Ads Pres Nov 14

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Presented by: Peter Gonzalez November 14, 2008

description

advanced system design, peter gonzalez

Transcript of Ads Pres Nov 14

Page 1: Ads Pres Nov 14

www.adspcb.com 321.676.6358

Presented by:

Peter Gonzalez November 14, 2008

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www.adspcb.com 321.676.6358

Overview

• In business since 1994• IPC Certified Layout Designers• Clients: Harris Corporation, Motorola,

Intersil, Raytheon, Lockheed Martin, Northrop Grumman, DRS, SAIC, L-3 Communications, etc.

• Type of Work: Military, Aerospace, Medical, Commercial

• 10 employees

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Services

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PCB LAYOUT SERVICES

•High Density Multilayer, Blind/Buried vias, Microvias, HDI

•High Speed Digital Designs –DDR, PCI Express, Gigahertz Ethernet

•RF / Microwave Designs•Rigid Flex and Flex Designs•Backplanes, Power Supplies, VME, PMC,CPCI, PCI•Design for DFM and DFT•Constraints Rule Driven Designs•Controlled Impedance, Differential Pairs, Matched Length

•MATERIALS:–FR4, Polyimide, Rogers, Arlon, Isola, Nelco, Getek

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ROUTING SERVICES

• Manual Routing of critical Signals

• Constraints Driven Auto-Routing

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SCHEMATIC ENTRY

• Full CAD Data output, BOM, netlist

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LIBRARY DEVELOPMENT

• Schematic Symbols

• PCB Layout Footprints

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DOCUMENTATION

Mechanical &

Electrical CAD

Drafting support

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OTHER VALUE ADDED SERVICES

• Reverse Engineering• Digital/Analog Circuit Designs Services

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Layout Process

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STEP 1: DATA PREPSchematic- Netlist - Datasheets for all parts- Parts List with MFG Part Numbers and

description of parts- Mechanical outline with keepouts and Height

Restrictions- Statement of Work

- Preliminary Component Placement- Suggested Layer Stack-up- Critical Routing, Impedances

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STEP 2: PLACEMENT

- Placement of Critical Components

- Layer Stack-up Setup

- Contraint Setup for critical routing

- Placement Review

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STEP 3: ROUTING

- Fanout, Plane Setup, Impedance Calculation

- Pre-routes of all critical signals- Completion of routing (Manually or Auto-routing)

- Routing Review

- Back annotate Reference Designators

- Generation of Assembly and Fabrication Drawings

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STEP 4: POST PROCESS & DELIVERABLES

1- XXXXXX_mfg.zip Everything the MFG needs to assemble the board.XXXXXX.val CDS2FAB FILE FOR ASSEMBLYdata.file UNICAM FILE FOR ASSEMBLYroute.txt VALOUT FILES FOR ASSEMBLY board.txt “ pad.txt “symbol.txt “testprep.log TEST POINT REPORTXXX-ccam.cad CIRCUIT CAM FILE

2- XXXXXX_art.zip Everything the Vendor needs to fabricate the bare board (Gerber Files).ads-fab.art fabrication drawing ads-l0X.art layer 01 thru however many layers there are.ads-smt.art solder mask topads-smb.art solder mask bottomads-spt.art solder paste topads-spb.art solder paste bottomads-sst.art silk screen topads-ssb.art silk screen bottomphotoplot.log Photoplot/Gerber log fileart_aper.txt Aperture listart_param.txt Gerber parametersADS-001.tap NC Drill filenctape.log NC Drill count

testprep.log TEST POINT REPORTXXXXXX.ipc IPC 356 NET LIST for E-Test

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POST PROCESS & DELIVERABLES (cont’d)

3- XXXXXX_brd.zip CAD Database and reports for ArchiveXXXXXX.brd ALLEGRO DATABASE BOARD FILEnet.rpt ALLEGRO NET LIST FILE.place.rpt COMPONENT (X, Y POSITION)sum.rpt ALLEGRO SUMMARY REPORTtestprep.log TEST POINT REPORT

4- XXXXXX_dxf.zip DXF files for every layer.asyt.dxf ASSEMBLY TOP DXF FILEasyb.dxf ASSEMBLY BOTTOM DXF FILEfab.dxf FABRICATION DRAWING DXF FILE

5- XXXXXX_pdf.zip PDF files for every layer.asyt.pdf ASSEMBLY TOP PDF FILEasyb.pdf ASSEMBLY BOTTOM PDF FILEfab.pdf FABRICATION DRAWING PDF FILE

6- XXXXXX_odb.zip ODB++ Manufacturing files

Accreditations page:

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