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61/5908/INFFor IEC use only

2019-09-06

INTERNATIONAL ELECTROTECHNICAL COMMISSION

TECHNICAL COMMITTEE NO. 61: SAFETY OF HOUSEHOLD AND SIMILAR ELECTRICAL APPLIANCES

Compilation of comments on 61/5867A/DC: Revised Proposal of TC 61/WG 40 for an amendment to IEC 60335-2-5: Household and similar electrical appliances - Safety - Part 2-5: Particular requirements for dishwashers

Note: This document will be discussed during the TC 61 Plenary meeting in Shanghai, China, 21-25 October 2019. After the meeting, a revised INF document will be circulated with Observations of the Secretariat included.

Copyright © 2023 International Electrotechnical Commission, IEC . All rights reserved. It is permitted to download this electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions. You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without permission in writing from IEC.

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61(Shanghai/WG40)33

October 2019

61/5908/INF

Annex A

Report of Comments on 61/5867A/DCCirculation Date: 2019-07-05 Closing Date: 2019-08-16Revised Proposal of TC 61/WG 40 for an amendment to IEC 60335-2-5: Household and similar electrical appliances - Safety - Part 2-5: Particular requirements for dishwashers

Country Status Comments ReceivedAlbania PArgentina OAustralia P Y 2019-08-16Austria P N 2019-08-12Belarus O N 2019-08-14Belgium P N 2019-08-14Brazil O N 2019-08-16Bulgaria OCanada P N 2019-08-06China P N 2019-08-16Czech Republic P N 2019-08-14Denmark P Y 2019-08-15Egypt P N 2019-08-15Finland P N 2019-08-16France P Y 2019-07-25Germany P N 2019-07-24Greece PHungary P N 2019-08-16India P N 2019-08-13Indonesia P N 2019-08-12Iran P N 2019-08-14Ireland P N 2019-07-10Israel P N 2019-08-14Italy P Y 2019-08-02Japan P Y 2019-08-15Korea, Republic of P N 2019-08-16Kuwait OMalaysia P N 2019-08-16Mexico P N 2019-08-15Netherlands P Y 2019-08-12New Zealand P Y 2019-08-13Norway P N 2019-08-13Pakistan PPhilippines, Rep. of the P N 2019-08-16Poland P Y 2019-08-14Portugal P N 2019-08-16Qatar ORomania ORussian Federation O N 2019-08-16Saudi Arabia OSerbia PSingapore OSlovakia OSlovenia P N 2019-07-12South Africa P N 2019-08-16Spain P N 2019-07-25Sweden P Y 2019-08-16Switzerland P Y 2019-08-09Thailand P N 2019-07-25Turkey P Y 2019-08-02Ukraine P N 2019-08-15United Kingdom P Y 2019-08-14United States of America P Y 2019-08-14Vietnam P N 2019-08-14

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P-members O-members Non-members TotalY : comments 13 0 0 13

N : no comments 26 3 0 29- : no response 4 8 0 12

NotesP-members with no response: Albania; Greece; Pakistan; Serbia

*Comments rejected because they were not submitted in the IEC Comment form.

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Date Document Project Nr.2019-08-16 61/5867A/DC 60335-2-5

MB/NC Line number(e.g. 17)

Clause/ Subclause(e.g. 3.1)

Paragraph/ Figure/ Table/

(e.g. Table 1)

Type of comment

Comments Proposed change Observations of WG40 convener

1 CH01 ge The CH NC supports this document with the following comment(s).

Noted

2 CI/ANEC01

ge CI supports the proposal Noted

3 GB01 ge The British NC generally supports the proposal. However we cannot support 22.x.5 for the reason below.

Noted. Clause 22.x.5 will be deleted

4 PL01 ge PL NC doesn’t support the proposal due to following reasons:

Noted

5 TR01 ge TR NC does not support the proposal with the following comments.

Noted

6 DK01 ge The proposal is very complex and offer a variety of alternative solutions to prevent the said risk of fire from soldered connections.While many alternatives may be desirable from an overall point of view the resulting complexity of the standard is not desirable. Cl. 22.x.1 offers the solution of enclosing the relevant connections/circuit boards in a enclosure that provide a barrier against an eventual spread of fire. This is a well-known type of construction and considering the cost and complexity involved with the proposed alternatives either in direct cost in the appliance or in cost/time associated with the testing it is likely that the solution of enclosing the relevant connection will be the preferred solution.To reduce the complexity of cl. 22 it may be more feasible to keep the solution of enclosing the parts as the requirement in cl. 22 and then deferring the rest of the proposal to an annex that is indicated as an alternative option.

Moving the additional clauses to the annex is not accepted.

The comment about 22.x.1 is noted.

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(e.g. Table 1)

Type of comment


7 DK02 ge From previous background material the DKNC understand that the situations where soldered connections becomes a source of ignition is problematic in dishwashers is mainly due to the widespread use of thermal insulation and “sound deadening” materials in dishwashers that may be located in close proximity to circuit boards and soldered connections and so be ignited resulting from the described “failures” of soldered connections. The DK NC is wondering if this problem could not be solved instead through a change of cl. 30.2 in 60335-2-5 in which soldered connections on printed circuit boards are considered as “connections” and therefore any non-metallic parts in contact with the soldered connections or within 3 mm from such connections are NOT exempt from the tests of cl. 30.2.3 or otherwise by setting additional requirements in cl. 30.2 for the thermal insulation- and sound-deadening materials?

Sound dampening will be addressed in a separate proposal.

This proposal is just tied to soldered connections.

The proposal to use a change to clause 30.2 was rejected (document # from UK)

8 FR01 ge FRNC considers that the failure of soldered connections is linked to the environment of the PCB and to the quality of the manufacture process. However, the proposal will not adequately solve the problem. See following comments.

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(e.g. Table 1)

Type of comment


9 FR02 ge The intent of this proposal is to cover fault coming from soldered connections on PCB, as explain in the rational, which can generate important heat energy. It seems that only risk of fire of the PCB is taken into account and not the surrounding parts such as plastic supports.It is to be highly that resistance to heat and fire of PCB itself is already covered by Clause 30.2.4 of the current standard (Needle flame test, metal enclosure, V0).For parts supporting connections or surrounding connections, clause 3.2.3.2 apply.If we shall consider PCB connection faults, there is no reason to consider them differently than general connections.

Delete the proposal.Consider power soldered connections on PCB as general connections covered by the standard and in particular by applying clause 30.2 to cover risk of heat and fire.Delete the exclusion of soldered connections on PCB from 30.2.3 (third dash item).

Not accepted.See previous comment #7)

10 IT01 ge In our opinion, the proposal is focused only on soldered connections without considering any other potential source of fire (e.g. wiring connection and components).

Noted. Fully correct, that proposal is for soldered connections on PCB.

11 JP01 ge We do not support the proposal for the following reasons.

(1) The proposal is covered in clause 30.2 of the existing standard.

