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Application of Embedded Planar
Passives in Medical Electronic Designs
MEPTEC Medical Technology
Conference
September 17-18, 2013
Tempe, AZ
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Agenda
• Background on Embedded Passives
• Drivers for Embedded Planar Passives
• Products and Board Types Utilizing Planar Embedded Passive Technology
• Case Studies: Electrical Performance/EMI Data
• SMT Component Elimination Examples
• Existing and Potential Medical Applications
• Summary
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Background on Embedded
Planar Passives
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Passive
Embedded Components
Formed Placed
Active Capacitors Resistors
Materials are added to the
printed circuit structure to
create the passive element.
The component is placed
on an internal layer then
buried as additional layers
are added.
Source: JISSO International Council, May 2004
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Passive
Embedded Components
Formed Placed
Thin Film Thick Film
Plated
Vacuum
Deposited
Active Capacitors
Copper Clad
Laminates
Thick Film
Unfilled
dielectric
Filled
dielectric
Resistors
Thin Film
Embedded Component Segmentation
Source: TechSearch International
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Product
Description
Sheets of Cu-clad laminate
Very thin, high Dk dielectric
Uses Power-ground innerlayer (distributed capacitance)
for rigid and flex PWBs and IC packages
Singulated (discrete-like) capacitors for
decoupling, filtering and other functions in rigid
and flex PWBs and IC packages
Cap. Density up to 20 nF/in2
Ideal for high frequency decoupling
Eliminates discrete capacitors
Dampens plane resonances
Cu Foil (17-35 um)
Cu Foil (17-35 um)
Embedded Planar Capacitance
Laminate Materials
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Planar Embedded Capacitance: PCB Processing
Board Cross Section
Pattern Capacitors
Planar EC layer
Laminate into PCB
Supply EC Panels to PCB Fab
Cu
^ EC Dielectric
Embedded Planar Resistor Materials
Construction
Resistive coated copper or laminate form
Resistive Layer <1 micron thick
Common dielectrics, glass styles & thickness
COPPER FOIL (17-35 um)
COPPER FOIL (17-35 um)
DIELECTRIC PREPREG
Thin film resistive layer (10-1000 ohms/sq)
Planar Embedded Resistance: PCB Processing
Remove Cu
Ammoniacal etching
solution
Define Width
Apply photoresist
Expose and develop
Remove Cu and NiCr
resistive layer
Cupric chloride etching
solution
Strip photoresist
Define length
Apply photoresist
Expose and develop
Strip photoresist
Photoresist
ED copper foil
Resistive layer
Dielectric
TCR Laminate
(then laminate into board)
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Drivers for Embedded
Planar Passives
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4. Cost
2. Space/Weight
1. Performance
Drivers for Embedded Planar Passives
Surface
Mount Cap Active Device
Embedded Capacitor
Complexity
Cost Discrete
Embedded
3. EMI
- Improved Signal Integrity
- Improved Power Integrity
- Reduced Noise
-SMT component, pads, vias, solder eliminated
-Opens area on external layers for more actives
- Power bus noise is a leading cause of EMI
- Board size/thickness reduction
- Reduced assembly costs
5. Reliability
- Elimination of components/solder joints/vias
Planar EPs: Cost Reducers and Adders
Board
Board Assembly
System/Design
Material costs
PCB processing costs
Potential lower yields
Smaller board sizes
Reduced layer counts
Fewer solder joints/vias
Difficult to alter
embedded materials
Eliminated components
Reduced assembly costs
Improved yields
Fewer design cycles
Faster layouts
Eliminated EMI measures
Improved reliability, service life
Adders Cost
Reducers Cost
Trend…
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Planar Embedded Passives:
Products and Board Types
Main Uses for Planar EP by Board Type
• High Speed Digital/Mixed Signal
– EC: Power Supply Decoupling
– ER: Termination, Pull Up/Pull Down Resistors
• Analog
– EC: Low Pass Filters (incl. RFI Mitigation)
– ER: Low Pass Filters (incl. RFI Mitigation)
• RF
– ER: Power Dividers
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*EC can also be potentially used for DC block/AC coupling , band pass filters, timing
*ER can also be potentially used for power combiners and current limiting
Non-Medical Planar EP Applications
By Market Segment
Computer High-end servers, Supercomputers, Storage
Consumer Electronics
Mobile handheld devices including smartphones, Video,
MEMS sensors including microphones
Chip Packaging
Processors, Memory Modules
Military / Aerospace Aircraft & missile avionics, Radar, Satellites
Telecom Routers, Base stations, Switches
Miniaturization Performance/EMI Component Reduction
Test & Measurement Automated test equipment
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High C/A Needed in MEMS Module
Early design with 2 SMT
components (lid removed)
Later design with Planar EC and
ER replacing SMT components
Planer EP materials have been used in Smartphones since 2005
Over 1 Billion phones shipped with Planar EP materials
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Planar EP Case Studies
Comparison of Power Bus Noise on Board with and
without Planar Embedded Capacitance
Power noise ripple of FR4 board is much higher than ECM board (156 mV vs. 24 mV)
ECM board shows superiority over FR4 on noise reduction in entire bandwidth (10MHz-4GHz)
ECM board noise close to white noise of Spectrum Analyzer in higher frequency over 1.5GHz
Very promising for ECM to improve power supply quality, digital /analog interference in board and board level EMI
-160
-140
-120
-100
-80
-60
-40
-20
0
0.01
0.14
0.26
0.39
0.52
0.65
0.77
0.9
1.03
1.15
1.28
1.41
1.54
1.66
1.79
1.92
2.04
2.17
2.3
2.43
2.55
2.68
2.81
2.94
3.06
3.19
3.32
3.44
3.57
3.7
3.83
3.95
GHz
dBm
3M C-PLY19 (0.75mil)
FR4 (3.54mil)
Power ripple noise comparison in time domain Power noise frequency spectrum comparison
Courtesy of Huawei
0
10
20
30
40
50
60
70
30
101
172
243
314
385
456
527
598
670
741
812
883
954
1025
1096
1167
1238
1309
1380
1451
1522
1593
1664
1735
1807
1878
1949
Frequency (MHz)
dBuV/m
3M C-PLY19 (0.75mil)FR4 (3.54mil)
Full Wave
Darkroom Radiated Emission Test Result (30MHz - 2GHz )
Radiated Emission Test in standard full wave darkwave for FR4/ECM board.
