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Transcript of Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries...
![Page 1: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/1.jpg)
Alliance Memory Inc.2014
![Page 2: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/2.jpg)
Worldwide HQ in
San Carlos California, USA
Sales offices in 7 countries
Warehouses in 3 countries – California
USA, Taiwan & Shanghai, China
Over 75 International Distributor Sales Offices
Over 55.6 million parts shipped worldwide
Over 300 products on offer
![Page 3: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/3.jpg)
Alliance Memory Products
![Page 4: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/4.jpg)
Fast Asynchronous SRAMs
Low Power Asynchronous SRAMs
ZMD Low Power Asynchronous SRAMs
Synchronous SRAMs
Synchronous DRAMs (SDRs)
DDR1, DDR2, DDR3 & Mobile DDR1 DRAMs
Alliance Memory Product Line
![Page 5: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/5.jpg)
Mobile Technology Industrial Medical
Consumer/Gaming Automotive Telecom/Networking
Alliance Memory Markets
![Page 6: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/6.jpg)
ABBDelta TauGEHoneywellHunter EngineeringMaximRockwellSiemens
Philips MedicalRespironicsMindrayDelphi Medical SystemsMassimoCardinal HealthC.M.T. MedicalOlympusGE MedicalNova BiomedicalAdvanced Medical InstrumentsPolycom
IPCTellabsPattonAvocentKofaxIntraRom
IGTFuturlogicHoneywellCantaloupe SystemsCrestronAltekMettlerHarman Music GroupIngersol RandDolbyWincorSmartDTVVeeder Root
Consumer/Gaming
Automotive
Industrial
Telecom/Networking
Medical
BoschDelphiBeckhoff Automation
Representative Customers
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Wafer Fab TestAssembly
Alliance Memoryships all material out of
warehousesin the USA, Taiwan or Shanghai
World-Class Manufacturing Partners
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World-Class Distributor Partners
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Published Article in Electronics Specifier Design Magazine by David Bagby CEO Alliance Memory
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Alliance Memory Financials
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5 Years Shipped Sales Revenues
![Page 12: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/12.jpg)
• Over 55.6 million parts shipped worldwide • Buffer stock programs• Quick sample turnaround – same day deliveries
Alliance Memory % Sales Revenue per RegionAmericas Total 35%
APAC Total 32%Europe Total 32%Japan Total 1%
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13
Product Roadmap
![Page 14: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/14.jpg)
All devices are in production64K New die rev in full production AS7C164A-15JCNVariety of package options: SOJ/TSOP I & TSOP II/DIP/BGAI-temp range devices fully screened at -40°C to +85°C 16M Available Now! (1M x 16) & 2M x8 - 10ns industrial temp - BGA (48-ball) TSOP II
8Kx815 ns
512Kx88 – 20 ns
256Kx168 – 20 ns
32Kx812 – 20 ns
32Kx810 – 20 ns
32Kx1610 – 20 ns
32Kx1612 – 20 ns
512Kx812 – 20 ns
256Kx1612 – 20 ns
128Kx810 – 20 ns
64Kx1610 – 20 ns
128Kx810 – 20 ns
64Kx1610 – 20 ns
5Volt
3.3Volt
64K 256K 512K 1M 4M
256Kx810 – 20 ns
128Kx1610 – 20 ns
2M
512Kx1610 ns
1Mx810ns
16M New!
1Mx162M x 810 ns
8M
Fast Asynchronous SRAM
Available
Now!
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256K
4M
64K
Density
0.18
Process
1M 0.18
0.18
0.35
0.18
2M
2012 2013 2017
In Production
2014 2018
8M 0.18
2015 2016 2019 2020+
Fast Asynchronous SRAM
512K
0.18
In production16M
16M Now available
0.18
16M – datasheet & Samples available now!
