8000i wire-bonder overview

8000i Wire Bonder & Ball (Stud) Bumper

© Palomar Technologies, Inc. www.palomartechnologies.com 1

8000i Die BonderAt a Glance• Fully automatic, thermosonic, high-speed bumper,

ball bonder• Unique bond-head motion patented dual Z-axis with

linear and rotary motion, allowing for formation of precise gold ball bumps by repeatable, smooth and tailless shearing of the wire

• Consistent formation of flat <20 micron high bumps, eliminating the need for a secondary coining process

• Comes equipped with Intelligent Interactive Graphical Interface™ (i2Gi™), a revolutionary software capability for modern wire bonding

www.palomartechnologies.com 2© Palomar Technologies, Inc.

8000i Die BonderAt a Glance• Cycle Time

0.125 sec/wire; 0.077 sec/bump

• Placement Accuracy+/- 2.5 micron, 3 sigma

• VersatilityWire bonder and ball

bumper; deep access with capillary of 11.10-19.05mm (0.437 inch to 0.75 inch); in-line and magazine handlers; tall multi-level bonding >12.7mm (>0.5 inch)

• Large Work Area304.8 x 152.4mm (12 x 6

inch) www.palomartechnologies.com 3© Palomar Technologies, Inc.

8000i: Meeting the Unfilled Need

Conventional Hybrid Ball Bonders

8000i Wire Bonder

Semiconductor Ball Bonders

Semiconductor Applications

Large

Small

Low HighSpeed (Net UPH)

WorkArea

Hybrid & Wafer Applications

UnfilledMarketNeed


Large Work Area is More Flexible

2”

2”

8000i

Conventional semi-conductor bonder

Large area ideal for:• Large parts• Multiple parts• Wafers• Low wire or bump counts

12”

6”


High YieldHigh ThroughputLow Cost of Ownership

Market Requirement 8000i Advantage

• Wire Bond & Ball Bump Advanced Process Capability √

• High Speed (uph) √• Large Work Area √• Deep Access To 20mm (Z Stroke) √• Fully Automated With In-situ, Closed Loop

Process Monitoring And Control Tools √

• High Reliability √• Small Footprint √

Most Advanced Large Area Ball Bonder


Key Features• True Orthogonal Bonding

– Consistently produces high quality bonds at varying surface heights over 20mm range

• Deep Access Capability– Enables wire placement into deep

electronic packages

• Semiconductor Wire Bonder– Hybrid wire bonder integrated into

one compact, flexible unit

• Tailless Bump Mode– Designed specifically for flip-chip

applications. It allows the formation of bumps with a height consistency of +/- 2 microns, 3 sigma


Key Features• SMEMA Compatible

– Compact design promotes efficient clean room layout in stand-alone installation or integrated into a full line; innovative handling systems eliminate indexing to create non-stop bonding (zero-wait state)

• Cognex On-Screen Video– Allows point and click selection of bond

placement slides

• Large Bonding Area– 304.8 x 152.4mm (12 x 6 inch)

X-Y bond area minimizes loading time and improves throughput time


Key Features• i2Gi

Supports advanced wire bond control through three key critical command tools, which work in concert to provide a dynamic and intuitive user experience

• Bond Data MinerTM

Monitors machine and process trends providing yields and predictive maintenance

• Automated Assembly Quality components result in

extremely high yields and repeatable, predictable electrical performance


Adaptive Bond Deformation™

• Tool enables direct and uniform control of ball deformation reducing process development time, while increasing productivity and reliability.


Applications

• Versatile, large work area and high reliability are hallmarks of the 8000i Wire Bonder

• Improves production yields and eliminates sources of variation in your microelectronic packaging processes

• Industry-best finished bond height consistency of 2 microns is combined with +/- 2.5 micron, 3 sigma placement accuracy


Common Applications*• Large Complex Hybrids• System in Packages (SiPs)• Multi-chip Modules (MCMs)• Automotive Assemblies• LEDS with Running Stitch• Disk Drive Assemblies• Flex Circuits• High-Bright/High-Power LED arrays• Optoelectronic Packaging• Chip on Board (COB)• Solar Concentrator Packaging• Specialty Lead Frames• Fine Pitch Devices *partial list


• One work stage bonds while other is loaded– Part index time reduced or eliminated

