Advanced Sensors and Novel Concepts for …...2012/10/08 · AeroDays 2011 Conference 31 March 2011...
Transcript of Advanced Sensors and Novel Concepts for …...2012/10/08 · AeroDays 2011 Conference 31 March 2011...
Advanced Sensors and Novel Conceptsfor Intelligent and Reliable Processing
in Bonded Repairs– the SENARIOSENARIO project
presented byMr. David Hernández Rodero
SENER & SENARIO Consortium
the results of an EC funded research projectFramework 6 – Aeronautics & Space area
AeroDays 2011 Conference 31 March 2011 – Madrid
Project partnersGMI Aero
INASCO (coordinator)
Laser Zentrum Hannover
National Tech. Univ. Athens
Kharkiv Aviation Institute
Tel Aviv University
INASMET
SENER
Israel Aircraft Industries
Bombardier Aerospace
AeroDays 2011 Conference 31 March 2011 – Madrid
Facts and figures
Start date: 01/01/2007
Finish date: 30/06/2010
Total effort: 294 man-months
Total cost: €2.92 MillionWorkplan: 9 technical WPs
1 exploitation WP1 management WP
7 nations2 large companies2 SMEs1 engineering firm2 research institutes3 universities
The The SENARIOSENARIO projectproject
Project Thematic AreaProject Thematic Area
The main limitation of the existing technology in bonding repair of aerospace structures is the inability of the repair control systems to assess the actual material state and integrate the available tools (simulations, measurements, experience and knowledge) into an intelligent material-based control system.
The main limitation of the existing technology in bonding repair of aerospace structures is the inability of the repair control systems to assess the actual material state and integrate the available tools (simulations, measurements, experience and knowledge) into an intelligent material-based control system.
To circumvent these limitations, the SENARIO project proposes the development of a revolutionary sensing systems linked to intelligent process control equipment and reliable methodologies of aero-structures component maintenance.
To circumvent these limitations, the SENARIO project proposes the development of a revolutionary sensing systems linked to intelligent process control equipment and reliable methodologies of aero-structures component maintenance.
AeroDays 2011 Conference 31 March 2011 – Madrid
Technical SolutionTechnical Solution
The proposed system consists of: • portable curing process console with blanket mounted
dielectric sensors• wireless non-intrusive dielectric sensors for monitoring
adhesive cure• reliable laser technology for increased automation and
bonding performance• thermo-mechanical simulation and monitoring set-up• intelligent multi-zone process guidance system for the
repair control unit for co-curing• technique for bonded repairs with reliability, controlled
quality and certification potential
The proposed system consists of: • portable curing process console with blanket mounted
dielectric sensors• wireless non-intrusive dielectric sensors for monitoring
adhesive cure• reliable laser technology for increased automation and
bonding performance• thermo-mechanical simulation and monitoring set-up• intelligent multi-zone process guidance system for the
repair control unit for co-curing• technique for bonded repairs with reliability, controlled
quality and certification potential
AeroDays 2011 Conference 31 March 2011 – Madrid
Fields of activitiesFields of activities
nano-scale
HOT BONDER SENSORSIN BLANKET INTELLIGENT MULTI-ZONE REPAIR CENTRE+ =
CRACKED PART
T/C(n)Heater 1 Heater nT/C(2)T/C(1) Heater 2
HOT BONDERCURE MONITORING
PROCESS CONTROL
+=
dielectric sensors
Hot bonder + process monitoring: SENARIO technology allows the optimal and safe processing of adhesive patch where thermomechanical modelling and simulation tools support complex (multi-zone) controllable repair processes
AeroDays 2011 Conference 31 March 2011 – Madrid
Development of adhesive sensing system► Monitoring cure of patch and adhesive film for repair process optimisation
Sensors fabricated for repair process monitoring
Sensor type NiP on ceramic NiP on ceramic Cu on Kapton filmSpacing /channel 100μm / 100μm 100μm / 100μm 80μm / 80μm
Structure
Air capacitance (pF) 5.5 4.5 3.2Feature durable, high T durable, high T disposable, low cost
sensing mat embedded / bondlinein metal plate
SENARIOSENARIO technology development [1]technology development [1]
AeroDays 2011 Conference 31 March 2011 – Madrid
SENARIOSENARIO technology development [2]technology development [2]Development of portable cure processing system► Integration of hot bonder to monitoring system (concept, hardware, software, applications)
Experimental set-up at NTUA laboratory
AeroDays 2011 Conference 31 March 2011 – Madrid
