Advanced Thermal Design Smarter Design€¦ · Input File Type Filament Diameter Position Accuracy...

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High Performance Functional Materials 3D Printer Advanced Thermal Design Heated chamber up to 90, hot end up to 450Functional Material Capability 3D print PEEK, ULTEM (PEI), PPSU and other functional materials FUNMAT HT Model Printing Technology Build Volume Build Platform Leveling Layer Thickness Print Speed Extruder Temperature Platform Temperature Chamber Temperature Input File Type Filament Diameter Position Accuracy Motor Drive Safety Certification Supported Material FUNMAT HT Fused Filament Fabrication (FFF) 260*260*260mm P1 Sheet Heating + Ceramic Glass Automatic Leveling 0.05-0.3mm 30-300mm/s 450/842 o F 160/320 o F 90/194 o F STL, OBJ 1.75mm X/Y: 12.5μm Z: 1.25μm 4 High Performance Independent Drivers FCC and CE PEEK, ULTEM, PPSU, PA/CF, PC, PC Alloys, PA, ABS, Carbon Fiber-Filled, Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS, TPU, PLA, PVA, ETC. Smarter Design Automatic Leveling, Filament Absence Warning

Transcript of Advanced Thermal Design Smarter Design€¦ · Input File Type Filament Diameter Position Accuracy...

Page 1: Advanced Thermal Design Smarter Design€¦ · Input File Type Filament Diameter Position Accuracy Motor Drive Safety Certification Supported Material FUNMAT HT Fused Filament Fabrication

High Performance Functional Materials 3D Printer

Advanced Thermal DesignHeated chamber up to 90℃, hot end up to 450℃

Functional Material Capability3D print PEEK, ULTEM (PEI), PPSU and other functional materials

FUNMAT HT

Model

Printing Technology

Build Volume

Build Platform

Leveling

Layer Thickness

Print Speed

Extruder Temperature

Platform Temperature

Chamber Temperature

Input File Type

Filament Diameter

Position Accuracy

Motor Drive

Safety Certification

Supported Material

FUNMAT HT

Fused Filament Fabrication (FFF)

260*260*260mm

P1 Sheet Heating + Ceramic Glass

Automatic Leveling

0.05-0.3mm

30-300mm/s

450℃/842oF

160℃/320oF

90℃/194oF

STL, OBJ

1.75mm

X/Y: 12.5μm Z: 1.25μm

4 High Performance Independent Drivers

FCC and CE

PEEK, ULTEM, PPSU, PA/CF, PC, PC Alloys, PA, ABS, Carbon Fiber-Filled,

Metal-Filled, Fiberglass-Filled, ASA, PETG, ESD-Safe, HIPS, TPU, PLA, PVA, ETC.

Smarter DesignAutomatic Leveling, Filament Absence Warning