Accelerated Thinking SM 1IDT© IDT CONFIDENTIAL IDT QUALITY SYSTEM OVERVIEW James Shih Vice...

Accelerated ThinkingSM1 IDT© IDT CONFIDENTIAL

IDT QUALITY SYSTEM OVERVIEWIDT QUALITY SYSTEM OVERVIEW

James ShihVice President, Corporate Quality and ReliabilityResearch and Development

James ShihVice President, Corporate Quality and ReliabilityResearch and Development


Corporate Overview

FOUNDED 1980

HEADQUARTERS San Jose, California

WORKFORCE 3,100

WAFER FABRICATION Hillsboro, Oregon

ASSEMBLY / TEST Penang, Malaysia


San JoseHeadquarters

A Global Force in Semiconductor Solutions

Shanghai

Sydney

Atlanta

Ottawa

Hillsboro

PenangPenang Singapore

Italy

3100 EMPLOYEES

Design Engineering Center

Sales & Marketing Headquarters

Wafer Fabrication Facility

Assembly / Test


2004$346.0 Million

2002$379.8 Million

2003$343.9 Million

Revenue Mix by Geography

48%

18%

14%

20%

30%

14%19%

37% 31%33%

20% 16%

Americas

Europe

Japan

APAC


Quality Organization

MARY VESEYDirector

SRAM / FCM / IPC

PS TOWDirector

Corporate QA& ReliabilityAssembly &

Backend

MIKE LAZURQA Manager

HillsboroWafer Fab

PETER SONGQA Manager

Penang Operation

JAMES SHIHVice President

Quality

BIMLA PAULQA ManagerSSD / TSD /

Telecom


Quality Certification Milestone

19931993 19941994 19971997 19981998 1999 /2000

1999 /2000

2000 /2004

2000 /2004 20002000 20012001 20052005

ISO 9001 / 9002 – Salinas, Santa Clara, Penang

ISO 9001 – Oregon

ISO 9002 – Manila

ISO 14000 – All Facilities Certified

ISO 9000 Corp. – All Facilities Certified

STACK 0001

STACK Self-Audit Certification

Transitional QML Certification (MIL PRF 38535)

STACK Supplier Award

ISO 9000, Rev2000

TS16949 Compliance


14.1 Reliability Test Methods for Packaged Devices14.1 Reliability Test Methods for Packaged Devices

14.3 Silicon Devices Reliability Qualification and Monitoring14.3 Silicon Devices Reliability Qualification and Monitoring

14.2 Wafer Level Reliability14.2 Wafer Level Reliability

Quality Membership in Industry Associations and Councils

EIA / JEDEC – Electronic Industries Association Joint Electronic Device Engineering Council


IDT Compliance to JEDEC or IndustrySpec Cross Reference

IDT TEST METHOD / PROCEDURE JEDEC OR INDUSTRY SPEC • Auto Clave (aka SPP) EIA / JESD22-A102 • Bake and Ball Shear Test EIA / JESD22-B116 • Coplanarity for PSMC JESD22-B108 • Corrective Action Requirements EIA / JESD671 • Die Shear Test Mil-Std 883 Method 2019• Dry Package Procedure IPC / JEDEC J-STD-033,EIA/JEP 124• ESD-CDM JESD22-C101 • ESD-HBM Mil-Std 883 Method 3015.7 • ESD-MM EIA / JESD22-A115• ESDS Handling and Control Program JESD625, EIA-471• External Visual Inspection JESD22-B1081 • Failure Mechanisms and Models JEP122 • Failure Mode and Effect Analysis JEP131• Failure-Mechanism-Driven Reliability Monitor JESD659


Quality Systems

Supplier Quality Management

• Supplier Audit, Supplier Rating

• SCIP Teams: Supplier Continuous Improvement Process– Silicon

– Chemical

– Gases

– Photomask

– Assembly Raw Materials

– Assembly Subconcontractor

– Burn-in Boards


Quality Systems

IQC – Incoming Quality Control and Supplier Certification

Fab Material• Silicon, Gases, Chemicals, Reticles,

Targets…

Fab Material• Silicon, Gases, Chemicals, Reticles,

Targets…

Assembly Material• Lead Frames, Mold Compounds • Die Attach, Wires, BGA Substrates

