ANSYS 17.0 Capabilities - Brochure

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    ANSYS 17.0 Capabilities

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    STRUCTURES

    Strength Analysis

    Static l  l  l  l  lBuckling - Linear l  l  l  l Buckling - Nonlinear l  l  l  l Substructuring l Geometric Nonlinearity 

    Large Strain l  l  l  l  l Large Deection l  l  l  l  l  lMaterial Models 

    Linear Material Models l  l  l  l  l  l  lRate Dependant Plasticity l  l  l Rate Independent Plasticity l  l  l  l Rate Dependent Hyperelasticity l  l  l Rate Independent Hyperelasticity l  l  l  l Viscoelasticity l  l  l 

    Creep l Reactive Materials l  l Contact Modeling 

    Bonded / No Separation Sliding l  l  l  l  l  l  lPretension (bolts, etc.) l  l  l  l Joints l  l  l  l  lSpot Welds l  l  l  l  l Nonlinear Contact Modeling 

    Rough l  l  l  p   l  l  lFrictionless l  l  l  p   l  l  lFriction l  l  l  l  l  lGaskets l 

    Cyclic Symmetry Analysis l  l  l  l Rezoning l  l Adaptive Remeshing l  l  l Submodeling l  l  l  l Element Birth and Death l  p p  Fracture Mechanics l Vibration Modal l  l  l  l  lSpectrum l  l Harmonic l  l Random Vibration l  l 

    Rotordynamicsl  l 

    Super Elements & ComponentMode Synthesis l 

    Mistuning l

      ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM  Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA

      Enterprise Premium

    l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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      ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM  Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA  Enterprise Premium

    l = Fully Supportedp= Limited Capability p= Requires more than 1 product

    Thermal Conduction l  l  l  l  l  l  lConvection l  l  l  l  lRadiation l  l  l  lPhase Change l  l  l  l  l Steady State l  l  l  l  lTransient l  l  l Motion

    Rigid Body Mechanisms l  l Rigid/Flexible Transient l Impact 

    Interactive Prep/Post and Solution l Remapping in Space l Remapping Solution Methods l Mass Scaling l  l l De-Zoning l 

    Part Activation and Deactivation l Part Addition/Removal

    During a Simulation l Erosion Based on Multiple Criteria l  l l Natural Fragmentation l  l Euler Solver l 2D Solver l  l l Implicit-Explicit Deformations p   l l Implicit-Explicit Material States p   l Durability Stress-Life (SN) l  l  l  lStrain-Life (EN) l  l  l  l

    Dang VanSafety Factor l  l  l Composite Materials Material Denitions l  l  l l Layers Denitions l  p   l l Solid Extrusion l First-ply Failure l  l Last-Ply failure l Delamination l  l l Draping l HPC – Structures 

    Parallel Solving on Local PC Option l  l  l  l  l  l  lParallel Solving over Network Option l  l  l  l  l CPU Support l  l  l  l  l  lGPU Support l  l  l

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      ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS ANSYS AIM  Mechanical Mechanical Mechanical Pro DesignSpace Autodyn LS-DYNA

      Enterprise Premium

    l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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    MULTIPHYSICS

    Platform Technologies

    Advanced, Automated Data Exchange l l l lAccurate Data Interpolation Between l l l l Dissimilar Meshes l p p

    Drag-n-Drop Multiphysics l lDirect Coupling Between Physics l lCollaborative Workows lFully Managed Co-Simulation lFlexible Solver Coupling Options l

    Fluid-Structure Interaction

    Force Induced Motion p  p p  p p  lFluid Thermal Deformation p  p p  p p  l

    Electro-Thermal Interaction

    Conduction Cooled Electronicsp  p p p p

    High Frequency Thermal Management p  p p p pElectromechanical Thermal p  p p p p Management

    Other Coupled Interactions

    Vibro-Acoustics lAcoustics-Structural pElectric-Magnetic lElectrostatic-Structural lMagnetic-Structural lElectromagnetic-Thermal l

    Piezoelectric lPiezoresistive lThermal-Electric l lThermal-Structural l l l l lThermal-Electric-Structural l l 

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      ANSYS CFD

      ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM

     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

    FLUIDS

    General Solver CapabilitiesComprehensive Inlet and Outlet l l l l l l lConditionsSteady-State Flow l l l l l l l l l

