Functional Semiconductor Process Tape

ICROSTM Tape

Akimitsu Morimoto

Mitsui Chemicals Tohcello, Inc.

Contents

Basic Information of ICROSTM Tape

ICROSTM Tape Technology

Summary

・Back Grinding(BG) Tape・Dicing(DC) Tape・The Other Functional Tape

• Mobility

• Health Care

• Food & Packaging

• Basic Materials

• One of the largest chemical manufacturers in the world• $13 billion in sales in fiscal 2017• Over 17,000 employees worldwide• Domestic: 5 manufacturing sites, 7 R&D Laboratories, 4 sales

branches• Over 100 Subsidiary Companies.

• Business Groups

Mitsui Chemicals Inc.

: Performance Compound, Elastomers, Functional Polymers

: Agricultural Materials, Films, Sheets, Tapes

: Personal Care, Nonwovens

: Phenol, Petrochemicals

ICROSTM Tape

Mitsui’sCombination ofTechnologies

Mitsui Chemicals Tohcello, Inc

Back-grinding

Surface protective tape

SemiconductorProcess

Laminating

Detaping

Package

Dicing

Bonding

Molding

Dicing

Pick-up

Grinding

Superior Total

ThicknessHigh Adhesion Anti ESD

Very Low

ContaminationBump Absorption

Chemical

Resistant ExpandabilityHEAT Resistant

≤260℃

Self ReleaseTransparent

ICROSTM Tape Application

Application to other areas

ElectronicComponent

Mitsui’s target is not limited to Semiconductor.ICROS tape are already used in other areas.

Sensors Semiconductor

Optics

Lens

VCSEL

3D Sensing

ICROSTM Tape TechnologyBack Grinding(BG) Tape

Tape TTV Control

Superior Total

Thickness

Back Grinding Tape I

Tape Conventional Mitsui Tape

Histogram

TTV Value * 9 1.5

Excellent TTV Control (<2um) Precise Manufacturing Control

*12inch wafer TTV after taping and grinding to 75um

TTV CheckTaping DetapingGrinding

High controlled TTV wafer

Back Grinding Tape II

Bump Type Solder Bump

Target FlipChip BGA WLCSP

Bump

Image

Tape Type

Si

120 μm

Si

200 μm

Base film Base film

Adhesive

Adhesive

Intermediatelayer I

Intermediate Layer II

Cover high topography (~300um) Maintain No Residue Performance Varieties of Tape Design (>=20)Bump

Absorption

Bump Encapsulation Technology

こんな感じの写真by DHE

Grinding WLCSP and fan-out wafer

Target Bump

ICROSTM Tape Technology Dicing(DC) Tape

High light Transmissivity Good wafer secured during

Dicing Good expansion & pick up

Good visibility

Expansion & Pick up

Target Application:

1) Wafer backside Inspection Transprarent Dicing Tape

Transparent Expandability

Keep chip goodwith no damage

High Lasertransmissivity

2) SD Through Tape

Chip Inspection through tape

SD through Tape

Heat Resistant Dicing Tape

Heat Resistance (≤150 ℃) Good expansion

after heating

Dicing Wafer level TestingExpansion & Pick up

Target Application:

Frame handling wafer level test

-15 ℃ to 150℃

Ring frame

Tape

Heat Resistant Expandability≤150℃

DC Tape property Heat resistance Expandability

Conventional tape

Heat resistant tape

Mitsui DC tape

Heat Resistant Dicing Tape

Dicing Wafer level Testing Expansion & Pick up

-15 ℃ to 150℃

Ring frame

Tape

- Pick up ability -

Chip

Lift 5mm

Good Expansion

Good Pick Up ability

Lift 15mmConventional HR-DC tape

- Heat Resistance -

WL-CSP

Mold Array Package

No Melting

No Attaching to CT.

@100 °C

- Dicing Property-Good Dicing property

Burr

Good

ICROSTM Tape Technology The Other Process Tape

Thermal Release Ability (≥ 190°C) Heat resistance (≤ 150°C) Satisfying Technical Requirements

(No residue, Easy peel-off etc)

Base film

Heat Resistant Adhesive

Thermal Release Adhesive

Liner

Liner

[Tape Construction] [Feature]

Substrate

Substrate

Thermo Release

Thermal release Tape

Target Application: Self Release ability is necessary

Wafer Level Package Thin wafer supportFragile surface

handling

Wafer

TapeSubstrate

MoldResin

TapeSubstrate

Chip

Substrate

e.g. MEMS Chip

Products can be released without any stress

Self Release Heat Resistant

Heat Resistant Bump Tape

Heat Resistant (≤ 150 ℃) Good bump encapsulation No residue after heating

Target Application

Wafer Backside coating process

No ResidueEasy peel-off

Bump wafer BG Tape Lamination

BG Wafer back side coating

Cure (<150°C) Detaping

Good bumpencapsulation

Heat resistant

Heat ResistantBump

Absorption

≤150℃

WfRing frame

Tape

Plating(Wet, 80°C)

High Heat Resistant Tape

Heat Resistant≤260℃ Very Low

Contamination

Heat Resistant (≤260 ℃) Easy peel-off after heating No residue after heating

Target Application:

Bumping reflow process with Tape

Bumping Reflow 260°C

Control adhesive strength Superior low contamination

High Adhesion tape Target Application:

Dry Lift-off

<Dry Metal Lift-off process>

Tape

Our proposal

Resist pattern Metalizing

Dry Lift-off

High Adhesion

(Equipment: TAKATORI AMR2200G )

Dry Lift-off

Advantage of Dry Lift-off

Easy to collect precious metal like Au

Saving of chemical and metal waste

Short tact-time (vs Wet lift-off)

No risk of surface damage (vs. Chemical Jet lift-off)

Summary

ICROSTM Tape widely cover semiconductor and Electronic components packaging process

Transparent DC tape(T : >90%@visible light)

Heat Resistant DC tape (150degC HR, with expandability)

Thermal Release Tape (150degC HHR & 190degC self release)

Heat Resistant and Bump Encap. Tape (150degC HR, ~ 250um Bump Encap. )

Summary

Back Grinding Tape(~ 250um Bump Encap. 1~2um TTV,)

High Heat Resistance Tape (260degC Heat Resistance)

High Adhesion Tape (Metal Lift-off by tape adhesion)

For detailed information, Please visit our booth : Hall A4, Booth No. 1004

≤150℃

≤260℃

≤150℃

≤150℃