7 W AUDIO POWER AMPLIFIER WITH THERMAL … de datos/tba810.pdf7 W AUDIO POWER AMPLIFIER WITH THERMAL...
Transcript of 7 W AUDIO POWER AMPLIFIER WITH THERMAL … de datos/tba810.pdf7 W AUDIO POWER AMPLIFIER WITH THERMAL...
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7 W AUDIO POWER AMPLIFIER WITH THERMAL SHUT-DOWN
The TBA810 S is a monolithic integrated circuit in a 12-lead quad in-line plasticpackage, intended for use as a low frequency class B amplifier.The TBA810 S provides 7 W output power at 16 V/4 O 6 W at 14.4 V/4 8,2.5 W at 9 V/4 8, 1 W at 6 V/4 51 and works with a wide range of supply voltages(4 to 20 V); it gives high output current (up to 2.5 A), high efficiency (75% at 6 Woutput), very low harmonic and cross-over distortion. The circuit is provided witha thermal limiting circuit which fundamentally changes the criteria normally used indetermining the size of the heatsink, in addition the TBA 810 S/AS can withstandshort-circuit on the load for supply voltages up to 15 V.�The TBA 810AS has the same electrical characteristics as the TBA 81OS, but itscooling tabs are flat and pierced so that an external heatsink can easily be attached.
Vs Supply voltage
I o Output peak current (non-repetitive)
+ Io Output peak current (repetitive)
+ Ptot Power dissipation: at Tamb I 80 OC (for TBA 810 S)at Ttab L 100 OC (for TBA 810 AS)
Tstg, Tj Storage and junction temperature
20 v
3.5 A
2.5 A
1 w
5 w
-40 to 150 oc
MECHANICAL DATA Dimensions in mm
Supersedes issue dated 6/73 399 6/75
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CONNECTION AND SCHEMATIC DIAGRAM
TEST AND APPLlCATlON CIRCUIT
* C3, C7 see fig. 6
C8100uF15v
c21000uF15v
400
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THERMAL DATA TBA 81 OAS
Rth j-tab Thermal resistance junction-tab 10 %/W
Rth j-amp Thermal resistance junction-ambient 80 �C/W
* Obtained with tabs soldered to printed circuit with minimized copper area
ELECTRICAL CHARACTERISTICS (Refer to the test circuit; Tamb = 25%)
Input resistance (pin 8)
B Frequency response Vs = 14.4 V(-3 dB) RL=4 Ohm
C3 = 820 pF 40 to 20,000 HzC3= 15OOpF 40 to 10,000 Hz
401
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4
4
4
ELECTRICAL CHARACTERISTICS (continued)
Parameter Test conditions
d Distortion Po = 50 mW to 3 WVs = 14.4 vR L = 4 Df = 1 kHz
Gv Voltage gain Vs = 14.4 v(open loop) RL= 451
f = 1 kHz
Gv Voltage gain(closed loop)
Vs = 14.4 vRL= 48f = 1 kHz
eN Input noise voltage ! Vs = 14.4 vRg = 0B (-3 dB) = 20 Hz to20,000 Hz
IN input noise current Vs = 14.4 vB (-3 dB) = 20 Hz to20,000 Hz
n Efficiency Po=5WVs = 14.4 vRL = 4 Ohmf = 1 kHz
SVR Supply voltage rejection Vs = 14.4 VRL= 49frippre = 100 HZ
Id Drain current Po=6WVs = 14.4 vRL= 4Q
* Thermal shut-downcase temperature Ptot = 2.8 w
*See figs. 7 and 16
Min. Typ. Max.
600
Unit
dB
dB
nA
dB
mA
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Fig. 1 - Typical output power versussupply voltage
6
4
2
0 4 8 12 16 Vs(V) 20
Fig.3 - Typical distortion versusoutput power
G-0945
Fig. 2 - Maximum power dissipationversus supply voltage (sinewave operation)
PtotG-0944
(w)
4
3
2
1
0 4 8 12 16 Vs(V)
Fig. 4 - Typical distortion versusfrequency
G-0946d
( % )
6
5
403
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Fig. 5 - Typical relative voltage gain(closed loop) and typical in-put voltage versus feedbackresistance (Rf) G-0947
Vi 8 Gv(mV)
4
1 10 20 40 60 80
Fig. 7 - Typical power dissipationand efficiency versus outputpower
/ /
2 4 6 8 Po(W) 0 4 a 12 16 Vs(V) 20
Fig. 6 -Typical value of C3 versusRf for various values of B
C3(pF) �
6
10 100 Rf
Fig. 8 - Typical quiescent output vol-tage (pin 12) versus supplyvoltage
10
Vo(V)
8
6
4
404
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Fig. 9 - Typical quiescent currentversus supply voltage
GO950Id
(mA)SVR
Fig. 10 - Typical supply voltagerejection
0
-10
-20
- 3 0
- 4 0
- 5 0
-600 50 100 Rf (0)
For portable equipment the circuit in Fig. 11 has the advantages of fewer external
components and a better behaviour at low supply voltages (down to 4 V).
Fig. 11 - Typical circuitwith loadconnected to thesupply voltage
Rf56OI-I
R1In
* C3, C7 see fig. 6
405
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SVR(db)
Fig. 12 - Typical supply voltage rejectionversus Rf (fig. 11 circuit)
0
- 1 0
-20
-30
-40
0 50 100 150 Rf(fll
MOUNTING INSTRUCTIONSThe thermal power dissipated in the circuit may be removed by connecting the tabsto an external heat sink (TBA 810 AS - fig. 13) or by soldering them to an area ofcopper on the printed circuit board (TBA 810s - fig. 14).During soldering the tabs temperature must not exceed 260% and the soldering timemust not be longer than 12 seconds.Fig. 15a and 15b show two ways that can be used for mounting the device.
Fig. 13 - Maximum power dissipationversus ambient temperature(for TBA 810 AS only)
406
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Fig. 14 - Maximum power dissipation versus copper area ,of the P.C. board(for TBA 810s only)
8 80
6' 60
4 40
2 20
0
0 10 20 30 40 I(mm)
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Fig. 15a shows a method, of mounting the TBA 8 1 0 S that is satisfactory both from
the point of view of heat dissipation and from mechanical considerations. For
TBA 810AS the desired thermal resistance is obtained by fixing the elements shown in
fig. 15b, to a suitably dimensioned plate. This plate can also act as a support for
the whole printed circuit board; the mechanical stresses do not damage the integrated
circuit. This is firmly fixed to the element, in fig. 15b.
Fig. 15a
Fig. 15b
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THERMAL SHUT-DOWN
The presence of a therms! limiting circuit offers the following advantages:
1) an overload on the output (even if it is permanent), or an above-limit ambient
temperature can be easily supported
2) the heatsink can have a smaller factor of safety compared with that of a con-
ventional circuit. There is no device damage in the case of too high a junction
temperature: all that happens is that Po (and therefore Ptot) and Id are reduced
(fig. 16).
Fig. 16 - Output power and drain current Poversus package temperature (W)
8
6
0 50 100 150 Tcase (oC)
409
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Fig. 17 - P.C. board and component layout for the test and application circuit
I 1
Fig. 18 - P.C. board and component layout for the fig. 11 circuit
\ /