(2) The proposal seems to overlap with other requirements such as the glow wire test and V-0 for printed circuit board.The relation between products related to accidents and the proposed requirements is unclear.

(3) The 5VA-test flame uses energy 100 times as large as energy of V-0.Such excessive test requirement is not necessary for solder joints.Unlike refrigerators, generally dishwashers do not have thermal insulation materials. Therefore, the 5VA test requirement is too strict.

Delete all of the proposal Not accepted.See previous comment.

Reject the comment that 5VA is too strict…5VA 500W, V-0 50 W flame = 10 times.A defect soldered connection in a heater circuit with a 2000 W heater will have a maximum power of 500 W fed into the board.

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(e.g. Table 1)

Type of comment


12 NL01 1 3.XX ed The definition is too scientific and too difficult to read.Further as the term ‘glass-transition temperature’ is only used in a single location in the proposal (22.x.4).As normally al PCBs are made from FR-4 material, in 22.x.4 the term ‘glass-transition temperature’ can be easily replace by the typcical termperature Tg value for FR4 material.

Delete 3.XX

And as a consequence in modify the last paragraph of 22.x.4 as follows’:

During the test, the temperature of the tested soldered connection or connections shall not exceed the glass-transition temperature Tg (measured according DSC method of ISO 108 11357-2) of the printed circuit board XX °C.

Not accepted.The glass transition temperature that is abbreviated with Tg is an important parameter of PCB material. You can get FR4 materials with different Tg. WG believe it should be defined..

13 NL02 1 3.XX te Only if NL01 is not accepted:

The definition is too scientific and too difficult to read.Parts of the current definition are not needed to be in the definition as these are only for additional information. These parts can be transferred to a note.

Only if NL01 is not accepted:

Replace by 3.XX as a whole by:

3.XX glass-transition temperature Characteristic value of the temperature range over which glass transition takes place for a certain material.

NOTE 1: Glass transition is the reversible change in an amorphous or non-crystalline material from a viscous or rubbery condition to a hard and relatively brittle condition and vice versa.

NOTE 2: Glass-transition temperature is a reference temperature for the thermal expansion of common printed circuit board materials where the thermal expansion factor of common printed circuit board materials is increased by a factor around five if the temperature of the printed circuit board material exceeds the glass-transition temperature.

Accepted.

14 CH02 3 to 15 ed Correct formatting. Format titles, not references, of all cited standards in italic.

Accepted

15 TR02 14-15 2 te Regarding TR6 comment, there is no need to add this standard reference related with cl 22.x.4.

Delete the standard reference:ISO 11357-2, Plastics -- Differential scanning calorimetry (DSC) -- Part 2: Determination of 14 glass transition temperature and glass transition step height

Not accepted.There are different methods to determine a glass transition temperature. Our intent is to define the used method.

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16 TR03 16-28 3.XX te Regarding TR6 comment, there is no need to add this definition related with cl 22.x.4.

Delete the clause 3.XX. Not accepted. Clause 22.x.4 will be improved.

17 NZ01 18-28 3.xx ed Term definitions have to be written so that they can replace the term where the term is used. Also in the 60335 series we only define a term if it is used more than once. If it used only once then the text of the proposed term definition is used in place of the term

Delete lines 18 to 28 and rewrite lines 107-109 Not accepted.There are different methods to determine a glass transition temperature. Our intent is to define the used method.

18 US01 20 – 23 3.XX ed Re-word the definition to make it clearer. Characteristic value of the temperature range over which the glass transition takes place. – reversible change in an amorphous polymer or in amorphous regions of a partially crystalline polymer from a viscous or rubbery condition to a hard and relatively brittle one and vice versa – takes place. Glass transition is considered to be the reversible change in an amorphous polymer or in amorphous regions of a partially crystalline polymer from a viscous or rubbery condition to a hard and relatively brittle one and vice versa.

See NL02.

19 US04 23 – 170

22.X.1 – 22.X.5.2

te This proposal is not written in the typical format with a requirement and compliance criteria. The compliance criteria for each of the tests is not clearly documented.

Reformat and include clear compliance criteria for each subclause.

Accepted

20 CH03 24 ed Correct formatting. Insert “The” before “glass-transition temperature” and remove CR (carriage return) at the end of line 23.

Accepted

21 CH04 25 3.XX ed Correction of typo. Replace “were” with “where”. Accepted

22 US02 25 3.XX ed Spelling error – change “were” to “where” …were where the factor of thermal expansion… Accepted

23 CH05 28 3.XX ed Correction of typo. Unbold “Tg” and insert a full stop at the end of Note 1.

Tg should be bold as definition.

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(e.g. Table 1)

Type of comment


24 NL03 31 22.x ed Soldered connections are always used for electrical connections, so we don't see an added value for the partial sentence:‘used for the electrical connection of components to the printed circuit board’.

Change the text of the requirement as follows:22.x Soldered connections on printed circuit boards used for the electrical connection of components to the printed circuit board, shall fulfill the requirements of 22.x.1, 22.x.2, 22.x.3, 22.x.4 or 22.x.5 per Figure 14.

Not accepted. Soldered connections on PCB are also used for mechanical fixation of metallic housings or heatsinks. A via could also be judged as soldered connection but is not intended to be and mechanical fixations would not be judged.

25 NZ02 31 22.x 1st para te Reference is made to “Soldered connections on printed circuit boards”. We presume populated printed circuit boards are meant

Add “populated” before “printed circuit boards” Not accepted.22.x begins with “Soldered connections on printed circuit boards used for the electrical connection of components to the printed circuit board”

26 CH06 32 22.x ed Correction of typo. Delete comma after “board”. Accepted

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(e.g. Table 1)

Type of comment


27 SE01 32 22.x ed To clarify. Change from “shall fulfil the requirements of 22.x.1, 22.x.2, 22.x.3, 22.x.4 or 22.x.5 per Figure 14.” To“shall at least fulfil the requirements in one of these clauses 22.x.1, 22.x.2, 22.x.3, 22.x.4 or 22.x.5 per Figure 14.”

Accepted with further clarification.22.x Each soldered connection on a printed circuit board used for the electrical connection of components to the printed circuit board is either exempted or shall fulfil at least the requirements in one of the clauses 22.x.1, 22.x.2, 22.x.3, 32 or 22.x.4 or 22.x.5. Figure 14 shows an overview of exemptions and requirements.

28 SE02 33 22.x ed To clarify. Insert a new note after line 33.NOTE 1 Compliance with clause 22.x is possible by fulfilling one clause in 22.x for all relevant soldered connections on the same printed circuit board or by fulfilling different clauses in 22.x for different relevant soldered connections on the same printed circuit board.

Accepted.

29 CH07 34 22.x ed Correction of typo. Insert a colon after “tests”:

30 NZ03 35 22.x 2nd para te Only dishwashers incorporating a programmer or a timer are unattended appliances according to 30.2

Replace line 35 by

soldered connections in appliances that do not incorporating a programmer or a timer

Accepted

31 US03 35 22.X te Dishwashers are not considered attended appliances, so this criteria should be deleted.

– soldered connections in attended appliances See NZ03

32 CH08 35, 36 and 38

22.x ed Correction of typo. Insert “, or” at the end of each dashed item (three times).

