ANSYS Solution to the Electronics Industry

© 2009 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary© 2009 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary

ANSYS Solution to the Electronics Industry ANSYS Solution to the Electronics Industry

Fadi Ben AchourANSYS IncDirector of Electronics Industry Marketing

Fadi Ben AchourANSYS IncDirector of Electronics Industry Marketing

© 2009 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary

Presentation Outline

• ANSYS Multiphysics solutions

– Electronics cooling solutions

– Structural mechanical solutions

– Electromagnetic solutions (Ansoft)

• New ANSYS R12 and WB 2.0 capabilities

• New Icepak 12.0 capabilities


ANSYS Solutions to the Electronics Industry


ANSYS and the Electronics Design Flow

PackageIC ManufacturingIC Design(EDA industry)

Metal Chemical Vapor Deposition Courtesy Novellus systems


ANSYS and the Electronics Design Flow

Printed Circuit Board (PCB) End Product


Thermal Management with Icepak Semiconductors: Ball Grid Array (BGA)


Thermal Management with Icepak Communication : Server and Routers


Micro channels

Advanced CFD and Multiphysics Simulation

Piezoelectric fan

Blower and fan modeling

Thermo-Electric cooler


Thermal mechanical Stress:BGA Solder and Lead frame

Exaggerated deformation due to the CTE mismatch between the different materials


Moisture content

Images courtesy PADT Inc.

Uses Fick’s Law of Diffusion to simulate moisture content and resultant hygroscopic strain

Moisture swelling - displacements

¼ Symmetry model

Moisture Induced Stress


Random Vibration

Acceleration

Deformation

Equivalent stressFixed support

PSD vibration excitation

plane


Drop Test Simulation with ANSYS Explicit STR: Cell Phone Example

Absolute displacement Von Mises stress

After 6ms


Ansoft Simulation Solutions

RF & Microwave

IC design & verificationSignal & power integrity

FEA

sourceA1

sourceA2

sourceB1

sourceB2

sourceC1

sourceC2

Magnet01

Magnet02

Name ValueFEA1.FEA_STEPS

SIMPARAM1.RunTime [s] 26.41kSIMPARAM1.TotalIterations 34.51k

SIMPARAM1.TotalSteps 6.00k

ω+

ICA:

+ΦGAIN

CONST

CONST

EQUBL

EQUBL

EQUBL

1500 rpm

LL:=922u

RA:=2.991

ANGRAD

57.3

-60+PWM_PER

-30+PWM_PER

QS1

QS2

QS3

VAL[0] := mod( INPUT[0] ,INPUT[1] )

PWM_T:=60

I_TARG:=9

I_HYST:=0.2

Q1

Q2

Q3 Q5

Q4 Q6

400 V

THRES := PWM_T

EQUBL

CONST

QS4

-90+PWM_PER

EQUBL

CONST

QS5

-120+PWM_PER

EQUBL

CONST

QS6

-150+PWM_PER

RA Ohm LL H

LDUM:=10m

0

8.50

5.00

0 30.00m20.00m

Q1.CTRL + Q2.CTRL + Q3.CTRL + Q4.CTRL + Q5.CTRL + Q6.CTRL

-10.30

10.00

0

0 30.00m20.00m

LA.I [A] LB.I [A] LC.I [A] PWM_PER:=180

INPUT[1] := PWM_PER

INPUT := -LB.I

LC.I

-LA.I

LB.I

-LC.I

LA.I

THRES1 := I_TARG - I_HYST

THRES2 := I_TARG + I_HYSTVAL1 := 1VAL2 := 0Y0 := 1

-14.50

7.80

0

0 30.00m20.00m

Torque Output

-30.00k

302.00k

200.00k

0 30.00m20.00m

FEA Outputs

FEA1.WIRE FEA1.CORE FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.PHI FEA1.OMEG

