600 V AC/DC
MATERIALS
• Housing: PA UL94-V0 and PC UL94-V2• Contact: brass and stainless steel spring
MECHANICAL
• Operating temperature: max +85°C• Wire range: 24 to 14AWG solid and stranded
0.2 to 4.0mm2 solid and stranded
CviLux – USB Type-C Connectors and Cables
The USB Type-C connector is designed to accept a plug in any direction. We offer a variety of different styles depending on your application.
The CviLux USB-C to USB-C cable charges your USB-C enabled device quickly and safely. Simply plug into any USB-C port to not only charge, but sync and transfer data as well. With a sleek and low profile connector, this cable’s minimal design harnesses the incredible power within.
SPECIFICATIONS
• Receptacle opening: ~8.3 x ~2.5mm• Durability: 10,000 cycles• Improved EMI and RFI mitigation features• Provide one interconnect solution for data
up to 10Gbps, power up to 100W at 20V• Power delivery capacity: 3A for standard
cables, 5A for connectors
FEATURES
• Waterproof options available• Instant current filter• E-Mark IC (optional), support power delivery 3.0• Overcurrent protection (optional), backup safety• 4-axis force durability• Supports USB 2.0/USB 3.1 Gen 1 (5Gbps)/USB
3.1 Gen 2 (10Gbps)• ABS connector housing or PVC modeling with
SS10 logo indicating full USB-IF compliance• Electronic marker identification, authentication,
and power delivery management circuit• Precision-welded metal shield to protect PCB
and E-Mark (also minimizes radiated emissions levels and provides additional mechanical strength)
• “Crimp” locks metal shield in place for optimal mechanical structure and shielding
APPLICATIONS
• Notebooks and tablets• Smartphones• Power and charge other devices• Type-C hub and adapter• Audio/visual devices• A/V digital switches• Gaming devices• Medical devices• Storage devices• Wearables• Consumer products
To buy products or download data, go towww.FutureElectronics.com/FTM
To buy products or download data, go towww.FutureElectronics.com/FTM
TE Connectivity (TE) introduces the compact,
IP67 rated, two position automotive ATM mini fuse
holder. These accept AMP MCP 2.8 contacts and
can be mounted using standard DEUTSCH DT and
AMPSEAL 16 connector mounting clips.
Constructed of heavy-duty thermoplastic to
withstand severe vibration and mechanical shock,
this fuse holder can accommodate two active fuses
and two spares. With TE's mounting clips, available
in 90° and 180° options and in thermoplastic or
metal material, you can easily add accessible circuit
protection into your heavy-duty vehicle and
equipment.
For more information or to buy products, go to:
www.FutureElectronics.com/FTM
Easily add accessible circuit protection with our sealed mini fuse holder
Side Mount Straight Mount Fir Tree Mount
DEUTSCH DT, AMPSEAL 16, TE Connectivity, TE and TE connectivity (logo) are trademarks.
1.800.FUTURE.1 • www.FutureElectronics.com
COMPONENT FOCUS
16
TE Connectivity’s (TE) Potter & Brumfield T9G relay series is a 30A Power PCB relay for HVAC, appliance and industrial control applications.
The T9G relay is the smallest relay in its class with a 30% smaller package size and 13% less PCB floor space all while keeping the standard footprint, allowing manufacturers to add more components on PCBs without having to compromise on relay performance. By having UL, CQC and VDE certifications, TE’s T9G series is a versatile relay that can be used globally and through its PCB and quick-connect terminations, it is user-friendly and easy to install.
APPLICATIONS
• HVAC • Appliances • Industrial controls • Energy management
Potter & Brumfield 30A PCB Relay T9G Series
FEATURES AND BENEFITS
• 30% smaller package size • Creepage/clearance (8mm at voltage ratings
up to 480VAC) with reinforced insulation • UL, VDE and CQC listings • PCB and quick connect terminations • RoHS compliant cadmium free contact • Better PCB utilization in same footprint• 30A switching in NO and 20A in CO• Minimum board space (29 x 21.5mm) • Option for load connections via 0.250”
(6.3mm) quick connect terminals• 4kV dielectric withstand and 8kV surge
voltage between coil and contacts
ELECTRICAL
• Rated current: 30A• Rated voltage: 480 VAC max.