Not accepted.In line 34 already clarified “The following soldered connections are not subject to the tests”

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33 CH09 37, 38 22.x ed Improve formulation and correct formatting. Replace “more than” with “exceeding” and format “normal operation” in bold.

Accepted

34 CH10 39 22.x ed Improve formulation, correct formatting and avoid misinterpretation.

Replace “more than” with “exceeding” and replace “volts” with “V a.c.”.

Accepted but V d.c or Vrms.

35 TR04 39 22.x ed “volt” must be changed into “V”. Replace “volt” by “V”. Accepted

36 CH11 40 22.x ed Correction of typo. Insert a full stop at the end of the last dashed item.

Accepted

37 CH12 41 22.x ed Improve formulation. Insert a hyphen between “matching” and “this”. Accepted but we propose to add a full stop and start “This …”.

38 CH13 42 22.x ed Correction of typos. Replace “Maximum” with “maximum” and insert “to” after “equal”.

Accepted but I think the M should be a capital letter.

39 CH14 43 22.x ed Improve formulation. Replace “is not more than” with “cannot exceed”. Not accepted, Cannot exceed would imply that the voltage has to be analyzed for every phenomena but intent is that a nominal voltage 14 V is enough to check.

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(e.g. Table 1)

Type of comment


40 NL04 39-40 22.x te The rational for the value of 14 V is very thin: reference to single isolated sentence of a random automotive document does not provide a solid base for the voltage value.Furthermore, not the working voltage but the open circuit voltage is of importance for arcing to occur.NLNC strongly suggest to take the open circuit voltage value (50 V) as present in IEC 62368-1 as a condition for an arcing potential ignition source. This 50 V value has a long history in predecessor standard IEC 60065 (Audio/video) which is the standard having longest experience with electronics and PCB materials.Additional benefit is that we align between product standards that cover the same hazards and technologies (fire through PCB connections).Note that the open circuit voltage is to be measured after 3 s to allow transitional effects to fade out.

Replace the last dashed item (lines 39-40) by:

– soldered connections in circuits with a working open circuit voltage not more than 14 volt 50 V measured after 3 s (see NOTE 2)

And delete NOTE 2:NOTE 2 MVFRI RESEARCH SUMMARY, Kennerly H. Digges, R. Rhoads Stephenson Fire Safety in Motor Vehicles with High Voltage Electrical Systems. “If a circuit is broken with a 14-volt circuit, some sparking may occur, but not a sustained arc.”

Accepted. Already existing IEC standard.

Open circuit voltage is not defined in 60335

41 NL05 41-43 22.x NOTE 1 ed Editorial improvement.Further the text in lines 44-48 does not add value as this is will be clear to any person with general knowledge on electrical engineering.

Modify NOTE1 as follows:NOTE 1 The highest power loss in a bad soldered connection will be reached in case of its impedance matching matches the total circuit load impedance. this refers to the “Maximum power theorem”. Therefore, if the nominal value of the total circuit load is equal or lower than 60W the maximum power loss in a degraded bad soldered connection is not more than 15W.For the assessment of the total circuit load of the considered soldered connection the current flowing through the soldered connection (trace – solder – component, component – solder – trace) is relevant, not the current flowing 45 by. E.g. the soldered connections of an interference suppression capacitor have a total circuit load defined by the current flow through that soldered connection that is usually in a mA range and not by the current flowing by into the control.

Not accepted. Note is there to provide guidance..

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(e.g. Table 1)

Type of comment


42 NZ04 37-38 22.x 2nd para te The content of NOTE 1 does not add anything to the understanding of this dashed item.

Delete (See NOTE 1) Not accepted. Note is there to provide guidance

43 NZ05 39-40 22.x 2nd para ed This dashed item is only relevant for 22.x.2 and 22.x.3 so the text and the dashed items need to be restructured to make this clear.

Restructure the dashed items and delete NOTE 2 Not accepted.

44 NZ06 41-48 22.x Note 1 We do not understand the technical accuracy of the second sentence of the first paragraph.

Explain how application of the maximum power transfer theorem allows the conclusion indicated in the second sentence of the first paragraph.

In line 48 replace “control” by “circuit load”

In any case we doubt that the content of the note aids in understanding the text in lines 37-38 so it should be deleted.

Not accepted. Note is there to provide guidance

The Maximum power theorem (no transfer) can be found in the web. The intent is to clarify why 60 W is used as limit.

45 US05 41 – 43 22.X ed The Note is not clear. NOTE 1 The highest power loss in a bad soldered connection will be reached in the case of impedance matching. this This refers to the “Maximum power theorem”. Therefore, if the nominal value of the total circuit load is equal or lower than 60W, then the maximum power loss in a degraded bad soldered connection is not cannot be more than 15W.

Accepted

46 US06 44 – 48 22.X ed The Note is not clear. Also, what is meant by “current flowing by”?

For the assessment of the total circuit load of the considered soldered connection, the current flowing through the soldered connection (trace – solder – component, component – solder – trace) is relevant, not the current flowing by. E.g. the soldered connections of an interference suppression capacitor have a total circuit load defined by the current flow through that soldered connection that is usually in a mA range and not by the current flowing by into the control.

Accepted.

47 FR03 22.X.1 te The current requirements of heat and fire resistance are covered by clause 30.2There is no reason to introduce higher level of heat resistant or other requirements for non-metallic part supporting connections or surrounding connections, including potential consideration of connections on PCB.

Delete the proposal Not accepted.See response to comment 9.

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48 CH15 54 22.x.1 ed Improve formulation. Delete the second “is” and replace “that” with “and”.

Accepted.

49 CH16 55 te There is no compliance criterion to test confinement of burning droplets.

Delete “or burning droplets”. See response to comment 50

50 NL06 53-55 22.x.1 te Editorial improvements.The words ‘or control’ does not add value.The sentence ‘that is able to work as a barrier and confines flames or burning droplets’ is not needed as the goal of this enclosing material is clear from the further requirements in 22.x.1.

Change as follows:The soldered connection is housed shall be enclosed, as part or together with the whole circuit or control, in material by a part that is made of metal, ceramic or is plastic non-metallic material classified 5VA according IEC 60695-11-20 that is able to work as a barrier and confines flames or burning droplets.

Accepted.

51 NZ07 53 22.x.1 1st para te The content of this document is applicable to “soldered connections on printed circuit boards”

Replace “whole circuit or control” by “printed circuit board”

Accepted, combine with NL06 (comment 50)The soldered connection shall be enclosed, as part or together with the printed circuit board, by a part that is made of metal, ceramic or non-metallic material classified 5VA according IEC 60695-11-20.

52 NL07 56 22.x.1 ed Editorial improvements. Replace by:Openings (if any) in the part that encloses the soldered connection shall comply with the following.

Accepted.