0

8.50

5.00

0 30.00m20.00m

QS1.VAL + QS2.VAL + QS3.VAL + QS4.VAL + QS5.VAL + QS6.VAL

Electromechanical systems


Data Integration Parameterization

Scripting Optimization

New Workbench 2.0 Architecture!Scalable & Adaptable Framework

Data Integration

Scripting

Parameterization

Optimization

Geometry

GeometryModeler

CADInterface

Meshing

WorkbenchMeshing

Modeling

CFXSetup

FLUENTSetup

StructuralSetup

MultiphysicsSolvers

Therm

Struct

FLUENT

Emag

CFX

Evolution of Multiphysics Engineering Simulation

11.0 12.0 13.0

Supports All Simulation Services

PostProcessing

FluidsPost

StructuralPost

Add-ins

Data &ProcessMgmt

FLUENT Integrated Into WorkbenchCommon CFD Postprocessor




Geometry

CADInterface

Meshing

WorkbenchMeshing

Modeling MultiphysicsSolvers

Therm

Struct

FLUENT

Emag

CFX


11.0 12.0 13.0

PostProcessing

StructuralPost

Add-ins

Data &ProcessMgmt

StructuralSetup

Project Management Simulation Workflow

Innovative Workflow System Accelerates Innovation




Geometry

CADInterface

Meshing

WorkbenchMeshing

Modeling MultiphysicsSolvers

Therm

Struct

FLUENT

Emag

CFX


11.0 12.0 13.0

PostProcessing

StructuralPost

StructuralSetup

Add-ins

Data &ProcessMgmt


Vertical Products Designed to Address Industry Needs

Turb

o

Offs

hore

Ele

ctro

nics

Pol

ymer

s

…





11.0 12.0 13.0

Geometry

GeometryModeler

CADInterface

Meshing

3rd PartyMeshing

WorkbenchMeshing

Modeling

CFXSetup

FLUENTSetup

StructuralSetup

MultiphysicsSolvers

Therm

Struct

FLUENT

Emag

CFXMultiphysics

Setup ANSYS

3rd

Party

PostProcessing

MultiphysicsPost

FluidsPost

StructuralPost

Add-ins

…

3rd PartyFatigue

Tool

Data &ProcessMgmt


Turb

o

Offs

hore

Ele

ctro

nics

Pol

ymer

s

…

Fully Integrated Multiphysics Simulation Environment


Complete Analysis Systems

Drag the desired analysis type onto the Project Schematic

Drag the desired analysis type onto the Project Schematic

The Analysis Systems group contains a set of pre-defined systems listed by analysis

type (and solver)

The Analysis Systems group contains a set of pre-defined systems listed by analysis

type (and solver)


Using ANSYS Workbench 2.0 “Editors”

Edit operation launches the application associated with the

cell to define details.

Edit operation launches the application associated with the

cell to define details.


Using ANSYS Workbench 2.0 “Editors”

SmartSmartEngineeringEngineeringSimulationSimulation

ProcessProcessCompressionCompression


Post-Processing Results

All cells are now up to date.

The simulation is complete.

All cells are now up to date.

The simulation is complete.


Adding to Your Project

Now, let’s add a Structural simulation with loads transferred from CFD.

Now, let’s add a Structural simulation with loads transferred from CFD.

Select Static Structural.

Drag it into your project.

Select Static Structural.

Drag it into your project.SmartSmart

EngineeringEngineeringSimulationSimulation

Virtual Virtual PrototypingPrototyping


Consider a More Complex Project

SmartSmartEngineeringEngineeringSimulationSimulation

Engineered Engineered ScalabilityScalability


New in 12.0Random Vibration


New Product at ANSYS 12.0►ANSYS Explicit STR►WB product integrated into simulation ►ANSYS AUTODYN solver

Benefits►First explicit capabilities native to WB ► Include CAD connectivity, WB meshing

tools, contact detection► Post process in WB and Data sharing

with DM, DX applicationsApplications• Drop tests of consumer electronics• On board electronics in projectiles• Electronics in automotive crash

New in 12.0Introduce ANSYS Explicit STR


ANSYS Icepak

ANSYS Icepak is robust and powerful computational fluid dynamics (CFD) software for electronics thermal management of packages, boards and systems.

