Apple iPhone X – IR Dot Projector - System Plus...©2017 System Plus Consulting| Apple iPhone X 3D...

©2017 System Plus Consulting | Apple iPhone X 3D Dot Projector 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Apple iPhone X – IR Dot Projector Dot Projector bundle including Heptagon

Imaging report by Sylvain HALLEREAUDecember 2017

mailto:[email protected]

http://www.systemplus.fr/


Table of ContentsOverview / Introduction 3

o Executive Summaryo Reverse Costing Methodology

Company Profile 7o Supply chaino Heptagono Lumentumo TrueDepth Module Supply Chaino Apple iPhone X Teardown

Physical Analysis 22

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Dot Projector teardown

o Ceramic Package 39

View, Dimensions & Marking

Cross-Section

Process Characteristics

Broadcomm BCM15952 IC

Schottky Diode

o NIR VCSEL 62 Die View, Dimensions & Marking Cavity Cross-Section Process Characteristics

o Folded Optic 71 View, Dimensions & Marking Disassembly & Main Blocks Identification Lens Cross-Section Process Characteristics

o Active DOE 99 DOE Dimensions DOE Disassembly & Main Blocks Identification DOE Cross Section Process Characteristics

o Comparison: Apple Dot Projector, Intel Real Sense, PMD/Infineon 126

Manufacturing Process Flow 130o Global Overview of the Dot Projectoro Package Front-End Process Flowo Package Fabrication Unito NIR VCSEL Front-End Processo NIR VCSEL Wafer Fabrication Unito Folded Optic Wafer Process Flowo Folded Optic Wafer Fabrication Unito DOE Wafer Process Flowo DOE Wafer Fabrication Unito Final Assembly Unit

Cost Analysis 150o Overview of the Cost Analysiso Yields Explanation and Hypotheseso Integrated Circuito Ceramic Packageo NIR VCSELo Folded Optic

Folded Optic Front-End Cost Folded Optic Front-End Cost per process steps Folded Optic Back-End 0 : Probe Test and Dicing Folded Optic Wafer and Die Cost Folded Optic Component Cost

o DOE Activeo Back-End : Final Assembly Costo Back-End : Final Assembly Cost per Process Stepo 3D Illumination Module Component Cost

Estimated Price Analysis 180

o 3D Illumination Module 181

Company services 183


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• The Apple iPhone X brings totally new functionality based on the TrueDepth technology. This project isissued from a collaboration including Lumentum for the VCSEL diode and Heptagon for the active DOE andfolded optic.

• The iPhone X implements this technology using a Dot Projector. The subsystem features a 30,000 dotsprojector from Heptagon. We estimate that the Active DOE and the folded optic are manufactured byHeptagon. The electronic package is assembled by an OSAT. The IC driver is designed by Broadcom. The no-grid VCSEL array diode is manufactured by Lumentum. Heptagon performs the assembly of the DotProjector.

• To provide the 30,000 dots, the VCSEL supplies the IR light and the Folded Optic directs the IR light to theActive Diffractive Optical Element (DOE). Finally, the Active DOE divides the light beam into 30,000 dots oflight. The VCSEL is driven in power, beam shape and frequency by an ASIC from Broadcom.

• The report includes technology and cost analysis of the Dot Projector. These analyses provide the technicalintelligence necessary to understand this technology.

• A comparison between the Dot Projector and the Intel Real Sense projector and the PMD/Infineon solutionare performed.


Overview / Introduction


Physical Analysis o Synthesiso Teardowno Ceramic Packageo IC Broadcomo NIR VCSELo Folded Optico Active DOEo Comparison


Cost Analysis


About System Plus

Dot Projector Teardown

Dot Projector – Global View©2017 by System Plus Consulting

Dot Projector – Bottom View©2017 by System Plus Consulting

Dot Projector – Flex Marking©2017 by System Plus Consulting

Dot Projector – Flex Removal©2017 by System Plus Consulting Dot Projector – Flex Removal

©2017 by System Plus Consulting

Dot Projector

RGB Camera

FlexCeramic

CeramicsubstrateThe Dot Projector module has a ceramic substrate with a

separate ceramic block under the VCSEL.






Cost Analysis


About System Plus

Dot Projector Dimension

XXmm

Dot Projector – Global View©2017 by System Plus Consulting

XXmm

XXmm

XXXmm

Ceramic Substrate

Bottom Lenses Substrate

Light Guide

Top Lenses

DOE

Ceramic Substrate


Light Guide

Top Lenses

DOE

Flex

Flex






Cost Analysis


About System Plus

Dot Projector Teardown

Dot Projector – Opened View©2017 by System Plus Consulting

VCSEL


Light Guide

The optical block is glued on top of the ceramic substrate.






Cost Analysis


About System Plus

Dot Projector – AlN Ceramic






Cost Analysis


About System Plus

NIR VCSEL Die View and Dimensions

XXm

m

XX mm

Die Area: XXmm²(xx x xx mm)

Nb of PGDW per 3-inch wafer: XX

Pad number: x

Wire Bonding: XX

VCSEL – Optical View© 2017 by System Plus Consulting






Cost Analysis


About System Plus

NIR VCSEL Die Cross-Section

Seed layer in titanium for the gold layer: 0.05µm






Cost Analysis


About System Plus

Folded Optic - Disassembly






Cost Analysis


About System Plus

Active Diffractive Optical Element - Disassembly

DOE Disassembly – Optical View© 2017 by System Plus Consulting




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso Broadcom BCM15952

Costo NIR VCSEL Wafer & Die

Costo Ceramic Package Costo Folded Optic Costo Active DOE Costo Assembly Costo Component Cost


About System Plus

Broadcom BCM15952 Front-End Cost




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso Broadcom BCM15952

Costo NIR VCSEL Wafer & Die

Costo Ceramic Package Costo Folded Optic Costo Active DOE Costo Assembly Costo Component Cost


About System Plus

NIR VCSEL Front-End Cost per Process Steps

Sensor Manufacturing Steps Cost (Simulated with LED CoSim+ Cost Simulation Tool)




Physical Analysis


Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

3D Illumination Module Estimated Manufacturer Price


COMPANYSERVICES




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models a Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Feedbacks

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Physical Analysis


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.




Physical Analysis


Cost Analysis



Legal

DISCLAIMER

System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic componentsand systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in thereport. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of thisreport. The quoted trademarks are property of their owners.

Reverse Costing® is a deposed brand, by System Plus Consulting.

SERVICES

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed byindustry experts.

These results are open for discussion. We can reevaluate this circuit with your information.

Apple iPhone X – IR Dot Projector - System Plus...©2017 System Plus Consulting| Apple iPhone X 3D...

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Transcript of Apple iPhone X – IR Dot Projector - System Plus...©2017 System Plus Consulting| Apple iPhone X 3D...