980 x 510 mm 1480 x 510 mm - Trans-Tec Factory · Max. 1,480 x 510 mm board (M20) is possible with...
Transcript of 980 x 510 mm 1480 x 510 mm - Trans-Tec Factory · Max. 1,480 x 510 mm board (M20) is possible with...
Max. Board size
980 x 510 mm (option)
Applicable components
0402mm to 120 x 90 mm
Next Generation Mounter
M10 spec
series
M20 spec
Applicable components
0402mm to 120 x 90 mm
Max. Board size
1480 x 510 mm
SpecificationsBoard size (With buffer unused) Min. L50 x W30 mm to Max. L980 x W510 mm
(With input or output buffer used) Min. L50 x W30 mm to Max. L420 x W510 mm
(With input and output buffers used) Min. L50 x W30 mm to Max. L330 x W510 mm
Board thickness 0.4 – 4.8 mm
Board flow direction Left to right (Std.)Board transfer speed Max. 900 mm/secPlacement speed (4 heads) Opt. Cond. 0.15 sec/CHIP (24,000CPH) /IPC9850 (19,000CPH)
Placement speed (6 heads) Opt. Cond. 0.12 sec/CHIP (30,000CPH) /IPC9850 (23,000CPH)
Placement accuracy A (µ+3 ) CHIP +/- 0.040 mm
Placement accuracy B (µ+3 ) IC +/- 0.025 mm
Placement angle +/-180 degrees
Z axis control / Theta axis control AC servo motorComponent height Max. 30 mm *1 (Pre-placed components: max. 25 mm)
Applicable components 0402 (mm) – 120 x 90 mm, BGA, CSP, connector, etc.
Component package 8 - 88 mm tape, stick, tray
Drawback check Vacuum check and vision checkScreen language English, Chinese, Korean, Japanese
Board positioning Board grip unit, front reference, auto conveyor width adjustment
Component types Max. 90 types (8 mm tape), 45 lanes x 2
Transfer height 900 +/- 20 mm
Machine dimensions, weight L1250 x D1750 x H1420 mm, Approx. 1,150 kg
SpecificationsBoard size (With buffer unused) Min. L50 x W30 mm to Max. L1,480 x W510 mm *2
(With input and output buffers used) L50 x W30 mm to Max. L540 x W510 mm
Board thickness 0.4 – 4.8 mm
Board flow direction Left to right (Std)
Board transfer speed Max. 900 mm/sec
Placement speed (4 heads) Opt. Cond. 0.15 sec/CHIP (24,000 CPH) /IPC9850 (19,000CPH)
Placement speed (6 heads) Opt. Cond. 0.12 sec/CHIP (30,000 CPH) /IPC9850 (23,000CPH)
Placement accuracy A (µ+3 ) CHIP +/- 0.040 mm
Placement accuracy B (µ+3 ) IC +/- 0.025 mm
Placement angle +/-180 degrees
Z axis control / Theta axis control AC servo motor
Component height Max. 30 mm *1 (Pre-placed components: max. 25 mm)
Applicable components 0402 (mm) – 120 x 90 mm, BGA, CSP, connector, etc.Component package 8 - 88 mm tape, stick, tray
Drawback check Vacuum check and vision check
Screen language English, Chinese, Korean, Japanese
Board positioning Board grip unit, front reference, auto conveyor width adjustmentComponent types Max 180 types (8 mm tape), 45 lanes x 4
Transfer height 900 +/- 20 mm
Machine dimensions, weight L1750 x D1750 x H1420 mm, Approx. 1450 kg
*1 : Board thickness + Component height = Max 30mm *2 1450mm for 6 Head Configuration
Some specifications and parts of the external appearance are subject to change without notice.* Under optimum conditions ** under standard conditions as defined by Yamaha Motor
Trans Tec America.7301 W Boston StreetChandler AZ 85226877-987-2678www.trans-tec-america.com
series series
Next Generation Mounter Next Generation Mounter
New Multi-Conveyor SystemProvides Optimum Board HandlingWith no mechanical board stoppers, the laser sensor determinesthe board size and locates it in the optimum position. This provides efficient component placement,regardlessof PCB size. Boards with cutouts or unusual shapes are also easy to handle.
3D Hybrid Placement
Max. Feeder capacity 180 lanes
CFB/CTF full compatibility
The newly developed CFB-45E as well as the ChangeableTrayFeederCTF-36Ccanbeused on either the M10 or M20 and are quickly interchanged allowing complete flexibility
Auto-Nozzle-Changer StationANC station can accommodate max. 24 nozzles. Available P type gripper nozzles allow odd form handling and placement of components without pick up tabs.
Options• On board dispensing• Dispensed dot check function• Rear fixed multi-scan camera• F3 45-lane fixed feeder bank• Rear side switches• Rear side operation system• UPS4• Conveyor extension, entrance/exit• Component setup verifier• Feeder anywhere• Waste tape box
External dimensions (mm)12501220
CTF-36C 2 CTF-36C + CFB-45E
* Fitted to M20 on the above pictures.
• Internal lighting• Lead coplanarity sensor• Safety cover, front/rear• Clamp unit for CFB/CTF• CFB-45E F3ElectricFeederBankChanger• CTF-36C Cassette type Changeable Tray Feeder• FTF-36C Cassette type Fixed Tray Feeder• RTS-1 Removable Tray Station• Parts feeders• Offline software• iQvision
17501720
Large board handling capability
(424)
F
(468)1750 (275)
R
(424)
F
(468)1750 (275)
RWide range component handling capability
Controlled Placement force
12501220
1750 (424)468
R F
17501720
R
1750 (424)468
F
*Configurations on pictures may be different from standard ones. *Specification and appearance are subject to change without prior notice.(July 2016) 010108E1607A43C
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Placement force is fully controlled in real time to reduce stress on components.
Dispense and Mount heads are interchangeable, allowing complete flexibility. Dispense and Mount functions can be alternated to create 3D assemblies. The removable dot station can be quickly fitted to the feeder bank
The M20 can accommodate max. 180 feeders (45 lanes x 4 positions, 8 mm tape). The M10 can accommodate max. 90 feeders (45 lanes x 2 slots, 8 mm tape).
Maximum 1,240 × 510 mm board can be handled (M20) without multi-staging the PCB for placement. Max. 1,480 x 510 mm board (M20) is possible with multi-staging.
01005 to max. 120 x 90 mm components can be handled by a single standard camera. Max. component height is 30 mm (component height + board thickness), the largest in its class.