Advanced Circuit Packaging with CBM Technology
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Transcript of Advanced Circuit Packaging with CBM Technology
Possibilities and challenges in electronics building and production
technology
On some cooperation with CPD Center AB
Professor Jerker DelsingEISLAB
High density electronics
DriversPrice - price scales with size and volume
Low power - shorter leads, less R,LC -> lower operation voltage (P=U2/R)
Performance - shorter leads -> higher clock frequencies
Comparison Si - PWB
Silicon: 8 - 32 nmPCB: 50 - 250 um
3 - 4 order of magnitude in difference
What about PWB?!
First PCB:s early 1900The print and etch process patented 1913 - PWB
Feature sizes Trace width - 40 um -- 100 um Via size - 50 um - .... Multi layer boards - 40 layers
Limitation due to the etch process
Component package
Chip bonding
Bondwires usually consist of one of the following materials:
Aluminum
Copper
Gold
Wire diameters start at 15 µm and can be up to several hundred micrometres for high-powered applications.
Thermosonic bonding
Ultrasonic bonding
The wet PCB dream
Sequential Build Up of PWB parts
The CBM process
• Polymer molecules attach and create Polymer “structures” on the surface
• Works UP FROM surface instead of DOWN INTO surface
• First molecule fastens on surface with a strong covalent bonding
• On surface and inside holes (1:12)
Copper Build-up
Bare substrate
Polymer Structure build-up
0.5 – 4 μmElectroless Copper
Galvanic platingto desired level
CBM process
Standard processes
Cu on Teflon© (with primer, TetraEtch)
Etching vs Sequential build Up (SBU)
SBU
Potentially smaller feature sizes
Enabling embedded component - embedded chip technology
What’s the difference?
Standard Copper
CBM™ copper
FR4
First experiments
10 um line width
Strategies for circuit board interconnect based on the
CBM™ process
Solder free interconnect
Solder free interconnect
Solder free interconnect
Application of CBM™ grafting chemistry
Solder free interconnect
Solder free interconnect
CBM™ grafting polymer
Solder free interconnect
Solder free interconnect
Benefits
Takes away:Capsule ~35% of component costBonding ~35% of component cost
Smaller feature sizes at circuit board enablesCircuit board area reductionSmall chip pads
100x100 um today -> 5x5 um -> chip area saving of 400 times100 pads -> 1mm2 -> 0.0025 mm2
Chip size directly proportional to costShorter interconnect leads
Less RLCLower power requirementsHigher performance
Can we do this today?
LTU has the following lab facilities currently used in research cooperation with CPD Center AB
Clean room facility featuring Down to ISO 14644-1 class 5 CBM™ process Lithography Via hole drilling
CBM
Lab scale CBM process capable of small series production
Lithography
Laser lithography Advanced laser writer Line width < 700 nm
Via making - laser ablation
Cold ablation via diameter<5um