    Transient Flow l l l l l l l2-D and 3-D Flow l p l p p p l  Time Dependent Boundary Conditions l l l l l l lCustomizable Materials Library l l l l l l l lFan Model l l l lPeriodic domains l l l l l l lDynamic/moving-deforming mesh l l l l l lOverset Mesh lImmersed-solid/MST method for l l lmoving partsFlow-driven solid motion (6DOF) l l lPressure-based coupled solver l l l l l l l l lDensity-based coupled solver l lAutomatic on-the-y mesh generation l   l lwith dynamic renementDynamic Solution-Adaptive l l l l l p l  Mesh renement

    Single Phase, non reacting flowsIncompressible Flow l l l l l l lCompressible Flow l l l l l l lPorous Media l l l lNon-Newtonian Viscosity l l l lTurbulence - Isotropic l l l l l l lTurbulence - Anisotropic (RSM) l l l

    Turbulence - Unsteady (LES/SAS/DES) l lTurbulence - Laminar/Turbulent l l l lTransitionFlow Pathlines (Massless) l l l l l lFan Model l l l lAcoustics (Source Export) l l lAcoustics (Noise Prediction) l

    Heat TransferNatural Convection l l l l lConduction & Conjugate Heat Transfer l l l l l l lInternal Radiation - Participating Media l l l l lInternal Radiation - Transparent Media l l l

    External Radiation l l l lSolar Radiation & Load l l

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      ANSYS CFD

      ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM

    Particles Flows (Multiphase)Coupled Discrete Phase Modeling l l l l l lInert Particle Tracking (With Mass) l l lLiquid Droplet (Incl. Evaporation) l l l lCombusting Particles l l l l

    Multicomponent Droplets l l l lDiscrete Element Model (DEM) lBreak-Up And Coalescence l l l l

    Free Surface Flows (Multiphase)Implicit And Explicit VOF l l l lCoupled Level Set/VOF l l lOpen Channel Flow And Wave l lSurface Tension l l l lPhase Change l l l lCavitation l l l l

    Dispersed Multiphase Flows(Multiphase)Mixture Fraction l lEulerian Model l l l lBoiling Model l l lSurface Tension l l lPhase Change l l l l lDrag And Lift l l l lWall Lubrication l l lHeat And Mass Transfer l l l l lPopulation Balance l l l lReactions Between Phases l l l l

    Reacting FlowsSpecies Transport l l l l lNon-Premixed Combustion l l l lPremixed Combustion l l l lPartially Premixed Combustion l l l lComposition PDF Transport l lFinite Rate Chemistry l l l lPollutants And Soot Modeling l l l lSparse chemistry solver with dynamiccell clustering and dynamic adaptive l l lchemistryAbility to use Model Fuel Library l l lmechanisms

     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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      ANSYS CFD

      ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM

    Flame-speed from Fuel-component lLibraryDPIK Spark-ignition Model lFlame-propagation using level-set l  method (G-equation)Internal Combustion Engine l l l lSpecic Solution0-D/1-D/2-D reactor models and l  reactor networksPlasma reactions lComprehensive surface-kinetics l lChemical and phase equilibrium l lFlamelet table generation l lFlamespeed and ignition table lgenerationReaction sensitivity, uncertainty l  

    and path analysisSurrogate blend optimizer lMechanism Reduction l

    Turbomachinery

    MRF/Frozen-Rotor l lSliding-Mesh/Stage l lTransient Blade Row lBlade Flutter Analysis lForced Response Analysis l

    In-Flight Icing

    Simulates Droplet Sizes lSimulates Ice Growth and Performs lVisibility StudiesModels Heat Transfer Anti- and lDe-icing Heat LoadsRotating frame of reference for theanalysis of turbomachines, rotors land propellersModel ice accretion at engine face(Fan and IGV) and within any number p of successive compressor stagesAerodynamic degradation (CFD) meets

    the requirements of Appendix C,l

    Appendix D (Ice Crystals) andAppendix O (SLD)

     l = Fully Supportedp = Limited Capability p= Requires more than 1 product

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      ANSYS CFD

      ANSYS ANSYS ANSYS ANSYS ANSYS CFD ANSYS CFD ANSYS ANSYS ANSYSFLUENT CFX POLYFLOW Forte FLO Professional FENSAP-ICE Chemkin AIM