MECHANICAL
• Contact arrangement: 1 form A (NO), 1 form B (NC), 1 form C (CO)
• PCB mounting or PCB mounting with quick connects
• Wash-tight (with knock off nib) or flux-proof plastic case
TE Connectivity. All Rights Reserved. Potter & Brumfield, TE, TE Connectivity, and the TE connectivity (logo) are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product and Company names mentioned herein may be trademarks of their respective owners.
VS.30% Smaller
T9G29mm length21.5mm width15.7mm height
T9A32.5mm length27.4mm width20.4mm height
Same Footprint
Uses 10% less energy*
13% less PCB floor space...
*In certain applications
DC Coil 30A PCB Relay
T9G SERIES
Dimensions
Mounting and termination code 2
Dimensions in millimeters (inches)
Mounting and termination code 1
MATERIAL
• Contact material: AgSnO
To buy products or download data, go towww.FutureElectronics.com/FTM
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Accelerate Time to Revenue Capitalize on Future Electronics’ experience and expertise to go to market quickly
Control Cost Future Electronics offers highly competitive, highly discounted NRE
Global Expertise Leverage Future Electronics’ pool of global talent in North America, EMEA, and Asia
Embrace Process Driven and Quality Assurance for Exceptional Products Design exceptional products through rigorous processes and quality assurance
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COMPONENT FOCUS
Dialight Optopipe® panel mount light pipes provide an excellent solution for products that contain a PCB that is parallel to the front panel in need of indication.
The UL94-V0 water clear polycarbonate light pipes are secured to the front panel with a press fit that is easy to install. Dialight Optopipe solu-tions are a cost effective way of bringing indica-tion to your front panel.
FEATURES AND BENEFITS
• Designed for both single and multi-color LEDs• Lens styles: flat, domed, and convex• Molded from RoHS compliant UL94-V0 water clear
polycarbonate with an oxygen index of 35%
3MM PCB Mount• Variable lengths available from .250” to 1.250”• Positive snap-in mounting to PCB• Opaque light barrier eliminates light bleed• Used with Dialight surface mount LEDs
597-XXXX-207F and -507, and 598-XXXX-XXXF• Available in clear lens (F) and diffused textured
lens (DF)
3MM and 5MM Panel Mounts• Lengths varying from .125” to 1.500”, custom
length available upon request
Vertical Light Pipe for PCB Mount and Panel Mount Applications
• Available in diffused textured lens only• Optimally designed to be used with Dialight
surface mount LEDs• See Dialight Surface Mount Selector Guide for
LED options• Recommend PLCC-2 and PLCC-4, surface mount
LEDs part number: 597-xxxx-207F• Light is produced by surface mount LEDs
through photonic emission, not as a by-product of radiating heat source
• Low voltage and minimal power consumption
3mm and 5mm Optopipe Panel Mounts
3mm Optopipe PCB Mounts
Solder Fortification® Preforms
©2018 Indium Corporation
QFN
Edge Connector
Through-hole
RF Shielding
• Increase solder volume to strengthen solder joint
• Improve shape and volume of fillet to ensure joints meet IPC specifications
• Eliminate costly, time-consuming processes
• Packaged in tape & reel to maximize pick rate
Contact us for the Solder Fortification® Design GuideTo access the Solder Fortification® Design Guide, for more information or to buy products, go to www.FutureElectronics.com/FTM
To register to qualify to receive FREE samples, buy products or download data, go towww.FutureElectronics.com/FTM
Available in 13 length options
(custom lengths are also available upon
request with minimal NRE charges)
FREE Samples Available!