Sample
In production
In production
In production
In production
In production
In production
In production
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All devices are in productionVariety of package options: sTSOP/TSOPI/TSOPII/TFBGA/SOP/PDIPI-temp range devices fully screened at -40°C to +85°C 32M Now available! (2M x 16) – 48pin TSOP I
Datasheet available now! Production Q2-2013
8Kx870 ns
512Kx855ns
256Kx1655 ns
32Kx855 ns
128Kx855 ns
64Kx1655 ns
256Kx855 ns
128Kx1655 ns
Wide 2.7 – 5 Volt
8Kx855 ns
1024Kx855ns
512Kx1655 ns
8M 16M
1024Kx1655/70ns
2M 4M1M
4.5 – 5.5V Volt
64K 256K
32Kx870 ns
ZMD 8Kx8
35/55/70 ns
ZMD 32Kx8
35/55/70 ns
32M
2M x1655ns
Now availabl
e!
Low Power SRAM
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64K LPSRAM- Organization – x8- Package – 28pin SOP, 28pin DIP- Speed – 35, 55, 70ns- Temperatures:
Commercial 0 -70 C, Industrial -45 – 85 C, Automotive -45 – 125 C
256K LPSRAM-Organization - x8-Package- 28pin SOP, 28pin DIP-Speed – 35, 55, 70ns-Temperatures:
Commercial 0 -70 C, Industrial -45 – 85 C, Automotive -45 – 125 C
ZMD SRAM
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4M
64K In production0.35
Process
1M 0.15
0.35
0.15
256K
2012 2016 2018 2020
8M 0.15
16M 0.15
In Production
20172013 20152014 2019
Low Power SRAM
Density
2M 0.15
Production Q2-201332M 0.15
Sample
32M Now available!
In production
In production
In production
In production
In production
In production
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1M x 18166 MHz
512K x 36166 MHz
3.3 Volt
9M 18M4M
2.5 Volt
All devices are in production Various speed options Package options: 100 TQFP I-temp range devices fully screened at -40°C to +85°C
256Kx187.5ns/150Mhz/166Mhz
128Kx367.5ns/150Mhz/166Mhz
512Kx187.5ns/150Mhz
256Kx367.5ns/150Mhz
Synchronous SRAM
![Page 20: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/20.jpg)
4M In production
Process
0.18
0.18
2013 2016 2017
In production
In production
2019
9M
0.1818M
Production
20182014 20212015 2020
Synchronous SRAM
Density
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21
All devices are in production64M, 128M & 256M
Package options: 54pin TSOP II, 54 ball FBGATemp Range: Commercial, Industrial, Automotive
512MPackage options: 54pin TSOP II, Temp Range: Commercial, Industrial – New A die
16M Package options: 50pin TSOP II, Temp Range: Commercial only
3.3 Volt
AS4C4M16S-7TCN/BCN4M x 16
7ns
AS4C8M16S-7TCN/BCN
8M x 167ns
AS4C16M16S-7TCN/BCN
16M x 167ns
AS4C4M16S-6TIN/6BIN4M x 16
6ns
AS4C8M16S-6TIN/
6BIN8M x 16
6ns
AS4C16M16S-6TIN/6BIN
16M x 166ns
AS4C1M16S-7TCN
1M x 167ns
AS4C16M16S-6TAN
16M x 166ns
AS4C8M16S-6TAN8M x 16
6ns
AS4C4M16S-6TAN
4M x 166ns
AS4C32M16SA-7TCN
32M x 167ns
AS4C32M16SA-7TIN
32M x 167ns
128M 256M64M 512M16M
Synchronous DRAM (SDR)x16
![Page 22: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/22.jpg)
In full production – x16 63nm technology 16M
Density
63nm
Process
256M