• Bonder accepts automated & manual handlers– In-line, push-pull, dual lane– Auer Boats

Push-Pull Handler


Patented 8000i Dual-Axis Bondhead

ZL

ZR

• ZL & ZR optimize delivery of force & ultrasonics-Repeatable ball deformation-Improved shear strength and loop shape

• Enables formation of one-step flat-top bump © Palomar Technologies, Inc. www.palomartechnologies.com 14

Dual-Axis Essential for Deep Access

• Dual access enables 20mm (0.8”) Z travel – For wire placement into deep

electronic packages

ZR Only(Non-Orthogonal)

ZR + ZL

(Orthogonal)

Competition

8000


Wire Bonding & Ball Bumping


Excellent Loop & Pitch Control

Long low loops

Fine pitch

Stitch impression

Fine pitchmimickingribbon bonding

Standard ball& stitch


Enhanced Loop Mode 2


Soft Knee

Sharp Knee

R (XY)

Z

X

Y R θxy

ØAL

Loop Height

um (mil)

516 (20.3)

Loop Length

mm (mil)

3.85 (150)

Flat Length mm (mil)

1.50 (58.4)

Die Height um (mil)

Wire Dia um (mil)

25 (1.0)

Enhanced Loop Mode 2 (Flash)


Die Height

um (mil)

381 (15)

Pad Pitch um (mil)

90 (3.54)

Wire Dia um (mil)

32 (1.3)

Loop Height

um (mil) 305 (12)

Loop Length

mm (mil)

2.5 (64)


.75 (19)

Short WireLoop Height

um (mil) 305 (12)

Loop Length

mm (mil)

5.1 (200)


1.5 (39)

Long Wire

Enhanced Loop Mode 2 (2 Level SoS)


Improved Looping Control


• 400 mils long proven in many applications• 600 mils in development with new wire feed

Faster & Easier Loop Mode Development

• Especially helpful for long wires (>2mm)– Important for fine pitch

• No need for parametric adjustment of individual wires


Standard Ball and Wire


Chain Bonding with Security Bond

Chain BondSecurity Bond


Stitch-Stitch “Chain Bonding”


Stand-Off Stitch (SoS) & Reverse Bonding


Die to Die with SoS Bonding


Wedge Bond Emulation


Complex Solutions


LED Wire Bond Development


Dynamic Force Control

• Two step force control– Typical: Low contact force, followed by

a higher bond force– Safely bonds sensitive parts– Increases shear strength, increases

yield, avoids cracking & cratering

Soft-touch Impact Force

Increased Bond Force

No Die Cracks© Palomar Technologies, Inc. www.palomartechnologies.com 31

www.palomartechnologies.com

Full Range of Custom Bumps Shapes

Turret bump

Triple bumpDouble bump

Pointed bump Tailless bump

• For epoxy dipping(break through top skin)

• Flat on top to providelarge contact area for waferprobe testing

• Extra tip for un-even (non-uniform) flip chip bonding

• Extra-high bump for epoxy dipping

• Test points whereextreme height is required

© Palomar Technologies, Inc. 32

8000i Advantage: One-Step Planar BumpTM

Competitor

“Beard”Step 1: Ball bump

Step 2: Coining

Not planar

2nd step required to produce flat, planar bump© Palomar Technologies, Inc. www.palomartechnologies.com 33

Best Planarity in the Industry• More consistent process• Higher yield• Able to produce flat

bumps <20μ in height

Planarity ±2μ


Process Tool Kit

• Windows platform• Bond Data Miner• Adaptive Bond Deformation• Process Control Software• RAM Statistics• Intuitive User Interface


Bond Data Miner Creates “Smart” Bonder• Three levels of capability through Bond Data Miner

software system, Process Control, and Adaptive Bond Deformation– Level 1: Data collection, archiving & analysis

• Traceability data– Level 2: Process monitoring

• Set upper & lower control limits – Level 3: Closed-loop automatic process control

(“Smart” system)• Links together system and bonding parameters • Proven improvement of yield, process development

time, predictive maintenance, and repair time


The Ultimate Analytical Tool• Bond Data Miner collects electrical and

robotic data from extensive array of sensors– Analyzes, time-stamps & archives data– Provides clear picture of process, machine

performance and stability– Allows traceability of bond parameters &

system state for individual bonds– Data can be viewed across multiple systems

and platforms, including third-party equipment• Powerful tool to improve yield & utilization