We Accelerate Time to Revenue by Providing
u The Most Comprehensive System-Level Product Portfolio
u Solid-State Lighting Expertise
u Design Support Services
u Global Supply Chain and Business Solutions
www.FutureLightingSolutions.com
Making LED Lighting Solutions Simple™
2018 LIGHTFAIR InternationalMay 6 – 10, 2018McCormick Place
Chicago, IL USABooth #837
21
ANALOG CORNER
20
ANALOG CORNER
FEATURES
• 2.4MHz switching frequency• 2.3V to 5.5V operating input range • Up to 0.6A output current• Output discharge• Short circuit protection (SCP) with hiccup mode• Enable (EN) pin for power sequencing• Output adjustable from 0.6V • 120mΩ and 80mΩ internal power MOSFET switches• 100% duty cycle• Stable with n=low ESR output ceramic capacitors
MP21600: 0.6A, 5.5V, 2.2MHz, Synchronous Step Down ConverterThe MP21600 is a monolithic, step down, switch-mode converter with built-in, internal power MOSFETs. The MP21600 achieves 0.6A of continuous output current from a 2.3V to 5.5V input voltage range with excellent load and line regulation. The output voltage can be regulated as low as 0.6V. The constant-on-time (COT) control scheme provides fast transient response and eases loop stabilization. Fault protections include cycle-by-cycle current limiting and thermal shutdown.
FEATURES
• 4.5V to 75V input voltage range• 5A current capability• 0.6V internal reference • High voltage internal LDO for single supply operation• Supports start-up to pre-bias output• 0.6V to 32V (limited by duty cycle) adjustable output• Adaptive constant on time control• Adjustable 270KHZ to 800KHZ switching frequency• Operation with both internal and external VDD
• Internal compensator for tight output regulation
MIC28514/15: 75V Hyper Speed Control Synchronous Buck RegulatorsThe MIC28514/15 is a family of wide input range (4.5V to 75V) integrated FET, 5A switching regulators. The MIC28514/15 is leveraging the latest enhanced high voltage COT controllers co-packaged with a pair of low FOM power trench N-channel FETS with improved avalanche rating. The output voltage is adjustable down to 0.6V with ±1% accuracy. The MIC28515 offers a “mode” select pin allowing the user to choose in between hyper light load and hyper speed control operations. The MIC28514 offers the option of external “soft start” feature in place of “mode” select pin allowing the user the flexibility to adjust soft start using an external capacitor.
MAX14878/79/80: 2.75kV and 5kV Isolated CAN TransceiversThe MAX14878-MAX14880 family of high-speed trans-ceivers improve communication and safety by integrating galvanic isolation between the CAN protocol controller side of the device and the physical wires of the network (CAN) bus. The MAX14879 provides up to 2750VRMS (60s) of galvanic isolation, while the MAX14878/MAX14880 provide up to 5000VRMS (60s) of galvanic isolation. All transceivers operate up to the maximum high-speed CAN data rate of 1Mbps. The MAX14879/MAX14880 feature an integrated standby input (STB) on the isolated side of the transceiver to disable the driver and place the transceiver in a low-power standby mode. The MAX14878 does not include the standby input.
DGD2136: Three-Phase Half Bridge Gate DriverThe DGD2136 is a three-phase gate driver IC designed for high-voltage/high-speed applications, driving N-channel MOSFETs and IGBTs in a half bridge configura-tion. High-voltage processing techniques enable the DGD2136’s high side to switch to 600V in a bootstrap operation. Its logic inputs are compatible with standard TTL and CMOS levels (down to 3.3V) for easy interfacing with controlling devices and are enabled low to better function in high noise environments. The driver outputs feature high-pulse current buffers designed for minimum driver cross conduction. A shoot-through protection logic prevents both outputs from being high when both inputs are high (fault state), an under-voltage lockout for VCC shuts down the respective high side output. An overcur-rent protection will terminate the six outputs.