Obvious better performance of ECM board from 30M to 2G ( only tested up to 2G)
Board Level EMC Performance Comparison – Test Result
Courtesy of Huawei
Signal Integrity Comparison
of SMT and Embedded Resistor
Embedded resistors provide 30% improvement in SI at 1 Gb/sec due to decreased reflections caused by impedance discontinuities
Courtesy of Applied Laser Technology
50 ohm SMT resistor
50 ohm embedded resistor
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SMT Component Elimination Examples
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Discrete Capacitor Elimination on Telecom Board
Baseline Design (BGA1) Embedded Capacitance Design
(BGA1)
Embedded Capacitance Design
(BGA2)
Baseline Design (BGA2)
VS
VS
Over 600 SMT
decoupling
caps removed
from board
Thin Film Metal Resistor - Increased available PWB surface area
Surface Mounted Embedded
Image courtesy of GMA Manufacturing
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Existing and Future Planar
EP Medical Applications
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Existing Medically Related Use of Planar EPs
• Low pass filters in microphones for hearing aids to meet space/thickness, RFI immunity, SNR requirements
• Decoupling in medical imaging (CT/PET/MRI/Combo) to meet noise, EMC, bandwidth, BER requirements
• Low pass filters in microphones for smartphones, tablets/laptops to meet space/thickness, RFI immunity, EMI, SNR requirements
• Decoupling in supercomputing/cloud computing (Medical/Pharmaceutical Research) to meet noise, EMC, data rate requirements
Existing volume usage primarily limited to expensive high speed
digital and MEMS microphones applications
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Potential Future Use of Planar EP Materials
• MEMS use in medical applications is expected to dramatically increase in the near future
• Applications include sensors, microfluidics (such as Lab on Chip), drug delivery (microneedles) and others
• Sensors is a very large opportunity due to the large number of sensor types needed including chemical, biological, motion, pressure, temperature, acoustic, etc.
• Sensors will be needed for on/internal patient use (implantable, ingestible, wearable) as well as external use
• Many patient based sensors will need to communicate to external devices
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Planar EP Material Advantages in MEMS Sensors
• Planar embedded passive technology is a good solution for many medical MEMS applications since they can typically meet the space/thickness, electrical performance, mechanical /reliability requirements better than SMT solutions
– Extremely thin and flexible (can be flexed/formed/folded)
– Compatible with rigid, flex and rigid-flex PCB fabrication
– Compatible with microvia (laser drilling) technology
– Have extremely low electrical parasitics
– Have tolerance, temperature, voltage and frequency characteristics that are suitable for many applications
– Have very high reliability since components, solder joints and vias are eliminated
– Have good thermal, mechanical and chemical resistance
Examples of Planar EPs with HDI and in Flex
Laser Drilled Microvias in Planar Embedded Capacitance Board
Flex Circuit with Planar Embedded Capacitors
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Combined EC/ER/HDI Board Stack Up
Planar EC, ER and HDI (microvias) utilized together to maximize space reduction and electrical performance on automotive PCB
Signal 3
Signal 1
Signal 2
Ground
Power 1 +
filter caps
Power 2/3 +
filter caps.
Embedded
resistors
Ground
Microvia
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Summary
• Planar embedded passives are a proven technology that offer many benefits over SMT solutions
• Currently planar embedded passives have limited use in high volume medical applications
• MEMS and in particular, MEMS sensors, are expected to increase dramatically in use in medical applications
• Planar embedded passives technology should allow medical MEMS sensors to better meet their requirements and be implemented at a faster rate
Embedded Capacitance
3M
Joel S. Peiffer [email protected]
651-575-1464
Embedded Resistance
Ticer Technologies
David Burgess
480-223-0891
Contact Information