Advanced Microelectronic Packaging Manufacturing ... · Flexible Substrates Rigid Substrates...
Transcript of Advanced Microelectronic Packaging Manufacturing ... · Flexible Substrates Rigid Substrates...
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Advanced Microelectronic Packaging Manufacturing Technologies for
Handheld and Implantable Medical Devices IEEE EMBS Dallas Chapter Meeting
April 13, 2012
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Microelectronic Packaging Manufacturing Technologies for Handheld and
Implantable Medical Devices
Frank D. Egitto, Rabindra N. Das, Frank Marconi, W. Wilson and Voya R. Markovich
Endicott Interconnect Technologies, Inc.
1903 Clark Street, Endicott, New York, 13760
Presentation given by: Susan Bagen, PE
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• Motivations
• Objectives
• Approach
• Systems studied – ICD & Pacemakers
– Ultrasound devices
• Implantable substrates – Stretchable Flex
– Rigid-Flex
• Summary
Outline
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Medical Device
A medical device is a product used for
medical purposes in patients, in
diagnosis, therapy or surgery.
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Medical Electronics/Devices
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•Intravascular Ultrasound Catheter Sensor Package
•Ultrasound
•X-ray CT
•Digital Radiography
• Mammography
•Pharmaceutical Research
•Molecular Dynamics
•Defibrillators
•Pacemakers
•Neurostimulators
Medical Opportunities
Implantable Devices
Super-computing
Home Healthcare
Medical Imaging
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Medical Electronics Industry
• Gradual production growth.
• Healthy growth of over 8-9% for the next several years.
• Recession affected growth slightly. Not to the extent it hurt other industries.
Source:
http://www.ems007.com/pages/z
one.cgi?a=60051&artpg=1 US Implantable device market is on
pace to exceed $50 billion in 2015.
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Stretchable Substrates
Flexible
Substrates
Rigid
Substrates
Implantable Electronics: Substrate Technology
Implantable
Conformal Electronics
Imaging
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Objectives
Develop miniaturized rigid substrate for SWaP (size, power and weight) advantage.
Develop flexible substrates to satisfy space requirements for medical imaging and health monitoring devices.
Develop bio-compatible and or bio-stable shapeless substrates for Conformal Electronics.
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FDA
approval
Bio-compatible &
Bio-stable:
•Body fluid
solution stability
•Cytotoxicity
Testing
•…other
•Cell growth
Implantable Electronics
•Substrate
•Coating
•Over mold
•Housing
• Materials
purity
•Product
Quality
•Product
Traceability
•Product
Reliability
Law Requirements Approaches Check Points
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Technology Available Today Printed Wiring Board (PWB) to System-in-Package (SiP) Design Conversion
Critical Design Inputs
BOM Analysis
BOM Substitution
Recommendations
SiP Physical Layout
Preliminary Design
Review
Critical Design
Review
SiP Physical Layout
Optimization
EI Proprietary
Concurrent Engineering
•Signal & Power Integrity
•Mechanical Modeling
•Thermal
•Reliability
•Producibility
•DFM
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Standard Build-up 3-2-3 CoreEZTM 2-4-2
Building Blocks SiP Fabrication & Assembly Technology
• Substrate Technology – Replace bulky, thick PWBs with thin, high density substrates
Vias are 4X smaller
EI Proprietary
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• Embedding Resistors and Capacitors
– Remove discrete passive devices and incorporate into the substrate to reduce required surface area
Building Blocks SiP Fabrication & Assembly Technology
EI Proprietary
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• Bare Semiconductor Die
Building Blocks SiP Fabrication & Assembly Technology
•Unpackaged die
has significantly
smaller footprint.
•Flipchip attach
results in smallest
configuration.
EI Proprietary
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PWB
Substrate
Die
Building Blocks High Density Electronics Integration
EI Proprietary
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Turn Key Solutions for Microsystems
Microelectronics Packaging Rigid Substrates
Substrate & Design
• Physical design
• Mechanical layout for SiP (MCM)
Substrate Fabrication
• 50 μm laser drilled vias
• 25/25 μm line width & space
IC Assembly
• Flip chip pitch down to 150 μm
• Wirebond, 60 μm in line, 45 μm staggered
Teradyne Ultra FLEX Module Tester
• Boundary scan
• Full functional module test
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• CoreEZ® 2-4-2 substrate
• SiP assembly (FCA)
Si Package – Medical Imaging:
Ultrasound Application
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Standard Build-up 3-2-3 CoreEZ® 2-4-2
Ultrasound Application: High Density Rigid Substrate
- Both packages use 50um blind vias
- CoreEZ® core vias are 4x smaller
- Core EZ requires fewer costly build up layers for the same wiring capacity
- Thinner core reduces electrical parasitics
(photos are to scale)
2 fully wireable
build up layers
2 fully wireable
build up layers
3 fully wireable
build up layers
3 build up layers only
useful for redistribution
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Ultrasound Application: Rigid HDI Substrate With High Core Via Density
• Very Dense Package Interconnect
– Ultra Dense Core Via Pitch can eliminate additional build up layers
• Dual Side Component Mounting
• Fine Line Width and Spacing
HDI Substrate has 9X Core Via Density over conventional build up
Standard Build-Up Mechanically drilled core:
400 micron diameter pad, 200 um diameter via
Laser Drilled CoreEZ Thin Core:
100 um diameter pad (50 um via)
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Miniaturized Rigid Substrate
•Defibrillators
•Pacemakers
•Pulse generators
SWaP
Reductions
Shrink Device
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ICD (implantable cardioverter defibrillator) and Pacemaker
• Smaller, less intrusive applications for implantable devices
• High density interconnect substrate – 8 layers
– 1.2” x 0.5” & 1.7” x 1.6”
• October 2008 marked 1st human implant of pacemaker with EI substrate.