    Shape Optimization

    Adjoint Solver for Sensitivity Analysis lMesh Morphing p

    High Rheology Material

    Viscoelasticity lSpecialty Extrusion Models lSpecialty Blow Molding Models lSpecialty Fiber Spinning Models l

    HPC – Fluids

    Parallel Solving On Local PC Option l l l l l l l lParallel Solving Over Network Option l l l l l l lCPU Support l l l l l l l lGPU Support l l

    MULTIPHYSICS 

    Platform Technologies

    Advanced, Automated Data Exchange l l l l l l lAccurate Data Interpolation Between l l l l l   l Dissimilar MeshesDrag-n-Drop Multiphysics l l l l lDirect Coupling Between Physics l l l l lCollaborative Workows l l l l lFully Managed Co-Simulation lFlexible Solver Coupling Options l l l l l

    Fluid-Structure Interaction

    Force Induced Motion l l l l lFluid Thermal Deformation l l l l l

    Electro-Thermal Interaction

    Convection Cooled Electronics lConduction Cooled Electronics lHigh Frequency Thermal Management lElectromechanical Thermal l Management 

    Other Coupled Interactions

    Aero-Acoustics l

    Acoustics-Structural l lFluid Magnetohydrodynamics p

    l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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    ELECTRONICSLow Frequency ElectromagneticsElectrostatics l AC Conduction lDC Conduction l

    Magnetostatics lAdaptive Field Mesh lAC Harmonic Magnetic lElectric Transient lHPC Frequency Sweeps lHPC Enabled Matrix Multiprocessing lHPC Time Distribution Solver lMagnetic Transient

    Translational Motion lFully Automatic Symmetrical

    lMesh GenerationLayered Mesh Generation lRotational Motion lNon-Cylindrical Motion lAdvanced Embedded Circuit Coupling lCircuit Coupling with Adaptive

    lTime SteppingDirect and Iterative Matrix Solvers lAdvanced Magnetic Modeling

    Vector Hysteresis Modeling lNonlinear Reduced Order Models lFrequency Dependent Reduced

    lOrder ModelsEquivalent Model Extraction

    l(Linear-Motion, Rotational-Motion, No-Motion)

    Nonlinear Anisotropic Materials lFunctional Magnetization Direction lMagnetization/De-magnetization

    lModelingTemperature De-magnetization

    lModelingCore Loss computation lLamination Modeling lHigh Frequency ElectromagneticsFrequency and Time Domain Analysis l

    Eigenmode Analysisl

    Hybrid Finite Element/Integrall

    Equation Analysis

      Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS  HFSS SIwave Icepak

     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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    Modal Wave Port Excitation lLumped, Voltage and Current

    ExcitationsFloquet Excitations lIncident Wave Excitation l

    Magnetic Ferrite Bias Excitation lTerminal Solutions lPerfect Electric and Magnetic Boundary lFinite Conductivity Boundaries lLumped RLC Boundary lSymmetry Boundary lPeriodic Boundary lFrequency dependant materials lHigher and Mixed order Elements lCurvilinear Elements lFully automated adaptive

    mesh renementS,Y,Z Matrix Results lE, H, J, P Field Results lDirect and Iterative Matrix Solvers lHPC Frequency Sweeps lHPC Enabled Matrix Multiprocessing lHPC Distributed Hybrid Solving lAntenna Parameter Calculation lInnite and Finite Antenna Array

    CalculationsRadar Cross Section calculation lFSS, EBG and Metamaterial Calculation l

    Specic Absorption Rate Calculationl

    EMI/EMC Calculation lSystem Level EMI and RFI analysis l 

    Power and Signal IntegrityBoard Simulation Capabilities

    Electronics Desktop 3D Layout GUI l l l lECAD Translation (Altium, Cadence, l l l l Mentor, Pulsonix, & Zuken)MCAD (.sat) Generation from ECAD l l l lLead Frame Editor l l l l DC Voltage, Current and Power l l l 

    Analysis for PKG/PCBDC Joule Heating with ANSYS Icepak l l l l l

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      Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS  HFSS SIwave Icepak

