Agilent SJ / SP family

SJ / SP Series III Unified Platform Flexibility

• Agilent offers a truly unique flexible AOI solutions

• Single machine platform for 3D paste, pre and post reflow

SP to SJ conversion

SJ to SP conversion

Mixed Mode, Pre-Reflow or Post-Reflow AOI?

Missing Part

Offset Part

Reversed Part

Wrong Part - OCR

Tombstones, Billboards

Bridging, Shorts

Lifted Lead / Insufficients

Dry Joint

Pre-Reflow

Post-Reflow

No joint or chip tilting defect coverage

Good SPC & Process Feedback Capabilities

Best Defect Coverage

No P&P Offset SPC

Measurement Data

Missing Part

Offset Part, X-Y-Theta

Reversed Part

Wrong Part - OCR

Mixed Mode

Missing Part

Offset Part, X-Y-Theta

Reversed Part

Wrong Part - OCR

2D Paste Inspection for

Large IC’s, i.e

QFPs,CSPs, QFPs

• SJ50sIII The standard machine.

Board size up to 510x510mm

• SJ50sIII XL The large board machine.

Board size up to 620x620mm

• SJ50sIII Dual Lane Board size up to 510x216mm

High speed – no loading time

SJ50 Series III system options

SJ50 Series III System Specifications

• Maximum Board Size: 510 x 510 mm (20 x 20 inches)

• Minimum Board Size: 50 x 50 mm (1.96 x 1.96 inches)

• Maximum Board Weight: 3 kg (6.6 lbs.)

• Top Side Board Clearance: 41 mm (1.6 inches)

• Bottom Side Board Clearance 50 mm (1.96 inches)

• Minimum Edge Clearance: 3 mm (.118 inches)

• Minimum Board Thickness: 1.5 mm (.006 inches)

• Maximum Board Thickness: 4 mm (.157 inches)

• Machine Conveyor Height: 821 mm to 965.2 mm (32.4 to 37.9 inches)

» SMEMA Standard – Reversible Conveyor Option

SJ50 Series III board handling

• Single lane or dual lane conveyor

• Large board inspection up to ~30“ length (inspects boards in

two halves)

• Automatic inline left to right or right to left (reversable by SW)

• Load unload at same side (loading into magazine, hand loading)

• Automatic width adjust (linked to program, program can be

linked to barcode)

• Clamping from bot – surface stays at same level independend of

pcb thickness

• Smooth handling and clamping of pcb for pre-reflow and

ceramic boards (pcb static – camera moves high speed)

SJ50 Series III motion system

• Moving the camera instead of pcb – allows for pre reflow test and

high accuracy measurement – no vibration introduced to pcb

• Linear motors for speed and reliability, high MTBF, cooling air not

required

• Linear glass scale encoders for accuracy - 0.5 micron resolution

• Pre-loaded linear bearings for

repeatability <10% GR&R (typ.3)

• Stable welded steel machine base

• Digital control – no adjustment

when changing parts

SJ50 Series III image acquisition - Evolution

Sq In Pixel Size Images Light

• GS-1 3.2 37u 1 white flourescent

• SJ10 3.2 25u 2/3 red LED angled

• SJ10c 3.2 25u 3 colour LED angled

• SJ50 3.5 25u 3 colour LED angled

• SJ50-II 4.0 23u 8 colour LED

angled&segmented

• SJ50-III 5.0 19u 8 - “ –

6.3 19u 4 colour LED angled

More than 10 years experience in AOI,

more than 15 years in SMD Gauging Systems

SJ50 Series III image acquisition - Camera

• Single High Resolution

Camera for High Quality

Images

• High speed, robust, easy

to calibrate

• Orthogonal, 4 MegaPixel

Array, 19µ pixel (0201)

• Compensation of lens

distortion (position in

view)

• Pixelsize adjustable,

capable of 01005 (~12µ)

SJ50 Series III image acquisition - Lightning

• Multi-Color,

Direction & Angled

Lighting

• Colored

LEDs,Multiple

Angles,

Segmented

• Repeatable

Structured

Lighting

• Allows Solid

Shape

Modeling….

SJ50 image processing

Colour – for better contrast

8 Image Planes – Chip Capacitor

Angle 1 Angle 2 Angle 3 Angle 4

Colour

Transform 1

Colour

Transform 2

Colour

Transform 3 Col. Transf. Low Contr. F.

Advanced Solder Joint Analysis

Uses Multiple Images and Angles of Colored Light

SJ50 Solder Joint

Profile Analysis

QFP PinSolder

“d”

Measured Fillet

Area “f” Derived

from Two Images

Good Joint

Signature

Image # 2

45 Degree

Green LEDs

Image # 1

60/70 Degree

Red LEDs

Camera Sensor

Distance “d” Is Measured

between middle of green

and middle of the red

SSM - Solid Shape Modelling

How does SSM work?

South

West East

North 1. Images are

captured at

multiple points

around the device.

2. These captured

images are

combined to form a

composite colour

image.

Programming the SJ50 Series III • Windows XP Graphical User Interface (SJ50 and Offline Programming)

• Automatic Algorithm Assignments based on Package Style

• Programmed by Geometric Boxes – Measurement Based Algorithms

• Large Standard Library of Default Algorithms

• Program by Shape, P/Ns, Ref. Des. with Built in Alternate Part Capability

• Optional Offline Programming Station / CAMCAD – 85% can be done offline

All program P/Ns are

assigned an algorithm

one time. Future boards,

using common P/Ns, are

partially pre-programmed!