70n
m
70n
m
128M In full production – x 16 70nm technology
In full production – x 16 70nm technology
Samples
Synchronous DRAM x 16
70n
m
64M
In full production – x 16 70nm technology
Production
512M**
70n
m
In full production March 2013 – x 16 70nm technologyJan13
2014 20152013 2016
**die shrink ‘A’ - awaiting details on process
New ‘A’ die Feb14
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64M, and 128M Package options: 86pin TSOP II, 90ball FBGATemp Range: Commercial and industrial temp
256MPackage options: 90ball FBGA onlyTemp Range: Commercial and industrial temp
3.3 Volt
128M 256M64M
AS4C2M32S- 5,6,7TCN/7BCN
6TIN/6BIN2M x 325,6,7ns
AS4C4M32S-6,7TCN/7BCN
6TIN/6BIN4M x 326,7ns
AS4C8M32S-7BCN6BIN
8M x 326,7ns
Synchronous DRAM (SDR)x32
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64M
Density
63nm BGA
Process
70nm BGA 256M
Samples
Synchronous DRAM x 32
128M
Production
In full production Feb 2013 – 2M x 32 – 63nm technologyJan13
Jan13 In full production Feb 2013 – 4M x 32 – 63nm technology
Jan13 In full production Feb 2013 – 8M x 32 – 70nm technology
2014 20152013 2016
90nm TSOP
63nm BGA
90nm TSOP
90nm TSOP
![Page 25: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/25.jpg)
64M, 128M , 256M and 512MPackage options: 66pin TSOP IITemp Range: Commercial, Industrial
2.5 Volt
128M 256M64M
AS4C4M16D1-5TCN
4M x 165ns
AS4C8M16D1-5TCN
8M x 165ns
AS4C16M16D1-5TCN
16M x 165ns
AS4C4M16D1-5TIN
4M x 165ns
AS4C8M16D1-5TIN8M x 16
5ns
AS4C16M16D1-5TIN
16M x 165ns
Synchronous DDR1 AS4C32M16D1-
5TCN32M x 16
5nsAS4C16M16D1-
5TIN32M x 16
5ns
512M
![Page 26: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/26.jpg)
64M
Density
70nm
Process
512M
63n
m
63n
m
256M
In full production by February 2013 – 70nm technology
Samples
DDR1
68n
m
128M
Production
Now!
Now!
Now!
Now!
In full production by June 2013 – 63nm technology
In full production by February 2013
In full production by March 2013 – 45nm technology
2014 2015
2013
2016Q1
Q2
Q3
Q4
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512M and 1GbPackage options: 512M – (32M x16) 84ball FBGA 1G (64M x16) 84ball FBGA 1G (128Mx8) 60ball FBGATemp Range: Commercial, Industrial
1.8 Volt
1Gb 1Gb512M
AS4C32M16D2-25BCN
32M x 1625ns
AS4C64M16D2-25BCN
64M x 1625ns
AS4C128M8D2-25BCN
128M x 825ns
Synchronous DDR2
AS4C32M16D2-25BIN
32M x 1625ns
AS4C64M16D2-25BIN
64M x 1625ns
AS4C128M8D2-25BIN
128M x 825ns
![Page 28: Alliance Memory Inc. 2014. Worldwide HQ in San Carlos California, USA Sales offices in 7 countries Warehouses in 3 countries – California USA, Taiwan.](https://reader033.fdocuments.us/reader033/viewer/2022051418/5697bffb1a28abf838cc1254/html5/thumbnails/28.jpg)
Density Process
45n
m
50n
m
1GB(128x8)
Samples
DDR2
1GB(64x16)
Production
Now!
Now!
In full production – 50nm technology
In full production – 45nm technology
2014 2015 2016
2013
Q1
Q2
Q3
Q4
512M 68nm In full production – 68nm technologyNow!