FEATURES
• 200mA source/350mA sink output current capability• 3.3V logic input • Matched prop delay for all channels• Schmitt triggered logic inputs• Under-voltage lockout for all channels• Overcurrent protection shuts down drivers• Outputs tolerant to negative transients, dV/dt immune• 290ns internal dead time to protect MOSFETs• Outputs out of phase with inputs• Cross conduction prevention logic• -40°C to +125°C temperature range
Drivers
Interface
Power Regulation, Conversion and Management
FEATURES
• 2.75kVRMS or 5kVRMS withstand isolation voltage for 60s (galvanic isolation)
• ±15kV HBM ESD • UL1577 certified • Two available 16-pin SOIC package pin configurations • Up to 1Mbps (max) data rates• ±25V receiver input common-mode range • ±54V fault protection on receiver inputs• 1.71V to 5.5V supply for the CAN controller interface • Dominant timeout protection• 1k MSRP: $2.90 US
MP21600
GND
FB
VIN
C110µF
EN
VIN5V
VOUT1.2V
SW
C210µF
R1200kΩ
R2200kΩ
EN
OUT
L11µH
To buy products or download data, go towww.FutureElectronics.com/FTM
Sensors
FEATURES
• Best global shutter efficiency• High linear full well• Small form factor• Low dark current/hot pixels• Low operational power
FEATURES
• Triaxis® hall technology• 4μs output refresh rate • Selectable magnetic field axis (X/Y - X/Z - Z/Y)• Selectable sensitivity range (10mT to 70mT)• Programming through the connector• Sine and cosine analog outputs• 3.3V and 5V operating supply voltage• End-of-shaft/through-shaft operation• Ratiometric outputs• -40°C to +150°C operating temperature range
FEATURES
• ±1.5% RH accuracy (HS3001, 10 to 90% RH, +25°C)• ±0.2°C typical (-10°C to +80°C) temperature sensor
accuracy• 24.4μA average power consumption• Excellent stability against aging• Robust protection from harsh conditions and
mechanical shock• 6 seconds response time• 14-bit resolution: 0.01% RH (typical)• 2.3V to 5.5V supply voltage• 3.0 x 2.4 x 0.8mm LGA package
AS6200C: Cold Chain Digital Temperature SensorThe AS6200C is a complete digital sensor system designed to fulfill the challenges of cold chain applications in storage and transportation. It is very well suited for data loggers complying with EN12830:1999 class 1 standard as well as enriching the performance of domestic and commercial refrigerators. The AS6200C provides a fully calibrated and linearized sensor system that can easily be accessed via an I²C interface. It provides a resolution of 12-bit with its highest accuracy of ±0.2°C from +20°C to -10°C.
FEATURES
• ±0.4°C (20°C to 65°C) measurement accuracy• ±1°C remaining operating temperature span• 1.8V to 3V supply voltage range• Alert functionality for exact temperature control• 6μA operation (at 4Hz) current consumption• Digital temperature sensor• No calibration or linearization needed• 1.5 x 1mm (WLCSP) package
HS3001/2/3: High-Performance Relative Humidity and Temperature SensorsThe HS300x series is a highly-accurate, fully-calibrated relative humidity and temperature sensor. The high accuracy, fast measurement response time, and long-term stability, along with the small package size, makes the HS300x ideal for a wide number of applications from portable to harsh environments. An integrated calibration and temperature compensation logic provides fully corrected RH and T values via a standard I²C output. The HS300x family consists of four devices – the HS3001, HS3002, HS3003, and HS3004 offering RH measure-ment accuracy of ±1.5%, ±1.8%, ±2.8% and ±3.8%, respectively.
MLX90380: Fast Pre-Programmed Magnetic Resolver ICThe MLX90380 is a monolithic contactless sensor IC sensitive to the flux density applied orthogonally and parallel to the IC surface. High-speed dual analog outputs allow the MLX90380 to deliver accurate sine/cosine signals when used with a rotating permanent magnet. With a wide range of operating temperature, supply voltage and magnetic flux density, the MLX90380 can resolve the angular position of a rotating axis over 360 degrees in many industrial and automotive applications.