• Steady State and Transient– Conjugate Heat Transfer– Conduction– Convection– Radiation

• Package, Board, and System Level Analysis


ANSYS Icepak 12.0:Overview of Major Enhancements

• GUI enhancements with ANSYS WB graphics options• Meshing enhancements

– Multi-level meshing• Modeling enhancements

– Multiple Reference Frame (MRF) modeling of fans• ANSYS Iceboard integration

– Trace Joule heating and SIwave import of powermaps• ANSYS Icechip Integration

– ECAD import of various packages with detailed component modeling

• ANSYS Workbench integration– CFD Post as an additional post-processing option


Meshing:Mesher-HD - Uniform Params

Mesher-HD for ANSYS Icepak 12.0: • New feature “Uniform Params”

effectively blocks interactions between sub-blocking meshes– Non-conformal mesh in sub-

blocks– Uniform mesh sizes– Lower mesh count– Improved quality

Mesh Count ~ 20kLowest quality= 0.026


Multi-level Meshing: An Example

No Multi-level MeshMesh size = 0.4 mm; Count = 931k

Multi-level MeshMesh size = 2 mm; Count = 343k


Meshing:Multi-level meshing - Global Controls

• Setting number of meshing levels– Automatically– Per-object basis

• Automatic levels– Proximity– Curvature

• Per-object levels– Can set levels for

every object independently


Advanced in PCB Design

• Electrical power distribution engineering using SIwave

• Thermal Management & Engineering using Icepak– With component layout from IDF format neutral

file.– With Accurate Board Conductivity distribution

from metal layers imported from Cadence .brd file

– Joule heat distribution of the metal layers imported from ANSYS SIwave


ANSYS Icepak 12.0: Board design

• New options– Import TCB file– Resize PCB block based on information in ECAD file– Trace heating


Trace Heating

• Trace heating panel– Display list of traces on

each layer in order of areas (descending)

– Filtering based on area (default 20% of max area)

– Selecting trace in list highlights trace in GDA

– Creation of trace block based on geometry criteria• Trace angle• Trace arm length


Trace Heating Boundary Conditions

• Set current/voltage for atleast two sides of poly block • Create sources (2D) at any location on block surface

– New current/voltage spec for source object• If sources used to specify current /voltage

– Ensure current flow is conserved


Meshing of Trace Blocks

• HD Mesher recommended – body fitted mesh necessary• Enclose trace block in non-conformal assembly• Use appropriate mesh sizes and minimum gap values


Trace Heating - Example


Package Object : MCM import

• Enhanced Package Object– Import trace and via geometry,

wirebonds, solder ball, solder bumps, etc from MCM database

– Control package location– Component visibility


Package Object: Solder Ball and Solder Bump Array Import

• Import of solder ball and solder bump arrays– Location and number– User can specify height and diameter– Cylindrical or prismatic geometry


Package Object: Die and Wirebonds

• Wirebond import– Geometry approximated as polygonal thin plates

• Die location and dimensions imported– For MCM, can be modified for each die

Wirebonds


•Comprehensive multiphysics and multi-scale simulation capabilities

Only company offers complete structural, fluids and Electromagnetic simulation capabilities

Multiscal package, board and system level simulation capabilities •Tools that enables innovation, speed and accuracy

DesignXplorer offers comprehensive optimization, design of experiment and design for six sigma capabilities

Continues improvements in solvers speed and accuracy and in HPCVertical application focused products like: ANSYS Icepak, SIwave

•Integrated EDA and CAE platforms WB 2.0 provides a platform for integrating ANSYS and third party

EDA and CAE tools Simplorer provides a multi-domain system level simulation tool for the

design of high-performance electromechanical systems

ANSYS Provides the Industry with Unmatched Breadth and Depth

ANSYS Solution to the Electronics Industry

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