Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 1

A Preliminary Study of Applying “Design-Chain Operations Reference-

model” (DCOR) to Collaborative Substrate Designs

Chi-Tai Wang*, Grace Lin**, Chin Pang Hung*

*Institute of Industrial Management, National Central University

**Advanced Research Center, Institute for Information Industry

984406007@cc.ncu.edu.tw

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 2

Collaborative Design and DCORCollaborative design� Used in product development projects.� Suppliers, manufacturers, customers, etc. can share

information and integrate product development processes.� Primary goal is to reduce product development times and

time to market.

DCOR� A cross-industry framework to provide systematic

approaches for planning, analyzing and reconfiguring design chains.

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 3

Integrated Business Reference Framework by Supply-Chain Council

Source: John Nyere, the Design-Chain Operations Reference-model (2006)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 4

DCOR’s Hierarchical Four Levels (1/2)Level Name Diagram Descriptions

1 Top level (processtypes)

Define design chain collaborating scopes, members, and processes between members.

2 Configuration (processcategories)

Define relationships between members to execute design chain processes.

Plan

PDPRPP

PAPI

Source: John Nyere, the Design-Chain Operations Reference-model (2006)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 5

Level Name Diagram Descriptions

3 Process element(decomposeprocesses)

Define design processes including process elements, inputs/outputs, and required resources.

4 Implementation(decomposeprocesselements)

Define detailed steps considering industry specific operations, business constraints, etc.

PD1

PD2PD3 PD4

DCOR’s Hierarchical Four Levels (2/2)

Source: John Nyere, the Design-Chain Operations Reference-model (2006)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 6

DCOR Levels 1 & 2 Processes

PS Blue Color for Abbreviation, Red color for DCOR Standard representation

Level 1 Level 2ENABLE(EN)

Enable Plan EP

EnableResearch ER

EnableDesign ED

EnableIntegrate EI

EnableAmend EA

PLAN(PP)

Plan Design Chain PP

PlanResearch PR

Plan Design PD

PlanIntegrate PI

PlanAmend PA

RESEARCH(RE)

ResearchProductRefresh R1

ResearchNew product R2

Research New Technology R3

DESIGN(DE)

ResearchProductRefresh D1

ResearchNew product D2

Research New Technology D3

INTEGRADE(IN)

ResearchProductRefresh I1

ResearchNew product I2

Research New Technology I3

AMEND(AM)

ResearchProductRefresh A1

ResearchNew product A2

Research New Technology A3

Source: John Nyere, the Design-Chain Operations Reference-model (2006)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 7

Managing Design Chain Performances

Source: John Nyere, the Design-Chain Operations Reference-model (2006)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 8

Substrate Design Chain

Source: Jei-Zheng Wu & Chen-Fu Chien, OR Spectrum (2008) 30: 401–430

Chip Maker(or IC Design House)

AssemblyVendor

SubstrateProvider

MaterialSupplier

Tooling Maker

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 9

Collaborative Substrate Design Flows in DCOR

Designsubstrate

IntegrateDesign

customer

IntegrateResearch

assembly

DesignA IC specs

B substratespecs

F evaluation results

G release notice

Design

tooling D tooling

C tooling specs E design diagrams/substrate samples

Integrate

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 10

DCOR Industry Case Studies (1/2)Article Industry Adopted methodologies & key features

Chen et al (2006) High techfabrics

� First industry application of DCOR.� Using SWOT to set up firm strategies and DCOR

to construct the new design chain.� Firms’ early involvement and efficient

information exchange is crucial.Wu et al (2007) Motorcycle � Integrating DCOR, collaborative product design

(CPD) and collaborative product commerce (CPC) to propose a collaborative design chain model.

� The model has a hierarchical structure resembling DCOR’s four levels: business, cooperative, process, and operational.

� The case study showed the importance of information sharing and management.

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 11

Article Industry Adopted methodologies & key featuresJuan et al (2009)

Mobilecommunic

ations

� Used process-oriented approaches to develop multi-agent systems (MAS) for CNPD.

� CNPD processes are defined using a modified 3rd level of the DCOR model (process element level) and represented using e-Business Scenario Diagrams.

Lyu and Chang (2010)

Mould � Based on DCOR, design levels 4 & 5 processes for mould development.

� Case company integrates design chain from mould material preparation and mould development to the product manufacturing assembly lines of manufacturers.

� Implemented a Web-base PDM system to strengthen information exchange between mould providers.

DCOR Industry Case Studies (2/2)

Joint Symposium of e-Manufacturing and Design Collaboration 2011and International Symposium on Semiconductor Manufacturing 2011 12

Acknowledgement

� This study is conducted under the “III Innovative andProspective Technologies Project” of the Institute forInformation Industry which is subsidized by theMinistry of Economy Affairs of the Republic of China.(

)