AR0144: 1/4-Inch 1.0 Mp CMOS Digital Image Sensor with Global ShutterThe AR0144 is a 1/4-inch 1.0 Mp CMOS digital image sensor with an active-pixel array of 1280H x 800V. It incorporates a new innovative global shutter pixel design optimized for accurate and fast capture of moving scenes. The sensor produces clear, low noise images in both low-light and bright scenes. It includes sophisticated camera functions such as auto exposure control, windowing, row skip mode, column-skip mode, pixel-binning and both video and single frame modes. It is programmable through a simple two-wire serial interface. The AR0144 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications, including scanning and industrial inspection.
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TECHNICAL VIEW TECHNICAL VIEW
22 23
Mid-Power LEDs: Now a Valid Low-Cost Light Source for Street Lights?
By: Emmanuel Gardette, Field Application Engineer, Future Electronics
LED street lighting designs are entering a new phase. Lighting equipment manufacturers are attempting to maintain all the benefits of LED street lamps – their long operating lifetime, low power consumption, and pleasing light output with good colour rendering – while at the same time substantially reducing the Bill-of-Materials (BoM) cost of the luminaire.
One way to reach this goal appears to be the use of alternative types of LED, replacing today’s high-power LED light sources with cheaper mid-power LEDs. This article describes the technical problems that OEMs face in implementing this change, and the efforts that LED manufacturers are making to support the change.
High-Reliability, High-Power LEDsHigh-power LEDs are a proven light source in street lights installed in some of the hottest as well as some of the coldest parts of the world. Highly dependable, their construction is robust, featuring materials which are immune to corrosion and which tolerate extreme ambient conditions. Normally supplied with ESD protection integrated in the package, high-power LEDs are today in operation in thousands of installations, casting bright white light in precisely shaped beam patterns.
The robustness of high-power LEDs is a crucial part of their appeal to street light OEMs, since the luminaire might be exposed both to extreme temperatures and to air polluted by vehicle exhaust fumes, industrial emissions and other airborne contaminants (see Figure 1).
So while the high unit cost of high-power LEDs – typical price: performance ratios are in the 500lm/$ range – is a deterrent to their use, street light OEMs have until now continued to depend on the devices because of their long-term reliability in harsh outdoor conditions. This continued reliance on high-power LEDs, however, could now be about to end.
Figure 1: Smog over Almaty city, Kazakhstan. LED street lights commonly have to operate in polluted urban air. (Image credit: Igors Jefimovs under CC 3.0 licence)
Mid-Power LEDs: Cheaper, Less RobustThe problem for street light OEMs used to be that the cheaper alternative to high-power LEDs – mid-power LEDs are typically valued at around 1,000lm/$ – also posed too high a risk of premature failure.
That is because mid-power LEDs have a less robust construction than high-power LEDs: a plastic case rather than a ceramic substrate, and a silver-plated leadframe. These components are inherently less resistant to chemical contamination and thermal stress than non-corrodible material, and contamination is indeed one of the new risks associated with the introduction of mid-power LEDs in street lights. Under the benign and stable conditions in which indoor lights operate, this risk does not arise, and so mid-power LEDs are very widely used in indoor luminaires. The broad adoption of mid-power LEDs has led to the development of a rich ecosystem of compatible components, such as optics, drivers and connectors, supporting the leading manufacturers’ families of mid-power LEDs. This ecosystem, as well as their low unit cost, help to make the mid-power LED an attractive choice for manufacturers of street lights.
Outdoors, however, conventional mid-power LEDs are prone to suffer impairment or failure in ways that manufacturers of indoor lighting are not familiar with: • Contamination (sulphuration) of the silver
plated leadframe, which can cause a reduction in flux and colour shift due to oxidation of the metal. In separate detailed application notes, Nichia and LG explain the process and conse-quences of silver sulphuration (see Figure 2).