53 CH17 57, 58 22.x.1 ed Improve formulation and formatting. Replace line 57, 58 with the following: the insertion of a connector classified as

at least V-1 according to IEC 60695-11-10 to close an opening or the insertion of wiring that meets ISO 6722-1 subclause 5.22 to close an opening; or

accepted

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54 NL08 57-58 22.x.1 te Reference to IEC standard for V-1 classification and material thickness is missing.The requirements for wiring shall only apply for wiring that leaves the enclosure by more that 30 degrees angle from the horizontal.Further, editorial improvements.

Replace by (similar wording used as in 30.2 of part 1):Non-metallic parts filling an opening shall comprise material classified as V-1 according IEC 60695-11-10 provided that the test sample used for the classification was no thicker than the relevant part filling the opening.Wiring leaving the enclosure by more than 30 degrees from the horizontal shall comply with clause 5.22 of ISO 6722.

Not accepted -see response to comment 53 as it will be the accepted wording for the first suggestion.

- Wiring rewording is nor correct and does clarify the clause.

55 NZ08 57-58 22.x.1 3rd para ed The ISO standard is 6722-1. Replace “6722”by “6722-1” accepted

56 NZ09 57-58 22.x.1 3rd para te Clause 5.22 of the ISO standard just refers to “appropriate gas”. For reproducibility the gas to be used needs to be specified. Also there is no method detailed on how to confirm the flame temperature.

Specify that the gas to be used is propane and provide a method for confirm the flame temperature.

Alternatively apply a 1 kW flame as detailed the basic safety publication IEC 60695-11-2.

Not accept.

57 SE03 57 22.x.1 ed To clarify V-1 Replace ”V-1” with “V-1 according to IEC 60695-11-10”.

Accepted

58 CH18 59 22.x.1 te, ed The shape of the barrier is not necessarily of a rectangular box, therefore the CH NC proposes to modify the relevant part of the text to consider the horizontal projection of the gap. Improve formulation and formatting.

Replace line 59 with the following: openings having a gap width of their

horizontal projection not exceeding 3 mm; or

Not acceptedDefining horizontal projection would allow “huge” gaps.Also on not rectangular shapes 3 mm can be measured.

59 NL09 59 22.x.1 te The dimensions are not clearly specified. E.g. does the 3 mm apply in any direction or only one direction?Further it is recognized that openings of 1 mm regardless of length (IEC 62368-1) are also considered openings that cannot cause fire spread.

Replace by:Openings shall not exceed 3 mm in any dimension or 1 mm regardless of length.

Not accepted. However, the wording for this clause will clarified by WG40.

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(e.g. Table 1)

Type of comment


60 CH19 60 - 66 22.x.1 te, ed See CH18. Improve formulation, formatting and correct editorials.

Replace line 60 to 66 with the following: openings having a gap width exceeding

3 mm of their horizontal projection and positioned within the volume described by a cylinder with diameter 20 mm and height 50 mm placed vertically above the soldered connection provided that

o no material classified as less than V-1 according to IEC 60695-11-10 is inside this cylinder, unless a barrier made of metal, ceramic or material classified as at least V-1 according to IEC 60695-11-10 is placed between the material and the soldered connection;

o wiring inside the volume described by this cylinder placed vertically above the soldered connection and having an orientation of more than 30 ° towards above from horizontal meets ISO 6722-1, sub clause 5.22 or equivalent.

Not accepted

Clear intention of the proposal is that the position of the soldered connection in the enclosure is not regarded due to the heat and fire spread in the total housing. The cylinder is placed at the housing surface.

61 NL10 60-63 22.x.1 te -The virtual cylinder shall not be applied to the opening itself but to the PCB solder connection closest to the opening.-Reference to IEC standard for V-1 classification and material thickness is missing.-We are not in favour of using the words ‘or equivalent’ (line 66). This leaves room for interpretation. Furthermore the wiring requirement in line 58 does not provide this option.-Editorial improvements.

Replace lines 60-66 by (similar wording used as in 30.2 of part 1):For openings greater that 3 mm or greater than 1 mm regardless of length, non metallic parts that encroach within the envelope of a vertical cylinder having a diameter of 20 mm and a height 50 mm placed upon the soldered PCB connection closest to the opening, shall comprise material classified as V-1 according IEC 60695-11-10 provided that the test sample used for the classification was no thicker than the relevant part.Wiring that encroaches within the envelope of the vertical cylinder shall comply with clause 5.22 of ISO 6722 if its orientation is more than 30 degrees from the horizontal.

Not accepted

62 SE04 62 22.x.1 ed To clarify V1 Replace ”V-1” with “V-1 according to IEC 60695-11-10”.

Accepted

63 SE05 63 22.x.1 ed To clarify V1 Replace ”V-1” with “V-1 according to IEC 60695-11-10”.

Accepted

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64 NL11 66 22.x.1 te Test specification is missing. Add: Compliance is checked by inspection.

Accepted

65 NZ10 66 22.x.1 7th para te What does “ISO 6722-65 1:2011 clause 5.22 or equivalent” mean?

Explain what is meant by “or equivalent” or delete “or equivalent”.

Accepted to delete equivalent

66 SE06 66 22.x.1 ed Add test. Insert new line after line 66.Compliance is checked by inspection and by the relevant tests.

Accepted

67 SE07 69 22.x.2 ed Add test. Insert new line after line 69.Compliance is checked by inspection and by the relevant tests.

Accepted.

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68 US08 53 – 66 22.X.1 ed This requirement is unclear. The soldered connection is housed, as part or together with the whole circuit or control, in material that is metal, ceramic, or is plastic classified 5VA according to IEC 60695-11-20, that is able to work is intended to function as a barrier and to confines flames or burning droplets.Any openings in the barrier shall provide containment by:- The insertion of a connector rated at least V-

1 according to IEC 60695-11-10or better material to close an opening, or OR the insertion of wiring that meets ISO 6722-1 clause 5.22 to close an opening.

- Openings having a gap of not more than 3 mm (remaining after the insertion).

- For openings with a gap larger than 3 mm, apply the 20 mm by 50 mm cylinder vertically at the opening on the barrier surface. (see Figure 15). - No material rated classified less than V-

1 according to IEC 60695-11-10 should shall be in that flame cylinder or unless a barrier of metal, ceramic or 5VA plastic material is needed provided between the opening and the v1 material.

- If wiring is present in the flame cylinder that and is above an opening in the barrier, and the orientation is more than 30 degrees from the horizontal, then the wire must meet ISO 6722- 1:2011 clause 5.22 or equivalent.

Accepted in principle. Wording improvements will be combined with proposed wording in comment 50.

69 FR04 22.X.2 te Use of glass or ceramic PCB will not avoid failure of a soldered connection which generates overheating and cause fire of plastic support closed to the connection.

Delete the proposal.Consider power soldered connections on PCB as general connections covered by the standard and in particular by applying clause 30.2 to cover risk of heat and fire. Delete the exclusion of soldered connections on PCB from 30.2.3 (third dash item).