Development of portable cure processing system (continued)► Integration of sensors in a special mat for monitoring cure of patch during repair process
2 sensors embedded in the sensing mat
aluminium substrateM20 pre-preg
sensing mat 21
heating blanket
vacuum bag
vacuum bag
perforated sheet
glass fibre breather
T/CT/Cwirewire
powerpower
controlT/C
AeroDays 2011 Conference 31 March 2011 – Madrid
SENARIOSENARIO technology development [3]technology development [3]
SENARIOSENARIO technology development [4]technology development [4]Thermomechanical process monitoring and correlation of sensing► Interaction and correlation between dielectric and optical sensing in repair processes
Determination of the point where stresses start to build up
AeroDays 2011 Conference 31 March 2011 – Madrid
Development of laser technology for adhesive repair► Application of laser ablation/processing for altering or improving surface characteristics
of composite materials towards bonding optimisation
Selective removal of the cured
composite matrix
3D-Ablation of the cured composite
material
Deployed UV laser source
AeroDays 2011 Conference 31 March 2011 – Madrid
Laser Pre-Treatment
SENARIOSENARIO technology development [5]technology development [5]
Development of adhesive sensing system► Monitoring cure of patch and adhesive film for repair process optimisation
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sensor 3
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Dielectric sensing [ion viscosity] (blue line) of thermoset
patch cure
Dielectric sensing [ion viscosity] (blue
line) of adhesive film cure
Lay-up for repair of composite materials
Sensing mat (grey) for monitoring
patch cure
Flat sensor for monitoring
adhesive film cure
Repair set-up in the instrumented autoclave (Shorts)
AeroDays 2011 Conference 31 March 2011 – Madrid
SENARIOSENARIO technology development [6]technology development [6]
Repair process simulation and modelling tools► Modelling of cure process for real-time degree of cure measurements (material state
monitoring)► Simulation tool for integral thermal/mechanical/chemical assessment of thermoset cure in
repair processes (where temperature and stress variations are not desired)
Integration of parametric cure kinetics and shrinkage models
for paste adhesive resin
AeroDays 2011 Conference 31 March 2011 – Madrid
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kinetic modelZ"max average values
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Determination of the degree of cure in real time through the translation of dielectric signal
SENARIOSENARIO technology development [7]technology development [7]
TEMPERATURE
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TCT1T2T3T4T5T6T7T8T9
Prediction of temperature, conversion, strains, etc. at
several locations of the system
AeroDays 2011 Conference 31 March 2011 – Madrid
SENARIOSENARIO technology benefits and riskstechnology benefits and risksBenefits: All these can lead to optimised and improved repair processing,
enhanced understanding of the material processes in adhesive bonding (patch and adhesive resin cure), shorter repair cycles and fail-safe procedures.
Impact: The application potential is not only limited to aerospace structures. The experience from this project is of great interest also for other industrial innovations as in repair processes of naval and construction structural composites with modelling and sensing capability or even of compacted structures in space, and self-healing surfaces and coatings.
Risks: There is not clear risk assessment in the use of embedded thin films at the bondline for the monitoring of adhesive cure during bonding. The sensor size and the cost of sensor wireless communication may become an issue for the industrialisation of the novel technique as cost reduction is a strong driver in the transport sector.
Recommendation: Multi-disciplinary research groups offer the potential for targeted technological development and fast knowledge transfer of advanced processing and control to several industrial sectors. These activities should be encouraged and actively supported.
AeroDays 2011 Conference 31 March 2011 – Madrid
Many thanks Many thanks (from the (from the SENARIOSENARIO Consortium)Consortium)
to the organisers to the organisers for allowing for allowing SENARIOSENARIO output output
to be disseminated to be disseminated to the to the AeroDaysAeroDays forumforum
For further technical matters For further technical matters and followand follow--up actionsup actions
please contactplease contactINASCOINASCO HellasHellaswww.inasco.comwww.inasco.com
[email protected]@inasco.com