• Degradation of the plastic case material due to thermal or mechanical stress
• The wire bonding used in mid-power LEDs can break. This effect depends on the ingredient and concentration of the corrosive gas.
At a system level, of course, street light OEMs design their products for a certain Ingress Protection (IP) rating, typically as high as IP68. It might be thought that this gives sufficient protection from contamination. But this is to gamble on the lifetime of the luminaire: • Contamination might reach
the LED in the luminaire’s assembly or maintenance process
• Discoloration by the gases (sulfure, chlorine or other halogen compounds)
• The root cause: silver may turn black (or tarnish) when exposed to gases
• Reaction mechanism: 2Ag + S → Ag2S (black)
Figure 2: The effect of sulphur contamination of a silver leadframe. (Image credit: LG Innotek)
• Materials used to make the luminaire might contain corrosive gases. These might be found in the gasket, glue or paint, for instance.
• Components installed in the luminaire can emit gases in operation
The risk of impairment or failure is clearly worrying for manufacturers of street lights: municipal authorities and other buyers will normally specify extremely long operating lifetimes of 15 years or more, and set tight conditions governing long-term lumen maintenance and, in some cases, colour shift. This means that shifts in correlated color temperature (CCT) – a measure of the relative yellowness or blueness of a fixture’s white light output – flux reductions or catastrophic failures attributable to contami-nation could trigger claims against the fixture manufacturer’s warranty.
How Manufacturers are Hardening Mid-Power LEDs
There is, then, a clear market need for an alter-native to the high-power LED in street lights, one which can both withstand harsh conditions and which is cheaper.
Now LED manufacturers are responding to this need by introducing new families of mid-power LEDs which are hardened for use in street lights. These new devices tend to be produced as two-die packages with a 3030 outline. For example,
Lighting Market Trend I High Reliability LEDCompetitive Solution Provider for Sulfur Tolerant
High Reliability
Figure 3: The anti-contamination features of the LG Innotek 3030N LEDs produces improved lumen maintenance when exposed to hydrogen sulphide. (Image credit: LG Innotek)
To buy products or download data, go towww.FutureElectronics.com/FTM
LG Innotek has carried out intensive research to understand the process by which hydrogen sulphide (H2S) and sulphur oxide (SOx) gas contaminates LED lamps, and this underlies the design of its mid-power 3030N LEDs: their package has excellent EMC characteristics, and features silver terminations which are coated to protect them against corrosion (see Figure 3). The 3030N products are valued at approximately 1,000lm/$.
LG is also demonstrating the effectiveness of its design with extended product testing to which standard mid-power LEDs are not subjected. Tested in accordance with the IEC60068-2-43 and IEC60068-2-42 standard, the LEDs’ performance is measured when operating in the presence of air contaminated with sulphur.
Nichia is another LED manufacturer which aims to support the demand for exterior mid-power LEDs, and has done numerous studies on the contamination and oxidation risks affecting its LEDs. Tests based on different classes of corro-sive gas (according to ISO11844), and field tests to measure the increase in mass of the silver elements of the LED attributable to oxidation, led Nichia to develop a new approach to the testing of sulphur contamination: as defined by IEC 60068-2-60, Nichia now performs accelerated testing in a mix of H2S and nitrogen dioxide (NO2) at 40°C and a relative humidity of 75%. All its 757 family devices are tested under these conditions for 240 hours to determine the impact of oxidation and to inform lumen maintenance models.
Lumileds has taken a different approach to solving the problem. Its HR30 (HR stands for ‘High Robustness’) series of LEDs are described by the company as a bridge between high-power and mid-power LEDs in outdoor and industrial applications. They feature a gold-plated lead-frame (eliminating the liability to contamination that mid-power LEDs with a silver leadframe suffer from) and a high-reflectance SMC housing. According to Lumileds, the HR30 devices offer ‘superior corrosion and chemical resistance to all mid-power solutions, including those specially treated for that purpose’. In contrast to high-power LEDs, however, the HR30 devices feature a lower maximum current rating of 240mA. The HR30 devices are valued at between 500lm/$ and 1,000lm/$.