Not accepted.

70 IT03 67 22.x.2 te The test method to verify the requirement is missing.

Please consider this aspect. Accepted.

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71 NL12 67-69 22.x.2 te The whole proposal in this DC is related to soldered connections on PCBs. PCBs are never made of ceramic or glass, so this requirement does not make sense at all.

Delete 22.x.2 and as a consequence renumber the clauses 22.x.3 – 22.x.5.(If deletion is not accepted then the test specification must be added: Compliance is checked by inspection).

Not accepted in principle but look at previous comment in regards to the Compliance checked by inspection.

72 CH21 68 22.x.2 te The CH NC kindly asks for more detailed information.

Please give more detailed information on arc track resistant material like specifications, standards or tests.

Please see the following comment

73 NZ11 68-69 22.x.2 te We presume the intent is to require only to use ceramic or glass material.Use of the term “such as” in the requirement is not compatible with reportability.

Replace “arc track resistant material such as ceramic or glass” by “ceramic or glass material”Delete the Note.

Accept.

74 NL13 70-87 22.x.3 te The use of an AFDD in dishwashers is not quite realistic in practice.

Delete 22.x.3 and as a consequence renumber the clauses 22.x.4 – 22.x.5.

Not accepted.

75 NZ12 71-72 22.x.3 1st para te We presume the arc fault detection device is built into the dishwasher.

Replace “by arc fault detection” by “by an incorporated arc fault detection circuit”

Not accepted.

76 US09 71 – 72 22.X.3 ed The first paragraph should be re-worded for clarity: “The soldered connection is protected by arc fault detection against arc tracking passing the following tests.”

The soldered connection is protected by arc fault detection intended to mitigate the risk of against arc tracking. Compliance is determined by the following tests:

Accepted.

77 CH22 73 - 81 and 86, 87

22.x.3 ed Test specification(s) shall be formatted in italic.

Check and correct format. Accepted.

78 SE08 73-81 22.x.3 ed It is a test specification Change line 73-81 to Italic Accepted.

79 TR05 73-81 22.x.3 ed Test specifications must be written in italic type.

Modify the lines 73-81 into italic. Accepted.

80 US10 73 - 74 22.X.3 te The proposal should include guidance on how to apply the Figure 5 test apparatus to the sample under test.

Rather than referring to Figure 5 of IEC 62606, the proposal should include a version of Figure 5 for use in 60335-2-5, with the figure depicting the method of connecting the sample under test to the arc generator.

Also, remove “EUT” since this term is not defined or used in the Standard and the intent is not clear.

Include Figure 5 of IEC 62606 in IEC 60335-2-5 which also depicts how to connect the sample to the arc generatorReplace “that the EUT switches” with “that the solder connections carry”

Accepted.

81 CH23 75 22.x.3 ed Correction of typo. Delete full stop after “figure”. accepted

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82 US11 75 – 76 22.X.3 ed Editorial modifications are needed. The test equipment according to figure. 5 of IEC 62606 is closed (no gap) or separately short circuited (by a wire).

Accepted

83 US12 75 – 76 22.X.3 te The proposal should include guidance on how to apply the Figure 5 test apparatus to the sample under test.


Include Figure 5 of IEC 62606 in IEC 60335-2-5 which also depicts how to connect the sample to the arc generator

Accepted. See response to comment 80

84 NZ13 77 22.x.3 4th para te Operating the appliance to clause 11 includes installing the appliance in the test corner and building in, if necessary, according to the instructions.

Is it necessary to carry out this test immediately following the test of Clause 11 with the appliance built-in?

Yes the product should be in an enclosure.

85 US13 77 – 80 22.X.3 ed Editorial modifications are needed.

Also, the phrase in parenthesis “(to give maximum mask conditions regarding the arc fault detection)” should be removed from this requirement and included as a Note.

The appliance is operated according to clause 11. After finishing clause 11 After the test of Clause 11 is completed, all possible loads are switched on (to give maximum mask conditions regarding the arc fault detection) . The and the short circuiting wire is disconnected. Then the test equipment according figure 5 of IEC 62606 is opened to generate an arc.Note: All possible loads are switched on to maximize the mask conditions regarding the arc fault detection.

Accepted in principle but additional test requirements ( all possible loads……) will be main text and not in a note.

86 US14 77 – 80 22.X.3 te The proposal should include guidance on how to apply the Figure 5 test apparatus to the sample under test.


Include Figure 5 of IEC 62606 in IEC 60335-2-5 which also depicts how to connect the sample to the arc generator

Accepted. See response to comment 80.

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87 US15 81 22.X.3 te A Note should be included to provide guidance on how this can be measured.

The arc detection device should be considered to be a PEC and comply with the relevant Clause 19 requirements.

Also, what is the rationale for the 1 sec proposal?

The arc detection circuit or device should react within around 1 sec after the arc is visible.Note: Methods to measure the time between when the arc is visible and the arc detection device activates may include…

Noted. WG will take a look and provide rationale for the wording.

88 NZ14 82-85 22.x.3 NOTE te The content of the Note adds nothing to the normative text

Delete the Note Not accepted.

89 AU01 86-87 22.x.3 te We believe that the Arc Fault Detection Device (AFDD) should be integral to the device and must comply with clause 19 fault conditions.

Clarify line 86 and 87, to ensure the AFDD is inside the appliance and in addition complies with this standard particularly clause 19, as a protective electronic circuit.

Not accepted

90 NZ15 86-87 22.x.3 6th para te Taking into account the text in lines 73-81 we doubt that it is sufficient to exempt an AFDD complying with IEC 62606 from the tests since these devices are designed for mounting on a distribution board.

Delete lines 86-87 Noted. WG will take a look and revise wording.

91 SE09 86-87 22.x.3 ed It is a test specification Change line 86-87 to Italic Accepted

92 US16 86–87 22.X.3 ed Clarification is needed. If the appliance is provided with an AFDD, is the testing in 22.X.3 waived, or is this test still needed?

An Arc Fault Detection Device (AFDD) complying with IEC 62606, that activates during the above testing, is acceptable without further testing.

Accepted.

93 IT02 52/110 22.x.1 22.x.5

ge Requirements in sub-clauses 22.x.1-22.x.5 are optional but the strictness is not equal. In particular 22.x.4 and 22.x.5 are not strong enough compared the preceding ones.

Revise and improve the sub-clauses 22.x.4 and 22.x.5.

Comment noted. 22.x.4 will be improved and 22.x.5 will be deleted.

94 NL14 88-109 22.x.4 te As overheating can take place very locally on PCBs, sensing devices would be required at many PCB spots to sense the temperature of the several PCB connections. The use of such devices sensing the temperature of each individual soldered connection in dishwashers is not quite realistic in practice.

Delete 22.x.4 and as a consequence renumber clause 22.x.5.

Comment partially accepted. See response to comment 93.

95 PL02 22.x.1-22.x.5

te The proposed requirements in subclauses 22.x.1-22.x.5 are optional but the severity of those are not equivalent. Especially the requirements proposed in 22.4 and 22.5 don’t bring any increase of product safety.