Assembly Material• Lead Frames, Mold Compounds • Die Attach, Wires, BGA Substrates

Backend Material• Burn-in Boards• Test & Measurement Equipment

Backend Material• Burn-in Boards• Test & Measurement Equipment


Quality Systems

• Calibration Support – Recall and Services

• Material Review Board – Product / Process

• Non-Conforming Disposition

• Corrective Action– Quality Alerts

– Internal Corrective Action

– Customer Complaints

– Quality Improvement Teams


Quality Systems

Internal Audit ProgramResponsibilities

• Ensure compliancy of IDT systems to ISO-9000, ISO-14000, Military, STACK and other customer specifications

• Detect minor, but recurring problems that need attention

• Monitor compliancy to all IDT Quality Systems

• Ensure that corrective actions are implemented in a timely and effective manner

• Provide IDT management with audit results, trends and recommendations


Quality Systems

Internal Audit ProgramAudit System Flow

• A thorough annual internal audit is performed at every manufacturing facility based on the 20 ISO quality-systems guidelines

• Re-audit of every discrepancy is conducted to assure that the agreed corrective actions has been implemented

• Six-month follow-up is conducted of every discrepancy to assure that the agreed corrective action has remained in place and is effective


Quality Systems

Document Control – Corporate Standardization• Process / Product / Procedure

Documentation – Manufacturing controls

– Flows, materials, procedures – General operating procedures

– Design, quality, purchasing, training, marketing

• DCN – Document Change Control Management

– Facilitate specification changes world-wide– Electronic signoff from all facilities

• Electronic Spec Distribution on Intranet– DC Web-Site locally - Offshore through DC

Department– Paperless Specifications in Wafer Fab IV and

Santa Clara / Salinas


Quality Systems

Product Change Notice and Product Discontinuance Notice• 90 Day Customer Notification of Change –

JESD 46 Compliance– Changes that affect Form, FIT, Function– All customers with 2 years ship history + current

backlog– PCN will be issued with sample and qualification

data ready

• Product Discontinuance Notice – JESD 48 Compliance Notification

– 1 year minimum notification for last time buy + 3 months shipment from date of last time buy

• Electronic Notification– IDT web page (www.IDT.com)– Email notification– PCN / PDN link to datasheet


Quality Systems

RMA – Customer Return Material Authorization• Closed-Loop RMA Flow

– Customer complaint– Failure analysis (5/10 working day response time)– Corrective / preventative action (across affected

manufacturing / process areas)– Customer feedback– Continuous monitoring

• Management review of trends & corrective action

– Trends– Defect Pareto

• Critical return material requests– Fast turnaround on F/A and containment

– Authorization # not required for critical or fast response


Quality Systems

Statistical Process Control (SPC)• Responsibilities

– Each process engineering area is responsible for developing and tracking SPC

– Formal SPC reports are generated monthly and discussed at production meetings. Informal reports are generated as needed

– Corporate Statistician (QA department) provides overall coordination and guidance

– Production operator is responsible for implementing and dispositioning “out of control” situations

• SPC training– Introductory SPC for all operators

– Engineering level SPC

– Engineering level statistics and design of experiments


ASSEMBLY / PACKAGE • Package technology• Assembly site• Equipment• Material

ASSEMBLY / PACKAGE • Package technology• Assembly site• Equipment• Material

Quality Systems

Qualification

WAFER PROCESS • Technology• Process• Equipment• Material

WAFER PROCESS • Technology• Process• Equipment• Material

PRODUCT• Die revision• Major layer change• Fab site change

PRODUCT• Die revision• Major layer change• Fab site change

BACKEND • Packing method• Packing material• Subcontractor test

and burn-In

BACKEND • Packing method• Packing material• Subcontractor test

and burn-In


Quality SystemsProduct Qualification Guidelines and Process Design Changes

1. For components built in hermetic packages2. Optional3. Design Rule change4. For Full Qualification, make sure that short term FIT goal is achieved, per QCC - 00255. X-ray adiology per Mil-Std-883, Method 2012, if bond pads relocated