Again, testing in the presence of harsh chemicals demonstrates the robustness of these hardened LEDs. The results shown in Figure 4 are drawn from tests conducted in accordance with the IEC 60068-2-43 method 4 standard, with a 15ppm
Figure 4: Relative colour (CCT) shift in LEDs including the HR30 from Lumileds, tested in air contaminated with H2S. (Image credit: Lumileds)
concentration of H2S in the air at a temperature of 45°C and relative humidity of 75%. Lumileds has also introduced tests performed in the pres-ence of dichlorine (Cl2) gas. The gold leadframe performs well in these tests, whereas silver can react with Cl2 to form silver chloride (AgCl).
Ecosystem Supporting 3030 FormatAs described above, the 3030 format is the favoured package outline supported by manu-facturers of mid-power LEDs for street lighting. To help speed adoption of these 3030 packages, optics manufacturers have developed various arrays which are compatible with street lighting specifications for illuminance, uniformity and glare.
The avoidance of glare is made easier by the use of mid-power LEDs: since they emit less light than high-power LEDs, they need a larger light-emitting surface (LES) for any given illuminance value.
Besides reducing the effect of glare, the optic must also produce the precise beam patterns required in street lighting. LEDiL’s approach has been to match the mechanical dimensions of its STRADA family of optics for street lights that use high-power LEDs. Its STRADELLA family (www.ledil.com/stradella) accommodates the increased number of points of light in a mid-power design, while still producing beam pattern suitable to a streetlight.
Carclo, by contrast, has developed an array specifically for mid-power LEDs. Its 12821 (www.carclo-optics.com/optic-12821?optictype =freeform) product is for an array of 84 mid-power LEDs, and produces a beam pattern suitable for P and S class street lighting. CARCLO has also characterized its street light optics when used with LEDs in the 3030 package.
Driver implementation for mid-power designs should not be difficult. Even though the number of LEDs in a mid-power design is higher, the light manufacturer should be able to use the same driver as for a high-power LED system, using a parallel-series connection between the LEDs. (High-power LEDs are usually connected all in series.)
Mid-power LEDs also give system designers the opportunity to think afresh about the power supply. In some cases an AC-direct solution, in which the power-management circuit is implemented directly on the light engine board, and which offers space and cost savings over a conventional switch-mode power supply, might be a viable choice for street lights.
New LED Choices for Street Light OEMsThere is, then, a new opportunity for manufac-turers of street lights to substantially reduce the BoM cost of their products by using a new generation of hardened mid-power LEDs. Equip-ment designers should, however, bear in mind the optical properties of mid-power LEDs. When producing mid-power LEDs, manufacturers use a cheaper process for phosphor-coating the die than for their high-power LEDs, instead embed-ding the die in a rectangular ‘bath’ of phosphor. This means that the phosphor coating is thicker at the sides than at the centre of the die, resulting in inherent non-uniformity of CCT across the beam. By contrast, high-power LEDs have a coating of a uniform thickness over the entire light-emitting surface, producing an almost perfectly uniform CCT across the entire beam.
In very many street lighting applications, the lumen depreciation attributable to environmental conditions, coupled with any colour shift, will be of negligible concern to specifiers and users. In some high-traffic areas, however, such as city center (downtown) pedestrianised streets, specifiers set very strict criteria for quality of light, and here the use of mid-power LEDs might be inappropriate.
It is also worth noting that street light manufac-turers are looking not only to mid-power LEDs but also to Chip-Scale Package (CSP) LEDs as an alternative to high-power LEDs, in their efforts to improve performance and lifetime and reduce system cost.
Certainly the new generation of hardened mid-power LEDs from Lumileds, LG Innotek and Nichia promises good performance at a much reduced cost compared to high-power LEDs, and looks set to make future street-lighting products more competitive and more attractive to potential buyers.
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