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Ultrasound Device Packaging
Transducers & Die
• PZT, PLZT, PMN-PT,
• ASIC Die
Substrate Fabrication
• 25 μm laser drilled vias (minimum)
• 12/12μm line width & space (minimum)
IC Assembly
• Flip chip pitch down to 70 μm (minimum)
• Piezoelectric Crystal assembly
Module Tester
• Full functional module test
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•Intravascular Ultrasound (IVUS) is a catheter- based system
that allows physicians to acquire images of diseased vessels
from inside the artery. IVUS provides detailed and accurate
measurements of lumen and vessel size, plaque area and
volume, and the location of key anatomical landmarks.
Intravascular Ultrasound Catheter Sensor Package
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Support of 12.5 µm polyimide film
during substrate fabrication: use of
rigid frame
14 µm line and space
Intravascular Ultrasound Catheter Manufacturing
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Micro Pillar Technology for Finer Pitch Applications
ASIC die with 70 µm bonding pad pitch
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Intravascular Ultrasound Catheter Sensor Package
• Flip Chip Ultrasound Transducer for Catheter
• Sensor assembly rolled to 1.175mm diameter
• 5 Flip Chip ASIC,.1mm thick, 31 I/O each, 2.5mm x 0.5mm
– 22 micron flip chip bumps on 70 micron die pad pitch
• 12.5mm by 6.5 mm single layer flex circuit
– 14 micron wide lines and space copper circuitry
– 12.5 micron thick polyimide dielectric
• Prototype to production
– Over 1M shipped
Single layer HDI Flex
200 µm
Transducer
ASIC Die
Flip Chip Bumps
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Intravascular Ultrasound Catheter Package
Intravascular Ultrasound (IVUS) catheter
Images: The image on the left depicts a
healthy artery with larger opening, while the
image on the right depicts a blocked vessel
with smaller opening
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Ultrasound Medical Application
• 12 µm lines / spaces
• 25 µm vias
• 6 µm thick metallurgy
• Flexible soldermask
• FC Die & SMT passives
High Density Double Sided Flex
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Multilayer Flex
Flex
Flex
Bond-ply
1. Cu Thickness
2. Flex thickness
3. Bond-ply thickness
Roll
Bend/Flex
Flex
Flexibility
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12 metal layers, 12.8-13 mils thick, bend radius 1 inch or higher
Multilayer Flex
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Multilayer Flex
12 metal layers, 7.5 mils thick, bend radius 1 inch or less
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2 metal layers, ~1 mil thick, Roll diameter: 180 mils
6 metal layers, ~5 mils thick
Multilayer Flex
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Silicones Polydimethylsiloxane (PDMS)
Si O
CH3
CH3n
Silicones
Nano composites
Marine coatings
Microfluidics
Medicals Electromechanical actuators
Microbe-resistant household products
Thermal interface materials
Random lasers
Magnetic
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Silicones PDMS Base Resins
Si O
CH3
HO H
CH3n
Silanol-Terminated PDMS Vinyl-Terminated PDMS
Silane-Terminated PDMS
Si O
CH3
H Si
CH3n
CH3
CH3
H
Si O
CH3
H2C=HC Si
CH3n
CH3
CH3
CH=CH2
•Molecular weight of Polymer •Curing Chemistry
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Silicones
Optically active silicone
Explore stretching
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Stretchable Electronics
Conductive wires made from a new carbon nanotube-polymer composite.
Professor Takao Someya of the University
of Tokyo
Stretchable Electronics with a Twist: Prof. John A.
Rogers, University of Illinois at Urbana-Champaign)
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Stretchable Electronics
• Bio-compatible
• Bio-stable
• Fine lines
silicone
SiOx
Cu
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Water soluble PVA Substrate
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Liquid Crystal Polymer (LCP)
LCP based Z-interconnect substrate
– 4 layer TV, 6” x 6”
– 1, 1.5, 2, 2.5 mil lines & spaces
– 2 & 4 mil thru vias
– 1, 2, 3 mil blind vias
– Understand uVia Reliability
6 Layer
2 mil uvia
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LCP based Rigid-Flex
Rigid Flex gives the ability to design circuitry to fit the
device, rather than building the device to fit the circuitry.
Rigid-flex can stay inside a semi-conformal metal shell
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Roll-to-Roll Manufacturing
Supply Roll Take-Up Roll
Thin Film Deposition & Laser Processing Photolithography
Supply Roll Take-Up Roll
Wet Chemical
Etching & Cleaning
Cooling Drum Laser
Azores Photolithography
R2R can lead to reductions in cost. • A fully integrated facility
• Lower capital & labor cost
Flex Rigid-Flex Rigid
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Summary
EI developed variety of Substrate technology for a host of applications including:
• Pacemakers
• Implantable cardioverter defibrillators (ICD)
• Ultrasonic catheters
• LED surgical overhead and endoscope lighting
• Digital x-ray
• Patient monitoring systems
• CT scan
• Supercomputing for life science simulation (drug design)
Extending development to other implantable applications
• Conformal electronics
• Pulse generator