6. For Full Qualification: 1st lot must reach 1K hours dynamic lifetest; 2nd lot must reach 1K hours dynamic lifetestLong term and short term FIT goals must be met, per QCC-0025For Limited Qualification:1st lot is shippable after 500 hours of lifetest2nd lot is shippable after 500 hours of life test3rd lot is shippable after 500 hours of lifetest and achievement of short term FIT goal per QCC-0025

7. Require only for die containing a significant amount of SRAM or DRAM

Stress Test Photo /Etch Diffusion Implantation Metal-

lizationPoly-

SiliconGate

DielectricInterlayerDielectric

Topside Glassivation

NewProcess

Technology

Fab Site Process Transfer

Fab Site Product Transfer

Wafer Dimension

WaferSource

(Supplier)

1 PR OCESS MODULE X X X X X X X X X X X

2 PEVAL X X X X X X X X X X X X

3 WAFER SORT YIELD X X X X X X X X X X X X

4 SEM X X X X X X X X

5 AUGER ANALYSIS X X X X

6 BALL SHEAR X X X X X X X

7 BOND PULL (1) (1) (1) (1) (1) (2) (1)

8 BIY (4) (4) (4) X X (4) (4) (4) (6) X (6) X

9 BIM X X X X (6) (6) (6)

10 LIFE TEST DYNAMIC X X X X X X X X X X X X X

11 LIFE TEST STATIC X

12 HAST X X

13 TC X X X X X X X X X X X X

14 Latch-up

15 ESD / HBM X X X X X X X X X X X

16 ESD / MM (3) (3) (3) (3) (3) (3) (2) (1) (2) (3) (3)

17 ESD / CDM X X X X X X X X X X

18 Other Test X X X

SIMS X X X

EM X X X

HC X X

TDDB X X X X

QBD X X X X X X X X X

Soft Error Rate (ASER) (3, 7) (3, 7) (7)


Quality Systems

Failure Analysis Process / Capability

• Wafer fabrication and assembly production yield improvement

• Quality and reliability monitors

• Die & process qualification

• Package qualification

• Customer return


CoordinateFA Activity

with Analyst

CoordinateFA Activity

with Analyst

Quality Receives Unitsand Issues FA #

Quality Receives Unitsand Issues FA #

Electrical Return Electrical Return Corp F/A and Manufacturing F/A

Groups Analyzethe F/A and

Issue the Report

Corp F/A and Manufacturing F/A

Groups Analyzethe F/A and

Issue the ReportProduct Engineering Analyzes the FA and Issues the Report

Product Engineering Analyzes the FA and Issues the Report

FA Report Acceptedby Product QA?

FA Report Acceptedby Product QA?

Issue Final FA Report(Corrective Action If Required)

Issue Final FA Report(Corrective Action If Required)

Quality Systems

Failure Analysis Process Flow

No

Yes

No


Quality Systems

Defect Analysis Reporting / Continuous Improvement Plan

• Defect Pareto analysis and feedback / continuous improvement

• Systematic review of defects by engineering / QA

• Management review of defect Pareto

• Continuous yield enhancement / reliability improvement

• Corrective action (if required)