Silver

Database

(P/Ns)

Golden

Database

(Default)

New Program

Search Area

Output from 4-point

filtering operation.

Vector resulting from

summing values in each

column of the search area.

P1

P2 P3

P4

4-Point Filter (example -1, 300, 1400, 1700)

Presence Value

Vector resulting

from summing rows

at each contact.

Box Filter

Horizontal Location

Filter Output

Vertical

Location

Classic Algorithms: Chip Algorithm

Body Size

Classic Algorithms: Detecting Polarity

Polarity search boxes are used to find areas two

areas on the component that have high brightness

differences. (red and green boxes)

Areas of high brightness difference include;

• Polarity markings and component bodies

- Polarity bands on the capacitors or passive components

- Body chamfers, dimples, and spots on active

components (pin one indicators)

- Even out of focus PTH components can be inspected for

polarity

Universal part – most flexible

Agilent‘s Self-Learning Algorithm- SLA

• Self Learning Algorithms

Enhancement of Feature algorithms Compares multiple features simultaneously Allows feature algorithms to self-tune

QFP PinSolder

d Area

Curvature

y

C1 x C2

d

20+ features

Self Learning for Joints

Self Learning for Chips

Good Bad

Good

Bad

Overlap = False Failures

Alg. 1

Alg. 2

Alg. 1

Alg. 2

-

Benefit SLA: Lower False Fails

Before Self-Learning

After Self-Learning

Example of False Fail rate: Missing Components

In-line SJ system

500

1000

1500

2000

OCR - Wrong Part Detection

OCR - Optical Character Recognition

• Real OCR / Wrong Part

• Can be used for first

article inspections in pre

or post reflow!

• Handles Multiple Fonts

• OCV Capability

• Auto Set Up / Training

• Traceability Capability

based on S/N of PWB

• OCR text storing capability added.

• Customer defines labels

• Output text file can be stored and searched in database.

• Excellent tracking - great for high specification automotive and military applications.

• Allows OEM customers to trace back any field returned PCBs to component level.

TIMESTAMP 15:37 11/4/2003

BOARD BARCODE 11241652741

Reference Des 1:r213

Serial Number 125ABC

Lot Code 1102

Part Number 123456ZX

Date 0203

Manufacturer MD

Miscellaneous “ ”

Enhanced OCR

Optical Character Verification - OCV

Angle 1 Angle 2 Angle 3

Match %

Can also be

used for polarity

test

Barcode reading through camera

• For labels or laser etched

codes

• 1D codes: 128, 39, 93,

codabar, EAN8, EAN13, 2/5

industrial, 2/5 interleaved

• 2D codes: ECC200, PDF417,

QR-code

• Panel and board based

barcodes – traceability down

to single board

SJ/SP environment –

Off-Line Programming Station

•Allows most of the test

program to be developed

offline

•Keeps the SJ50 free for

production

•For debugging

programs (false calls)

remotely

• Images of complete

board are captured on

SJ and used on OLP

SJ/SP environment - CAMCAD

SJ/SP Series

Quick translation of

many CAD formats

Gerber-ECAD merge

(RefDes for paste)

Comes together with

Offline Programming

Station (OLP)

One SW for SJ/SP,

5DX, 3070

SJ/SP environment - Agilent Repair Tool

Clear System image

with SSM 3D

image available

Board overview

Error list

Dedicated keypad

for single button

repair available

One Repair Solution

for SJ/SP, 5DX,

3070

SJ/SP environment - Agilent Quality Tool

•Fast, real-time

access to

inspection, test

and repair

information

•One solution for

SJ/SP, 5DX, 3070

SJ/SP environment - SPC

Charts:

Supplement to AQT

Focus on pre reflow

Provides comprehensive live charting for all data (x-y-teta offset measurements, p&p information, such as machine and feeders)

SJ/SP environment - SPC

Reports:

generates Pareto information and includes images of the defects

CpK Monitor: Provides factory wide overview of line

performance (in control)

CpK Monitor will be integrated into AQT

SJ/SP environment - Closed Loop

• Feeding back x-y offsets to placement machine (printer)

• Feeding forward “Board has critical defect - do not process further”

• Priority #1 in the SMT industry is the Closed loop for Pick & Place

Feedback

Feed forward

SJ/SP environment - Closed Loop

&

provides data-link into

Fuji offers Closed Loop through FujiTrax

Siemens offers Closed Loop through SIPLACE Explorer

Short Term SJ Roadmap

4.10

•Universal algorithm

•Side Fillets

•SLAM (classifier

improvement)

•Bridge and Joint masking

•Technician level

Pre Reflow

•Paste Bridging

•Paste around Leads

4.11 / Series 3

•4MP Camera

~5”Sq/Sec Post

~7”Sq/Sec Pre

faster & higher resolution

•Improved Component location

•New Offline Programming GUI

•OCV improvements

•Latest generation OS and PC

with Raid

Apr-Jul ‘06

July ‘07 ‘05 Dec–Mar 06

Aug-Oct 06

Next release

•Interaction with customer

Host systems

•Auto programming

•Solder Joint Capability

•Pin-Level Reporting

•Networked Database

•Long Board Capability

End of Presentation