     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

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     l = Fully Supportedp = Limited Capability p= Requires more than 1 product

      Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS  HFSS SIwave Icepak

    Passive Excitation Plane Resonance l l AnalysisDriven Excitation Plane Resonance l l AnalysisAutomated Decoupling Analysis l l

    Capacitor Loop Inductance Analysis l lAC SYZ Analysis - PI, SI, & EMI l l lDynamically Linked Electromagnetic

    l l l Field SolversChip, Package, PCB Analysis (CPM) l l lHPC SYZ Speed Up l l lNear-Field EMI Analysis lFar-Field EMI Analysis lCharacteristic Impedance (Zo) l PKG/PCB ScanFull PCB/PKG Cross-talk Scanning lTDR Analysis l l Transient IBIS Circuit Analysis lSerDes IBIS-AMI Circuit Analysis lMacro-Modeling (Network Data Explorer) l l l lSteady State AC (LNA) Analysis l lVirtual Compliance - DDRx, GDDRx,

    l & LPDDRxSynopsys HSPICE Integration lCadence PSPICE Support lElectromagnetically Circuit Driven l Field Solvers 

    RLCG Parasitic Extraction

    DCRL, ACRL & CG Solver l l l lIC Packaging RLCG IBIS Extraction

    l l l l for Signals & PowerTouchpanel RLCG Unit Cell Extraction l l l lAdaptive Meshing for Accurate l ExtractionBus Bar RLCG Extraction lPower Inverter & Converter

    Component ExtractionSpecialized Thin Plane Solver for

    Touchpanel ExtractionHPC Acceleration for DCRL, ACRL,

    l and CG3D Component Library l

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      Maxwell ANSYS SIwave-DC SIwave-PI ANSYS Q3D Extractor ANSYS  HFSS SIwave Icepak

     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

    Reduced RLCG Matrix Operations lSPICE equivalent Modeling Export lDCRL & ACRL Joule Heating Analysis

    l with IcepakMacro-modeling (Network Data Explorer) l

    2D Transmission Line Modeling Toolkit l2D Cable Modeling Toolkit l 

    Electronics Cooling

    Multi-mode Heat Transfer lSteady-state and Transient l CFD Analysis lTurbulent Heat Transfer lMultiple-uid Analysis lSpecies Transport lSolar Loading l

    Reduced Order Flow and Thermall 

    Network Modeling lJoule Heating Analysis l l l l l l lThermo-electric Cooler Modeling lThermostat Modeling lPackage Characterization lData Center Modeling l

    MultiphysicsPlatform Technologies

    Advanced, Automated Data Exchange l lAccurate Data Interpolation Between l l 

    Dissimilar Meshes l lDrag-n-Drop Multiphysics l lDirect Coupling Between Physics l lCollaborative Workows l lFully Managed Co-Simulation l lFlexible Solver Coupling Options l l 

    Electro-Thermal Interaction

    Convection Cooled Electronics l lConduction Cooled Electronics l lHigh Frequency Thermal Management  l

    Electromechanical Thermal Management  l

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      PowerArtist Pathnder ANSYS ReadhawkTotem

    SEMICONDUCTOR

    Integrated Circuit ReliabilityStatic and Dynamic Power EM

    l(Electromigration) AnalysisSignal EM Analysis for Average,

    l

    RMS and PeakFoundry Certied EM Rules Support

    lfor Advanced NodesTemperature-Dependent EM Analysis l lCTM and Package Aware Thermal

    lAnalysisSelf-Heat Calculation for FinFET Nodes l lTransistor-level Dynamic Signal

    EM AnalysisTransistor-level Vectorless Signal

    EM AnalysisTransistor-level Dynamic Power

    EM AnalysisLayout Based ESD Analysis lBump to Bump, Bump to Clamp,

    lClamp to Clamp Connectivity CheckBump to Bump, Bump to Clamp,

    lClamp to Clamp Resistance CheckHBM/MM/CDM ESD Analysis lResistance and Current Density

    lBased ESD AnalysisGuard Ring Weakness Checking l

    IC Power Effi ciency

    RTL Inference Based Power Analysisl

    Simulation Based (FSDB, VCD, SAIF)l

    and Vectorless Power AnalysisPhysically Aware RTL Clock Tree and

    lWire Capacitance ModelingPower Hotspot Identication by Logical

    Hierarchy, Design and Power CategoryAverage and Time Based Power

    lAnalysisUPF / CPF Based What-If RTL Power

    lExploration of Power DomainsPACE Model Generation lCross Probing Between Power Annotated