0

1

2

3

4

5

6

7

8

9

Q1'03 Q2'03 Q3'03 Q4'03 Q1'04 Q2'04 Q3'04 Q4'04 Q1'05

Manila – V/M RMA Profile

DamagedMBB PA56

Damaged MBB PJ28

Rough PlateDF80

SolderabilityPA56

SolderabilityPV56

SolderabilityDF80

Metal ShavingPV56

Bent LeadsDF80

MBB TornPV48

SolderabilityDF80

Solder BridgePB32

Lifted LeadsDM80

PhosphorousPB32

Non WettingPB44

SolderabilityPC20

SolderabilityDF80

Bent LeadsPV48

Bent LeadsPV48

Pkg ContamPB32

BurrsPB32

Solder BridgingPC20

Solder FlakesPB32

Bent LeadsDF80Uniquest HK

1 Unit Missing in Reel PC24l

SolderabilityDF80

Bent LeadsDM40

+ 9 Invalid

Expose CopperPC20

Damaged Carrier Tape PV48

Lifted LeadsDF80

Wrong Top Mark PC16

Broken CarrierTape PJ28

SolderabilityPA48

# of RMA Events


0

1

2

3

4

5

6

7

8

9

10

11

Q3'03 Q4'03 Q1'04 Q2'04 Q3'04 Q4'04 Q1'05

Penang – V/M RMA Profile# of RMA Events

Wrong T&ROrientation BF64 Samsung

MisorientedMark PZ28 WPI – Askey

DemarkingContrast PH44 Memec

Tarnish LeadsCS48General Dynamics

Bent LeadPK128 Microtek

Scratches & Bent Lead SB48 Avnet

Non WettingPK100Celestica

Foreign Materialon Lead PL68Cytech-ZTE

Bent LeadPD48Cytech - Huawei

Bent LeadPK128 Arrow Electronic

Solder BallDamage BS304Jabil Circuit

Lead OxidationPF48Sunrise Telecom

“E” DimensionFailure PL84Hitachi

Bent leadPK100Hitachi Jyotsu

Part Not Stickingon PCB PS24 V-Tech

Device Not Bondedon PCB PS20 Schneider ElecDefect SolderBall BB256Locus Networks

Bent LeadPZ28Jabil Penang

Wrong Device Mixed in One OrderDP208 SHARPBroken LeadPH32Glory Ltd

Missing / DamagedSolder BallsBS304 Celestica

Missing SolderBall BG119 Axiowave Networks

Wrong PartShippedPK100 Avnet

Missing Solder BallBX372 UniquestHan Infocomm

Missing SolderBallBX372 AvnetSanmina Sun

Wrong PartShippedPK100 Arrow Elec

Mold Flash onGold Gate BB416EDOM / Acard

Crushed SolderBall BF208 Fujitsu

SolderabilityPH44 Nihon - Tektronix

Solderability PF48Sunrise TelcomCrack inShoulder PL84Nihon ShingouBent LeadDH208 3 COM

Bent LeadPK100 Solectron - CiscoWrong TrayPK100 Memec Japan Carrier Tape ProblemPF56 Micron

Package SwellPH44 Hitachi - Jyotsu

Package ChipPL52 Oki Electric


0%

5%

10%

15%

20%

25%

30%

35%

40%

100

110

120

130

140

150

160

170

180

190

200

210

220

230

240

250

260

270

280

290

300

Q4CY2003 Starts

Q1CY2004 Starts

Q2CY2004 Starts

Q3CY2004 Starts

Q4CY2004 Starts

0.13um Product X Yield Distribution History% Wafers

DPW Yield


Customer Recognition

“This is an email I never thought I would get to write after what I have been through with other memory vendors. I would like to congratulate you for a part that is close to god-like as a part can get. We did a preliminary FIT rate calculation on the 4M part, and even though it is based loosely on RMA data, it came in at a 1 FIT rate. 1 board failure in 224,400 parts shipped. We should be increasing cut over to other products soon, if you have not heard…”

KIRK KERCHELICH

“This is an email I never thought I would get to write after what I have been through with other memory vendors. I would like to congratulate you for a part that is close to god-like as a part can get. We did a preliminary FIT rate calculation on the 4M part, and even though it is based loosely on RMA data, it came in at a 1 FIT rate. 1 board failure in 224,400 parts shipped. We should be increasing cut over to other products soon, if you have not heard…”

KIRK KERCHELICH


THANKYOUQandA

Accelerated Thinking SM 1IDT© IDT CONFIDENTIAL IDT QUALITY SYSTEM OVERVIEW James Shih Vice...

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