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1Gb, 2Gb and 4GbPackage options: 1G (128Mx8) 78ball FBGA / 1G (64M x 16) 96ball FBGA2G (128Mx16) 96ball FBGA /2G (256Mx8) 78ball FBGA4G (256Mx16) 96ball FBGA /4G (512Mx8) 78ball FBGATemp Range: Commercial, Industrial and Automotive (AEC-Q100)
1.5 Volt
1Gb 2Gb1GAS4C128M8D3-
12BCN128M x 8
12ns
Synchronous DDR3
AS4C128M8D3-12BIN
128M x 812ns
AS4C128M8D3-12BAN
128M x 812ns
AS4C64M16D3-12BCN
64M x 1612ns
AS4C64M16D3-12BIN
64M x 1612ns
AS4C64M16D3-12BAN
64M x 1612ns
AS4C128M16D3-12BCN
128M x 1612ns
AS4C128M16D3-12BIN
128M x 1612ns
AS4C256M8D3-12BCN
256M x 812ns
AS4C256M8D3-12BIN
256M x 812ns
4GbAS4C256M16D
3-12BCN256M x 16
12ns
AS4C256M16D3-12BIN
256M x 1612ns
AS4C512M8D3-12BCN
512M x 812ns
AS4C512M8D3-12BIN
512M x 812ns
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Density Process
30n
m
30n
m
1GB(64Mx16)
Samples
DDR3
1GB(128Mx8)
Production
In full production – 30nm technologyFeb
2015 2016 20172014 1H 2014 2H
30nm In full production – 30nm technologyFeb
4GB(256Mx16)
2GB(128Mx16)
2GB(256Mx8) 30n
m
30n
m
In full production – 30nm technologyFeb
In full production – 30nm technology
In full production – 30nm technologyFeb
Feb
4GB(512Mx8) 30n
m
In full production – 30nm technologyFeb
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256M and 512MPackage options: 60ball FPBGATemp Range: Commercial temp only currently
1.8 Volt
256M
AS4C16M16MD1-6BCN
16M x 166ns
Mobile DDR AS4C32M16MD1-
6BCN32M x 16
5ns
512M
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256M
Density
63nm
Process
63n
m
In full production by February 2014– 63nm technology
Samples
Mobile DDR
512M
Production
In full production by March 2014 – 63nm technology
2014 2015
2013
2016Q1
Q2
Q3
Q4
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Alliance Memory New Products Q1-2014/Q2-2014
2Gb DDR2 & 1Gb Mobile DDR
NEW DDR 2 releases coming
Density Organization VCC Speed Package Alliance Part Number
2Gb 128M x 16 1.8V 400Mhz 84-ball FBGA AS4C128M16MD2-25BCN
128M x 16 1.8V 400Mhz 84-ball FBGA AS4C128M16MD2-25BCNTR
128M x 16 1.8V 400Mhz 84-ball FBGA AS4C128M16MD2-25BIN
128M x 16 1.8V 400Mhz 84-ball FBGA AS4C128M16MD2-25BINTR
NEW MOBILE DDR 1 releases coming
Density Organization VCC Speed Package Alliance Part Number
1Gb 64M x 16 1.8V 200Mhz 60-ball FBGA AS4C64M16MD1-6BCN
64M x 16 1.8V 200Mhz 60-ball FBGA AS4C64M16MD1-6BCNTR
64M x 16 1.8V 200Mhz 60-ball FBGA AS4C64M16MD1-6BIN
64M x 16 1.8V 200Mhz 60-ball FBGA AS4C64M16MD1-6BINTR
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Alliance Memory New Products Q1-2014/Q2-2014
1Gb, 2Gb and 4Gb low voltage 1.35V DDR3
NEW DDR 3 releases coming
DensityOrganization VCC Speed Package Alliance Part Number
1G 64M x 16 1.35V 800MHz 96-ball FBGA AS4C64M16D3L-12BCN
2G 128M x 16 1.35V 800MHz 96-ball FBGA AS4C128M16D3L-12BCN
4G 256M x 16 1.35V 800MHz 96-ball FBGA AS4C256M16D3L-12BCN
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Quality & Reliability
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ISO 9001 certified until 2015
Document control system
Incoming QA and monitoring in place
Reliability program in place
State-of-the-art test equipment and techniques
Compliance to JEDEC and EIAJ standards
REACH ROHS2 compliant Automotive AECQ-100
compliant
Alliance Quality and Reliability
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Published Article in Material Handling & Logistics Magazine by Richard Ward – QA & Logistics Director
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•Company Information •Datasheets•Cross Reference Guides•Weekly stock inventory report•ROHS/REACH Compliancy information•Package details•MPQ’s •Testimonials•Worldwide Distributor information
available on the web at www.alliancememory.com
Alliance Memory Website
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Why Engage with Alliance Memory?
• Fast Information response times • Buffer stock programs• Quick sample turnaround
• Inventory held in the U.S. Shanghai & Taiwan
• Multiple manufacturing sites
• Great customer service and support
• All parts go through additional ‘Burn In’ testing
• Management has strong Memory background
• COMMITMENT TO LEGACY Memory!