Delete the sublcauses 22.x.4 and 22.x.5. Comment partially accepted. See response to comment 93.

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96 PL03 22.x.4 te The proposed verification of overheating protection is not sufficient safeguard against ignition of soldered connections or arc tracking on PCB.

Delete the subclause 22.x.4. Not accepted. Clause 22.x.4 will be improved.

97 TR06 22.x.4 te The proposed requirement for protection soldered connection against degradational overheating of PCB does not have the same severity with the proposed requirements in previous clauses (cl 22.x.1; 22.x.2; 22.x.3) and not sufficient to be as alternative method to those.

Delete the clause 22.x.4. Comment not accepted. Detection & Prevention in a properly worded 22.x.4 may be more effective than containment. Clause 22.x.4 will be improved.

98 US07 22.x.1-22.x.5

te The Requirements in sub-clauses 22.x.1-22.x.5 are optional, but the compliance expectation is not. Clauses 22.4 and 22.5 do not appear to improve the safety of the product.

Delete the sub-clauses 22.x.4 and 22.x.5. Comment partially accepted. See response to comment 93.

99 US17 22.X.4 te The safety verification of overheating protection is not adequate. The ignition of soldered connections, or arc tracking on PCB, should be specifically identified. In addition, this may be a very difficult test to conduct when you consider the following: The tester will need to measure the nominal current flowing through the connection and then isolate the connection in order to overload the soldering point. Difficulty will begin when multi-layer boards or SMD (surface mounted devices) that are in line with the circuit under test, are used in the appliance design.

Delete the sub-clause 22.x.4. Comment is noted. 22.x.4 will be improved.

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100 NL15 89-90 22.x.4 ed Only if NL14 is not accepted:

It is not clear from the text that this concerns a sensing means to prevent degradational overheating. And that this sensing means de-energizes the circuit to prevent heating of the PCB.


Improve the sentence as follows:The soldered connection is protected by any suitable sensing means, except those responsive to current only, against that de-energizes the circuit to prevent degradational overheating of the base material of the printed circuit board.NOTE 1 A measure based on overcurrent sensing or any reaction to overcurrent is not allowed because in case of a defect/degraded soldered connection the current is not increased by that failure. The increase of the current in the test is only used to get the overheating effect.NOTE1: A means sensing current only is not considered to be suitable.

Comment is noted. 22.x.4 will be improved.

101 CH24 91 to 93 22.x.4 NOTE 1 ed In order to avoid misinterpretation, complete NOTE 1.

Insert “E.g., a PTC is not considered measure based on overcurrent because it is sensitive to temperature. As consequence, it is allowed.” after “… the overheating effect.”


102 NZ16 91-93 22.x.4 Note 1 te The note is not necessary – the text in lines 89-90 is clear without reference to the note.

Delete lines 91-93 Comment is noted. 22.x.4 will be improved.

103 CH25 94 to 99, 102 to 104, 107 to 109


Check and correct format. Comment is noted. 22.x.4 will be improved.

104 NL16 94-109 22.x.4 te Only if NL14 is not accepted:

This concerns a test specification and should be italic.


Change lines 94-109 into italic.


105 SE10 94-109 22.x.4 ed It is a test specification Change line 94-109 to Italic. Except for the Notes on line 100-101 and 105-106


106 SE11 94 22.x.4 ed Change “Therefore, an” to “An” and on a new line.


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107 US18 94 – 96 22.X.4 ed Clarifications are needed. An overload test is carried out on the relevant soldered connections as specified in clause 22.X. Therefore, an An operative sample of the printed circuit board is placed in a test chamber at a temperature equal to the maximum ambient temperature of the printed circuit board measured during the test of clause 11.

Comment noted. 22.x.4 will be improved.

108 SE12 96 22.x.4 te Add that care shall be taken to not change the cooling or orientation of the sample to not change how the additional heat is moving inside the sample.

Add after line 96. The sample shall be mounted in the same orientation in the test chamber as in the appliance and care shall be taken not to influence the air movement in the sample. If here are heatsinks, they shall be connected to simulate the how the work in the appliance.


109 SE13 97 22.x.4 te How to load/insert the current in the test? Maybe by an example stated how to solder wirers to the PCB/component and insert the current by a LAB power supply with an adjustable output.The note 2 does not really state how to increase the load.

Please clarify. Comment accepted. This will be clarified when 22.x.4 is improved.

110 NZ17 98-99 22.x.4 3rd para te The sentence “The temperatures are measured according to the requirements of clause 11” needs clarification. We presume it is the temperature of the relevant soldered connection that is measured to ensure it is at thermal equilibrium.

Replace “After thermal equilibrium is reached the relevant soldered” by “After the relevant soldered connection has reached thermal equilibrium it is”

Delete “The temperatures are measured according to the requirements of clause 11.


111 US19 97 – 98 22.X.4 ed Clarifications are needed. The nominal test current should be specified.

After thermal equilibrium is reached the relevant soldered connection is loaded with a nominal current of XX amps, and operated until steady conditions are established. The temperatures are measured according to the requirements of clause 11.


112 NZ18 100-101 22.x.4 Note 2 te Use of the word “may” is not allowed in a Note as the word means the text is normative.

Either convert the note to normative text; or replace may by can; or delete the Note.

Comment noted. 22.x.4 will be noted.

113 NZ19 100-101 22.x.4 Note 2 te The content of this document is applicable to “soldered connections on printed circuit boards”

Replace “of the control” by “on the printed circuit board”


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114 US20 102 – 104

22.X.4 ed What if an electronic device does not open while the load is increasing? Should a maximum load be specified?

The load is then increased so that the current through the soldered connection is raised by 110% and kept until steady conditions (e.g. when temperatures are stabilized) are reached. This is done and repeated until any electronic circuit or protective device operates.If an electronic device or protective device does not operate, then…

Comment noted. 22.x.4 to be clarified and improved.

115 CH26 104 Wrong formatting. Format “electronic circuit” and “protective device” in bold.


116 NZ20 104 22.x.4 4th para te Since an electronic circuit can be used to provide protection – it must still operate in the presence of a single fault and if it programmable the software must comply with Annex R

Add the substance of the following:If compliance relies on the operation of an electronic circuit, the test is repeated under the following conditions applied separately:– the fault conditions in a) to g) of 19.11.2 applied one at a time to the electronic circuit;– the electromagnetic phenomena tests of 19.11.4.1 to 19.11.4.7 applied to theappliance.If the electronic circuit is programmable, the software shall contain measures to control thefault/error conditions specified in Table R.1 and is evaluated in accordance with the relevantrequirements of Annex R.

Comment noted. 22.x.4 will be clarified and improved.

117 NZ21 105-106 22.x.4 Note 3 te The Note adds nothing to the understanding the normative text.

Delete Note 3 Partially accepted. 22.x.4 will be improved.