Unparalled Process ControlRAM Statistics

Fiducial Tracking Adaptive Bond Deformation

Bond Data Miner (BDM)Data Acquisition & Analysis Tool

Third-Party EquipmentBDM

Calibration & Validation Data


Factory BDM

Bond Deformation

RAM (Repair and Maintenance) Statistics

• Tracks uptime statistics per SEMI E10-0701 & E58-0301• Tracks accumulated bond statistics


Process Control Software• “Supervises”

standard or adaptive bond deformation process

• Collects real-time bonded ball & stitch deformation data

• User can set upper & lower deformation control limits– Bonder stops

bonding if limits exceeded

– Prevents yield loss


Uniform Ball Bump Deformation Test


Deformation versus Bump

2.6

2.72.8

2.93.0

3.1

3.23.3

3.4

0 5 10 15 20 25 30 35

Bump

Defo

rmati

on

[u

m]

Shear Force (gram)

0

50

100

150

200

250

0 5 10 15 20 25 30 35

Deformation 3S

ABD ON 0.5 um

ABD OFF 4.0 um* Micrometers 3sigma

• Deformation variance >8X better with ABD

• Shear force not significantly affected

(Process intentionally set for large variation for ABD OFF)

Uniform Ball Bump Deformation


Adaptive Bond DeformationTM (ABD)Mashed Ball Height (um)

70.0

72.0

74.0

76.0

78.0

80.0

82.0

84.0

86.0

0 5 10 15 20 25 30 35

• Software feature option• Enables direct, uniform control of ball deformation

(height and/or diameter)

w/o ABD

w/ ABD


ABD: Automatic Process Control


• Uses closed-loop, in-situ process control-Allows user to define ball/bump height or diameter; bonder optimizes parameters automatically• Uniform bump size regardless of variations lot-to-lot, in material, and in

environment

ABD: Field-Proven to Improve Yield• Customer A: From 95% to

≥99.5% w/ ABD (5 machines, bumping app.)

• Customer B: Triple-bump stack not possible without ABD

• Only bonder w/ ABD capability


Intelligent Interactive Graphical Interface (i2Gi)


Common Configurations for Automated Production


Automated production line with customizable magazine handlers and hotrail conveyers. Ideal for high-mix, complex automated production.

Ergonomic kit that supports both traditional keyboard and track-ball or a large glove-touch compatible touch screen (optional). Ideal for complex programming and intuitive control of part builds.

Standard for reduced footprint and automated production scalability. Ideal for complex hybrid device packaging with flexibility to meet changing production needs.

Summary


• Superior large area ball bonder– Wire bonding– Ball bumping

• Industry’s most advanced hardware & software tools for yield enhancement– “Smart” bonder

8000i Wire Bonder Resources

• 8000i Wire Bonder data sheet• Improved Wire Bond Reliability with Stand-Off Stitch

Chain Wire Bonding of a RF SOE Package Using a Gold Ball Bonder

• Multipurpose Wire Bonding – Wires, Bumps and Combination Interconnects Odd Form Factor Packaging

• The Great Debate: Ball vs. Wedge


http://www.palomartechnologies.com/8000-wire-bonder/ball-stud-bumper/

http://www.palomartechnologies.com/resources/www.palomartechnologies.com/improved-wire-bond-reliability-technical-paper

http://www.palomartechnologies.com/chain-wire-bonding-of-a-rf-soe-package-using-a-gold-ball-bonder

http://www.palomartechnologies.com/chain-wire-bonding-of-a-rf-soe-package-using-a-gold-ball-bonder

http://www.palomartechnologies.com/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects/

http://www.palomartechnologies.com/multipurpose-wire-bonding-wires-bumps-and-combination-interconnects/

http://www.palomartechnologies.com/guide-to-odd-form-factor-packaging-ebook

http://www.palomartechnologies.com/the-great-debate-ball-vs-wedge-article/

Corporate Headquarters: +1-760-931-3600

APAC: +65-6686-3096

EMEA: +49-9131-48009-30

Palomar TechnologiesFor more information visit www.palomartechnologies.com


8000i wire-bonder overview

Technology

Transcript of 8000i wire-bonder overview