A New Space Modular Computer Core based on NG-Medium FPGA · FUSIO RT A New Space Modular Computer...

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All Rights Reserved © 3D PLUS 2018 Confidential under NDA Pierre-Xiao WANG April 9th, 2018 ESTEC FUSIO RT A New Space Modular Computer Core based on NG-Medium FPGA SEFUW 2018

Transcript of A New Space Modular Computer Core based on NG-Medium FPGA · FUSIO RT A New Space Modular Computer...

Page 1: A New Space Modular Computer Core based on NG-Medium FPGA · FUSIO RT A New Space Modular Computer Core based on NG-Medium FPGA ... CG NAND memory DDR2 memory TMR SPI NOR Layer 1

All Rights Reserved © 3D PLUS 2018 Confidential under NDA

Pierre-Xiao WANG

April 9th, 2018

ESTEC

FUSIO RTA New Space Modular Computer Core based on NG-Medium FPGASEFUW 2018

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Outline

• What is FUSIO RT / Modular Computer Core

• The motivation

• The architecture

• The key feature & benefits

• Conclusion

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FPGA based computer unite is quite common in space design thanks to FPGA’s high flexibility, high performance and its

short time to market and unit low cost.

A Modular Computer Core(MCC) is this kind of complete computer built in a single module with modular design, with

microprocessor(inside of FPGA), memories, input/output (I/O) and other features required of a functional computer.

What is this modular computer core

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The motivation to develop this module

To be updated

In most computer board or processingunite, the common design is the FPGA with its boot memory + computingmemory + storage memory.

The FUSIO RT is to propose a reusablematured space computing core with all these necassary elements inside.

To reduce the board area, to propose a verified radiaiton harding design, to qualified it as a whole module ready to use.

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3D PLUS develop this module under CNES R&T activity

Under CNES R&T

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L1+L2

L1+L2+L3

L1+L2+L3+L4

The module will keep all configurations at the same footprint with NG-Medium

Spacewire

CG

NAND memory

DDR2 memory

TMR

SPI NOR

Layer 1

Layer 2

Layer 3

Layer 4

Modular computer core architecture

BGA484 1.27pitch, LxWxH: 32x32x12mm

Modular design with same footprint

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Configuration Memory:

• Standard SPI NOR – triple dice, each 128Mb

• TMR - Triple vote to mitigate SEU

• 100K erase/program cycles

• 20 Years data retention

• Single Power Supply operation: 3.3V read, erase

and program operations.

• Enhanced TID implementation (Switch integrated)

• 50MHz Normal

• Program 1 to 256 bytes per page

• Program/Erase Suspend & Resume

• Low Instruction Overhead Operations

Memories FeaturesConfiguration + Computing + Mass memories are inside of the module

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Layer 2

*Please note: this TMR SPI Nor can be ordered as a single module under 3D PLUS P/N: 3DFS128M01VS2728

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Computing Memory (Optional):

• SDRAM – from x8 to x24b bus to adapt to

different speed & ECC

• From 512Mb to 1.5Gb configurations

• 3D PLUS SDRAM memory listed at EPPL

Mass Memory (Optional):

• Nand Flash – from 16Gb to 64Gb

configurations

• From x8b to x32b bus to adapt to different

speed

• 100K erase/program cycle

• 10 years data retention

• 3D PLUS NAND memory listed in EPPL

Radiation Hardening IP Core (Optional):

• SDRAM Controller IP core to manage the

SDRAM radiation issue

• Nand Flash Controller IP core to manae the

Nand Flash radiation issue

Memories FeaturesConfiguration + Computing + Mass memories are inside of the module

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Layer 3

Layer 4

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• BGA484 1.27mm pitch, LxWxH: 32x32x12.5mm (all memories)

- 1.27mm BGA is under 3D PLUS PID.

- BGA 484 with 32X32mm saving PCB area

- Easy to assembly

- All memory I/Os has been integrated inside of the module

- 262 user I/Os (3.3V, 1.8V & 1.5V ) abailable

• SDRAM/Nand had been selected

- sufficient performance

- No further termination regulator needed for SDRAM

- Good power consumption/ 3.3V I/Os

• Radiation tolerance

- Total ionizing dose > 50Krads

- SEL immune up to LET > 60MeV.cm2/mg.

- SPI Nor switch off during non-use

- memory controller IP core ready to use to manage radiation issue

FUSIO RT module a trade off among performance/power/size/easy to use

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no board design for the memories

no memory controller design

Radiation Hardening design

all in one Space Qualified Package

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FUSIO RT : FPGA integrated with Radiation tolerant Memory

Module Key Benefits:

• Space technology FPGA

• Triple vote SPI NOR – bitstream memory integrated

• Optional DRAM – max x24b wide computing memory

integrated

DRAM Controller IP core available

• Optional Nand – max x32b wide mass memory

integrated

Nand Flash Controller IP core available

• Embedded bitstream integrity check – low error rate

• 262 user I/Os (3.3V, 1.8V & 1.5V ) abailable

• Temperature range: -55 to +105°C

• BGA484 1.27mm pitch, LxWxH: 32x32x12.5mm (all

memories)

• Radiation Tolerance:

Total ionizing dose > 50Krads

SEL immune up to LET > 60MeV.cm2/mg.

• The EM will be available the end of 2018, and FM will be

available at middle of 2019

FUSIO RT module summaryKey Features & Benefits

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