118 NL17 107-109 22.x.4 te Only if NL14 is not accepted:

The term ‘glass-transition temperature (Tg)’ is unnecessarily scientific and not necessary at all since the term ‘glass-transition temperature’ is only used in this single location in the proposal.

Further it will be difficult and unnecessary to determine for each PCB the Tg.As normally al PCBs are made from FR4 material, the term ‘glass-transition temperature’ can be easily replace by the typical temperature (Tg) value for FR4 material.

(See also NL01)


Modify the last paragraph of 22.x.4 as follows’:

During the test, the temperature of the tested soldered connection or connections shall not exceed the glass-transition temperature Tg (measured according DSC method of ISO 108 11357-2) of the printed circuit board XX °C

(See also NL01)

Maybe use it only here but it must be the parameter due to the fact that PCB materials so also FR4 is available with different Tg temperatures.

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119 NZ22 107-109 22.x.4 6th para te Glass transition temperature does not need to be a defined term since it is only used here. The substance of the text from IEV 212-12-28 and IEC 212-12-29 should be used.

Replace lines 107-109 by the substance of the following:During the test, the temperature of the tested soldered connection or connections shall not exceed the midpoint of the thermodynamic temperature range, measured as specified in ISO 11357-2, over which a physical change of the printed circuit board from a viscous or rubbery condition to a hard one, or the reverse takes place. NOTE: The temperature at which the change takes place is known as the glass transition temperature and can be designated Tg


120 CH27 108 22.x.4 ed The symbol “Tg” is not part of the term “glass transition temperature”.

Delete “Tg” Comment noted, 22.x.4 will be improved.

121 NL18 109 22.x.4 te Only if NL14 is not accepted:

If an electronic circuit ensures compliance with this test is shall at least be sufficiently immune to EM disturbances.


Add as a last new paragraph:

If compliance relies on the operation of an electronic circuit, the test is repeated with the electromagnetic phenomena tests of 19.11.4.2 and 19.11.4.5 applied to the appliance. During the test, the temperature of the tested soldered connection or connections shall not exceed XX °C.


122 GB02 110-169178-179

22.x.5 Fig 14Soldered connections qualified for the application(last box under PCB)

te No conformity assessment can guarantee 100% compliance which this particular clause requiresDoes not take into account the risk of variation during the manufacturing process whilst the other options take these issues into account and either contain, monitor or control in the event of failure.

Delete 22.x.5 from the proposal (lines 110-169 and 178-179) but retain Figure 14 in general

Accepted. Clause will be deleted.

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123 PL04 22.x.5 te Thermal aging in combination with temperature measurement at normal operation is not sufficient evidence that the electronic circuits in the appliance is resistant to ignition coming from soldered connections or arc tracking on PCB.

Delete the sublcause 22.x.5. See response to comment 122 for GB02

124 TR07 22.x.5 te The proposed requirement for thermal cycling does not have the same severity with the proposed requirements in previous clauses (cl 22.x.1; 22.x.2; 22.x.3) and not sufficient to be as alternative method to those. Moreover, IEC 60335 series are related with product safety measures and does not deal with the requirements regarding process controls.

Delete the clause 22.x.5. See Response to comment 122 for GB02

125 US21 22.x.5 te The combination of thermal aging and temperature test during normal operation is not sufficient evidence that the electronic circuits in a product are resistant to ignition. This is particularly true in the case of bad connection soldering or arc tracking on PCB.

Delete the sub-clause 22.x.5. See response to comment 122 for GB02

126 NL19 110 22.x.5 ed Sentence requires improvements. Replace by:

Soldered connection on printed circuit boards shall be suitable for the application.

No need to change. Clause 22.x.5 will be deleted.

127 NZ23 111-112 22.x.5 Note 1 te The Note adds nothing to the understanding the normative text which is very clear.

Delete Note 1 No need to change. Clause 22.x.5 will be deleted.

128 CH28 114 to 129, 132 to 143, 151 to 152, 155 to 164


Check and correct format. No need to change. Clause 22.x.5 will be deleted.

129 NZ24 114-116 22.x.5 2nd para te Clarify what is meant by “determined according clause 11” We presume it means that the temperature is measured during the test of clause 11.

Replace lines 114-116 by“The maximum temperature at the soldered connection(s) or ambient temperature at the soldered connection(s) (depending on the chosen following procedure) is determined during the test of clause 11.”

No need t change. Clause 22.x.5 will be deleted.

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130 NL20 117 22.x.5 ed The term ‘electronic control’ is too restrictive. The term ‘printed circuit board’ should be used, also for consistency.

Replace the term ‘electronic control’ by ‘printed circuit board’.

No need to change. 22.x.5 will be deleted.

131 NL21 117-120 22.x.5 te To ensure thermal approximation of the PCB the PCB shall be tested without housing.

Delete the text: ‘or a housing opened to a high extent to allow good thermal approximation of 118 the electronic control to the temperature in the thermal chamber)’

No need to change. 22.x.5 to be deleted.

132 NZ25 117-120 22.x.5 3rd para te The content of this document is applicable to “soldered connections on printed circuit boards”

In two places replace “electronic control” by “printed circuit board”

No need to change. 22.x.5 to be deleted

133 CH29 121 22.x.5 ed Correction of typo. Delete full stop after “cycling”. No need to change. 22.x.5 to be deleted.

134 NL22 121-122 22.x.5 ed For better readability this text shall appear as a second paragraph in 22.x.5.

Make the following improvement to the text and move the text to a new second paragraph in 22.x.5:

Thermal cycling. shall be achieved under the conditions of The printed circuit board shall be subject to either 22.x.5.1 or 22.x.5.2. See Figure 16.

No need to change. 22.x.5 to be deleted.

135 NZ26 123-126 22.x.5 5th para te After the thermal cycling test we presume that the printed circuit board is then put back into the appliance and the test of Clause 11 is repeated.

Please confirm or clarify our presumption. No need to change. 22.x.5 to be deleted.

136 US23 123 – 126

22.X.5 te The compliance criteria should not be based on 25 K higher than the max temp recorded during Clause 11 testing, but rather should be based on the glass transition temp of the printed circuit board material.

After the temperature cycling test of either 22.x.5.1 or 22.x.5.2, the circuit boards shall be operated with the conditions of clause 11. The maximum temperature, measured at the soldered connection, shall not exceed the glass- transition temperature Tg (measured according DSC method of ISO 11357-2) of the printed circuit board.

No need to change. 22.x.5. to be deleted.

137 NZ27 127 22.x.5 6th para te The content of this document is applicable to “soldered connections on printed circuit boards”

Replace “electronic controls” by “printed circuit boards”

No need to change. 22.x.5 to be deleted

138 IT04 127-129 22.x.5 ge We consider unfeasible to add a process control for production in IEC safety standard.

Delete sentence in lines 127-129. Comment accepted. 22.x.5 to be deleted.

139 PL05 127-129 22.x.5 te The process control for production cannot be a part of IEC safety standard for household appliances.