    Schematics, Waveforms and HDLSequential and Combinatorial Power

    Reduction Algorithms

     l = Fully Supportedp = Limited Capability p= Requires more than 1 product

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    PowerArtist Pathnder ANSYS ReadhawkTotem

    l = Fully Supportedp= Limited Capability p= Requires more than 1 product

    Block-level Data and Clock Gatingl 

    Opportunity Identication15 Clock, Memory and Logic Power

    Reduction TechniquesPower Reduction Opportunity

    Identication for Clock, Memory l and LogicPeak and di/dt Cycle Selection

    from FSDBRTL Power Driven Early Chip and

    Package Power Grid PlanningStandard Power Metrics Reporting l Tcl Based UI to OADB Power

    Database for Custom ReportsOn/O State Power Leakage Analysis l lVoltage Island Ramp-up /

    Ramp-down Analysis

    In-Rush Current Analysisl

    Driver / Receiver Hot-Pair Analysis lMixed-Mode Ramp-up and

    On-State AnalysisPower Gate/Switch Id-Sat Check lDriver/Receiver Dierential

    Voltage CheckPower Gate Optimization lPower Gate Delay Optimization lMixed-Mode VCD and Vectorless

    Power AnalysisLow Power IP/Block Analysis l

    Power Gated IP Analysis lAutomatic Switch Identicationl 

    and CharacterizationSwitched RAM Analysis l lLDO / Voltage Regulator Based

    Low Power Analysis

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      ANSYS Simplorer ANSYS SCADE ANSYS SCADE ANSYS SCADE  System Suite Display

    SYSTEMS & EMBEDDED SOFTWARE

    Virtual Systems Prototyping Integrated Graphical Modeling

    EnvironmentStandard Modeling Languages and

    Exchange FormatsExtensive Model Libraries l  Reduced Order Modeling (ROM) l  Power Electronic Device AndModule Characterization l  Model Import Interfaces l  Rapid Prototyping l  Modelica Library Integration l  

    Model-based Systems Engineering Model-Based System Design lFunctional Decomposition lArchitecture Decomposition l

    Allocation Of Functions ToComponents lModel Checks lSystem Model Di/Merge lSystem / Software Bi-Directional Sync l  Model Sharing And IP Protection l  Model-Based Interface Control

    lDocument ProductionCongurable For Industry Standards

    (IMA, AUTOSAR, Etc.)Product conguration for avionics

    ldevelopers

    Embedded Control SoftwareDevelopment Data Flow And State Machine Design

    lAnd Simulation CapabilitiesExtensive Set Of Libraries Delivered

    lAs Design ExamplesSimulation Capabilities l  Record And Playback Scenarios l  Integration In To Conguration

    lManagement EnvironmentPlant Model Co-Simulation Including

    FMI

    Coverage Analysis For Requirements- lBased Tests

    l = Fully Supportedp = Limited Capability p= Requires more than 1 product

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     l = Fully Supportedp= Limited Capability p= Requires more than 1 product

     

    ANSYS Simplorer ANSYS SCADE ANSYS SCADE ANSYS SCADESystem Suite Display

    Formal Verication lTiming And Stack Optimization lWorst Case Execution Time Estimates

    On TargetVerication Of Stack Space Requirements l  

    Certied Code Generation For DO-178C, l  EN 50128, ISO 26262, IEC 61508Certication Kits For DO-178C,

    EN50128, ISO 26262, IEC 61508

    Man-Machine Interface Software Model-Based Prototyping And

    Specication Of MMIsSupport Of OpenGl, OpenGl SC and

    OpenGL ESIntegration In To Conguration

    Management EnvironmentFont Management lOptimization Of Graphical Specications lPlant Model Co-Simulation Including

    FMIAutomatic Generation Of iOS and

    Android ProjectsCertied Code Generation For DO-178C,

    EN 50128, ISO 26262, IEC 61508Certication Kits For DO-178C,

    EN50128, ISO 26262, IEC 61508Testing capabilities l

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