Advanced SiP Technology and System Design Zhangya… · SIP designed to spread heat more...
Transcript of Advanced SiP Technology and System Design Zhangya… · SIP designed to spread heat more...
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Advanced SiP Technology and System DesignOct 19 - 20, 2017
Yang Zhang, Ph.D. Senior Director of EngineeringQualcomm Technologies, Inc.
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Agenda
• What is our view of SiP?
• Advantages and Vision
• Trial Products
• Future of SiP
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QTI (Qualcomm Technologies, Inc.) System In PackageWhat is our view of SiP?
• Cutting edge, genuine one chip solution for mobile devices
• All-inclusive – WWLAN (2G/3G/4G), WiFi/BT, GPS, all BB, RF, and PM
• Superior conformal molding and RF shielding
• Pre-certification for quick time-to-commercialization
• Support new competition in mobile industry
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Most SiPs are sub-systems for mobile devices
Current SiPs Commercially Available
• SiP consists of◦ Bare IC die◦ Packaged IC die (2D/3D)◦ SMT active and passive components◦ Integrated passive devices (IPD)◦ Embedded components◦ Performance enhancements• Thermal lids• Shielding• Stiffeners
Tracking devices
Smartphones
GPS SiPsRunning Monitors
WiFi/Bluetooth SiPsWearables
Tablets
3G/4G SiPsIoT/M2M Auto USB Dongles
POS
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A Genuine Mobile SiP!
SiP with Complete Mobile System
Smartphone SiPANT1 ANT0
WiFiMiMO
ANT2WiFi/BT/GPS
Dual MIPI Camera
LCD MIPI
Dual SIM
LED/Flash
Stereo Audio
TouchVibratorSDIOUSB HS
AccelerometerGeomagnetic
GyrosPressureProximity
TemperatureAmbient light
HapticsNFC
Finger PrintEthernet
I2C/SPI
UARTGPIOJTAGI2C
Processor & Memory(RAM+Flash)
Charging & Power Management
(PMICs)
ConnectivityWiFi/BT
TransceiversGPS
WWAN Rx/TxBB + RFFE
(Filters, PAs, Duplexers,
RF Switches)
Components not integrated for customer differentiation
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Integrating ~500 components into one chipMobile SiP Makes Phone Design Simple!
Conventional Phone-mounting over 500 components
Sample Mobile SiP
BT & WiFi
RFBB
PAPA
AP & Memory PM
Front Back
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SIP Benefit for Customers• No large design team and multiple board
turns required to design a phone• No longer need to manage hundreds of
suppliers
Simplified Supply Chain
Help OEMs reduce time-to-market and
cost
Reduce upfront investment and operating cost
Attractive business model
• Simplify complexities of wireless device design and tests
• Flexibility to focus on customization and differentiation
• Comprehensive solution to simplify process of designing, building, and manufacturing
• Reduce phone PCB layer count and burden for system designers
• Small form factor S-SIP to allow ID design flexibility
• Pre-tested and Pre-certification for cost effective ownership
Procurement
Design & Test
CertificationTime to Commercialization
NRE
Single chip solution for smartphone
400—500 components
9SIP designed to spread heat more efficiently
Phone with SiP (25x25mm)
Conventional Phonewith discrete chips
SIP (25x30mm) Flatness – Shadow Moire Test
Module structure engineered to achieve sub-60um max warpage despite large body size!
SiP AdvantagesThermal and Mechanical Performance
System Thermal System Mechanical
10 CLower
Hot Spot
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SiP Examples
Size: 25x25mmComponents: 325+Conformal ShieldingWAN/GPS/WiFi
Size: 24x29mmComponents: 450+Conformal ShieldingWAN/GPS/WiFi
Size: 19x22mmComponents: 120+Conformal ShieldingWAN/GPS
CAM
Speaker CAM
Speaker
Size: 23x24mmComponents: 480+Mental-can ShieldingWAN/GPS/WiFiChina OBOR support
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Future SIPsKey Areas for Innovation
• Single / Double Sided• Conformal / Compartmental• Waterproofing
• WLP / Flip Chip / IPDs• Cost reduction• Yield improvement
• Multiple bare IC die• IPDs• Passives
Embedding ComponentsBare Die IntegrationMolding/Shielding
Silicon
SiP
Follow us on:For more information, visit us at: www.qualcomm.com & www.qualcomm.com/blog
Nothing in these materials is an offer to sell any of the components or devices referenced herein.
©2017 Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved.
Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other products and brand names may be trademarks or registered trademarks of their respective owners.
References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiariesor business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially allof its product and services businesses, including its semiconductor business, QCT.
Thank you