Delete the sublcause 22.x.5. Comment accepted. 22.x.5 to be deleted.

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140 SE14 127-129 22.x.5 ed This is routine tests. Move line 127 -129 to a new clause in Annex A.On line 127, state that this new clause in Annex A must be performed.


141 US22 127-129 22.x.5 te It does not seem appropriate for an IEC Safety Standard to contain a production process control.

Delete the sub-clause 22.x.5. No need to change. 22.x.5 will be deleted.

142 US24 127 – 128

22.X.5 te Production line process control requirements should not be included in type-testing requirements.

Application of a process control for production of electronic controls according to the requirements of end-product class of level b of IEC 61191-1, -2 and -3 for the relevant soldered connections is necessary for compliance to clause 22.x.5.


143 CH30 129 ed Correction of typo. Replace “clause” with “sub clause”. No need to change. 22.x.5 will be deleted.

144 NZ28 130-131 22.x.5 Note 2 te The note adds nothing to the normative text. Delete the note. No need to change. 22.x.5 will be deleted.

145 NL23 133 22.x.5.1 ed The term ‘electronic control’ is too restrictive. The term ‘printed circuit board’ should be used, also for consistency.

Replace the term ‘electronic control’ by ‘printed circuit board’.


146 NZ29 132-135 22.x.5.1 1st para te The content of this document is applicable to “soldered connections on printed circuit boards”

In two places replace “electronic control” by “printed circuit board”


147 SE15 133 22.x.5.1 ed It is a test specification Change from the middle of the line 133-143 to Italic


148 CH31 137, 156

22.x.5.1, 22.x.5.2

ed Correction of typo. Insert full stop after “1000 cycles”. No need to change. 22.x.5 will be deleted.

149 NL24 141 22.x.5.1 te There is too much variation allowed in the temperature rate change.3K rate appears to be too low.

Editorial improvement.

Change as follows:

The rate of ambient change shall be between 3 K and 10K +/- 2K per minute and the extremes of temperature shall be maintained for 30 min.


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150 US25 141 – 143

22.X.5.1 ed Remove explanatory statement from requirement and include as a Note.

This Note should also be included in Clause 22.X.5.2(c).

c) The rate of ambient change shall be between 3 K and 10K per minute and the extremes of temperature maintained for 30 min. The 30 min allow the temperature approximation of the soldered connection to the temperature in the thermal chamber.

Note: The 30 min allow the temperature approximation of the soldered connection to the temperature in the thermal chamber.


151 US26 141 – 143

22.X.5.1 and 22.X.5.2

te The laboratories should be certain that they have equipment to conduct this test.

The rate of ambient change shall be between 3 K and 10K per minute and the extremes of temperature maintained for 30 min


152 NL25 144-145 22.x.5.1 ed Editorial improvement. Change as follows:

NOTE 1 Due to possible exceeding of the temperature ratings of components a defects of that components is negligible are ignored.


153 NZ30 144-150 22.x.5.1 Note 1 and Note 2

te The content of the notes is not understood In Note 1 clarify what is meant by “a defect of that components is negligible.”

In Note 2 clarify what is meant by “If soldered connections with lower maximum temperatures according clause 11 comply with the final criteria of the test they comply to this clause and need no further testing regarding this clause. If they do not fulfill the final criteria, they can be tested again in the fitting temperature range for that soldered connection/-s”.


154 NL26 146-150 22.x.5.1 te The text in the note is too prescriptive (‘is used’ must be ‘may be used’).

Editorial improvements.

Change as follows:

NOTE 2 If more than one soldered connection should be qualified and they have not the same initial maximum ambient temperature determined according clause 11 the highest ambient temperature is may be used for the test setup.


155 SE16 150 22.x.5.1 ed It cannot be tested on the same sample due to that is destroyed

Add insert “, on an additional sample” after “connection/-s”


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156 NL27 151-170 22.x.5.2 te Is makes no sense to achieve heating of the soldered connections by both increasing the ambient temperature up to the temperature of the soldered connection +15 K AND by passing current through the connection. In this way the connections are completely overstressed and this is not realistic to real use stress.

The temperature of the chamber / oven shall be increased up to the normal operation ambient temperature of the PCB, not the temperature of the connection.

Change item b) (lines 157-159) as follows:

The ambient temperature (temperature in the thermal chamber) of the printed circuit board is varied between 20°C and the maximum ambient temperature of the soldered connection printed circuit board measured according clause 11 at the relevant soldered connection location in the appliance + 15 K.


157 NZ31 153-154 22.x.5.2 Note 1 te The note is not needed – the text in lines 151-152 is clear.

Also if 22.x.5.2 is more advantageous than the test in 22.x.5.1 why is the test in 22.x.5.1 needed?

Delete lines 153-154 No need to change. 22.x.5 will be deleted.

158 NL28 153-155 22.x.5.2 te In contrary to what is indicated in note 1 we do not see a difference in max temperature compared to 22.x.5.1. It seems the temperature change rate is meant here.

Modify as follows:

Note 1 The advantage of the mixed procedure is better thermal suitability for the used components because max. temperature change rate in the thermal chamber is lower and therefore reduces side effects.


159 NL29 160-161 22.x.5.2 te The required temperature rate change is not clear.

Editorial improvement.

Change as follows:

The rate of temperature change for the thermal chamber shall be in the order of min. at least 3 K/min and the extremes of temperature maintained for 30 min.


160 NL30 165-169 22.x.5.2 te The text in the note is incorrect and not applicable as the test of 22.x.5.2 is about the ambient temperature of the PCB as a whole, not the temperature of the individual connections.

Change as follows:

Delete NOTE 2.


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161 NZ32 165-169 22.x.5.2 Note 2 te The content of the note is not understood In Note 2 clarify what is meant by “If soldered connections with lower maximum temperatures according clause 11 comply with the final criteria of the test they comply to this clause and need no further testing regarding this clause. If they do not fulfill the final criteria, they can be tested again in the fitting temperature range for that soldered connection/-s”.


162 NZ33 170-185 ed The text in the draft should be written clearly so that lines 170-185 are not needed.

Delete lines 170-185 No need to change. 22.x.5 will be deleted.

163 TR08 170-171 Figure 14 te Regarding TR6 and TR7 comments, the figure must be revised.

Delete clauses 22.4 and 22.5 from the figure. No need to change. 22.x.5 will be deleted.

164 CH32 173, 176, 178, 180, 181

ed Correction of typo. Replace “C(c)lause(s)” with “S(s)ub clause(s)”. No need to change. 22.x.5 will be deleted.

165 SE17 173-182 ed Are these lines part of the proposal or just clarification of the proposal? They seem to be misplaced.

Please clarify. No need to change. 22.x.5 will be deleted.

166 CH33 182 22.x te Compliance criterion is incomplete. Add “Compliance is checked by inspection and relevant tests.” at the end of the compliance criterion.


167 CH20 183 to 184

Figure 15 ed Consequence of CH19. Adapt figure 15 accordingly. No need to change. 22.x.5 will be deleted.

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